CN210274432U

CN210274432U - Pickup equipment

Info

Publication number: CN210274432U
Application number: CN201921606381.2U
Authority: CN
Inventors: 王洪豪
Original assignee: Beijing Baidu Netcom Science and Technology Co Ltd
Current assignee: Baidu Online Network Technology Beijing Co Ltd; Beijing Baidu Netcom Science and Technology Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-04-07
Anticipated expiration: 2029-09-25

Abstract

The application discloses pickup equipment relates to signal processing technology field. The specific implementation scheme is as follows: the application provides a pickup equipment, including casing and circuit board, the casing has and holds the chamber, and the circuit board setting is holding the intracavity, is provided with the microphone array on the circuit board, and the microphone array includes the microphone that a plurality of intervals set up, and the outside of every microphone all is overlapped and is equipped with the seal cover. The microphone array of the pickup equipment is good in sealing performance and good in pickup effect.

Description

Pickup equipment

Technical Field

The utility model relates to a signal processing technology field especially relates to a pickup equipment.

Background

The sound pick-up is a device for collecting the sound of the field environment and then transmitting the sound to the back-end equipment, and consists of a microphone and an audio amplification circuit. The sound pickup is generally divided into a digital sound pickup and an analog sound pickup, and the digital sound pickup is a sound sensing apparatus that converts an analog audio signal into a digital signal through a digital signal processing system and performs corresponding digital signal processing. The analog sound pick-up simply amplifies the sound picked up by the microphone by a common analog circuit.

The sound pickup generally comprises a shell and a circuit board positioned in the shell, wherein a microphone array for collecting sound is arranged on the circuit board, and environmental background sound can be filtered to the maximum extent through the microphone array, noise such as noise and echo is suppressed, so that a listener can acquire clear sound without noise. Especially for far-field sound pickup, the sound source can be positioned by using the microphone array, and the direction of the sound is judged.

However, in the existing sound pickup, the sealing performance of the microphone array is poor, and the performance and the effect of the sound pickup are not ideal.

SUMMERY OF THE UTILITY MODEL

The application provides a pickup equipment, and pickup equipment's microphone array's sealing performance is better, and the pickup effect is better.

The embodiment of the application provides a pickup equipment, including casing and circuit board, the casing has and holds the chamber, and the circuit board setting is holding the intracavity, is provided with the microphone array on the circuit board, and the microphone array includes the microphone that a plurality of intervals set up, and the outside of every microphone all is equipped with the seal cover.

The pickup equipment mainly comprises a shell and a circuit board, wherein the shell is used as a main body supporting structure of the pickup equipment and is provided with a hollow accommodating cavity, the circuit board is positioned in the accommodating cavity of the shell, and sound is acquired by arranging a microphone array on the circuit board, wherein the microphone array comprises a plurality of microphones which are arranged at intervals, the sound waves can be filtered through the phase difference of the sound waves received between the adjacent microphones, noise and echo are suppressed, so that the sound acquired by the microphones has better definition, and the sound source can be positioned according to the strength of the sound received by different microphones, so that the pickup effect and the sound source positioning function of the pickup equipment are improved; moreover, the sealing sleeves are sleeved outside the microphones, so that the microphones are in a relatively closed environment, the mutual interference of different microphones can be weakened, and the sound pickup effect of the microphone array is further improved.

In a possible implementation mode, the edge of the sealing sleeve is attached to the circuit board, the sealing sleeve is provided with a sound inlet hole, and the sound inlet hole is communicated with the microphone and the accommodating cavity.

The edge of the sealing sleeve is attached to the circuit board, so that the sealing sleeve can have good sealing performance on the microphone, and the interference among different microphones can be effectively prevented; and through seting up the sound inlet on the seal bush, the sound inlet can communicate microphone and hold the chamber, and clear sound can be gathered through the sound inlet to the microphone like this.

In one possible embodiment, the plurality of microphones are arranged at regular intervals along the circumferential direction of the circuit board.

