CN210243692U - Light-weight inspection jig for substrate and inspection device for substrate - Google Patents

Abstract

A light-weight inspection jig for a substrate and an inspection apparatus for a substrate, which can reduce the weight of the light-weight inspection jig for a substrate, facilitate mounting, and ensure the inspection accuracy of a circuit substrate. The light-weight inspection jig for a substrate includes: a clamp head; and an electrode mounting portion provided on a side of the jig head opposite to the circuit board, wherein the substrate inspection apparatus includes a device mounting portion provided on a side of the electrode mounting portion opposite to the jig head, the electrode mounting portion is provided with a plurality of electrodes, and is formed by laminating at least a first electrode support plate and a second electrode support plate made of resin in a plumb direction, the first electrode support plate is formed with a plurality of through holes for respectively receiving one end portions of the electrodes and is connected to the jig head, the second electrode support plate is formed with a through hole for receiving the electrodes, the through hole is formed with an enlarged portion on a side close to the jig head, and a receiving portion is formed on a side close to the device mounting portion and falls within a range of the enlarged portion when viewed in the plumb direction.

Description

Light-weight inspection jig for substrate and inspection device for substrate

Technical Field

The present invention relates to a light-weight inspection jig for a substrate for electrically inspecting an inspection object such as a circuit board and an inspection apparatus for a substrate provided with the light-weight inspection jig for a substrate.

Background

Conventionally, a substrate inspection apparatus including an inspection jig provided with a probe is generally used for electrical inspection of wiring of a circuit substrate. The inspection jig generally includes a jig head portion and an electrode mounting portion, wherein the electrode mounting portion is formed of three plates in total from top to bottom, two resin-made electrode support plates and one aluminum-made electrode support plate, a plurality of through holes capable of accommodating upper ends of the respective electrodes are formed in the upper resin-made electrode support plate, a first through hole capable of accommodating the respective electrodes is formed in the lower resin-made electrode support plate, the plurality of through holes fall within a range of the first through hole when viewed in a plumb direction, a second through hole is formed in the aluminum-made electrode support plate, and the respective electrodes are introduced into a device mounting portion of the inspection device for a substrate through the first through hole and the second through hole, respectively.

However, in the case where the inspection points are widely distributed in a case where the wiring area of the circuit substrate to be inspected is large; and in the case where it is necessary to improve inspection efficiency while performing electrical inspection for more inspection points of wiring, a larger inspection jig needs to be used. In the conventional inspection jig, since the aluminum electrode support plate is used, the entire inspection jig is heavy, and therefore, both the mounting load and the load acting on the moving mechanism when the inspection jig is mounted on the inspection apparatus for a substrate are large, which increases the mounting difficulty and the substrate inspection difficulty.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve above-mentioned technical problem and do, its aim at provides a lightweight inspection anchor clamps for base plate and inspection device for base plate can reduce the installation degree of difficulty and the base plate inspection degree of difficulty.

In order to achieve the above object, the present invention provides a light-weight inspection jig for a substrate, which is mounted on an inspection apparatus for a substrate for electrically inspecting wiring formed on a circuit substrate having a plurality of wirings, the inspection apparatus including: a clamp head; and an electrode mounting portion detachably connected to the jig head portion and provided on a side of the jig head portion opposite to the circuit board, wherein the substrate inspection apparatus includes a device mounting portion detachably connected to the electrode mounting portion and provided on a side of the electrode mounting portion opposite to the jig head portion, wherein the electrode mounting portion is provided with a plurality of electrodes, and is formed by laminating at least a first electrode supporting plate and a second electrode supporting plate made of resin in a plumb direction, the first electrode supporting plate is provided with a plurality of through holes for receiving one end portions of the electrodes, respectively, and is connected to the jig head portion, the second electrode supporting plate is provided with a through hole for receiving the electrodes, and the through hole is provided with a flared portion on a side close to the jig head portion, and a closing-in portion which falls within a range of the flared portion when viewed in a plumb direction is formed on a side close to the device mounting portion.

