CN210247151U

CN210247151U - Circuit board, circuit board semi-finished product and electronic device

Info

Publication number: CN210247151U
Application number: CN201920098051.0U
Authority: CN
Inventors: Zhen Huang; 黄桢; Bojie Zhao; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-01-21
Filing date: 2019-01-21
Publication date: 2020-04-03
Anticipated expiration: 2029-01-21

Abstract

The utility model discloses a circuit board, circuit board semi-manufactured goods, electron device. The circuit board comprises a substrate and a plurality of circuit board units which are arranged on the substrate in a mutually separated mode, at least one part of the first surface of each circuit board unit is combined with the surface of the substrate, the second surface of each circuit board unit protrudes out of the surface of the substrate, and the substrate is a molding layer or a molding circuit board. The utility model discloses a method of etching after moulding earlier prepares the circuit board, therefore the circuit board unit protrusion that finally forms is in the base plate. Each circuit board unit does not need to be kept connected with the frame through the connecting portion, so the arrangement mode of the circuit board units is more flexible, the material utilization rate of the etching layer is also improved, and in addition, the smoothness of the circuit board units is better and the tilting is not easy to occur.

Description

Circuit board, circuit board semi-finished product and electronic device

Technical Field

The utility model relates to a circuit board preparation technical field especially relates to circuit board, circuit board semi-manufactured goods, electron device.

Background

The circuit board is an important component in the camera module, and in order to reduce the size of the camera module and improve the flatness of the base of the camera module, it is a conventional practice to mold the surface of the circuit board so as to obtain a flat mounting surface. In order to improve the processing efficiency of the circuit board, several circuit boards or electrodes to be separated are generally integrally molded, and the preparation process generally comprises the following steps

Etching: as shown in fig. 1 and 2, the circuit board panel 01 includes an outer frame 011 and a plurality of circuit boards 012 arranged in the outer frame 011, an area in each dotted line frame in fig. 1 and 2 is a circuit board 012, adjacent circuit boards 012 are connected by a connecting part 013, the circuit boards 012 and the outer frame 011 are also connected by a connecting part 013, and the circuit boards 012 can include a plurality of mutually independent sub-circuit boards 0121;

molding: placing the circuit board jointed board 01 into a molded mold 02, as shown in fig. 3, attaching one side of the circuit board jointed board 01 to a lower mold 022, forming a cavity between the other side of the circuit board jointed board 01 and an upper mold 021, injecting a molding material into the cavity, so that the molding material partially or completely covers one side of the circuit board jointed board 01, and fills gaps among the circuit boards 012, if each circuit board 012 comprises a plurality of mutually independent sub-circuit boards 0121, the molding material is also filled among the adjacent sub-circuit boards 0121, and the molding material forms a molding layer 03 after molding, so that the obtained molded circuit board 04 is shown in fig. 4A and 4B;

cutting: the circuit board 012, the chassis 011, and the connecting portion 013 between the adjacent circuit boards 012 and the molding material are cut to obtain the individual circuit boards 012, as shown in fig. 5.

However, in actual molding, the molding material easily penetrates between the circuit board 012 and the lower mold 022, and the circuit board 012 is lifted as shown in fig. 6A and 6B. The warping of the circuit board 012 affects the flatness of the mounting surface, which makes the assembly difficult in the subsequent process, and the covering of the wires or devices on the surface of the circuit board 012 with the insulating molding material also affects the electrical conductivity thereof.

In some cases, when molding, one side of the circuit board panels 01 is not covered by the molding material, that is, a part of the sub-circuit board 0121 needs to be exposed for subsequent electrical connection with the component to be mounted thereon, and in order to avoid the molding material covering this part of the sub-circuit board 0121, a corresponding material blocking structure 021 needs to be disposed on the upper mold 021, as shown in fig. 7. After the upper mold 021 and the lower mold 022 are closed, one side surface of the circuit board jointed board 01 is attached to the lower mold 022, one part of the other side surface of the circuit board jointed board 01 is covered by the material blocking structure 0211, a cavity is formed between the part which is not covered by the material blocking structure 0211 and the upper mold 021, a molding material is molded in the cavity to form a molding layer 03, the molding layer 03 is provided with a window 031 at a position corresponding to the material blocking structure 0211, as shown in fig. 8, the sub-circuit board 0121 opposite to the window 031 is exposed, and after molding is completed, the molded circuit board 04 shown in fig. 9A and 9B is obtained.

During molding, in order to avoid a molding material from entering between the material blocking structure 0211 and the circuit board jointed board 01, the material blocking structure 0211 needs to be compressed on the circuit board jointed board 01, namely, a part of the circuit board 012 is compressed on the lower die 022 through the material blocking structure 0211, but the part of the circuit board 012 which is not covered by the material blocking structure 0211 cannot be compressed on the lower die by the upper die, and then the molding material more easily permeates into a gap between the circuit board 012 and the lower die 022, so that the circuit board 012 is tilted.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board, when solving circuit board among the prior art mould, the problem between circuit board unit and the bed die is oozed easily to the molding material.

Another object of the utility model is to provide a circuit board semi-manufactured goods, this circuit board semi-manufactured goods transportation is convenient, is difficult to damage during the transportation.

Another object of the present invention is to provide an electronic device including the above circuit board.