The plurality of microphones are arranged along the circumferential direction of the circuit board, and the distances between the adjacent microphones are the same, so that the sound pickup effect of the microphone array can be improved, and the sound source positioning function of the microphone array can be improved.

In one possible embodiment, the outer surface of the housing is provided with a shock absorber on which the housing is supported.

Through set up the bradyseism piece at the surface of casing, the casing can support on the bradyseism piece, and the bradyseism piece can improve the stability of pickup equipment, reduces the vibration coupling effect between the different microphones in the microphone array.

In one possible embodiment, the shock absorbing member is a silicone ring or a rubber ring.

Through setting up the bradyseism piece into silica gel circle or rubber circle to make the bradyseism piece for having elastic flexible piece, the bradyseism piece can effectively slow down external impact to the adapter, improves the stability of adapter.

In one possible embodiment, the shell comprises an upper shell and a lower shell, and the upper shell and the lower shell are buckled with each other and jointly form a containing cavity; wherein, the bradyseism piece sets up the bottom at the inferior valve.

The shell of the pickup equipment consists of an upper shell and a lower shell, the upper shell and the lower shell are buckled with each other to form the shell, and the upper shell and the lower shell jointly form a containing cavity for containing the circuit board; through setting up the bradyseism piece in inferior valve bottom, make the bradyseism piece can slow down the impact effect of external to the adapter.

In one possible embodiment, the lower case includes a bottom wall and an inner side wall connected to the bottom wall, the inner side wall extending from the bottom wall to the upper case; the upper shell comprises a top wall and an outer side wall connected with the top wall, and the outer side wall extends from the top wall to the lower shell; wherein the outer surface of the inner sidewall and the inner surface of the outer sidewall abut each other.

Constitute by diapire and inside wall through making the inferior valve, the epitheca comprises roof and lateral wall, and the inside wall of inferior valve extends to the epitheca, and the lateral wall of epitheca extends to the inferior valve, and inside wall and lateral wall looks butt, and epitheca and inferior valve lock each other like this form the casing.

In a possible implementation mode, the circuit board is overlapped on the end face of the inner side wall, at least one positioning portion is arranged on the bottom wall, the positioning portion is provided with a positioning hole, the circuit board is provided with a connecting hole, the connecting hole corresponds to the positioning hole, and a connecting piece penetrates through the positioning hole and the connecting hole.

Through making the circuit board overlap joint at the inside wall terminal surface of inferior valve, and set up the location portion that has the locating hole on the diapire, set up the connecting hole that corresponds with the locating hole on the circuit board, through wearing to establish the connecting piece in connecting hole and locating hole, can fix the circuit board on the inferior valve.

In a possible embodiment, the top wall is provided with a sound pickup hole.

Through seting up on the roof of epitheca and picking up the sound hole, outside sound accessible pickup hole gets into inside the casing, and then can make the microphone array that holds the intracavity of casing gather clear sound.

In a possible embodiment, the top wall is provided with a control key, and the control key is electrically connected with the circuit board.

The control key is arranged on the top wall of the shell and electrically connected with the circuit board, so that a user can control the working state of the sound pickup equipment by manipulating the control key.

Other effects of the above-described alternative will be described below with reference to specific embodiments.

Drawings

The drawings are included to provide a better understanding of the present solution and are not intended to limit the present application. Wherein:

fig. 1 is a schematic structural diagram of a sound pickup apparatus according to an embodiment of the present disclosure;

fig. 2 is a front view of a sound pickup apparatus provided in an embodiment of the present application;

fig. 3 is a bottom view of a sound pickup apparatus according to an embodiment of the present disclosure;

fig. 4 is a side view of a sound pickup apparatus according to an embodiment of the present disclosure;

fig. 5 is a perspective view of a sound pickup apparatus provided in an embodiment of the present application;

fig. 6 is an exploded view of a sound pickup apparatus according to an embodiment of the present application.