According to the above configuration, the electrode mounting portion is formed by laminating at least the first electrode support plate and the second electrode support plate made of resin, and the through-hole of the second electrode support plate is formed with the flared portion and the constricted portion, so that the aluminum electrode support plate in the related art is omitted, and the weight of the electrode mounting portion is reduced as compared with the related art. Thus, the whole weight of the inspection jig can be reduced, the mounting load and the load acting on the moving mechanism can be reduced, and a large inspection jig is used, so that even when the wiring area of the circuit board to be inspected is large, the inspection points are widely distributed; and the installation of the inspection jig and the inspection of the substrate can be realized even when the inspection efficiency is required to be improved and the electrical inspection is performed for more inspection points of the wiring.

In addition, the present invention provides the light weight inspection jig for a substrate according to a second aspect, wherein the electrode mounting portion includes only the first electrode support plate and the second electrode support plate, the first electrode support plate is in contact with the second electrode support plate from the jig head portion side, so as to close the opening of the flared portion, and the second electrode support plate is connected to the device mounting portion.

According to the above configuration, the electrode mounting portion is formed to include only two plates, i.e., the first electrode support plate and the second electrode support plate, so that the number of components constituting the electrode mounting portion can be reduced compared to the conventional art, and the structure of the electrode mounting portion can be simplified and reduced in weight. Further, by closing the opening of the flared portion of the second electrode support plate from the jig head side, foreign matter such as dust can be prevented from entering the through-hole of the second electrode support plate from the gap between the first electrode support plate and the second electrode support plate as indicated by arrow L1 in fig. 3. Therefore, the condition that the detection precision is reduced due to the adverse effect of foreign matters such as dust on the electric conductivity of the electrode can be effectively avoided.

In addition, according to a third aspect of the present invention, in addition to the light-weight inspection jig for a substrate of the second aspect, an outer peripheral edge of the second electrode support plate is located on an outer peripheral side of an outer peripheral edge of the first electrode support plate when viewed in a plumb direction.

According to the above configuration, the outer peripheral edge of the second electrode support plate is positioned on the outer peripheral side of the outer peripheral edge of the first electrode support plate when viewed in the plumb direction, whereby the first electrode support plate can be supported over the entire periphery of the first electrode support plate. This can sufficiently support the first electrode support plate.

In addition, according to a fourth aspect of the present invention, in addition to the light weight inspection jig for a substrate of the first aspect, the thickness of the second electrode support plate is larger than the thickness of the first electrode support plate.

According to the above configuration, by forming the thickness of the second electrode supporting plate to be larger than the thickness of the first electrode supporting plate, the strength of the second electrode supporting plate is increased to suppress deformation, so that the first electrode supporting plate can be stably supported.

In addition, according to a fifth aspect of the present invention, in the light weight inspection jig for a substrate of the second aspect, the device mounting portion includes a support portion formed in a hollow shape, the support portion being detachably connected to the second electrode support plate and provided on a side of the second electrode support plate opposite to the first electrode support plate so as to close an opening of the receiving portion.

According to the above configuration, the support portion of the device mounting portion closes the opening of the receiving portion of the second electrode support plate from the side opposite to the jig head portion, thereby preventing foreign matter such as dust from entering the electrode mounting portion and the hollow portion of the device mounting portion from the gap between the second electrode support plate and the support portion as indicated by arrow L2 in fig. 3. Therefore, the condition that the detection precision is reduced due to the adverse effect of foreign matters such as dust on the electric conductivity of the electrode can be effectively avoided.

In addition, according to a sixth aspect of the present invention, in addition to the light-weight inspection jig for a substrate of the fifth aspect, a periphery of the support portion is located between the receiving portion and an outer peripheral edge of the second electrode support plate when viewed in a plumb direction.