According to an aspect of the present invention, there is provided a circuit board, comprising a substrate and a plurality of circuit board units disposed on the substrate in a spaced manner, wherein at least a portion of a first surface of each of the circuit board units is bonded to a surface of the substrate, and a second surface of each of the circuit board units protrudes from a surface of the substrate, and the substrate is a molding layer or a molding circuit board.

Further, the substrate is a molding layer, the molding layer comprises a plurality of windows, and the windows are opposite to part of the surface of at least one circuit board unit.

Further, the substrate is a molded circuit board, the molded circuit board comprises a plurality of molded circuit board sub-circuit boards and a molding material filled between the molded circuit board sub-circuit boards, and the circuit board unit is at least partially overlapped with the molded circuit board sub-circuit boards.

Further, the substrate is a molded wiring board having a surface formed of a molding material, and the circuit board unit is disposed on the surface formed of the molding material.

Furthermore, the circuit board unit is an electrode, and the thickness of the second surface of the circuit board unit protruding out of the surface of the substrate is 0.05-0.1 mm; or, the circuit board unit is a circuit board, and the thickness of the second surface of the circuit board unit protruding out of the surface of the substrate is 0.3-0.4 mm.

According to another aspect of the present invention, there is provided a circuit board semi-finished product, which comprises a substrate and a plurality of sub-circuit boards separately disposed on the substrate, wherein at least a portion of a first surface of each sub-circuit board is bonded to a surface of the substrate, and a second surface of each sub-circuit board protrudes from a surface of the substrate, and the substrate is a molding layer or a molding circuit board.

Further, the substrate is a molding layer, and the molding layer comprises a plurality of windows, and the windows are opposite to part of the surface of the sub circuit board.

Furthermore, the sub circuit board comprises a plurality of mutually independent circuit board units, at least one part of the first surface of each circuit board unit is combined with the substrate, and the second surface of each circuit board unit protrudes out of the surface of the substrate.

Furthermore, the periphery of at least one circuit board unit is provided with other circuit board units.

Furthermore, the sub circuit board is an electrode, and the thickness of the second surface of the sub circuit board protruding out of the surface of the molding layer is 0.05-0.1 mm; or the sub circuit board is a circuit board, and the thickness of the second surface of the sub circuit board protruding out of the surface of the molding layer is 0.3-0.4 mm.

According to another aspect of the present invention, there is provided a circuit board semi-finished product, which comprises a substrate and an etching layer disposed on the surface of the substrate, wherein the etching layer is suitable for etching to form a plurality of sub-circuit boards, and the substrate is a molding layer or a molded circuit board.

Further, the substrate has a plurality of windows, and the windows are opposite to part of the surface of the etching layer.

According to another aspect of the present invention, an electronic device is provided, including the circuit board of the present invention.

Furthermore, the electronic device is a projection module, and the projection module further comprises a light-emitting element, and the light-emitting element is attached to the second surface of at least one circuit board unit or the second surface of the sub-circuit board.

Further, the light-emitting element is provided with at least one positive electrode and at least one negative electrode, and the positive electrode and the negative electrode are respectively in conductive connection with at least one circuit board unit or the circuit of the sub-circuit board.

Furthermore, the electronic device is a camera module, and a photosensitive chip of the camera module is electrically connected with the circuit board.

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model adopts the method of molding and etching to prepare the circuit board, when molding, the molding material can not permeate into the other side of the sub-circuit board (or the circuit board unit), thus solving the problem that the sub-circuit board (or the circuit board unit) is easy to tilt because the molding material easily permeates between the sub-circuit board (or the circuit board unit) and the lower mold in the prior art; the method of molding first and etching second is adopted to prepare the circuit board, which is beneficial to improving the reliability of the semi-finished product of the circuit board and is convenient for the transportation of the semi-finished product of the circuit board; the circuit board prepared by the method of molding before etching is beneficial to improving the utilization rate of an etching layer and the design freedom of a sub circuit board (or a circuit board unit).

Drawings

FIG. 1 is a schematic view of one embodiment of a prior art circuit board panel;

FIG. 2 is a schematic view of another embodiment of a prior art circuit board panel;

FIG. 3 is a schematic view of a mold during molding in the prior art;

FIG. 4A is a schematic front view of one embodiment of a prior art molded wiring board;

FIG. 4B is a schematic backside view of one embodiment of a prior art molded wiring board;

FIG. 5 is a schematic diagram of one embodiment of a prior art circuit board;

FIG. 6A is a schematic sectional view of a molding in the prior art, FIG. 6B is an enlarged view of a part of FIG. 6A, and FIGS. 6A and 6B show a state where a molding material penetrates between a wiring board and a lower mold;

FIG. 7 is a schematic view of one embodiment of an upper mold as molded;

FIG. 8 is an exploded view of a prior art molding process;

FIG. 9A is a schematic front view of another embodiment of a molded wiring board of the prior art;