Description of reference numerals:

1-a sound pickup device;

11-a housing; 12-a circuit board; 13-a shock absorber;

111-upper shell; 112-a lower shell; 113-a containment chamber; 121-microphone; 122-a sealing sleeve; 123-connecting hole; 124-connecting piece;

1111-top wall; 1112-an outer sidewall; 1121-bottom wall; 1122-inner side wall; 1221-sound entrance hole;

1111 a-sound pickup hole; 1111 b-control keys; 1121 a-positioning section; 1121 b-positioning holes.

Detailed Description

The following description of the exemplary embodiments of the present application, taken in conjunction with the accompanying drawings, includes various details of the embodiments of the application for the understanding of the same, which are to be considered exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

Fig. 1 is a schematic structural diagram of a sound pickup apparatus according to an embodiment of the present disclosure; fig. 2 is a front view of a sound pickup apparatus provided in an embodiment of the present application; fig. 3 is a bottom view of a sound pickup apparatus according to an embodiment of the present disclosure; fig. 4 is a side view of a sound pickup apparatus according to an embodiment of the present disclosure; fig. 5 is a perspective view of a sound pickup apparatus provided in an embodiment of the present application; fig. 6 is an exploded view of a sound pickup apparatus according to an embodiment of the present application.

As shown in fig. 1 to 6, the sound pickup apparatus 1 provided by the embodiments of the present application includes a housing 11 and a circuit board 12, where the housing 11 has an accommodating cavity 113, the circuit board 12 is disposed in the accommodating cavity 113, a microphone array is disposed on the circuit board 12, the microphone array includes a plurality of microphones 121 disposed at intervals, and a sealing sleeve 122 is sleeved outside each microphone 121.

As shown in fig. 1 and 6, the sound pickup apparatus 1 of the present embodiment is mainly composed of a housing 11 and a circuit board 12, the housing 11 is a main structure of the sound pickup apparatus 1, and the components of the sound pickup apparatus 1 are assembled inside the housing 11, so that the sound pickup apparatus 1 is integrally formed by the housing 11. Specifically, the exterior of the housing 11 forms the appearance of the sound pickup apparatus 1, the interior of the housing 11 has an accommodating cavity 113, a circuit board 12 is disposed in the accommodating cavity 113, and a microphone array is disposed on the circuit board 12, it can be understood that the microphone array and the circuit board 12 are electrically connected to collect the sound in the environment where the sound pickup apparatus 1 is located through the microphone array, and process the received sound vibration through an audio amplification circuit on the circuit board 12, and transmit the sound vibration to the back-end device.

As shown in fig. 5 and 6, the microphone array includes a plurality of microphones 121, and the plurality of microphones 121 are arranged on the circuit board 12 at intervals to form the microphone array, in this embodiment, the plurality of microphones 121 are arranged on the circuit board 12 at intervals, so that the sound waves can be filtered by using the difference between the phases of the sound waves received by two adjacent microphones, and the ambient background sound can be removed to the maximum extent, and only the required sound waves are left. Especially for relatively noisy environments, with the arrangement of the microphones 121, the sound collected by the microphone array can be heard clearly by listeners without noise. The microphone array can suppress noise, and also has the functions of echo suppression, reverberation removal and the like.

In addition, by arranging a plurality of spaced microphones 121 on the circuit board 12 to form a microphone array, different microphones 121 in the microphone array are located at different positions in the sound pickup apparatus 1, and for a sound wave transmitted from a sound source in a certain direction to the sound pickup apparatus 1 in the environment, the distances between the different microphones 121 and the sound wave are different, so that the strengths of the sound waves received by the different microphones 121 are different, and thus the direction and the distance of the sound wave can be determined according to the distance and the strength of the sound wave signals received by the different microphones 121 in the same direction, that is, the sound source can be localized by arranging the microphone array, which includes a single sound source and a plurality of sound sources.

