CN210245460U - Etching machine for digital publishing - Google Patents
Etching machine for digital publishing Download PDFInfo
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- CN210245460U CN210245460U CN201921116281.1U CN201921116281U CN210245460U CN 210245460 U CN210245460 U CN 210245460U CN 201921116281 U CN201921116281 U CN 201921116281U CN 210245460 U CN210245460 U CN 210245460U
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Abstract
The utility model discloses an etching machine for digital publication, the power distribution box comprises a box body, the front end surface of box articulates there is the chamber door, the lower extreme fixed surface of box installs gas pitcher and hydraulic press, the hydraulic press is located one side of gas pitcher, the upper end fixed surface of gas pitcher installs the air pump, fixed mounting has first intake pipe between air pump and the gas pitcher, the air pump passes through second intake pipe fixed connection and has the reaction hood, the upper end internal surface fixed mounting of reaction hood has the molecular pump, the equal fixed mounting in both ends surface has the outlet duct around both ends surface and the gas pitcher around the reaction hood, the upper end surface movable mounting of hydraulic press has the lifter, the upper end fixed surface of lifter installs the thing platform that holds in the palm, the upper end fixed surface of thing platform installs the sealing washer. The utility model discloses, it is more even to make the sculpture gas to the sculpture of wafer to be convenient for, the gaseous reuse of sculpture of being convenient for.
Description
Technical Field
The utility model relates to an etching machine technical field specifically is an etching machine for digital publishing.
Background
The digital publishing is that all information is stored in a medium such as an optical disc, a magnetic disc and the like in a digital form of a uniform binary code in the whole publishing process, the information is processed and received by a computer or a terminal device, an etching machine is a machine for processing chips, circuit boards and the like, and plasma etching in the etching machine is the most common form in dry etching.
Therefore, an etching machine for digital publishing is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an etching machine is used in digital publication, it is more even to the sculpture of wafer to be convenient for make the sculpture gaseous, the gaseous reuse of the sculpture of being convenient for to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an etching machine for digital publication, the power distribution box comprises a box body, the front end surface of box articulates there is the chamber door, the lower extreme external fixed surface of box installs gas pitcher and hydraulic press, the hydraulic press is located one side of gas pitcher, the upper end external fixed surface of gas pitcher installs the air pump, fixed mounting has first intake pipe between air pump and the gas pitcher, the air pump has a reaction hood through second intake pipe fixed connection, the upper end internal fixed surface of reaction hood installs the molecular pump, the equal fixed mounting in both ends surface has the outlet duct around both ends surface and the gas pitcher around the reaction hood, the upper end surface movable mounting of hydraulic press has the lifter, the upper end external fixed surface of lifter installs the thing platform, the upper end external fixed surface of thing platform installs the sealing washer.
Through placing the wafer at the support platform, the hydraulic press drives the lifter and moves upward, it contradicts with the reaction cover to hold up the sealing washer on the thing bench, the air pump is gaseous to carry the sculpture in the gas pitcher for the molecular pump through first intake pipe and second intake pipe, the sculpture is gaseous to be etched the wafer in the reaction cover through the molecular pump, the sculpture is gaseous after top-down etches the wafer, the inside of gas pitcher is reinforted into to two outlet ducts of intercommunication between rethread reaction cover and the gas pitcher, two outlet ducts are favorable to the gaseous flow of sculpture, can make the gaseous more even to the wafer sculpture, the inside of gas pitcher is reinforted into through two outlet ducts to the sculpture gas pitcher, and then form a circulation, be convenient for the gaseous reuse of sculpture.
Preferably, a handle is fixedly arranged on the outer surface of the front end of the box door.
The staff can hold the handle to open the box door conveniently.
Preferably, the air pump, the first air inlet pipe, the second air inlet pipe, the molecular pump, the two air outlet pipes, the air tank and the reaction cover are all communicated.
The etching gas can form a cycle when etching the wafer, so that the etching gas can be repeatedly used.
Preferably, the sealing ring is made of perfluororubber, and the sealing ring is annular.
The perfluoro rubber has the corrosion resistance effect, and can enable the sealing ring to have the corrosion resistance and sealing effects.