FIG. 9B is a schematic backside view of another embodiment of a prior art molded wiring board;

fig. 10A is a schematic perspective view of a circuit board according to the present invention;

fig. 10B is a schematic cross-sectional view of a first embodiment of a circuit board according to the present invention;

fig. 10C is a schematic cross-sectional view of a second embodiment of the circuit board of the present invention;

fig. 10D is a schematic cross-sectional view of a circuit board according to a third embodiment of the present invention;

fig. 10E is a schematic cross-sectional view of a fourth embodiment of the circuit board of the present invention;

fig. 10F is a schematic cross-sectional view of a fifth embodiment of the circuit board of the present invention;

fig. 10G is a schematic cross-sectional view of a fifth embodiment of the circuit board of the present invention;

fig. 11 is a schematic diagram of a sixth embodiment of a circuit board according to the present invention;

fig. 12 is a schematic diagram of a seventh embodiment of the circuit board of the present invention;

fig. 13 is a schematic view of a first embodiment of a circuit board semi-finished product D2 according to the present invention;

fig. 14A is a schematic front view of a second embodiment of a circuit board blank D2 according to the present invention;

fig. 14B is a schematic back view of a second embodiment of a circuit board blank D2 according to the present invention;

fig. 15 is a schematic view of a third embodiment of a circuit board semi-finished product D2 according to the present invention;

fig. 16 is a schematic view of a fourth embodiment of a circuit board semi-finished product D2 according to the present invention;

fig. 17A is a schematic view of an embodiment of a circuit board blank D1 according to the present invention;

fig. 17B is an exploded view of an embodiment of a circuit board blank D1 according to the present invention;

fig. 18 is an exploded schematic view of a molding step of the circuit board manufacturing method of the present invention, showing an etching layer provided between an upper mold and a lower mold;

FIG. 19 is a schematic diagram of the daughter circuit board layout;

fig. 20 is a schematic view of an upper mold used in a molding step of the circuit board manufacturing method of the present invention;

fig. 21 is a schematic diagram of an intermediate product of another embodiment of the circuit board manufacturing method of the present invention;

FIG. 22 is a schematic view of a prior art molded wiring board electrically connected to a predetermined wiring board Y of an electronic device;

fig. 23 is a schematic view of the conductive connection between the circuit board and the preset circuit board Y of the electronic device according to the present invention;

in the figure: 01. splicing the circuit boards; 011. an outer frame; 012. a circuit board; 0121. a sub-circuit board; 013. a connecting portion; 02. a mold; 021. an upper die; 0211. a material blocking structure; 022. a lower die; 03. a molding layer; 031. windowing; 04. molded circuit board

1. Etching the layer; 101. a first surface; 102. a second surface; 11. a sub-circuit board; 111. a circuit board unit; 2. a mold; 21. an upper die; 211. a material blocking structure; 22. a lower die; 3. a substrate; 3a, a molding layer; 3b, molding a circuit board; 30b, a molding surface; 31b, molding the board sub-circuit board; 301. and (6) windowing.

Detailed Description

The present invention will be further described with reference to the following detailed description, and it should be noted that, in the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

In the description of the present invention, it should be noted that, for the orientation words, if there are terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and positional relationship indicated are based on the orientation or positional relationship shown in the drawings, and only for the convenience of describing the present invention and simplifying the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and not be construed as limiting the specific scope of the present invention.

It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

As shown in fig. 10A, the present invention provides a circuit board D, which comprises a substrate 3 and a plurality of circuit board units 111 disposed on the substrate 3 and separated from each other, wherein at least a portion of the first surface of each circuit board unit 111 is combined with the surface of the substrate 3, and the second surface of each circuit board unit 111 protrudes from the surface of the substrate 3.

The circuit board D of the present invention is different from the existing circuit board (for example, the circuit board shown in fig. 5) in that the circuit board unit 111 protrudes from the surface of the substrate 3, and the circuit board unit 111 protrudes from the surface of the substrate 3 and is determined by the manufacturing method of the circuit board D. The utility model discloses a preparation of circuit board unit 111 combines the etching layer that forms circuit board unit 111 with base plate 3 earlier, then etches the etching layer again to obtain a plurality of circuit board unit 111 of mutual separation, consequently the circuit board unit 111 protrusion that finally forms in base plate 3. The utility model provides a circuit board D's beneficial effect lies in: each circuit board unit 111 need not to keep being connected with the frame through connecting portion, therefore circuit board unit 111's the mode of arranging is more nimble, also is favorable to improving the material utilization ratio on etching layer, and in addition, circuit board unit 111's planarization is better, and difficult emergence perk.

The substrate 3 in the circuit board D may be a molding layer 3a formed of a resin material, as shown in fig. 10B or fig. 11. When the substrate 3 is the molding layer 3a, an etching layer for forming the circuit board unit 111 is provided first, then molding is performed on one side of the etching layer, so that the molding layer 3a is obtained on the etching layer, and then the etching layer is etched from the other side of the etching layer where the molding material is not provided, so that a plurality of circuit board units 111 separated from each other are obtained.

The substrate 3 in the circuit board D may also be a molded wiring board 3b that has been molded, as shown in fig. 10C, 10D, 10E, or 12. The molded wiring board 3b may have various embodiments:

in some embodiments, the molded wiring board 3b includes a plurality of molded board sub-wiring boards 31b and a molding material filled between the molded board sub-wiring boards 31b, as shown in fig. 10C or 10D or 10G. The circuit board unit 111 provided on the molded board 3b may completely overlap or partially overlap with the molded board sub-board 31b, so that the circuit board unit 111 is conductively connected to the molded board sub-board 31b, as shown in fig. 10C or 10D. Of course, the circuit board unit 111 disposed on the molded circuit board 3b may not overlap with the molded circuit board sub-circuit board 31b, that is, the circuit board unit 111 is disposed on the surface formed by the molding material, as shown in fig. 10G, at this time, whether to perform conductive connection with the molded circuit board sub-circuit board 31b may be selected according to actual needs, and if so, the circuit board unit 111 and the molded circuit board sub-circuit board may be connected by a conductive wire (not shown in the figure).