According to the above configuration, the peripheral edge of the support portion is positioned between the receiving portion and the outer peripheral edge of the second electrode support plate when viewed in the plumb direction, whereby the electrode mounting portion can be reliably supported.

Furthermore, the present invention provides an inspection apparatus for a substrate for electrically inspecting a wiring formed with a circuit substrate having a plurality of wirings, wherein the inspection apparatus includes: the light-weight inspection jig for a substrate according to any one of the first to sixth aspects; a moving mechanism for moving the light-weight inspection jig for a substrate; a holding mechanism for holding the circuit substrate at an inspection position; a control unit for controlling at least one of the moving mechanism and the holding mechanism; and a display unit for displaying a result of the inspection of the circuit board.

According to the above configuration, the substrate inspection apparatus includes the light-weight substrate inspection jig, the moving mechanism, the holding mechanism, the control unit, and the display unit, thereby achieving electrical inspection of the substrate with a simple configuration.

Drawings

Fig. 1 is a sectional view showing the overall configuration of a substrate inspection apparatus according to an embodiment.

Fig. 2 is a partially enlarged schematic view of the light-weight inspection jig for a substrate in the inspection apparatus for a substrate in fig. 1.

Fig. 3 is a partially enlarged schematic view of a through hole in an electrode mounting portion in the light weight inspection jig for a substrate in fig. 2.

(symbol description)

1 a substrate inspection device;

10 a light-weight inspection jig for a substrate;

11 an inspection side support body;

111 a loading plate;

1111 inspection side through holes;

112 middle plate;

1121 inspecting the side through-holes;

113 a support plate;

1131 inspecting the side through-holes;

12 a connecting member;

13 an electrode side support body;

131 a first electrode side support body;

1311 first-electrode-side through-holes;

132 a second electrode side support body;

1321 a second-electrode-side through hole;

133 a third electrode side support body;

1331 a third electrode side support body;

14 an electrode mounting portion;

141 a first electrode support plate;

142 a second electrode supporting plate;

143 through holes;

143a flared portion;

143b a closing-in part;

15 electrodes;

16 probes;

17 through holes;

20 a moving mechanism;

21 a device mounting section;

210 hollow part;

211 a support part;

30 a holding mechanism;

40 a control unit;

50 a display unit;

100 a circuit substrate;

ZF carrying surface.

Detailed Description

Hereinafter, an embodiment of the present invention will be described in detail with reference to fig. 1 to 3. Fig. 1 is a cross-sectional view showing the overall configuration of the substrate inspection apparatus according to the embodiment. Fig. 2 is a partially enlarged schematic view of the light-weight inspection jig for a substrate in the inspection apparatus for a substrate in fig. 1. Fig. 3 is a partially enlarged schematic view of a through hole in an electrode mounting portion in the light weight inspection jig for a substrate in fig. 2. Here, fig. 2 and 3 are each a cross-section of the substrate light-weight inspection jig in fig. 1 cut on a plane parallel to the paper plane. In fig. 2, the number of inspection-side through- holes 1111, 1121, 1131 in the inspection-side support 11, the number of probes 16, the number of electrode-side through- holes 1311, 1321, 1331 in the electrode-side support 13, the number of through-holes 17 in the first electrode support plate 141, and the number of electrodes 15 are schematically illustrated in two. In the present application, the vertical direction in fig. 1 and the like is referred to as the vertical direction (i.e., the plumb direction), and the direction perpendicular to the vertical direction in fig. 1 and the like is referred to as the horizontal direction.

The substrate inspection apparatus according to the present embodiment is an apparatus for electrically inspecting a wiring or the like of a circuit substrate on which a plurality of wirings are formed.

The substrate inspection apparatus according to the embodiment of the present invention will be described below with reference to fig. 1 and 2.