Preferably, the sealing ring is positioned right below the reaction hood and is matched with the outer surface of the lower end of the reaction hood.
The sealing ring plays a role in sealing, so that the etching gas can form a cycle when the wafer is etched, and the etching gas can be recycled conveniently.
Preferably, the two air outlet pipes have the same specification and correspond to each other in front and back.
The two air outlet pipes have the same specification, which is beneficial to the flowing of etching gas and can ensure that the etching gas can etch the wafer more uniformly.
Preferably, the air pump, the molecular pump and the hydraulic machine are electrically connected with an external power supply.
Can provide current to operate the etcher.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses, through the power of staff switch-on hydraulic press, place the wafer at the support bench, the hydraulic press drives the lifter and moves upward, it is contradicted with the reaction hood until the sealing washer of support bench, the power of staff switch-on air pump, the air pump is carried for the molecular pump through the etching gas of first intake pipe and second intake pipe in with the gas pitcher, the etching gas is etched the wafer in the reaction hood through the molecular pump, the etching gas is after top-down is etched the wafer, the inside of gas pitcher is carried into again to two outlet ducts of intercommunication between rethread reaction hood and the gas pitcher, the outlet duct is favorable to the gaseous flow of etching, can make the etching gas more even to the wafer sculpture, the etching gas is defeated the inside of sending into the gas pitcher again through two outlet ducts, and then form a circulation, be convenient for the gaseous reuse of etching.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a view showing the combination of the box body and the box door of the present invention;
FIG. 3 is a view showing the combination of the object supporting table and the sealing ring;
fig. 4 is a combined view of the gas tank and the reaction hood of the present invention.
In the figure: 1. a box body; 2. a box door; 3. a gas tank; 4. an air pump; 5. a reaction hood; 61. a first intake pipe; 62. a second intake pipe; 7. a molecular pump; 8. an air outlet pipe; 9. a hydraulic press; 10. a lifting rod; 11. a material supporting table; 12. and (5) sealing rings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: an etching machine for digital publishing is disclosed, as shown in fig. 1 to 4, and comprises a box body 1, wherein a box door 2 is hinged to the outer surface of the front end of the box body 1, a gas tank 3 and a hydraulic machine 9 are fixedly mounted on the outer surface of the lower end of the box body 1, the hydraulic machine 9 is positioned on one side of the gas tank 3, a gas pump 4 is fixedly mounted on the outer surface of the upper end of the gas tank 3, a first gas inlet pipe 61 is fixedly mounted between the gas pump 4 and the gas tank 3, the gas pump 4 is fixedly connected with a reaction hood 5 through a second gas inlet pipe 62, and a molecular pump 7 is fixedly mounted on the;
as shown in fig. 1, 2 and 3, the outer surfaces of the front and rear ends of the reaction hood 5 and the outer surfaces of the front and rear ends of the gas tank 3 are both fixedly provided with gas outlet pipes 8, the outer surface of the upper end of the hydraulic machine 9 is movably provided with a lifting rod 10, the outer surface of the upper end of the lifting rod 10 is fixedly provided with a material supporting table 11, and the outer surface of the upper end of the material supporting table 11 is fixedly provided with a sealing ring 12.
Through adopting above-mentioned technical scheme, place the wafer at the support platform 11, hydraulic press 9 drives lifter 10 and moves up, it is contradicted with reaction hood 5 until sealing washer 12 on the support platform 11, the gaseous molecular pump 7 of conveying for the etching in the gas pitcher 3 of air pump 4 through first intake pipe 61 and second intake pipe 62, the etching is gaseous to be etched the wafer in reaction hood 5 through molecular pump 7, the etching is gaseous after top-down etches the wafer, two outlet ducts 8 of intercommunication between rethread reaction hood 5 and the gas pitcher 3 are reinforted into the inside of gas pitcher 3, two outlet ducts 8 are favorable to the gaseous flow of etching, can make the etching gas more even to the wafer etching, the etching is gaseous to be conveyed into the inside of gas pitcher 3 again through two outlet ducts 8, and then form a circulation, be convenient for the gaseous reuse of etching.
Specifically, as shown in fig. 2, a handle is fixedly mounted on the outer surface of the front end of the box door 2.
