CN210222194U

CN210222194U - Substrate layer offset alignment test strip

Info

Publication number: CN210222194U
Application number: CN201920689840.1U
Authority: CN
Inventors: Yongyou Wu; 伍永友; Zhuyuan Li; 李铢元; Xusheng Bao; 包旭升
Original assignee: Star Science And Technology Semiconductor (jiangyin) Co Ltd
Current assignee: Star Science And Technology Semiconductor (jiangyin) Co Ltd; Stats Chippac Semiconductor Jiangyin Co Ltd
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2020-03-31
Anticipated expiration: 2029-05-15

Abstract

The utility model discloses a base plate layer is to position test strip partially belongs to base plate detection technical field. It includes initiating line, super specification line of judging, termination line, a plurality of base plate layer deviation counterpoint test unit, initiating line, termination line all with super specification line of judging parallel arrangement, base plate layer deviation counterpoint test unit several arranges into a row at the X direction and neatly sets up between initiating line and termination line, and the equidistant distribution of uniform width, base plate layer deviation counterpoint test unit head sets up base plate layer deviation counterpoint and judges the sign, base plate layer deviation counterpoint judges the sign and aligns with termination line, and ends in within the termination line, initiating line and super specification line of judging interval inject super specification line length C, and the length of its Y direction is the arithmetic degressive setting of equidifferent along the X direction. The utility model discloses the skew condition can be directly judged with the naked eye, and confirm the offset, and efficiency is fast.

Description

Substrate layer offset alignment test strip

Technical Field

The utility model relates to a base plate layer is to position test strip partially belongs to base plate detection technical field.

Background

The conventional layer offset measurement method is to actually measure the actual line offset between an upper layer and a lower layer by means of X-section judgment, as shown in fig. 1 and 2, wherein fig. 1 shows no layer offset, fig. 2 shows that the layer offset is △ X, the measurement method requires a special slicing machine and measurement equipment, and not only consumes a long time, but also cannot measure the overall offset condition.

Disclosure of Invention

An object of the utility model is to overcome the not enough of existence among the prior art, provide a relative layer of ability short-term judgement base plate between each layer and the inclined to one side alignment test strip of base plate layer of the whole skew condition.

The utility model discloses a purpose implementation mode:

the utility model provides a base plate layer is counterpointed test strip partially, it includes the initiating line, surpasses specification determination line, terminates line, a plurality of base plate layer is counterpointed test unit partially, initiating line, termination line all with surpass specification determination line parallel arrangement, base plate layer is counterpointed test unit several partially and is arranged into a list at the X direction and neatly set up between initiating line and termination line, and the equidistant distribution of uniform width, base plate layer is counterpointed test unit head partially sets up base plate layer counterpointed decision mark partially, base plate layer is counterpointed decision mark partially and is terminated line alignment, and end in within the termination line, initiating line and super specification determination line interval are injectd super specification determination line length C, and the length of its Y direction is the arithmetic degressive setting along the X direction.

Optionally, the substrate layer deviation position determination mark is U-shaped, zigzag, arc or stepped.

Optionally, the substrate layer deviation position determination marks are equally spaced serrations.

Optionally, the substrate layer offset position determination mark is an unequal-pitch sawtooth.

Advantageous effects

(1) The substrate layer offset alignment test strip designed by the utility model has simple structure, can adjust the structural parameters according to the actual needs, and has simple manufacturing process;

(2) the utility model discloses the judgement method of base plate layer offset test strip can directly judge whole skew condition and the concrete offset condition in every layer through the naked eye from the side, need not professional slicer and measuring equipment, has improved judgement efficiency, and the practicality is strong.

Drawings

Fig. 1 and 2 are schematic diagrams of a conventional layer offset measurement method;

fig. 3 to 6 are schematic diagrams illustrating a structure of a substrate layer offset test strip according to the present invention and a partial enlargement thereof;

fig. 7 is a schematic diagram of a method of using a substrate layer offset position test strip in accordance with the present invention;

fig. 8-13 are schematic illustrations of a method determination of monitoring the substrate layer offset position test strip of fig. 7.

Detailed Description

The following describes in detail embodiments of the present invention with reference to the accompanying drawings. Spatially relative terms (such as "below …", "below", "lower", "above …", "upper", and the like) may be used for ease of illustration to describe one element or component's relationship to another element or component as illustrated in the figures. Spatially relative terms may also encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Examples

The utility model relates to a base plate layer is counterpointed test strip partially, as shown in fig. 3 to 6, wherein, fig. 3 is the utility model discloses a base plate layer is counterpointed to schematic diagram of test strip's structure partially, and fig. 4 to 6 are its enlarged schematic diagram partially.

The utility model relates to a structure of base plate layer counterpoint test strip partially, it includes the initiating line, surpasss specification determination line, terminates line, a plurality of base plate layer counterpoint test unit partially. In fig. 3, the start line is indicated by a solid line, the end line is indicated by a broken line, and the out-of-specification determination line is indicated by a dotted line plus dots.