Moreover, for multiple sound sources existing in the environment, the microphone array can estimate the number of sound sources, separate the sound sources, and the like besides positioning the multiple sound sources, and details are not repeated herein.

In this embodiment, a sealing sleeve 122 is sleeved outside each microphone 121 of the microphone array, and the microphone 121 is sealed by the sealing sleeve 122, so that the microphone 121 is in a relatively sealed environment. By sleeving the sealing sleeve 122 outside the microphone 121, foreign matters such as dust can be prevented from entering the microphone 121, the performance of the microphone 121 can be improved, and the service life of the microphone 121 can be prolonged; more importantly, the sealing sleeve 122 is sleeved outside the microphone 121, so that the sealing performance of the microphone 121 is improved, the sound transmission between adjacent microphones 121 in the sound pickup device 1 can be avoided, the sound pickup effect of the microphone 121 can be further improved, and the microphone array can acquire clear and noise-free sound.

For the specific arrangement of the sealing sleeve 122 outside the microphone 121, in a possible embodiment, the edge of the sealing sleeve 122 may be attached to the circuit board 12, and the sealing sleeve 122 may be provided with a sound inlet 1221, where the sound inlet 1221 communicates the microphone 121 and the accommodating cavity 113.

As shown in fig. 5 and 6, in the present embodiment, the shape of the microphone 121 may be a micro block structure, electrical contact points are disposed on the circuit board 12 at positions corresponding to the microphones 121, and the microphones 121 are attached to the electrical contact points to make the microphones 121 electrically connected to the circuit board 12.

The sealing sleeve 122 sleeved outside the microphone 121 is matched with the microphone 121 in shape, for example, a main body structure in the middle of the sealing sleeve 122 is provided with a concave cavity corresponding to a block-shaped structure of the microphone 121, after the sealing sleeve 122 is arranged outside the microphone 121, the inner surface of the concave cavity of the sealing sleeve 122 is attached to the outer surface of the microphone 121, the outer edge of the sealing sleeve 122 extends to the outer side of the microphone 121, and the edge of the sealing sleeve 122 is attached to the circuit board 12, so that the sealing sleeve 122 can wrap all parts of the microphone 121, has good sealing performance on the microphone 121, better isolates all microphones in a sealing space, can effectively avoid mutual interference among different microphones 121, and improve the sound pickup effect of a microphone array.

Seal cover 122 is playing sealed microphone 121, when keeping apart the effect of mutual interference between different microphones 121, in order to make microphone 121 the outside sound of collection that can be better, still set up on seal cover 122 by sound inlet 1221, it is specific, sound inlet 1221 can set up the sunken chamber position that corresponds microphone 121 at seal cover 122, sound inlet 1221 is the through-hole of the surface and the internal surface of running through seal cover 122, sound inlet 1221 can communicate microphone 121 and pickup apparatus 1's the chamber 113 that holds promptly, the sound wave accessible that gets into pickup apparatus 1 and hold in the chamber 113 enters into sound inlet 1221 like this and spreads into microphone 121 and is gathered by microphone 121.

By arranging the sound inlet 1221 on the sealing sleeve 122, on one hand, the sealing sleeve 122 does not completely seal the microphone 121, so that the sealing sleeve 122 is prevented from completely isolating the microphone 121 from the outside, sound waves are prevented from being transmitted into the microphone 121 through the sealing sleeve 122, the microphone 121 cannot acquire clear and effective sound signals due to the isolation of the sealing sleeve 122 is prevented, and the problem that the sound pickup effect of the microphone 121 is reduced due to the arrangement of the sealing sleeve 122 is avoided; on the other hand, the microphones 121 only collect external sounds through the sound inlet holes 1221, which not only ensures that the microphones 121 are communicated with the accommodating cavities 113, so that the microphones 121 can collect clear sounds, but also effectively reduces interference between the microphones 121 through the isolation of the sealing sleeves 122 between the adjacent microphones 121, and ensures that the microphone array can collect clear and non-impurity sounds.