In other embodiments, the molded circuit board 3b includes a plurality of molded board sub-circuit boards 31b and a molding material filled between the molded board sub-circuit boards 31b and covering one side of the molded board sub-circuit boards 31b, as shown in fig. 10E, that is, the molded circuit board 3b has a molding surface 30b formed of the molding material. The circuit board unit 111 is disposed on the molding surface 30b of the molded circuit board 3b, and the circuit board unit 111 disposed on the molded circuit board 3b and the molded board sub-circuit board 31b do not overlap, and the circuit board unit 111 and the molded board sub-circuit board 31b can be selected according to actual needs to be electrically connected, and if electrically connected, the circuit board unit 111 and the molded board sub-circuit board 31b can be connected by a conductive wire (not shown in the figure).

In still other embodiments, the molded circuit board 3b includes a molding material layer and a plurality of molded board sub-circuit boards 31b disposed on one side of the molding material layer, as shown in fig. 10F, that is, the molded circuit board 3b has a molding surface 30b formed by the molding material, the circuit board unit 111 is disposed on the molding surface 30b of the molded circuit board 3b, and the circuit board unit 111 disposed on the molded circuit board 3b and the molded board sub-circuit boards 31b do not overlap, and the circuit board unit 111 and the molded board sub-circuit boards 31b can be selected according to actual needs to be electrically connected, and if electrically connected, the circuit board unit 111 and the molded board sub-circuit boards 31b can be connected by conductive wires (not shown.

When the substrate 3 is a molded wiring board 3b, an etching layer (which may be formed by vapor deposition or electroplating) is first formed on the surface of the molded wiring board 3b, and then the etching layer is etched, thereby obtaining circuit board units 111 separated from each other.

The molded circuit board 3b of the present invention can be produced by a conventional process (for example, the molded circuit board 3b shown in fig. 10C, 10D, 10E, and 10G), or by a method provided later in the present invention (for example, the molded circuit board 3b shown in fig. 10F).

The provision of the circuit board unit 111 on the molded wiring board 3b also has the following advantageous effects: the flexibility in the arrangement of the molded board sub-wiring board 31b on the molded wiring board 3b can be improved. When the circuit board is arranged in the electronic device, the circuit board needs to be electrically contacted with a preset circuit board Y. When the circuit board used is the separate molded circuit board 3b, as shown in fig. 22, in order to ensure that the molded board sub-circuit board 31b on the molded circuit board 3b is electrically contacted with the circuit board Y, the position of the molded board sub-circuit board 31b needs to correspond to the circuit board Y, and thus the design flexibility of the molded board sub-circuit board 31b is low. When the circuit board D in which the substrate 3 is the molded circuit board 3b is used, as shown in fig. 23, even if the molded board sub-circuit board 31b does not correspond to the circuit board Y, the circuit board unit 111 can be electrically connected to the molded board sub-circuit board 31b by designing the circuit board unit 111, and the circuit board unit 111 corresponds to the circuit board Y, so that the electrically conductive connection between the molded board sub-circuit board 31b and the circuit board Y is realized, and the design flexibility of the molded board sub-circuit board 31b can be greatly improved.

The utility model provides a circuit board D is suitable for being installed in an electron device integratively. Of course, it is not excluded that the above-mentioned circuit board D is cut to separate the circuit board units 111, and then the circuit board units 111 are mounted in at least one electronic device, respectively.

The utility model discloses a circuit board D can be applied to all kinds of electronic device, for example module or LED light source board etc. make a video recording, of course, the type of the electronic device of application circuit board D is not limited to enumerate above.

The aforementioned "at least a portion of the first surface of each circuit board unit 111 is bonded to the substrate 3" means: in some embodiments, the first surface of each circuit board unit 111 is entirely bonded to the substrate 3, as shown in fig. 10A to 10F or fig. 12; in other embodiments, the substrate 3 is formed with a window 301, as shown in fig. 11, a portion of the first surface of the circuit board unit 111 is opposite to the window 301, and another portion is combined with the substrate 3, so that a portion of the first surface of the circuit board unit 111 is exposed, and the purpose of the invention is mainly to provide other components on the exposed first surface of the circuit board unit 111 to ensure that the components are electrically connected with the circuit board unit 111.

It will be understood by those skilled in the art that the circuit board unit 111 may be an electrode or various circuit boards. In some embodiments, the circuit board unit 111 is an electrode, and the thickness of the second surface of the circuit board unit 111 protruding from the surface of the substrate 3 is 0.05-0.1 mm. In other embodiments, the circuit board unit 111 is a circuit board, and the thickness of the second surface of the circuit board unit 111 protruding from the surface of the substrate 3 is 0.05-0.1 mm.

In actual production, in order to improve the efficiency of processing circuit boards, a plurality of circuit boards are generally processed integrally to obtain a circuit board semi-finished product, and then the circuit board semi-finished product is cut to obtain a plurality of circuit boards separated from each other. Based on this, the present invention also provides a circuit board semi-finished product D2, as shown in fig. 13, 14A, 14B, 15 and 16.

The utility model discloses a circuit board semi-manufactured goods D2 includes base plate 3 and sets up a plurality of sub circuit board 11 on base plate 3 with separating each other, and at least partly and the base plate 3 of the first surface of each sub circuit board 11 combine, and the second surface protrusion of each sub circuit board 11 is on the surface of base plate 3.

