CN210223954U - Operating platform for visual inspection of semiconductor epitaxial wafer - Google Patents
Operating platform for visual inspection of semiconductor epitaxial wafer Download PDFInfo
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- CN210223954U CN210223954U CN202020176841.9U CN202020176841U CN210223954U CN 210223954 U CN210223954 U CN 210223954U CN 202020176841 U CN202020176841 U CN 202020176841U CN 210223954 U CN210223954 U CN 210223954U
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Abstract
The utility model mainly discloses an operating platform for visual inspection of semiconductor epitaxial wafers, which comprises a bottom plate, wherein the bottom plate is provided with turnover clamping positioners, and hinges are arranged on the bottom plate between the turnover clamping positioners; the turnover plate is hinged with the bottom plate through a hinge for turnover; the turnover plate also comprises a screw, and the turnover plate is fastened on the turnover clamping positioner through a nut; a rotating shaft is arranged above the turnover plate, penetrates through the rotating plate supporter to fix the rotating plate, and a plurality of stop pins and silicon wafer supports are arranged on the rotating plate. Through the utility model discloses an operation platform can realize safer, convenient and standardize controllable visual inspection operation flow to the epitaxial wafer of large size, the utility model discloses an operation platform compares with conventional visual inspection operation method, but the dirty introduction that causes to the epitaxial wafer surface in the greatly reduced operation process, also can avoid appearing the wrong judgement to epitaxial wafer surface defect because of different angles, different visual fields simultaneously.
Description
Technical Field
The utility model belongs to the operating means field of semiconductor laser, concretely relates to an operation platform for visual inspection semiconductor epitaxial wafer.
Background
With the rapid development of the semiconductor chip industry, the application of the semiconductor chip to high-end chips, such as VCSELs, silicon-based sensors, optical communication and other related fields, is rapidly developed. High-end chip manufacturers have successively implemented high-end chip industrialization. However, after the 6-inch epitaxy production line has expanded capacity, most of the process equipment and related processes at the back end of the production line are not continuously updated and optimized to meet the process requirements of the latest product process.
The method comprises a step of visual detection in the product manufacturing process of an epitaxial production end, and the operation steps mainly comprise the steps of observing the surface of an epitaxial wafer under a strong light, and carrying out primary defect judgment and quality classification on the epitaxial wafer to be subjected to the off-line manufacturing process according to the surface defect judgment standard set by a quality center. In the prior art, most of domestic III-V family GaAa series epitaxial production lines mainly produce 2-inch and 4-inch epitaxial wafers, and the production is mainly carried out in the visual inspection operation link by directly clamping the epitaxial wafers by special tweezers or placing the epitaxial wafers on a simple operation platform and then irradiating the epitaxial wafers by a strong light. With the step of mass production of 6-inch epitaxial wafers, the visual inspection method and the simple visual inspection operation platform for the conventional small-size epitaxial wafers are difficult to meet the requirement of realizing mass visual inspection operation, and are mainly embodied in the following two aspects:
1, when a large-size epitaxial wafer is clamped by tweezers, fragments are easy to fall off;
2, the large-size epitaxial wafer is applied to a high-end laser device, the surface requirement is high, and dirt introduction and surface abrasion are easily caused during the process of clamping by using tweezers and turning the tweezers back and forth to observe the surface.
SUMMERY OF THE UTILITY MODEL
The utility model discloses jumbo size epitaxial wafer visual inspection operation platform is the actual demand who is dedicated to the epitaxial wafer visual inspection operation in-process, through simple and easy, reasonable design, makes epitaxial production personnel can safe standard more, convenient and fast ground to carry out visual inspection operation to jumbo size epitaxial wafer, reduces the dirty introduction in surface, reduction piece rate of visual inspection operation in-process.
According to one aspect of the utility model, an operation platform for visual inspection of semiconductor epitaxial wafers comprises a bottom plate 1, an overturning clamping positioner 2, an overturning plate 3, a rotating plate supporter 4, a rotating shaft 5, a stop pin 6, a silicon wafer bracket 7, a hinge 8 and a rotating plate 9; the base plate 1 is provided with two overturning clamping positioners 2, the overturning clamping positioners 2 are provided with angle adjusting grooves, and hinges 8 are arranged on the base plate 1 between the two overturning clamping positioners 2; the turnover plate 3 is hinged with the bottom plate 1 through the hinge 8 for turnover; the turnover plate 3 further comprises screws which penetrate through the angle adjusting grooves of the two turnover clamping positioners 2, and the turnover plate 3 is fastened on the turnover clamping positioners 2 through nuts; a rotating shaft 5 is arranged above the turnover plate 3, the rotating shaft 5 penetrates through a rotating plate support 4 to fix a rotating plate 9, and the rotating plate support 4 is fixed below the rotating plate 9; the rotating plate 9 is provided with a plurality of stop pins 6 and a silicon wafer support 7.