(Overall Structure of inspection apparatus for substrate)

As shown in fig. 1, the substrate inspection apparatus 1 of the present embodiment includes: a light-weight inspection jig for substrate 10; a moving mechanism 20, the moving mechanism 20 having a device mounting portion 21 for moving the light-weight inspection jig for substrate 10; a holding mechanism 30 for holding the circuit substrate 100 at the inspection position by the holding mechanism 30; a control unit 40, the control unit 40 controlling at least one of the moving mechanism 20 and the holding mechanism 30; and a display unit 50, the display unit 50 displaying a result of the inspection of the circuit board 100.

Here, the outer shape of the device mounting portion 21 is smaller than the outer shape of the electrode mounting portion 14 described below when viewed in the up-down direction.

In the present embodiment, as shown in fig. 1, the inspection apparatus includes two upper and lower light-weight inspection jigs 10 for substrates, and since the two light-weight inspection jigs 10 for substrates are vertically symmetrical, the structure of the light-weight inspection jig 10 for substrates will be described in detail below by taking the lower light-weight inspection jig 10 for substrates in fig. 1 as an example. However, the present invention is not limited to this, and the two upper and lower substrate light-weight inspection jigs may have different structures, and the substrate inspection apparatus may include only one substrate light-weight inspection jig.

In the present embodiment, the light-weight inspection jig for substrates 10 includes a jig head portion and an electrode mounting portion. The following description is made.

(Structure of the head of the jig)

As shown in fig. 2, the substrate light-weight inspection jig 10 is mounted on a substrate inspection apparatus 1 for electrically inspecting wiring of a circuit substrate 100 on which a plurality of wirings are formed, and includes: a clamp head; and an electrode mounting portion 14, the electrode mounting portion 14 being detachably connected to the jig head, provided on the opposite side of the jig head from the circuit board 100, and mounting a plurality of electrodes 15.

Further, as shown in fig. 2, the jig head includes: an inspection side support 11 having inspection side through- holes 1111, 1121, 1131; an electrode-side support 13 disposed at a distance from the inspection-side support 11 and having electrode-side through holes 1311, 1321, and 1331; a connecting member 12 for connecting the inspection side support 11 and the electrode side support 13; and a plurality of probes 16 that penetrate the electrode side through holes 1311, 1321, 1331 and the inspection side through holes 1111, 1121, 1131, and that have tips (upper ends in fig. 2) protruding from the inspection side support 11 so as to be able to contact the circuit board 100 and have rear ends (lower ends in fig. 2) protruding from the electrode side support 13 so as to contact the electrodes 15.

As shown in fig. 2, the inspection side support body 11 includes: a mounting plate 111 having a mounting surface ZF contactable with the circuit board 100 and an inspection-side through hole 1111 through which the probe 16 passes; an intermediate plate 112 formed in the same size as the mounting plate 111 and having an inspection-side through-hole 1121 formed at a position corresponding to the inspection-side through-hole 1111; and a support plate 113, the support plate 113 supporting the mounting plate 111 and the intermediate plate 112 from below, and having inspection-side through holes 1131 through which the probes 16 are inserted, formed at positions corresponding to the inspection-side through holes 1111 and 1112.

Here, the placing plate 111, the intermediate plate 112, and the support plate 113 are formed in a rectangular plate shape having the same size as each other in a top plan view, and are fixed together by screws (not shown). The mounting plate 111, the intermediate plate 112, and the support plate 113 are all formed of the same resin material and have the same thickness. As described above, by providing the inspection side support 11 with the multilayer structure including the mounting plate 111, the intermediate plate 112, and the support plate 113, the inspection side through holes 1111, 1121, 1131 can be easily processed, and the deformation resistance of the inspection side support 11 can be enhanced.

The positions of the tips of the probes 16 can be reliably determined by forming the inspection side through-holes 1111 of the mounting plate 111, the inspection side through-holes 1121 of the intermediate plate 112, and the inspection side through-holes 1131 of the support plate 113 at corresponding positions and housing the tips of the probes 16. Thus, at the time of inspection, a misalignment is less likely to occur between the inspection point of the circuit board 100 and the tips of the plurality of probes 16 exposed from the placement surface ZF of the inspection side support body 11, and the circuit board 100 can be electrically inspected smoothly. When the probe 16 is brought into contact with the inspection point to electrically inspect the circuit board 100, the end portion of the inclined probe 16 can be smoothly guided to be retracted into the inspection-side through hole.

