CN210245511U - Paster TVS diode - Google Patents
Paster TVS diode Download PDFInfo
- Publication number
- CN210245511U CN210245511U CN201921652855.7U CN201921652855U CN210245511U CN 210245511 U CN210245511 U CN 210245511U CN 201921652855 U CN201921652855 U CN 201921652855U CN 210245511 U CN210245511 U CN 210245511U
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- Prior art keywords
- copper
- tvs
- plastic shell
- tvs chip
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a surface mount TVS diode, which comprises a plastic shell, a copper pin, a TVS chip, a copper particle and white glue, wherein one surface of the plastic shell is provided with an opening, the opening extends inwards to form an accommodating cavity, and a limiting groove is arranged in the plastic shell; one end of the copper pin is arranged on the bottom wall of the containing cavity of the plastic shell, and the other end of the copper pin extends out of the plastic shell and is used for being communicated with a circuit; the TVS chip is arranged in the plastic shell containing cavity and used for realizing the circuit function; the TVS chip is welded between the two copper particles and arranged in the containing cavity of the plastic shell, one end of the TVS chip, away from the one copper particle, is welded on the copper pin, and the white glue is arranged in the containing cavity of the plastic shell and used for protecting the TVS chip and the insulation protection circuit. There is not mechanical stress in the whole technological process, and the TVS chip is difficult impaired, the spacing welding of TVS chip, and TVS chip location is accurate, and the stable performance is just controllable, paints the protection of white glue after the primary importance mechanism once only welds, moulds the spacing connection copper grain of shell, need not to glue again, simple process.
Description
Technical Field
The utility model relates to a diode field, in particular to paster TVS diode.
Background
At present, a Transient Voltage Suppressor (TVS) is used as an effective protection device to effectively suppress transient interference. The TVS is a diode with special functions made of silicon semiconductor materials, and when two ends of the TVS tube are subjected to instantaneous high-energy impact, the TVS tube can be quickly started, simultaneously absorbs surge current, and clamps the voltage between the two ends of the TVS tube to a preset value, so that the following precise electronic components are prevented from being damaged by the impact of transient high energy.
Conventional paster TVS diode adopts high-cost plastics mould pressing encapsulation, and equipment price is high, and the technology management and control degree of difficulty is great, and the TVS chip can't be spacing in the welding process to the stress of the relevant equipment of plastics encapsulation is very easily exerted on the TVS chip, like the extrusion force of mould pressing, cut the shearing force of curved foot etc. thereby leads to the TVS chip impaired, causes the loss of expensive TVS chip. If hidden damage is caused and finally the damage flows to a client, the reliability of the whole machine is affected, and the loss is beyond estimation, so a patch TVS diode needs to be provided to solve the technical problem.
SUMMERY OF THE UTILITY MODEL
The utility model provides a paster TVS diode, it is through adopting low-cost encapsulation white glue to combine the welding process of ripe shaft type diode, it is high to have the equipment price in many with the TVS diode who solves among the prior art, and the technology management and control degree of difficulty is great, and the TVS chip is unable spacing in the welding process, and the TVS chip is impaired easily, influences the reliability of complete machine, and the not reasonable problem inadequately of distribution of each part.
In order to solve the technical problem, the utility model adopts the technical scheme that:
a patch TVS diode, comprising:
the plastic shell is a cuboid, one surface of the plastic shell is provided with an opening, the opening extends towards the inside to form a containing cavity, and a limiting groove is formed in the plastic shell;
one end of the copper pin is arranged on the bottom wall of the containing cavity of the plastic shell, and the other end of the copper pin extends out of the plastic shell and is used for being communicated with a circuit;
the TVS chip is arranged in the plastic shell containing cavity and used for realizing the circuit function;
the copper particles comprise a first copper particle and a second copper particle, the TVS chip is welded between the two copper particles and is arranged in the cavity of the plastic shell, and one end, far away from the TVS chip, of the second copper particle is welded on the copper pin;
and the white glue is arranged in the containing cavity of the plastic shell and used for protecting the TVS chip and the insulation protection circuit.
Paster TVS diode in, mould shell minor face place inner wall in the middle of the opening side be equipped with a draw-in groove, the draw-in groove is along moulding the shell opening downwards, the draw-in groove width does copper pin width, the draw-in groove degree of depth are copper pin thickness half.
Paster TVS diode in, spacing recess sets up and puts at diapire central point, and spacing groove connection moulds two minor face place inner walls of shell, two groove limits of spacing recess and mould the parallel of shell long limit direction, the width with copper pin width is unanimous, and the degree of depth is copper pin thickness half.