By adopting the technical scheme, the handle is convenient for a worker to hold the handle to open the box door 2.
Specifically, as shown in fig. 1 and 3, the air pump 4, the first air inlet pipe 61, the second air inlet pipe 62, the molecular pump 7, the two air outlet pipes 8, the air tank 3 and the reaction hood 5 are all communicated.
By adopting the technical scheme, the etching gas can conveniently form a cycle when the wafer is etched, so that the etching gas can be repeatedly utilized.
Specifically, as shown in fig. 1 and 3, the sealing ring 12 is made of perfluororubber, and the sealing ring 12 is annular.
By adopting the technical scheme, the perfluororubber has the corrosion-resistant effect, so that the sealing ring 12 can play the roles of corrosion resistance and sealing.
Specifically, as shown in fig. 1 and 3, the sealing ring 12 is located right below the reaction hood 5 and fits with the outer surface of the lower end of the reaction hood 5.
By adopting the technical scheme, the sealing ring 12 plays a role in sealing, so that the etching gas can form a cycle when the wafer is etched, and the etching gas can be recycled.
Specifically, as shown in fig. 4, the two outlet pipes 8 have the same specification and correspond to each other in the front-rear direction.
By adopting the technical scheme, the two air outlet pipes 8 have the same specification, which is beneficial to the flowing of etching gas and can ensure that the etching gas can etch the wafer more uniformly.
Specifically, as shown in fig. 1 and 3, the air pump 4, the molecular pump 7, and the hydraulic machine 9 are all electrically connected to an external power supply.
By adopting the technical scheme, the current can be supplied to the etching machine to work.
In the present exemplary embodiment, the function of the sealing ring 12 is to be explained.
The working principle is as follows: the wafer is placed on the object supporting table 11, the hydraulic machine 9 can drive the lifting rod 10 to move upwards, until a sealing ring 12 on the object supporting table 11 is abutted to the reaction cover 5, the air pump 4 conveys etching gas in the gas tank 3 to the molecular pump 7 through the first air inlet pipe 61 and the second air inlet pipe 62, the etching gas etches the wafer in the reaction cover 5 through the molecular pump 7, the etching gas etches the wafer from top to bottom, the etching gas is conveyed into the gas tank 3 through the two air outlet pipes 8 communicated between the reaction cover 5 and the gas tank 3 again, the two air outlet pipes 8 are favorable for flowing of the etching gas, the etching gas can be more uniform for etching the wafer, the etching gas is conveyed into the gas tank 3 through the two air outlet pipes 8 again, a circulation is formed, and the etching gas can be reused.
The using method comprises the following steps: when in use, firstly, a worker switches on the power supply of the hydraulic press 9 to place a wafer on the object supporting table 11, the hydraulic press 9 drives the lifting rod 10 to move upwards until the sealing ring 12 on the object supporting table 11 is abutted against the reaction hood 5, the box door 2 is closed, secondly, the worker switches on the power supply of the air pump 4, the air pump 4 conveys etching gas in the air tank 3 to the molecular pump 7 through the first air inlet pipe 61 and the second air inlet pipe 62, the etching gas etches the wafer in the reaction hood 5 through the molecular pump 7, finally, after the etching gas etches the wafer from top to bottom, the etching gas is conveyed into the air tank 3 again through the two air outlet pipes 8 communicated between the reaction hood 5 and the air tank 3, the two air outlet pipes 8 are favorable for the flowing of the etching gas, the etching gas can etch the wafer more uniformly, wherein the etching gas is conveyed into the air tank 3 again through the two air outlet pipes 8, and a cycle is formed to facilitate the recycling of etching gas, the model of the gas pump 4 is 2xz-0.25, the model of the hydraulic press 9 is CX-LS, and the model of the molecular pump 7 is FF-160/700.
The installation method comprises the following steps:
firstly, assembling a box body 1, a box door 2, a gas tank 3, a gas pump 4 and a reaction cover 5;
secondly, assembling the first air inlet pipe 61, the second air inlet pipe 62, the molecular pump 7 and the air outlet pipe 8;
and thirdly, assembling the hydraulic press 9, the lifting rod 10, the object supporting table 11 and the sealing ring 12 to finish the installation.