The utility model provides an each sub-circuit board 11 in the semi-manufactured goods D2 of circuit board is suitable for and installs in electronic device alone. It should be noted that the layout of the circuit on the sub-circuit board 11 may be the same as or different from the circuit board D.

The sub-circuit board 11 can be applied to various electronic devices, such as a camera module or an LED light source board, and the type of the electronic device to which the sub-circuit board 11 is applied is not limited to the above list.

The utility model discloses a circuit board semi-manufactured goods D2 mainly lies in its sub circuit board 11 to be protrusion in base plate 3 surface with the difference of current circuit board semi-manufactured goods, and so protrusion in base plate 3 surface of sub circuit board 11 is decided by circuit board semi-manufactured goods D2's preparation method. The utility model discloses a preparation of circuit board semi-manufactured goods D2 combines the etching layer that forms sub-circuit board 11 with base plate 3 earlier, then etches the etching layer again to obtain a plurality of mutual separated sub-circuit board 11, consequently the sub-circuit board 11 protrusion that finally forms in base plate 3. The utility model provides a semi-manufactured goods D2 of circuit board's beneficial effect lies in: since the etching step is performed in the last step, each sub circuit board 11 does not need to be connected with the frame through a connecting portion, so that the arrangement manner of the sub circuit boards 11 is more flexible, the improvement of the material utilization rate of the etching layer is facilitated, and in addition, the flatness of the sub circuit boards 11 is better and the tilting is not easy to occur.

The substrate 3 in the circuit board semi-finished product D2 may be a molded layer 3a formed of a resin material, or may be a molded wiring board 3b that has been molded. When the substrate 3 is the molding layer 3a, as shown in fig. 14A or 15, an etching layer for forming the sub circuit board 11 is provided first, then molding is performed on the etching layer to produce the molding layer 3a on the etching layer, and then the etching layer is etched to obtain a plurality of sub circuit boards 11 separated from each other. When the substrate 3 is a molded circuit board 3b, an etching layer (which may be formed by vapor deposition or electroplating) is first formed on the surface of the molded circuit board 3b, and then the etching layer is etched, so as to obtain the sub-circuit boards 11 separated from each other. The molded circuit board 3b can be prepared by the prior art by etching first and then molding, or by the technique provided by the utility model by etching first and then molding.

In some embodiments, each sub-circuit board 11 includes a plurality of circuit board units 111 spaced apart from each other, as shown in fig. 14A or 15 or 16. Each circuit board unit 111 of the sub circuit board 11 is formed when etching the etching layer.

In some embodiments, the sub-circuit board 11 of the semi-finished circuit board D2 includes a plurality of circuit board units 111 separated from each other, and at least one circuit board unit 111 is provided with other circuit board units 111 around. The other circuit board units 111 around and the circuit board unit 111 may belong to the same sub circuit board 11, or may belong to different sub circuit boards 11. For example, when the circuit board units 111 of the sub-circuit board 11 are arranged in an array of 3 rows and 3 columns, one circuit board unit 111 in the middle of the sub-circuit board 11 and the other circuit board units 111 arranged around the same sub-circuit board 11 belong to the same sub-circuit board 11; when the circuit board units of the sub-circuit board 11 are arranged in an array of 2 rows and 3 columns, one row of circuit board units 111 of the sub-circuit board 11 is adjacent to one row of circuit board units 111 of another sub-circuit board 11, as shown in fig. 16, the other circuit board units 111 around one circuit board unit 111 in the middle of the row of circuit board units 111 respectively belong to two sub-circuit boards 11.

In some embodiments, the sub-circuit board 11 is an electrode, and the thickness of the second surface of the sub-circuit board 11 protruding from the surface of the substrate 3 is 0.05-0.1 mm. In other embodiments, the sub-circuit board 11 is a circuit board, and the thickness of the second surface of the sub-circuit board 11 protruding from the surface of the substrate 3 is 0.05-0.1 mm.

In some embodiments, the substrate 3 is a molding layer 3a, and the molding layer 3a includes a plurality of windows 301, and the windows 301 are opposite to a portion of the surface of the sub-circuit board 11, such that the portion of the surface of the sub-circuit board 11 is exposed, so as to facilitate disposing other components on the portion of the surface later, as shown in fig. 14A, 14B, and 15.

The utility model provides a circuit board semi-manufactured goods D1, as shown in FIG. 17A, 17B, this circuit board semi-manufactured goods D1 is for not carrying out the circuit board of etching, and circuit board semi-manufactured goods D1 can obtain circuit board semi-manufactured goods D2 through the etching. The semi-finished circuit board D1 includes a substrate 3 and an etching layer 1 disposed on the surface of the substrate 3, wherein the etching layer 1 is suitable for etching to form a plurality of sub-circuit boards (shown by dotted lines).

The substrate 3 in the circuit board semi-finished product D1 may be a molded layer 3a formed of a resin material, or may be a molded wiring board 3b that has been molded. When the substrate 3 is the mold layer 3a, the etching layer 1 is provided first, and then molding is performed on the etching layer 1, thereby obtaining the mold layer 3a on the etching layer 1. When the substrate 3 is a molded wiring board 3b, an etching layer 1 is formed on the surface of the molded wiring board 3b (the etching layer 1 may be formed by vapor deposition or plating). The molded circuit board 3b can be prepared by the prior art by etching first and then molding, or by the technique provided by the utility model by etching first and then molding.