Paster TVS diode in, first copper grain and second copper grain are located mould the shell and keep away from the one end of moulding shell opening draw-in groove department in the content chamber, first copper grain and second copper grain are hugged closely and are moulded two longer inner walls on the shell, first copper grain and second copper grain and mould shell opening draw-in groove department inner wall gapped.
Paster TVS diode in, the white glue is filled first copper grain and second copper grain with mould shell opening draw-in groove department in the clearance between the inner wall, the white glue fill copper grain with TVS chip connects back TVS chip around.
Paster TVS diode in, the three-section is buckled into to the copper pin, including fixed part, connecting portion and extension, the fixed part is located mould the spacing groove department of shell content chamber bottom, fixed part and extension are connected to connecting portion, the extension is located mould shell opening draw-in groove department.
Paster TVS diode in, copper pin connecting portion are perpendicular with the fixed part, copper pin connecting portion are perpendicular with the extension, the whole "Z" shape that is of copper pin.
Paster TVS diode in, first copper grain and second copper grain cross-section surround completely TVS chip cross-section, the spacing welding of TVS chip is in the middle of first copper grain and second copper grain, the second copper grain welding is on the copper pin.
Paster TVS diode in, copper grain, TVS chip and copper pin are placed when moulding the shell in, first copper grain upper surface and copper pin extension position parallel and level, the gross thickness of first copper grain, second copper grain, TVS chip and copper pin is higher than and moulds the shell and holds the chamber degree of depth.
Paster TVS diode in, first copper grain and second copper grain size are unanimous, are the cuboid.
The utility model discloses compare in prior art, its beneficial effect is: the utility model discloses a do not have mechanical stress in the whole technological process of paster TVS diode, the TVS chip is difficult for impairedly, the spacing welding of TVS chip, TVS chip location is accurate, stable performance and controllable, paints the protection of white glue after the main part mechanism once only welds, moulds the spacing connection copper grain of shell, need not the encapsulating once more, simple process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding drawings of some embodiments of the present invention.
Fig. 1 is a top view of the structure of the TVS diode of the present invention.
Fig. 2 is a schematic sectional view taken along the direction a in fig. 1.
Fig. 3 is the utility model discloses a paster TVS diode mould shell top view.
Fig. 4 is a schematic sectional view taken along the direction B in fig. 3.
Fig. 5 is a plan view of the limiting device for welding the main structure of the TVS diode of the present invention.
Fig. 6 is used for the utility model discloses a cross-sectional view during spacing welding of paster TVS diode major structure welded stop device.
Wherein, 1, first copper grain, 2, copper pin, 3, TVS chip, 4, mould the shell, 5, casting glue, 6, second copper grain, 7, stop device, 41, draw-in groove, 42, spacing recess
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, wherein fig. 1 is the structural plan view of the TVS diode, fig. 2 is a schematic cross-sectional view along a direction a in fig. 1, fig. 3 is the plastic shell plan view of the TVS diode, fig. 4 is a schematic cross-sectional view along a direction B in fig. 3, fig. 5 is a plan view of a limiting device for welding the main structure of the TVS diode, fig. 6 is a schematic cross-sectional view for limiting and welding the limiting device for welding the main structure of the TVS diode of the present invention.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The utility model provides a paster TVS diode, which comprises a plastic shell 4, a copper pin 2, a TVS chip 3, a copper particle and white glue 5, wherein the plastic shell 4 is a cuboid, one surface of the plastic shell 4 is provided with an opening, the opening extends to the inside to form an accommodating cavity, and the plastic shell 4 is provided with a limiting device; one end of the copper pin 2 is arranged on the bottom wall of the containing cavity of the plastic shell 4, and the other end of the copper pin extends out of the plastic shell 4 and is used for being communicated with a circuit; the TVS chip 3 is arranged in a containing cavity of the plastic shell 4 and used for realizing a circuit function, the copper particles comprise a first copper particle 1 and a second copper particle 6, the TVS chip 3 is welded between the two copper particles and is arranged in a limiting device in the containing cavity of the plastic shell 4, and one end, far away from the TVS chip 3, of the second copper particle 6 is welded on the copper pin 2; the white glue 5 is arranged in the containing cavity of the plastic shell 4 and used for protecting the TVS chip 3 and the insulation protection circuit. There is not mechanical stress in the whole technological process, TVS chip 3 is difficult impaired, TVS chip 3 limit welding, TVS chip 3 location is accurate, the stable performance and controllable, main body mechanism once only paints white glue 5 protection after the welding, moulds 4 limit connection copper particles of shell, need not to glue again, simple process.