As shown in fig. 2, the inspection side support 11 is supported by the electrode side support 13 via a connection member 12. Although only two connection members 12 are illustrated in fig. 2, the inspection side support 11 is actually supported by the electrode side support 13 via the plurality of connection members 12. Thus, by increasing the supporting area of the electrode side support 13 with respect to the inspection side support 11, the inspection side support 11 can be sufficiently and firmly supported.

The electrode side support 13 is formed by laminating a first electrode side support 131, a second electrode side support 132, and a third electrode side support 133, wherein the first electrode side support 131 is located on the jig head portion side of the electrode support 13 and is formed with a first electrode side through hole 1311 for housing the probe 16, the second electrode side support 132 is located below the first electrode side support 131 and is formed in the same size as the first electrode side support 131 and is formed with a second electrode side through hole 1321 for housing the probe 16, and the third electrode side support 133 is located below the second electrode side support 132 and is formed in the same size as the first electrode side support 131 and the second electrode side support 132 and is formed with a third electrode side through hole 1331 for housing the probe 16.

The first electrode side support 131, the second electrode side support 132, and the third electrode side support 133 are formed in rectangular shapes having the same size and thickness when viewed from above in a plan view.

The first electrode side support body 131, the second electrode side support body 132, and the third electrode side support body 133 are formed of the same resin material.

As described above, by providing the electrode side support 13 with a three-piece plate structure having the same shape, thickness, and material, sufficient strength can be provided for sufficiently supporting the probe 16 and the inspection side support 11, and deformation of the electrode side support 13 can be prevented.

In the present embodiment, the inspection-side through holes 1111, 1121, 1131 are stacked in a substantially inclined manner from top to bottom, and are fastened by screws to form a through hole structure that is substantially inclined in one direction. Although fig. 2 illustrates the through-hole inclined substantially to the left side, the through-hole is not limited thereto, and may be inclined substantially to the right side or any other direction. The electrode side through holes 1311, 1321, and 1331 are substantially inclined from top to bottom in the same direction as the inspection side through holes 1111, 1121, and 1131, so as to form through holes that are substantially inclined in the same direction as the inspection side through holes. In this way, the probes 16 can be stored in an inclined manner, so that the probes 16 can be more reliably brought into contact with the inspection points of the circuit board 100 by being retracted after being pressed, thereby effectively avoiding contact failure and the like and accurately performing electrical inspection on the wiring. Fig. 2 schematically shows only the inspection-side through holes 1111, 1121, 1131 and the electrode-side through holes 1311, 1321, 1331, and does not show in detail a structure capable of guiding the probe 16 and accurately performing electrical inspection on the wiring.

(Structure of electrode mounting part)

As shown in fig. 2, the electrode mounting portion 14 is provided with a plurality of electrodes 15, is positioned below the electrode side supporter 13 of the jig head, and is in direct contact with the electrode side supporter 13. More specifically, as shown in fig. 3, the electrode mounting portion 14 includes: a first electrode support plate 141 which is positioned below the electrode-side support 13 of the jig head, has a plurality of through holes 17 formed therein for receiving one end (upper end in fig. 2) of each of the plurality of electrodes 15, and is connected to the jig head; and a second electrode support plate 142 laminated with the first electrode support plate 141 from below, the second electrode support plate 142 having a through hole 143 for accommodating the plurality of electrodes 15, the through hole 143 having an expanded portion 143a formed on an upper side (a jig head portion side) and a constricted portion 143b formed on a lower side (an apparatus mounting portion 21 side), wherein the constricted portion 143b falls within a range of the expanded portion 143a when viewed from below.