The utility model discloses a half-finished product D1 of circuit board mainly lies in with the difference of the half-finished product of current circuit board: circuit board semi-manufactured goods D1 is before etching layer 1, earlier etch layer 1 and base plate 3 combination, consequently, etch layer 1 obtains base plate 3's support, when circuit board semi-manufactured goods D1 transports, etch layer 1 is difficult to buckle the damage, and because etch layer 1 one side is connected with base plate 3, during each sub-circuit board 11 of etching, need not to set up connecting portion between each sub-circuit board 11, also need not to reserve the frame, consequently, sub-circuit board 11's the mode of arranging can be more nimble, etch layer 1's material utilization is also higher.

The utility model provides a circuit board preparation method, including following step:

s1, providing an etching layer 1, as shown in fig. 18, the etching layer 1 having a continuous first surface 101, the etching layer 1 being suitable for forming a plurality of sub-circuit boards 11;

s2, placing the etching layer 1 into the mould 2 for in-mould injection molding, and forming a molding layer 3a on the first surface 101 of the etching layer 1;

s3, removing the excess material on the etching layer 1 not used to constitute the sub circuit board 11 from the second surface 102 of the etching layer 1.

The circuit board prepared by the method can be directly applied to an electronic device, each sub-circuit board 11 independently plays the function of the circuit board, and the circuit board can also be cut, and each independent sub-circuit board 11 is independently applied to the electronic device. When the circuit board prepared by the above method needs to be cut, the intermediate product obtained in step S2 is the aforementioned circuit board semi-finished product D1, and the intermediate product obtained in step S3 is the aforementioned circuit board semi-finished product D2.

It will be understood by those skilled in the art that the sub-circuit board 11 may be a flexible circuit board, a rigid circuit board or a rigid-flex circuit board, the sub-circuit board 11 may be a single panel, a double-sided board or a multi-layer board, and the sub-circuit board 11 may form an electrode or a conductive circuit. For example, the sub-board 11 may be an alumina ceramic board, an aluminum nitride ceramic board, an aluminum substrate, a copper substrate, or the like.

The in-mold injection molding or molding of the utility model refers to: and placing a device to be molded into an injection mold, and injecting resin into a cavity between the device and the mold to integrate the resin and the device. The resin required for molding belongs to the prior art, and the molding material is not limited by the invention.

As shown in fig. 18, the mold 2 includes an upper mold 21 and a lower mold 22, and when the etching layer 1 is set in the mold 2, the first surface 101 faces the inner surface of the upper mold 21, and the second surface 102 faces the inner surface of the lower mold 22, and since it is necessary to set a molding material on the first surface 101 of the etching layer 1, the second surface 102 is attached to the lower mold 22, and a cavity is formed between the first surface 101 and the upper mold 21. It will be understood by those skilled in the art that the mold 2 has a mold flow inlet (not shown) through which the molding material is injected into the cavity.

It will be appreciated by those skilled in the art that the desired daughter circuit board 11 may be designed in different shapes and/or sizes for different electronic devices. In step S3, the excess material on the etching layer 1 that is not used to constitute the sub circuit board 11 is removed according to the shape and/or size of the sub circuit board 11 designed in advance. In fig. 17A, the dotted lines on the etching layer 1 are an example of the layout design of each daughter circuit board 11, and in step S3, the extra material to be removed, i.e. the area outside the dotted lines, is removed. Of course, the arrangement of the sub circuit boards 11 is not limited to the arrangement shown in fig. 17A.

In step S1, the sub circuit boards 11 are not formed into the required shape and/or size, and the sub circuit boards 11 are connected by the "extra material" on the etching layer 1, i.e. the first surface 101 of the etching layer 1 has no gap; in step S2, the molding layer 3a is disposed on the first surface 101 of the etching layer 1, and since there is no gap on the etching layer 1, the molding material cannot penetrate between the etching layer 1 and the lower mold 22, which also solves the problem in the prior art that the sub-circuit board is easily tilted due to the molding material easily penetrating between the sub-circuit board and the lower mold; after the molding is completed, in step S3, etching is performed on the second surface 102 of the etching layer 1 to remove excess material, so as to obtain the desired daughter circuit board 11.

Because the utility model discloses a mode preparation circuit board of etching after moulding earlier, consequently when the etching, needn't like among the prior art between each sub-circuit board 11 reserve connecting portion, the utility model discloses a moulding layer 3a can play the effect of connecting portion. After etching, although the sub-circuit boards 11 are separated from each other, the sub-circuit boards 11 are not completely separated in structure due to the molding layer 3a, and thus the transportation of the circuit board semi-finished product D2 is convenient, and the sub-circuit boards 11 are not easily damaged during the transportation. In addition, since the positions of the connection portions do not need to be reserved, when the arrangement of the sub circuit boards 11 is designed on the etching layer 1, the distance between the sub circuit boards 11 can be correspondingly reduced, as shown in fig. 15, the positions of the frame and the connection portions do not need to be reserved on the etching layer 1, so that the space of the etching layer 1 can be fully utilized, and the waste of materials is reduced. Further, since the respective sub circuit boards 11 do not need to be kept connected by the connecting portions, the degree of freedom in designing the arrangement of the sub circuit boards 11 is also higher.