As shown in fig. 5 and 6, alternatively, a plurality of microphones 121 may be arranged at regular intervals in the circumferential direction of the circuit board 12. In the present embodiment, the plurality of microphones 121 in the microphone array may be arranged along the circumferential direction of the circuit board 12, for example, if the circuit board 12 is a circular circuit board 12 as shown in fig. 5 and 6, the microphones 121 may be arranged at intervals along the circumferential direction of the circuit board 12, and the distances between the adjacent microphones 121 are equal, that is, the microphones 121 are uniformly arranged along the circumferential direction of the circuit board 12. Thus, different microphones 121 correspond to different directions in the circumferential direction, and it can be understood that, for a sound transmitted into the microphone array from a certain direction, the intensity of the sound collected by the microphone 121 closer to the direction where the sound source is located is higher and the definition is better, so that the sound source direction of the sound signal can be distinguished by different strengths, different definitions and distances of propagation distances of the sound signal collected by the plurality of microphones 121.

In practical applications, for the circuit board 12 in the accommodating cavity 113 of the housing 11 of the sound pickup apparatus 1 to be a circular circuit board 12, the number of microphones 121 in the microphone array and the interval between adjacent microphones 121 may be set according to the specific size of the circuit board 12 and the sound pickup requirements of the microphone array, for example, as shown in fig. 5 and 6, 6 microphones 121 are arranged on the circuit board 12 along the circumferential direction thereof, and the intervals between adjacent microphones 121 are all equal. In addition, in order to improve the application range and flexibility of the sound pickup apparatus 1, the size of the sound pickup apparatus 1 is getting smaller, and thus the microphones 121 arrayed along the circumferential direction of the circuit board 12 may be disposed close to the outer edge of the circuit board 12, so that the adjacent microphones 121 have a larger interval therebetween, and the interference between the adjacent microphones 121 is reduced.

It is understood that, according to the external shape structure and the usage requirement of different sound pickup apparatuses 1, the circuit board 12 disposed in the accommodating cavity 113 of the housing 11 may also be rectangular, triangular, elliptical, hexagonal, and the like, and the microphone array disposed on the circuit board 12 may also be other array structures such as a rectangular array, a linear array, and the like, which is not limited in this embodiment.

It should be noted that parameters such as the array structure of the microphone array and the distance between adjacent microphones 121 should be matched with a software algorithm used when processing the sound signals collected by the microphones 121, so as to ensure the clarity of the sound collected by the microphone array and the accuracy of sound source positioning.

In order to further improve the performance of the sound pickup apparatus 1, such as noise suppression and sound source localization, and improve the sound pickup effect of the sound pickup apparatus 1, in a possible embodiment, the outer surface of the housing 11 may be provided with a shock absorbing member 13, and the housing 11 is supported on the shock absorbing member 13.

As shown in fig. 3, 4, and 6, a shock absorbing member 13 is further disposed on an outer surface of a housing 11 of the sound pickup apparatus 1 of this embodiment, and the sound pickup apparatus 1 is placed on a supporting structure of the sound pickup apparatus 1 through the shock absorbing member 13, for example, an application scene of the sound pickup apparatus 1 is a conference monitoring, and then the sound pickup apparatus 1 may be placed on a table top of a conference table, and at this time, the sound pickup apparatus 1 contacts the table top through the shock absorbing member 13 on the outer surface of the housing 11, and when the table top is collided to generate shock, the shock absorbing member 13 may buffer the shock transmitted from the table top to the sound pickup apparatus 1, so as to improve stability of the sound pickup apparatus 1.

Especially for the far-field pickup with high requirement on the vibration coupling of the microphone array inside the pickup apparatus 1, the shock absorbing piece 13 is arranged on the outer surface of the pickup apparatus 1, and the shell 11 of the pickup apparatus 1 is supported on the supporting structure through the shock absorbing piece 13, so that the shock absorbing performance of the pickup apparatus 1 can be improved, the working stability of the pickup apparatus 1 is good, the vibration coupling effect among the microphones 121 of the microphone array inside the pickup apparatus 1 can be weakened, and the pickup effect of the microphone array is improved.

