CN210272739U - CPCI backplate VIO quick jumper wire device - Google Patents
CPCI backplate VIO quick jumper wire device Download PDFInfo
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- CN210272739U CN210272739U CN201921584132.8U CN201921584132U CN210272739U CN 210272739 U CN210272739 U CN 210272739U CN 201921584132 U CN201921584132 U CN 201921584132U CN 210272739 U CN210272739 U CN 210272739U
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- bonding pad
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Abstract
The utility model discloses a CPCI backplate VIO quick jumper wire device, which comprises a bonding pad, a CPCI backplate, a first copper column, a second copper column and a third copper column, wherein the second copper column is positioned between the first copper column and the third copper column and is VIO; the bonding pad where the second copper column is located is in short circuit with the bonding pad where the first copper column is located through the first copper sheet and the screw, and is used for outputting 3.3V voltage; the bonding pad where the second copper pillar is located is in short circuit with the bonding pad where the second copper pillar is located through a second copper sheet and a screw, and the bonding pad is used for outputting 5V voltage; through the matching of the copper sheet and the copper column, the CPCI back board can output different voltages; the guarantee back plate can operate in a 5V system and a 3.3V system.
Description
Technical Field
The utility model relates to a computer field, concretely relates to quick wire jumper device of CPCI backplate VIO.
Background
In a special computer or an industrial computer, the CPCI backplane is constrained by the expansion board card and needs to adapt to different voltages, usually 5V or 3.3V, and the backplane needs to output different voltages to supply power to the circuit board. This requires that the backplate can not only operate at 5V system but also can operate 3.3V system, realizes through the fly line or welding 0 omega resistance to different pads, all has inconveniently in welding operation and maintenance, consequently realizes the backplate VIO jumper wire fast and is the key point that this patent solved.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, the utility model aims to provide a quick jumper device of CPCI backplate VIO.
The utility model provides a technical scheme that its technical problem adopted is: a CPCI backboard VIO quick jumper device comprises a bonding pad, a CPCI backboard, a first copper column, a second copper column and a third copper column, wherein the second copper column is positioned between the first copper column and the third copper column and is VIO; the bonding pad where the second copper column is located is in short circuit with the bonding pad where the first copper column is located through the first copper sheet and the screw, and is used for outputting 3.3V voltage; and the bonding pad where the second copper column is located is in short circuit with the bonding pad where the second copper column is located through a second copper sheet and a screw, so that 5V voltage is output.
Specifically, the first copper pillar, the second copper pillar and the third copper pillar are welded on the CPCI backboard.
Specifically, first copper post, second copper post and third copper post all are equipped with little cylinder and big cylinder, and its inside is equipped with the screw thread.
The utility model discloses following beneficial effect has:
the utility model provides a CPCI backboard VIO quick jumper device, which realizes the output of different voltages by the CPCI backboard through the matching of a copper sheet and a copper column; the guarantee back plate can operate in a 5V system and a 3.3V system.
Drawings
Fig. 1 is a schematic view of the uninstalled structure of the present invention.
Fig. 2 is a schematic view of the installation structure of the present invention.
Fig. 3 is a schematic structural view of a first copper pillar.
Fig. 4 is a cross-sectional view of fig. 3.
Fig. 5 is a schematic structural view of a copper sheet.
Fig. 6 is a schematic view of the structure of the screw.
In the figure: 1-a pad; 2-CPCI backplane; 3-a first copper pillar; 4-a second copper pillar; 5-a third copper pillar; 6-first copper sheet.
Detailed Description
The technical solution in the embodiments of the present invention will be described in further detail in the following clearly and completely with reference to the accompanying drawings in the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-6, a CPCI backplane VIO fast jumper device includes a pad 1, a CPCI backplane 2, a first copper pillar 3, a second copper pillar 4, and a third copper pillar 5, where the second copper pillar 4 and the third copper pillar 5 are completely identical to the first copper pillar in size and shape, and the second copper pillar 4 is located between the first copper pillar 3 and the third copper pillar 5 and is VIO; the bonding pad 1 where the second copper pillar 4 is located is in short circuit with the bonding pad 1 where the first copper pillar 3 is located through the first copper sheet 6 and a screw, so that 3.3V voltage is output; the bonding pad 1 where the second copper pillar 4 is located is in short circuit with the bonding pad 1 where the second copper pillar 4 is located through a second copper sheet and a screw, and 5V voltage is output; the size and shape of the second copper sheet are completely consistent with those of the first copper sheet 6; the first copper pillar 3, the second copper pillar 4 and the third copper pillar 5 are welded on the CPCI backplane 2.
The embodiment of the utility model is that the first copper column 3, the second copper column 4 and the third copper column 5 are welded on the CPCI backboard 2 by tin soldering;
if the output is 3.3V: the second copper pillar 4VIO is in short circuit connection with the first copper pillar 3.3V bonding pad by using a 0.5mm first copper sheet 6 and two screws; if the output is 5V: the second copper sheet 4VIO and the third copper column 5V bonding pad are in short circuit by using the second copper sheet with the thickness of 0.5mm and two screws, and the backboard can operate in a 5V system or a 3.3V system by changing the positions of the first copper sheet 6, the second copper sheet and the screws.
The utility model discloses not be limited to above-mentioned embodiment, anybody should learn the structural change who makes under the teaching of the utility model, all with the utility model discloses have the same or close technical scheme, all fall into the utility model discloses an within the protection scope.
The technology, shape and construction parts which are not described in detail in the present invention are all known technology.
Claims (3)
1. A CPCI backboard VIO quick jumper device is characterized by comprising a bonding pad, a CPCI backboard, a first copper column, a second copper column and a third copper column, wherein the second copper column is positioned between the first copper column and the third copper column and is VIO; the bonding pad where the second copper column is located is in short circuit with the bonding pad where the first copper column is located through the first copper sheet and the screw, and is used for outputting 3.3V voltage; and the bonding pad where the second copper column is located is in short circuit with the bonding pad where the second copper column is located through a second copper sheet and a screw, so that 5V voltage is output.
2. The CPCI backplane VIO fast jumper device of claim 1, wherein the first, second, and third copper pillars are soldered to the CPCI backplane.
3. The CPCI backplane VIO fast jumper device of claim 1, wherein the first copper cylinder, the second copper cylinder and the third copper cylinder are provided with a small cylinder and a large cylinder, and are internally provided with threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921584132.8U CN210272739U (en) | 2019-09-23 | 2019-09-23 | CPCI backplate VIO quick jumper wire device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921584132.8U CN210272739U (en) | 2019-09-23 | 2019-09-23 | CPCI backplate VIO quick jumper wire device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210272739U true CN210272739U (en) | 2020-04-07 |
Family
ID=70019611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921584132.8U Active CN210272739U (en) | 2019-09-23 | 2019-09-23 | CPCI backplate VIO quick jumper wire device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210272739U (en) |
-
2019
- 2019-09-23 CN CN201921584132.8U patent/CN210272739U/en active Active
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