CN210242436U

CN210242436U - Lamination frame for sintering aluminum nitride ceramic substrate

Info

Publication number: CN210242436U
Application number: CN201920889476.3U
Authority: CN
Inventors: Yongjian Sun; 孙永健; Jian Guo; 郭坚; Guangpu Wang; 王光普; Luo Chen; 谌洛; Junfeng Jia; 贾军峰; Xuegang Dou; 豆学刚; Shaoqiong Mo; 莫少琼
Original assignee: Baoding Zhongchuang Yanyuan Semiconductor Technology Co ltd
Current assignee: Baoding Zhongchuang Yanyuan Semiconductor Technology Co ltd
Priority date: 2019-06-13
Filing date: 2019-06-13
Publication date: 2020-04-03
Anticipated expiration: 2029-06-13

Abstract

The utility model discloses a lamination frame for sintering an aluminum nitride ceramic substrate, which comprises a bottom plate, a cover plate and a plurality of supporting laminations with the same size as the bottom plate; four fixing columns are fixed at four corners of the bottom plate respectively; fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the supporting lamination; fixing grooves or fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the cover plate; during the use, each support lamination wears on the fixed column on the bottom plate, and the apron also wears on the fixed column on the bottom plate. The lamination frame is used for laminating and sintering the aluminum nitride green bodies, so that the prepared aluminum nitride ceramic substrates cannot be bonded, the performance stability and repeatability of the aluminum nitride ceramic substrates are not changed, the flatness of the substrates is ensured, the warpage deformation is basically avoided, and the yield is high.

Description

Lamination frame for sintering aluminum nitride ceramic substrate

Technical Field

The utility model belongs to the microelectronics packaging material field of making especially relates to an aluminum nitride ceramic base plate is lamination frame for sintering.

Background

The AlN ceramic has excellent insulativity, thermal conductivity, high temperature resistance and corrosion resistance, is matched with the thermal expansion coefficient of silicon, and becomes an ideal heat dissipation and packaging material for a new generation of large-scale integrated circuits, semiconductor module circuits and high-power devices.

Currently, the main method for producing AlN ceramic substrates is tape casting, and most of them are organic solvent tape casting. The tape casting technology is firstly proposed by Glenn N. Howatt and is successfully applied to the preparation of the microwave dielectric ceramic multilayer capacitor. The tape casting forming technology is simple in equipment, continuous operation is facilitated, automation is basically achieved, production efficiency is high, the cost for preparing the membrane is low, the tape casting forming is carried out on a common tape casting machine to prepare the thin sheet with the thickness of 10 mu m-1 mm, then the thin sheet is punched into a green body, and sintering is carried out to form the ceramic substrate. The conventional sintering method of the aluminum nitride ceramic substrate mainly comprises pressureless sintering, hot-pressing sintering, plasma sintering, microwave sintering and the like, wherein the pressureless sintering is a sintering mode which is most beneficial to realizing industrialization of the aluminum nitride ceramic substrate due to the characteristics of simple equipment operation, realization of continuous production, low cost, high repeatability, high stability and the like. Because the thickness of the cast green body is very small (less than 1 mm), the problems of warping, deformation, cracking and the like easily occur in the sintering process of the ceramic substrate with 4.5 inches or even larger area commonly used in the market, so that the stress exists in the ceramic substrate, and the performance and the qualification rate of the ceramic substrate product are seriously reduced.

At present, there is a chinese patent for a method for preparing a high thermal conductivity aluminum nitride ceramic substrate (publication No. CN 101333114A), wherein the sintering method of the ceramic substrate is: aluminum nitride powder is coated among aluminum nitride green bodies with the same size, 10-15 pieces of aluminum nitride powder are laminated, then the aluminum nitride green bodies are placed into a boron nitride crucible, mixed powder of aluminum nitride and boron nitride is sprayed around the aluminum nitride green bodies to cover, mix and burn in a burying way, and then glue is removed and the aluminum nitride ceramic substrate is obtained through sintering. The aluminum nitride powder in the mixed embedded powder is very thick and volatile at high temperature, few aluminum nitride powder can be integrated with the surface of the aluminum nitride ceramic substrate, the stability and the repeatability of the performance of the aluminum nitride ceramic substrate are reduced after long-term accumulation, and the embedded powder easily pollutes a vacuum system such as a mechanical pump and a diffusion pump, so that the vacuum degree and the sealing property of sintering equipment are influenced; the mixed buried powder around the aluminum nitride green bodies enters the aluminum nitride green bodies under the action of high-temperature airflow, so that the thickness of the aluminum nitride green bodies is uneven, and the flatness of the ceramic substrate is difficult to control; during the high temperature liquid phase sintering, the aluminum nitride powder between the aluminum nitride green bodies may form a liquid phase, resulting in bonding of the laminated substrates; boron nitride crucibles are costly.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above-mentioned problem that exists among the prior art, provide a lamination frame for aluminum nitride ceramic substrate sintering, use this lamination frame to carry out the sintering behind the lamination with the aluminium nitride unburned bricks, can not produce between the aluminium nitride ceramic substrate of making and bond, do not change the stability and the repeatability of aluminium nitride ceramic substrate performance, guaranteed the roughness of base plate, do not have warpage basically, the yield is high.