Specifically, the shock absorbing member 13 may be a silicone ring or a rubber ring. Be the silica gel circle or rubber circle through the bradyseism piece 13 that makes the setting at the 11 surface of casing of pickup apparatus 1, make bradyseism piece 13 for having elastic flexible piece, silica gel circle or rubber circle support are between casing 11 and the bearing structure of pickup apparatus 1, when bearing structure produces and rocks or shakes, silica gel circle or rubber circle can cushion bearing structure to pickup apparatus 1's effort, improve pickup apparatus 1's job stabilization nature, reduce the vibration coupling effect of the inside microphone array of pickup apparatus 1.

In addition, the sealing sleeve 122 sleeved outside the microphone 121 may also be a silicone sleeve or a rubber sleeve, so as to ensure the sealing performance of the sealing sleeve 122 to the microphone 121, reduce interference between different microphones 121 in the microphone array, and prevent the sealing sleeve 122 made of a flexible material from damaging the microphone 121.

As shown in fig. 6, the housing 11 may alternatively include an upper shell 111 and a lower shell 112, and the upper shell 111 and the lower shell 112 are fastened to each other and together form a receiving cavity 113; wherein the shock absorbing members 13 may be provided at the bottom of the lower case 112. In this embodiment, the casing 11 of the sound pickup apparatus 1 may be formed by an upper casing 111 and a lower casing 112, the upper casing 111 and the lower casing 112 are fastened to each other to form a whole, a containing cavity 113 is formed after the upper casing 111 and the lower casing 112 are fastened together, and the circuit board 12 is disposed in the containing cavity 113. For example, the upper shell 111 and the lower shell 112 may be fastened and fixed to form an integral structure by screwing or snapping, etc. to form the housing 11 of the sound pickup apparatus.

When the sound pickup apparatus 1 is placed on the supporting structure, the sound pickup apparatus may be in contact with the lower case 112 and the supporting structure, and the shock absorbing member 13 may be disposed at the bottom of the lower case 112, so that the shock absorbing member 13 may be supported between the supporting structure and the lower case 112, and when the shock absorbing member 13 plays a role of buffering, the lower case 112 may be prevented from being in direct contact with the supporting structure, and the lower case 112 may be protected from being worn.

Specifically, the lower shell 112 may include a bottom wall 1121 and an inner sidewall 1122 connected to the bottom wall 1121, wherein the inner sidewall 1122 extends from the bottom wall 1121 to the upper shell 111; the upper shell 111 includes a top wall 1111 and an outer side wall 1112 connected to the top wall 1111, the outer side wall 1112 extending from the top wall 1111 to the lower shell 112; wherein the outer surface of the inner sidewall 1122 and the inner surface of the outer sidewall 1112 abut each other.

As shown in fig. 6, in the present embodiment, the lower shell 112 of the housing 11 of the sound pickup apparatus 1 is formed by a bottom wall 1121 and an inner side wall 1122, the bottom wall 1121 may be a planar structure, so that when the sound pickup apparatus 1 is placed on a supporting structure, the bottom wall 1121 may be stably supported on the supporting structure, and the arrangement of a buffer member on the outer surface of the bottom wall 1121 is facilitated, the inner side wall 1122 is connected to the bottom wall 1121, and the inner side wall 1122 extends from the bottom wall 1121 to the upper shell 111, and exemplarily, the inner side wall 1122 is a ring-shaped structure as a whole, and the inner side wall 1122.