The first electrode support plate 141 is in contact with the second electrode support plate 142, and the opening of the flared portion 143a is closed from the jig head side. This effectively prevents foreign matter such as dust from entering through the gap between the first electrode support plate 141 and the second electrode support plate 142 into the through-hole 143 of the second electrode support plate 142. Therefore, the influence of foreign matters such as dust on the conductivity of the electrode due to the contact of the foreign matters with the electrode can be avoided.

As shown in fig. 2, the outer peripheral edge of the second electrode support plate 142 is formed so as to be located on the outer peripheral side of the outer peripheral edge of the first electrode support plate 141 when viewed in the vertical direction. Thus, the first electrode support plate 141 can be supported over the entire circumference of the first electrode support plate 141 by the above-described configuration, and thus the effect of supporting the first electrode support plate 141 is more sufficient.

Further, the thickness of the second electrode supporting plate 142 is greater than that of the first electrode supporting plate 141, wherein the thickness of the second electrode supporting plate 142 is preferably 10mm, and the thickness of the first electrode supporting plate 141 is preferably 3 mm. Thus, the strength of the second electrode supporting plate 142 is increased to suppress the deformation, so that the first electrode supporting plate 141 can be supported more stably.

Further, since the first electrode supporting plate 141 and the second electrode supporting plate 142 are both formed of a resin material, the weight of the electrode mounting portion 14 itself can be reduced as compared with the case of being formed of a metal material, thereby reducing the mounting load when the electrode mounting portion 14 is mounted on the device mounting portion 21 and reducing the load acting on the moving mechanism 20 when the substrate light-weight inspection jig 10 is moved by the moving mechanism 20. This makes it possible to perform electrical inspection of the circuit board 100 more smoothly and to extend the service life of the moving mechanism 20 and the device mounting portion 21.

Further, the peripheral edge of the flared portion 143a is formed so as to be positioned on the outer peripheral side of each through-hole (i.e., the position where the electrode is located) of the first electrode support plate 141 in the horizontal direction, whereby all the electrodes 15 can be securely housed in the flared portion 143a of the second electrode support plate 142.

In addition to the jig head, the substrate inspection apparatus 1 of the present embodiment further includes a moving mechanism 20, and as shown in fig. 2 and 3, the moving mechanism 20 includes an apparatus mounting portion 21 that supports the light-weight jig for substrate 10. The structure of the device mounting portion 21 will be described in detail below.

(Structure of device mounting part)

As shown in fig. 2, the device mounting portion 21 includes a support portion 211, and the support portion 211 is formed in a hollow shape and detachably mounted on the lower end surface of the second electrode support plate 142. The support portion 211 further includes a cylindrical hollow portion 210, and the hollow portion 210 closes the opening of the closing portion 143b and forms a space for accommodating the lower end portion of the power supply electrode 15 together with the through hole 143 in the second electrode support plate 142. Thus, a sufficient space can be provided to accommodate the lower end portion of the electrode 15, so that the electrode 15 is prevented from being bent after being pressed due to a narrow space, and the height of the jig head in the vertical direction can be adjusted by adjusting the height of the support portion 211, thereby smoothly performing electrical inspection of the circuit board 100.

As shown in fig. 3, the peripheral edge of the support portion 211 is located between the peripheral edge of the receiving portion 143b and the outer peripheral edge of the second electrode support plate 142 when viewed in the vertical direction. This can reliably support the electrode mounting portion 14, and prevent foreign matter such as dust from entering the hollow portion 210 and the through-hole 143 of the device mounting portion 21 through the gap between the support portion 211 of the device mounting portion 21 and the second electrode support plate 142 as indicated by arrow L2 in fig. 3. This can reliably prevent the deterioration of the inspection accuracy of the substrate inspection apparatus due to the dust.

In the present embodiment, the depth of the flared portion 143a of the through-hole 143 of the second electrode support plate 142 is preferably 8mm, and the depth of the constricted portion 143b is preferably 2 mm.