In order to achieve the above purpose, the technical scheme of the utility model is that: a lamination frame for sintering an aluminum nitride ceramic substrate comprises a bottom plate, a cover plate and a plurality of supporting laminations with the same size as the bottom plate; four fixing columns are fixed at four corners of the bottom plate respectively; fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the supporting lamination; fixing grooves or fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the cover plate; during the use, each support lamination wears on the fixed column on the bottom plate, and the apron also wears on the fixed column on the bottom plate.

Further preferably, the fixing column on the bottom plate is a square column, and the fixing hole on the support lamination is a square hole matched with the square column. The fixing stability is good.

Further preferably, a plurality of transverse supporting ribs are uniformly fixed on the four fixing columns. The supporting force of the lamination frame is increased.

When the aluminum nitride laminated plate is used, a small amount of aluminum nitride powder is scattered on the upper surface of the bottom plate and the upper surfaces of the supporting laminated plates, aluminum nitride green bodies are placed on the upper surface of the bottom plate and the upper surfaces of the supporting laminated plates (the aluminum nitride green bodies are not placed on the last supporting laminated plate), and the periphery of the aluminum nitride powder is sealed. The lamination frame of the utility model is used for sintering the aluminum nitride green body after lamination, and the used aluminum nitride powder is very little, so even if some high temperature volatilizes, the quantity is very little, so firstly, the aluminum nitride ceramic substrate is not influenced any more, and the stability and the repeatability of the performance of the aluminum nitride ceramic substrate are not changed; secondly, the prepared aluminum nitride ceramic substrates cannot be bonded and are easy to take down; thirdly, even under the action of high-temperature airflow, the thickness uniformity among the aluminum nitride green bodies is not influenced any more, and the flatness of the substrate is ensured; and the aluminum nitride ceramic substrate is basically free from warping deformation by being supported by the base plate and the supporting lamination, so that the flatness of the ceramic substrate is further improved. These ensure high quality of the aluminum nitride ceramic substrate and greatly increase the yield.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a top view of the middle base plate of the present invention;

fig. 3 is a top view of a support lamination of the present invention;

fig. 4 is a bottom view of the middle cover plate of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1, 2, 3 and 4, the present embodiment includes a base plate 1, a cover plate 5 and a plurality of support laminations 2 having the same size as the base plate 1. Four fixing columns 3 are respectively fixed at four corners of the bottom plate 1. And fixing holes 4 which are completely matched with the fixing columns 3 on the bottom plate 1 are formed in the positions corresponding to the four corners of the supporting lamination 2. The four corners of the cover plate 5 are provided with fixing slots 6 (or fixing holes) corresponding to the fixing posts 3, which are completely matched with the fixing posts 3 on the bottom plate 1. When the support device is used, each support lamination 2 is penetrated on the fixing column 3 on the bottom plate 1, and the cover plate 5 is also penetrated on the fixing column 3 on the bottom plate 1.

Preferably, the fixing column 3 on the bottom plate 1 is a square column, the fixing hole 4 on the support lamination 2 is a square hole matched with the square column, and the fixing groove 6 on the cover plate 5 is a square groove matched with the square column.

Preferably, a plurality of transverse supporting ribs 7 are uniformly fixed on the four fixing columns 3.

The above embodiments are preferred and illustrative only, and equivalent technical modifications may be made by those skilled in the art based on the description of the patent, which are within the scope of the patent.

Claims

1. A lamination frame for sintering an aluminum nitride ceramic substrate is characterized by comprising a bottom plate, a cover plate and a plurality of supporting laminations with the same size as the bottom plate; four fixing columns are fixed at four corners of the bottom plate respectively; fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the supporting lamination; fixing grooves or fixing holes which are completely matched with the fixing columns on the bottom plate are formed in the positions, corresponding to the fixing columns, of the four corners of the cover plate; during the use, each support lamination wears on the fixed column on the bottom plate, and the apron also wears on the fixed column on the bottom plate.

2. The lamination stack for sintering aluminum nitride ceramic substrates according to claim 1, wherein the fixing posts on the bottom plate are square posts, and the fixing holes on the support laminations are square holes matched with the square posts.

3. The lamination stack for sintering the aluminum nitride ceramic substrate according to claim 1 or 2, wherein a plurality of transverse support ribs are uniformly fixed on the four fixing columns.