The utility model provides an air pump 4, hydraulic press 9, molecular pump 7's product model is only for the use that this technical scheme goes on according to the structural feature of product, and its product can adjust and reform transform after purchasing, makes it match more and accord with the utility model discloses affiliated technical scheme, its technical scheme who is the best application of this technical scheme, the model of its product can be replaced and reform transform according to the technical parameter of its needs, and it is known for the technical staff that belongs to in the field, consequently, what the technical staff that belongs to in the field can be clear passes through the utility model provides a technical scheme obtains corresponding result of use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an etching machine for digital publishing, includes box (1), its characterized in that: the outer surface of the front end of the box body (1) is hinged with a box door (2), the outer surface of the lower end of the box body (1) is fixedly provided with a gas tank (3) and a hydraulic machine (9), the hydraulic machine (9) is located on one side of the gas tank (3), the outer surface of the upper end of the gas tank (3) is fixedly provided with a gas pump (4), a first gas inlet pipe (61) is fixedly arranged between the gas pump (4) and the gas tank (3), the gas pump (4) is fixedly connected with a reaction hood (5) through a second gas inlet pipe (62), the inner surface of the upper end of the reaction hood (5) is fixedly provided with a molecular pump (7), the outer surfaces of the front end and the rear end of the reaction hood (5) and the outer surface of the front end and the rear end of the gas tank (3) are fixedly provided with gas outlet pipes (8), the outer surface of the upper end of, and a sealing ring (12) is fixedly arranged on the outer surface of the upper end of the object supporting table (11).
2. The digital publishing etcher as set forth in claim 1, wherein: the outer surface of the front end of the box door (2) is fixedly provided with a handle.
3. The digital publishing etcher as set forth in claim 1, wherein: the air pump (4), the first air inlet pipe (61), the second air inlet pipe (62), the molecular pump (7), the two air outlet pipes (8), the air tank (3) and the reaction cover (5) are all communicated.
4. The digital publishing etcher as set forth in claim 1, wherein: the sealing ring (12) is made of perfluoro rubber, and the sealing ring (12) is annular.
5. The digital publishing etcher as set forth in claim 1, wherein: the sealing ring (12) is positioned right below the reaction cover (5) and is matched with the outer surface of the lower end of the reaction cover (5).
6. The digital publishing etcher as set forth in claim 1, wherein: the two air outlet pipes (8) have the same specification and correspond to each other in the front and the back.
7. The digital publishing etcher as set forth in claim 1, wherein: the air pump (4), the molecular pump (7) and the hydraulic machine (9) are electrically connected with an external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921116281.1U CN210245460U (en) | 2019-07-17 | 2019-07-17 | Etching machine for digital publishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921116281.1U CN210245460U (en) | 2019-07-17 | 2019-07-17 | Etching machine for digital publishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210245460U true CN210245460U (en) | 2020-04-03 |
Family
ID=69991324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921116281.1U Active CN210245460U (en) | 2019-07-17 | 2019-07-17 | Etching machine for digital publishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210245460U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113964011A (en) * | 2021-08-26 | 2022-01-21 | 中环艾能(高邮)能源科技有限公司 | PERC battery piece production etching machine with foolproof function |
-
2019
- 2019-07-17 CN CN201921116281.1U patent/CN210245460U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113964011A (en) * | 2021-08-26 | 2022-01-21 | 中环艾能(高邮)能源科技有限公司 | PERC battery piece production etching machine with foolproof function |
| CN113964011B (en) * | 2021-08-26 | 2023-08-01 | 中环艾能(高邮)能源科技有限公司 | PERC battery piece production etching machine with prevent slow-witted function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230828 Address after: Unit 2, Building 3, Yard 6, Automobile Museum East Road, Fengtai District, Beijing, 100070 Patentee after: Beijing August melon Technology Co.,Ltd. Address before: 362200 No.96, Huancheng Road, sucuo village, Chendai Town, Jinjiang City, Quanzhou City, Fujian Province Patentee before: Fujian August melon Technology Service Co.,Ltd. |
|
| TR01 | Transfer of patent right |