Preferably, the angle adjusting range of the angle adjusting groove arranged on the turning clamping positioner 2 is 0-90 degrees.
Preferably, a circular groove, a rotating shaft 5, a bolt and a gasket are arranged above the turnover plate 3, the rotating shaft 5 is placed in the circular groove, and the rotating shaft 5 is fixed on the turnover plate 3 from the bottom of the turnover plate 3 to the top through the bolt comprising the gasket.
Preferably, a fastening rubber ring is further disposed between the rotating shaft 5 and the circular groove to stabilize the rotating plate 9.
Preferably, the barrier pin 6 and the silicon wafer support 7 are made of polymer compound materials.
Has the advantages that:
the utility model discloses mainly disclose one kind and be used for the epitaxial visual inspection operation platform of 6 inches at semiconductor laser and LED trade at present, can realize safer, convenient and standardize controllable visual inspection operation flow to the epitaxial wafer of jumbo size (being greater than 4 inches) through this innovation platform, the utility model discloses an operation platform compares with conventional visual inspection operation method, but the dirty introduction that causes to the epitaxial wafer surface in the greatly reduced operation process, also can avoid appearing the wrong judgement to epitaxial wafer surface defect because of different angles, different visual fields simultaneously.
Drawings
Fig. 1 is a side view of the structure of the operation platform for visually inspecting the semiconductor epitaxial wafer according to the present invention.
Fig. 2 is a front view of the structure of the operation platform for visually inspecting the semiconductor epitaxial wafer according to the present invention.
Description of reference numerals: the silicon wafer overturning and clamping device comprises a base plate 1, an overturning and clamping positioner 2, an overturning plate 3, a rotating plate supporter 4, a rotating shaft 5, a blocking pin 6, a silicon wafer support 7, a hinge 8 and a rotating plate 9.
Detailed Description
The contents of the present invention will now be discussed with reference to several exemplary embodiments. It should be understood that these examples are discussed only to enable those of ordinary skill in the art to better understand and thus implement the teachings of the present invention, and are not intended to imply any limitations on the scope of the invention.
As used herein, the term "include" and its variants are to be read as open-ended terms meaning "including, but not limited to. The term "based on" is to be read as "based, at least in part, on". The terms "one embodiment" and "an embodiment" are to be read as "at least one embodiment". The term "another embodiment" is to be read as "at least one other embodiment".
As shown in fig. 1 and fig. 2, the utility model discloses an operation platform for visual inspection of semiconductor epitaxial wafer, its device structure includes:
the turnover clamping positioning device comprises a base plate 1, at least two turnover clamping positioning devices 2 are arranged on the base plate 1, the two turnover clamping positioning devices 2 form a basic structure of an operation platform, the two turnover clamping positioning devices 2 are designed in an arc shape, and one side of each turnover clamping positioning device 2 is fixed on the base plate 1 through bolts; an angle adjusting groove is arranged on the opposite outer side of the arc edge of the overturning clamping positioner 2, and the angle adjusting range of the angle adjusting groove is 0-90 degrees. Two turnover clamping locators 2 are arranged on the base plate 1 at intervals, the interval width of which is wider than the width of the turnover plate 3.
The turnover plate 3 is arranged between the two turnover clamping positioners 2 and is connected with the bottom plate 1 through a hinge 8, one leaf of the hinge 8 is fixed with the bottom plate 1 through a bolt, and the other leaf of the hinge 8 is fixed with the turnover plate 3 through a bolt. Therefore, the function of overturning and adjusting the operation platform is realized. The two overturning clamping locators 2 are connected with the overturning plate 3 through long bolts, and the length of each long bolt is longer than the interval length between the two overturning clamping locators 2. The long bolt passes through the angle adjusting groove of one turning clamping positioner 2, penetrates from one side of the turning plate 3 to the other side, and then passes through the angle adjusting groove of the other turning clamping positioner 2. The threaded side of the long bolt is fastened by a nut. Thereby fixing the flipping panel 3 at a designated angle. When the angle of the turnover plate 3 needs to be adjusted, the nut is loosened to adjust the turnover plate 3 to reach a proper angle, and then the turnover plate is fastened by using the nut.
A circular groove, a rotating shaft 5, a bolt and a gasket are arranged above the turnover plate 3, and the rotating shaft 5 is placed in the circular groove. The outer side of the rotating shaft 5 is sleeved with a fastening rubber ring, and the rotating shaft 5 comprising the fastening rubber ring is fixed on the turnover plate 3 by upwards fixing the rotating shaft 5 at the bottom of the turnover plate 3 through a bolt comprising a gasket. The fastening rubber ring can make the rotation of the rotating shaft 5 more stable and smooth.