In step S3, the second surface 102 of the etching layer 1 is etched to remove the excess material that is not used to form the sub-circuit boards 11 from the etching layer 1, thereby leaving only the sub-circuit boards 11 on the molding layer 3a and separating the sub-circuit boards 11 from each other. Those skilled in the art will appreciate that etching is a technique for removing material using a chemical reaction or physical impact, and in combination with the fact that the etching layer 1 is actually, those skilled in the art can select a suitable etching process to remove the excess material on the etching layer 1, and the etching process can be, but is not limited to, electrolysis, photolithography, and the like.

In some preferred embodiments, each daughter circuit board 11 is adapted to be individually mounted in an electronic device, and the product obtained in step S3 needs to be cut to completely separate the daughter circuit boards 11 from the structure. In these embodiments, the above method for manufacturing a circuit board further includes the steps of: s4, the molding layer 3a between the sub-circuit boards 11 is cut to separate the sub-circuit boards 11. It should be noted that after cutting, the cross section of the molding layer 3a on the sub circuit board 11 may be larger than the cross section of the sub circuit board 11, or may be the same as the cross section of the sub circuit board 11.

Further, the sub circuit board 11 includes a plurality of independent circuit board units 111, and therefore, in the step S3, the excess material on the etching layer 1 includes the material connecting the sub circuit boards 11 and the material connecting the circuit board units 111. In these embodiments, step S3 includes: excess material between the sub circuit boards 11 is removed from the second surface 102 of the etching layer 1, and excess material between the circuit board units 111 on the sub circuit boards 11 is removed from the second surface 102 of the etching layer 1.

Each circuit board unit 111 of the present invention can be kept connected by the molding layer 3a, so that it is not necessary to connect each circuit board unit 111 with the outer frame by a connecting portion as in the prior art. For example, fig. 16 shows an arrangement of the sub circuit board 11 including a plurality of circuit board units 111, each of the chain line boxes indicates a sub circuit board 11 (two sub circuit boards 11 are shown in the figure), and the sub circuit board 11 includes a plurality of circuit board units 111 independent of each other.

If the sub circuit board 0121 is connected to the chassis 011 through the connecting part 013 (the part shown by the dotted line in the figure) during etching, as shown in fig. 19, the sub circuit board 0121 marked B cannot be arranged because it cannot be connected to the chassis 011, the sub circuit board 0121 marked a is only connected and fixed by the connecting part 013, the stability is poor, and the bending and warping are likely to occur during transportation or molding according to the prior art method. That is, if it is necessary to obtain the daughter circuit board 11 arranged as shown in fig. 19, it is impossible to achieve with the prior art. It should be noted that, in the prior art, the circuit board unit marked as B and the circuit board unit marked as a are not connected through the connecting portion, mainly because the inside of the sub-circuit board 11 is not cut after molding, and if the connecting portion is provided, the connecting portion between the two circuit board units cannot be cut after molding.

And adopt the utility model provides a method, the etching after moulding, then need not consider at all whether circuit board unit 111 can be connected with frame 011, even when designing, need not design frame 011, as shown in fig. 16. The etching layer 1 is etched after the integral etching layer 1 is molded, redundant materials between each circuit board unit 111 and each sub circuit board 11 are removed during etching, after the materials are removed, the circuit board units 111 cannot be completely separated due to the molding layer 3a, the circuit board semi-finished product D2 can still be conveniently transported, and in the transportation process, the circuit board units 111 are supported by the molding layer 3a and are not easy to bend. Adopt the utility model provides a method preparation circuit board, the utilization ratio on etching layer 1 is higher, and the design degree of freedom of sub-circuit board 11 is also higher.

In some preferred embodiments, a portion of the surface of the first surface 101 of each sub-circuit board 11 does not need to be covered by the molding layer 3, and this portion of the exposed surface needs to be electrically connected to other electronic devices, as shown in fig. 11 or 14B. In order to make the molding layer 3 form windows at positions where the sub circuit boards 11 are not required to be covered during molding, corresponding dam structures 211 are provided on the upper mold 21, as shown in fig. 20, when the etching layer 1 is provided between the upper mold 21 and the lower mold 22, the dam structures 211 of the upper mold 21 cover the surface of each sub circuit board 11 where the molding material is not required to be provided. Based on this, step S2 includes the steps of:

s21, providing a lower mold 22 and an upper mold 21 with a dam structure 211, disposing the etching layer 1 between the lower mold 22 and the upper mold 21, forming a cavity between the first surface 101 of the etching layer 1 and the upper mold 21, and covering a part of the surface of the daughter circuit board 11 with the dam structure 211;

s22, injecting a molding material into the cavity, wherein the molding material covers the part of the first surface 101 of the etching layer 1 which is not covered by the baffle structure 211;

s23, after the molding material is formed, a molding layer 3 is formed on the first surface 101 of the etching layer 1.

Due to the dam structures 211, the finally formed molding layer 3 has the windows 301, and the portions of the sub-circuit board 11 that need to be exposed are opposite to the windows 301, as shown in fig. 11 or 14B.

In some embodiments, each circuit board unit 111 of the sub-circuit board 11 has a portion that needs to be exposed, and when the blocking structure 211 is designed, a blocking structure 211 is designed for the portion that needs to be exposed of each circuit board unit 111. However, when the number of the circuit board units 111 is large, the number of the dam structures 211 is also large, which is not favorable for the molding material to flow in the cavity.