While the embodiments of the present invention have been described above specifically, the elements of the embodiments may be modified as appropriate without departing from the spirit of the present invention.

In the above embodiment, the inspection side support 11 is constituted by three plates in total of the placement plate 111, the intermediate plate 112, and the support plate 113, but the number of plates is not limited thereto.

In the above embodiment, the jig head is constituted by the inspection side support 11, the electrode side support 13, and the connecting member 12 that connects between the inspection side support 11 and the electrode side support 13, but the present invention is not limited to this, and other configurations may be adopted.

In the above embodiment, the shapes, thicknesses, and materials of the placement plate 111, the intermediate plate 112, and the support plate 113 are the same, but the present invention is not limited thereto, and the shapes, thicknesses, and materials of the three may be different, and the three may be fixed by a method other than screws.

In the above embodiment, the first electrode side support 131, the second electrode side support 132, and the third electrode side support 133 have the same shape, thickness, and material, but are not limited thereto, and the three may have different shapes, thicknesses, and materials, and may be fixed together by means other than bolt fastening.

Claims (7)

1. A light-weight inspection jig for a substrate, which is mounted on an inspection device for a substrate for electrically inspecting a plurality of wirings formed on a circuit substrate, comprising:

a clamp head; and

an electrode mounting portion detachably connected to the jig head portion and provided on a side of the jig head portion opposite to the circuit board,

the substrate inspection apparatus includes a device mounting portion detachably connected to the electrode mounting portion and provided on a side of the electrode mounting portion opposite to the jig head,

it is characterized in that the preparation method is characterized in that,

a plurality of electrodes are mounted on the electrode mounting portion, and at least a first electrode supporting plate and a second electrode supporting plate made of resin are laminated along the plumb direction,

the first electrode support plate is formed with a plurality of through holes for receiving one end portions of the electrodes, respectively, and is connected to the jig head,

the second electrode support plate is formed with a through-hole for housing the electrode,

the through hole is formed with a flared portion on a side close to the jig head, and a constricted portion that falls within a range of the flared portion when viewed in the plumb direction is formed on a side close to the device mounting portion.

2. The light-weight inspection jig for a substrate according to claim 1, wherein the jig is a jig for inspecting a substrate,

the electrode mounting part includes only the first electrode supporting plate and the second electrode supporting plate,

the first electrode supporting plate is in contact with the second electrode supporting plate from the jig head side to close the opening of the flared portion,

the second electrode supporting plate is connected to the device mounting portion.

3. The light-weight inspection jig for a substrate according to claim 2, wherein the jig is a jig for inspecting a substrate,

the outer peripheral edge of the second electrode support plate is located on the outer peripheral side of the outer peripheral edge of the first electrode support plate when viewed in the plumb direction.

4. The light-weight inspection jig for a substrate according to claim 1, wherein the jig is a jig for inspecting a substrate,

the second electrode support plate has a thickness greater than a thickness of the first electrode support plate.

5. The light-weight inspection jig for a substrate according to claim 2, wherein the jig is a jig for inspecting a substrate,

the device mounting portion includes a support portion formed in a hollow shape, the support portion being detachably connected to the second electrode support plate and provided on a side of the second electrode support plate opposite to the first electrode support plate so as to close the opening of the receiving portion.

6. The light-weight inspection jig for a substrate according to claim 5, wherein the jig is a jig for inspecting a substrate,

the peripheral edge of the support portion is located between the cutout portion and the outer peripheral edge of the second electrode support plate when viewed in the plumb direction.

7. An inspection apparatus for a substrate for electrically inspecting a plurality of wirings formed on a circuit board, comprising:

the light-weight inspection jig for a substrate according to any one of claims 1 to 6;

a moving mechanism for moving the light-weight inspection jig for a substrate;

a holding mechanism for holding the circuit substrate at an inspection position;

a control unit for controlling at least one of the moving mechanism and the holding mechanism; and

and a display unit for displaying a result of the inspection of the circuit board.

Images