The upper shell 111 is composed of a top wall 1111 and an outer side wall 1112, the outer side wall 1112 is connected to the top wall 1111, the outer side wall 1112 extends from the top wall 1111 to the lower shell 112, the outer side wall 1112 is matched with the inner side wall 1122 of the lower shell 112, for example, the top wall 1111 may also be a plane structure, the outer side wall 1112 is a ring structure perpendicular to the top wall 1111, when the upper shell 111 and the lower shell 112 are fastened to each other, the outer side wall 1112 is located outside the inner side wall 1122, and the inner surface of the outer side wall 1112 and the outer surface of the inner side wall 1122 are abutted to each other, so. The inner surface of the outer sidewall 1112 is provided with an internal thread, and the outer surface of the inner sidewall 1122 is provided with an external thread matching the internal thread, so that the upper shell 111 and the lower shell 112 are connected by a thread to form the housing 11, and the top wall 1111 of the upper shell 111, the bottom wall 1121 of the lower shell 112 and the inner sidewall 1122 of the lower shell 112 together form the accommodating cavity 113 of the housing 11.

In a specific embodiment, the circuit board 12 may be overlapped on an end surface of the inner side wall 1122, the bottom wall 1121 may be provided with at least one positioning portion 1121a, the positioning portion 1121a may have a positioning hole 1121b, the circuit board 12 is provided with a connection hole 123, the connection hole 123 corresponds to the positioning hole 1121b, and the connection member 124 is inserted into the positioning hole 1121b and the connection hole 123.

As shown in fig. 6, for the fixing of the circuit board 12 in the accommodating cavity 113, as mentioned above, the inner sidewall 1122 of the lower shell 112 extends from the bottom wall 1121 to the upper shell 111, and the inner sidewall 1122 abuts against the outer sidewall 1112 of the upper shell 111, so that the edge of the circuit board 12 can be overlapped on the end surface of the inner sidewall 1122, and the circuit board 12 abuts against the outer sidewall 1112, thereby fixing the horizontal position of the circuit board 12 and avoiding the phenomena of translation and the like of the circuit board 12.

In order to further fix the position of the circuit board 12 in the vertical direction and prevent the circuit board 12 from moving up and down, a positioning portion 1121a may be disposed on the bottom wall 1121 of the lower case 112, the positioning portion 1121a may be a positioning pillar extending from the bottom wall 1121 along the inner side wall 1122, an upper end of the positioning pillar may abut against the circuit board 12, the positioning pillar has a positioning hole 1121b along the axial direction thereof, a position of the circuit board 12 corresponding to the positioning portion 1121a is provided with a connection hole 123, the connection hole 123 overlaps with the positioning hole 1121b, and a connection member 124 such as a screw or a screw is inserted into the connection hole 123 and the positioning hole 1121b to fix the circuit board. In order to firmly fix the circuit board 12 on the lower shell 112, there may be a plurality of positioning portions 1121a, a plurality of connection holes 123 are opened on the circuit board 12 corresponding to the plurality of positioning portions 1121a, and the connection holes 123 correspond to the positioning holes 1121b of the positioning portions 1121a one-to-one.

As shown in fig. 1 and 2, the top wall 1111 may be opened with a sound pickup hole 1111 a. In this embodiment, a sound pickup hole 1111a is opened on an outer surface of the upper casing 111 of the sound pickup apparatus 1, specifically, the top wall 1111, and sound in the environment is transmitted to the microphone array in the accommodating cavity 113 of the housing 11 through the sound pickup hole 1111a, so that the microphone array collects the sound. Specifically, a plurality of sound pickup holes 1111a may be formed in the top wall 1111, and the plurality of sound pickup holes 1111a are uniformly distributed on the surface of the top wall 1111 in different directions, so that sound from each direction in the environment can be clearly transmitted to the microphone array through the plurality of sound pickup holes 1111 a.