A hole is provided at the center of the rotating plate support 4, and the rotating shaft 5 can be inserted through the hole to set the rotating plate 9 on the rotating shaft 5. The rotation plate support 4 is disposed below the rotation plate 9, and the rotation plate support 4 can support the rotation plate 9 more stably. The rotary plate 9 is fixedly connected to the rotary shaft 5, and the rotary plate 9 can be rotated by 360 ° in the horizontal direction together with the rotary shaft 5.
The rotating plate 9 is provided with the stop pin 6 and the silicon wafer support 7 above, the stop pin 6 and the silicon wafer support 7 are made of high molecular compound materials, the stop pin 6 and the silicon wafer support 7 made of the materials can not scratch the back of the epitaxial wafer and introduce dirt when contacting with the back of the semiconductor device, and can well support the semiconductor device at the same time, and the bend angle design of the stop pin 6 and the silicon wafer support 7 can also avoid the occurrence of slide-out abnormity during high-position angle visual inspection. The barrier pins 6 and the wafer supports 7 form a circular matrix arrangement to limit lateral displacement of the epitaxial wafer. The diameter of the stop pin 6 and the silicon wafer support 7 which form a circular matrix is 0.5-1.5mm larger than the diameter of an epitaxial wafer to be placed, and the epitaxial wafer is placed in the circular matrix and can be limited. The wafer support 7 is tapered and an epitaxial wafer may be placed thereon.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an operation platform for visual inspection semiconductor epitaxial wafer, includes bottom plate (1), upset clamp positioner (2), returning face plate (3), rotor plate eyelidretractor (4), rotation axis (5), blocks round pin (6), silicon chip support (7), hinge (8) and rotor plate (9), its characterized in that:
the base plate (1) is provided with two overturning clamping positioners (2), the overturning clamping positioners (2) are provided with angle adjusting grooves, and hinges (8) are arranged on the base plate (1) between the two overturning clamping positioners (2); the turnover plate (3) is hinged with the bottom plate (1) through the hinge (8) for turnover;
the turnover plate (3) further comprises screws which penetrate through the angle adjusting grooves of the two turnover clamping positioners (2), and the turnover plate (3) is fastened on the turnover clamping positioners (2) through nuts;
a rotating shaft (5) is arranged above the turnover plate (3), the rotating shaft (5) penetrates through the rotating plate support (4) to fix the rotating plate (9), and the rotating plate support (4) is fixed below the rotating plate (9);
the rotating plate (9) is provided with a plurality of stop pins (6) and a silicon wafer bracket (7); wherein the barrier pins (6) and the silicon wafer supports (7) form a circular matrix arrangement to limit lateral displacement of the epitaxial wafer.
2. The work platform for visual inspection of semiconductor epitaxial wafers according to claim 1, characterized in that the angular adjustment range of the angular adjustment grooves provided on the flip clamp positioner (2) is 0-90 °.
3. A platform for visual inspection of semiconductor epitaxial wafers as claimed in claim 1 wherein: a circular groove, a rotating shaft (5), a bolt and a gasket are arranged above the turnover plate (3), the rotating shaft (5) is placed in the circular groove, and the rotating shaft (5) is upwards fixed on the turnover plate (3) through the bolt comprising the gasket from the bottom of the turnover plate (3).
4. A platform for visual inspection of semiconductor epitaxial wafers as claimed in claim 3 wherein: and a fastening rubber ring is further arranged between the rotating shaft (5) and the circular groove to stabilize the rotating plate (9).
5. An operation platform for visual inspection of semiconductor epitaxial wafers according to claim 4, wherein: the blocking pin (6) and the silicon wafer support (7) are made of high molecular compound materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020176841.9U CN210223954U (en) | 2020-02-18 | 2020-02-18 | Operating platform for visual inspection of semiconductor epitaxial wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020176841.9U CN210223954U (en) | 2020-02-18 | 2020-02-18 | Operating platform for visual inspection of semiconductor epitaxial wafer |
Publications (1)
Publication Number | Publication Date |
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CN210223954U true CN210223954U (en) | 2020-03-31 |
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CN202020176841.9U Active CN210223954U (en) | 2020-02-18 | 2020-02-18 | Operating platform for visual inspection of semiconductor epitaxial wafer |
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CN (1) | CN210223954U (en) |
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2020
- 2020-02-18 CN CN202020176841.9U patent/CN210223954U/en active Active
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