In other embodiments, each circuit board unit 111 of the sub-circuit board 11 has a portion that needs to be exposed, and when designing the blocking structure 211, an integral blocking structure 211 is disposed for the plurality of circuit board units 111, and the blocking structure 211 can cover the portions that the plurality of circuit board units 111 need to be exposed at the same time, in this case, the blocking structure 211 covers not only the portions that the circuit board units 111 need to be exposed, but also the area between some circuit board units 111, so that the window 301 of the finally formed molding layer 3 is opposite to the portions that the plurality of circuit board units 11 need to be exposed, and is also opposite to the area between the circuit board units 11.

The utility model also provides a circuit board preparation method, including following step:

s1, providing a molding circuit board 3 b;

s2, disposing an etching material on one surface of the molded wiring board 3b, thereby forming an etching layer 1 on the surface of the molded wiring board 3b, the etching layer 1 being suitable for forming at least one sub-circuit board 11, as shown in fig. 21;

s3, excess material on the etching layer 1 that is not used for constituting the sub-circuit board 11 is removed (e.g., material other than the dotted line in fig. 21), thereby forming the sub-circuit board 11 on the molded wiring board 3 b.

It is worth mentioning that each sub circuit board 11 may include a plurality of circuit board units 111 separated from each other, that is, in step S3, the excess material between the circuit board units 111 of the sub circuit board 11 is also removed from the etching layer 1.

Further, the step S3 is followed by the following steps: s4, the molded wiring board 3b between the sub-circuit boards 11 is cut to separate the sub-circuit boards 11.

The utility model also provides an electron device, this electron device include aforementioned circuit board D or by the circuit board that aforementioned circuit board preparation method made.

In some embodiments, the electronic device is a camera module, and the photosensitive chip of the camera module is electrically connected to the circuit board.

In other embodiments, the electronic device is a projection module, such as an LED light source board, and the projection module includes a light emitting element attached to at least one circuit board unit 111 of the circuit board or the second surface of the sub-circuit board 11.

Further, the light emitting element has at least one positive electrode and at least one negative electrode, and the positive electrode and the negative electrode are respectively and electrically connected with the circuit of the at least one circuit board unit 111 or the sub-circuit board 11.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A circuit board comprises a substrate and a plurality of circuit board units which are arranged on the substrate in a mutually separated mode, and is characterized in that at least one part of the first surface of each circuit board unit is combined with the surface of the substrate, the second surface of each circuit board unit protrudes out of the surface of the substrate, and the substrate is a molding layer or a molding circuit board.

2. The circuit board of claim 1, wherein the substrate is a molding layer, the molding layer including a plurality of windows, the windows being opposite to a portion of a surface of at least one of the circuit board units.

3. The circuit board of claim 1, wherein the substrate is a molded circuit board including a plurality of molded circuit board sub-circuit boards thereon and a molding material filled between the molded circuit board sub-circuit boards, and the circuit board unit at least partially overlaps the molded circuit board sub-circuit boards.

4. The circuit board according to claim 1, wherein the substrate is a molded wiring board having a surface formed of a molding material, and the circuit board unit is disposed on the surface formed of the molding material.

5. The circuit board of claim 1, wherein the circuit board unit is an electrode, and the second surface of the circuit board unit protrudes from the substrate surface by a thickness of 0.05-0.1 mm; or, the circuit board unit is a circuit board, and the thickness of the second surface of the circuit board unit protruding out of the surface of the substrate is 0.3-0.4 mm.

6. A semi-finished product of a circuit board is characterized by comprising a substrate and a plurality of sub-circuit boards which are arranged on the substrate in a mutually separated mode, wherein at least one part of the first surface of each sub-circuit board is combined with the surface of the substrate, the second surface of each sub-circuit board protrudes out of the surface of the substrate, and the substrate is a molding layer or a molding circuit board.

7. The circuit board blank according to claim 6, wherein the substrate is a molding layer, the molding layer comprising a plurality of windows, the windows being opposite to a portion of the surface of the sub-circuit board.

8. The circuit board blank according to claim 6, wherein the daughter circuit board comprises a plurality of independent circuit board units, at least a portion of the first surfaces of the circuit board units is bonded to the substrate, and the second surface of each circuit board unit protrudes from the surface of the substrate.

9. The circuit board blank according to claim 8, wherein at least one of said circuit board units is provided with other said circuit board units around its periphery.

10. The circuit board semi-finished product of claim 6, wherein the sub-circuit board is an electrode, and the thickness of the second surface of the sub-circuit board protruding from the surface of the molding layer is 0.05-0.1 mm; or the sub circuit board is a circuit board, and the thickness of the second surface of the sub circuit board protruding out of the surface of the molding layer is 0.3-0.4 mm.

11. The circuit board semi-finished product is characterized by comprising a substrate and an etching layer arranged on the surface of the substrate, wherein the etching layer is suitable for etching to form a plurality of sub-circuit boards, and the substrate is a molding layer or a molding circuit board.

12. The circuit board blank according to claim 11, wherein the substrate has a plurality of windows, the windows being opposite to a portion of the surface of the etching layer.

13. An electronic device comprising a circuit board according to any one of claims 1-12.

14. The electronic device of claim 13, wherein the electronic device is a projection module, and the projection module further comprises a light-emitting element attached to the second surface of at least one of the circuit board unit and the sub-circuit board.

15. The electronic device of claim 14, wherein the light-emitting element has at least one positive electrode and at least one negative electrode, and the positive electrode and the negative electrode are electrically connected to at least one circuit of the circuit board unit or the sub-circuit board, respectively.

16. The electronic device of claim 13, wherein the electronic device is a camera module, and a light sensing chip of the camera module is electrically connected to the circuit board.