The utility model discloses a theory of operation: coating solder paste on electrodes at two ends of a TVS chip 3, placing the TVS chip between a first copper particle 1 and a second copper particle 6, coating solder paste on the other end of the second copper particle 6, placing a copper pin 2 fixing part, wherein the first copper particle 1, the second copper particle 6, the TVS chip 3 and the copper pin 2 form a main body structure of a diode, placing the copper pin 2 fixing part upwards in a limiting device 7, then placing the TVS chip 3 into a welding furnace for one-time welding, limiting and welding the TVS chip 3, coating white glue 5 around the TVS chip 3, coating white glue 5 between a copper pin 2 connecting part and the first copper particle 1 and the second copper particle 6, clamping the main body structure in a plastic shell 4 with the copper pin 2 fixing part downwards, clamping the copper pin 2 extending part in a clamping groove 41 of the plastic shell 4, switching on a circuit, and when two ends of the TVS chip 3 are subjected to instantaneous high-energy impact, the TVS chip 3 can change the impedance value from high impedance to low impedance value at high impedance, so as to absorb an instantaneous large current and clamp the voltage across the TVS chip 3 at a predetermined value, thereby protecting the following circuit elements from the impact of the transient high voltage spike.
This completes the assembly and operation of the patch TVS diode of the preferred embodiment.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.
Claims (10)
1. A patch TVS diode, comprising:
the plastic shell is a cuboid, one surface of the plastic shell is provided with an opening, the opening extends towards the inside to form a containing cavity, and a limiting groove is formed in the plastic shell;
one end of the copper pin is arranged on the bottom wall of the containing cavity of the plastic shell, and the other end of the copper pin extends out of the plastic shell and is used for being communicated with a circuit;
the TVS chip is arranged in the plastic shell containing cavity and used for realizing the circuit function;
the copper particles comprise a first copper particle and a second copper particle, the TVS chip is welded between the two copper particles and is arranged in the cavity of the plastic shell, and one end, far away from the TVS chip, of the second copper particle is welded on the copper pin;
and the white glue is arranged in the containing cavity of the plastic shell and used for protecting the TVS chip and the insulation protection circuit.
2. The paster TVS diode of claim 1, wherein said plastic shell has a slot at the middle opening side of the inner wall where the short side of the plastic shell is located, the slot is downward along the opening of the plastic shell, the slot has a width equal to the width of said copper pin, and a depth equal to half the thickness of the copper pin.
3. The paster TVS diode of claim 1, wherein the limiting groove is formed in the center of the bottom wall, the limiting groove is connected to the inner wall of the plastic casing where the two short edges are located, the two groove edges of the limiting groove are parallel to the long edge direction of the plastic casing, the width of the limiting groove is consistent with the width of the copper pin, and the depth of the limiting groove is half of the thickness of the copper pin.
4. The paster TVS diode of claim 3, wherein said first and second copper particles are tightly attached to two longer inner walls of the plastic shell, and there is a gap between the first and second copper particles and the inner walls of the plastic shell opening at the slot.
5. The paster TVS diode of claim 4, wherein the white glue fills the gap between the first and second copper particles and the inner wall of the opening of the plastic casing at the card slot, and the white glue fills the copper particles and the TVS chip around the TVS chip after the TVS chip is connected.
6. The patch TVS diode of claim 1, wherein said copper pin is bent into three segments including a fixing portion, a connecting portion and an extending portion, wherein the fixing portion is located at a bottom limiting groove of said plastic housing inner cavity, the connecting portion connects the fixing portion and the extending portion, and the extending portion is located at said plastic housing opening slot.
7. The TVS diode as recited in claim 4, wherein the copper pin connecting portion is perpendicular to the fixing portion, the copper pin connecting portion is perpendicular to the extending portion, and the copper pin is generally "Z" -shaped.
8. The TVS diode of claim 1, wherein said first and second copper pellet cross sections completely surround said TVS chip cross section, with said TVS chip bonded intermediate said first and second copper pellets and said second copper pellet bonded to said copper pin.
9. The paster TVS diode of claim 1, wherein when said copper pellet, TVS chip and copper pin are placed inside said plastic casing, the upper surface of the first copper pellet is flush with the position of the copper pin extension, and the total thickness of the first copper pellet, the second copper pellet, the TVS chip and the copper pin is higher than the depth of the plastic casing cavity.
10. The patch TVS diode of claim 1, wherein said first and second copper particles are of uniform size and are cuboids.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921652855.7U CN210245511U (en) | 2019-09-29 | 2019-09-29 | Paster TVS diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921652855.7U CN210245511U (en) | 2019-09-29 | 2019-09-29 | Paster TVS diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210245511U true CN210245511U (en) | 2020-04-03 |
Family
ID=69965490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921652855.7U Active CN210245511U (en) | 2019-09-29 | 2019-09-29 | Paster TVS diode |
Country Status (1)
Country | Link |
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CN (1) | CN210245511U (en) |
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2019
- 2019-09-29 CN CN201921652855.7U patent/CN210245511U/en active Active
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