Optionally, the top wall 1111 may be provided with a control button 1111b, and the control button 1111b is electrically connected to the circuit board 12. As shown in fig. 1, fig. 2 and fig. 6, a control key 1111b is further disposed on a top wall 1111 of the upper casing 111 of the sound pickup apparatus 1, for example, the control key 1111b may specifically include a button for controlling the sound level and a button for controlling the operation of the sound pickup apparatus 1, and the control key 1111b is electrically connected to the circuit board 12, so that the control key 1111b can control the sound pickup apparatus 1 to implement corresponding functions. In order to facilitate the user to operate and improve the wear resistance of the control 1111b, the control 1111b may be a button formed by combining plastic and silicon rubber (P + R).

In addition, in this embodiment, an antenna may be further disposed in the accommodating cavity 113 formed by the upper casing 111 and the lower casing 112 of the sound pickup apparatus 1, and the antenna is used for receiving and transmitting signals, and in order to enable the antenna to effectively receive and transmit signals, the casing 11 of the sound pickup apparatus 1 may be made of a plastic material, so as to avoid shielding signals of the antenna by making the casing 11 of a metal material.

The pickup equipment provided by the embodiment mainly comprises a shell and a circuit board, wherein the shell is used as a main body supporting structure of the pickup equipment and is provided with a hollow accommodating cavity, the circuit board is positioned in the accommodating cavity of the shell, and sound is acquired by arranging a microphone array on the circuit board, wherein the microphone array comprises a plurality of microphones which are arranged at intervals, the sound waves can be filtered through the phase difference of the sound waves received between the adjacent microphones, noise and echo are inhibited, the sound acquired by the microphones has better definition, and the sound source can be positioned according to the strength of the sound received by different microphones, so that the pickup effect and the sound source positioning function of the pickup equipment are improved; moreover, the sealing sleeves are sleeved outside the microphones, so that the microphones are in a relatively closed environment, the mutual interference of different microphones can be weakened, and the sound pickup effect of the microphone array is further improved.

The above-described embodiments should not be construed as limiting the scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The utility model provides a pickup equipment, its characterized in that, includes casing and circuit board, the casing has and holds the chamber, the circuit board sets up hold the intracavity, be provided with the microphone array on the circuit board, the microphone array includes the microphone that a plurality of intervals set up, every the outside of microphone all is equipped with the seal cover.

2. The pickup device as claimed in claim 1, wherein the sealing sleeve has an edge attached to the circuit board and is provided with a sound inlet hole communicating the microphone and the accommodating chamber.

3. The sound pickup apparatus as claimed in claim 2, wherein the plurality of microphones are arranged at regular intervals in a circumferential direction of the circuit board.

4. The pickup apparatus as recited in claim 1 wherein an outer surface of the housing is provided with a shock absorber, the housing being supported on the shock absorber.

5. The pickup apparatus as claimed in claim 4, wherein the shock absorbing member is a silicone ring or a rubber ring.

6. The pickup apparatus as claimed in claim 4, wherein the housing includes an upper shell and a lower shell, the upper shell and the lower shell being engaged with each other and jointly forming the receiving cavity; wherein, the bradyseism piece sets up in the bottom of inferior valve.

7. The pickup apparatus of claim 6, wherein the lower housing includes a bottom wall and an inner side wall connected to the bottom wall, the inner side wall extending from the bottom wall to the upper housing; the upper shell comprises a top wall and an outer side wall connected with the top wall, and the outer side wall extends from the top wall to the lower shell; wherein an outer surface of the inner sidewall and an inner surface of the outer sidewall abut each other.

8. The sound pickup apparatus as claimed in claim 7, wherein the circuit board is overlapped on an end surface of the inner sidewall, the bottom wall is provided with at least one positioning portion, the positioning portion has a positioning hole, the circuit board is provided with a connecting hole, the connecting hole corresponds to the positioning hole, and a connecting member is inserted into the positioning hole and the connecting hole.

9. The pickup device as recited in claim 7 wherein said top wall defines a pickup aperture.

10. The pickup apparatus as recited in claim 7 wherein the top wall has control keys disposed thereon, the control keys being electrically connected to the circuit board.