The starting line and the ending line are both arranged in parallel with the over-specification judging line, a plurality of equal-width and equal-interval substrate layer offset alignment testing units are distributed and arranged in a row in the X direction and are arranged between the starting line and the ending line in order, a substrate layer offset alignment judging mark is arranged at the head of the substrate layer offset alignment testing unit and is aligned with the ending line and stops in the ending line, the substrate layer offset alignment judging mark is U-shaped, sawtoothed, arc-shaped, stepped and the like, as shown in figures 3 to 6, the substrate layer offset alignment judging mark is shown in a sawtoothed shape in figure 3, the substrate layer offset alignment judging mark can be saw teeth with equal intervals, such as more equal saw teeth with equal intervals, three equal saw teeth, four equal saw teeth, or unequal intervals, and can be other irregular figures, the interval between the starting substrate layer line of the offset alignment testing unit and the over-specification judging line of the over-specification judging line is limited to an over-specification judging line length C, the length of the Y direction is gradually reduced along the X direction, the over-specification judging line length is designed to be an upper limit that the offset specification is acceptable for a product, the offset specification is a specification, the product is adjusted according to an enlarged drawing, the length of the product specification of 3510, and the adjacent substrate layer offset alignment testing unit is designed to be equal-specification upper limit um specification, and is equal-specification, and the product specification enlarged drawing is equal-specification upper limit, and the product.

When the test strip is used, the substrate layer deviation alignment test strips are printed at the head and the tail of the four frames of each layer of the substrate according to the identical positions, and the relative positions of the test strips and the metal layer of the substrate are fixed. The substrate layer offset position test strip is usually formed by an electroplating transfer process, and is typically made of copper or copper alloy, and has a certain thickness, which is generally the same as the thickness of the metal layer. When there is no layer bias in the metal layer of the substrate, as shown in fig. 7, the first substrate layer of the left substrate layer bias alignment test strip is biased against the start line of the alignment test unit and tightly attached to the outer edge of the border of the substrate, and the rest of the substrate layers are sequentially biased against the alignment test unit.

The utility model relates to a monitoring method of base plate counterpoint test strip, as shown in fig. 8 to 13, the stack of using a four-layer base plate in the picture indicates, it is formed by 4 layers of metal layers and resin material pressfitting, the base plate is counterpoint test strip and every layer of metal layer of base plate form in same technological process partially, its super specification decision line length design is 40um for C, the base plate is counterpoint decision maker to equidistant sawtooth partially, the width A of base plate is 300um to counterpoint test element partially, interval B is 200um, adjacent base plate is counterpoint test element length to counterpoint difference △ Y =10um partially in proper order, on the X-Z plane, its monitoring method is as follows:

A. as shown in fig. 8, when only the first row of the left-side substrate layer deviation alignment test units are visible on the entire side of the substrate, it means that there is no overall deviation between the metal layers of the substrate and no relative layer deviation between the metal layers;

B. as shown in fig. 9, when the first left row of the substrate layer alignment test unit is visible from the entire side of the substrate, and the second layer of the metal layer appears one more row than the other layers, i.e., the second left row of the substrate layer alignment test unit, it means that there is no overall offset of the metal layers of the substrate, but the second layer of the metal layer is offset by 10um in the Y direction (i.e., forward) relative to the other layers;

C. as shown in fig. 10, when two rows of the substrate layer misalignment testing units can be seen on each layer of the whole side of the substrate, which is the first and second left-side substrate layer misalignment testing units, it means that all metal layers of the substrate are shifted 10um in the Y direction (i.e. forward), but there is no relative layer shift between the metal layers;

D. as shown in fig. 11, when two rows of the substrate layer misalignment testing units are visible on each layer of the whole side of the substrate, and the third metal layer appears two rows more than the other layers, i.e. the third and fourth substrate layer misalignment testing units on the left side, it means that the third metal layer is shifted 20um in the Y direction (i.e. forward) relative to the other layers;

E. as shown in fig. 12, when the number of rows of each layer of substrate layer on the entire side of the substrate is the same but the first row has saw-tooth points, it means that there is no relative layer bias state on the entire substrate, but the entire substrate is shifted by 50um in the Y direction (i.e. forward), and the entire substrate is shifted out of specification because the length of the out-of-specification determination line is designed to be 40 um;

F. as shown in fig. 13, when the number of rows of substrate layer offset alignment test units in each layer of the entire side surface of the substrate is the same, and two rows of saw-tooth points are present in the first row and the second row, it indicates that the entire substrate is offset by 60um in the Y direction (i.e. forward), and the entire substrate is severely offset out of specification; meanwhile, the second layer and the third layer are more than the other layers by one column, which means that the metal layers of the second layer and the third layer are shifted by 10um in the Y direction (i.e. forward) relative to the other layers.

By the method for judging the monitoring method of the substrate layer deviation position test strip, the deviation condition can be directly judged by naked eyes from six sides of the substrate, the deviation is determined, the substrate layer deviation problem can be timely found and solved, a machine and measuring equipment are not needed, the efficiency is high, and the practicability is high.

The above-mentioned embodiments further describe the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a base plate layer is counterpointed test strip, its characterized in that, it includes initiating line, exceeds specification and judges line, termination line, a plurality of base plate layer is counterpointed test unit, initiating line, termination line all with exceed specification and judge line parallel arrangement, base plate layer is counterpointed test unit several and is arranged into a row at the X direction and neatly sets up between initiating line and termination line, and the equidistant distribution of uniform width, base plate layer is counterpointed test unit head and is set up base plate layer and is counterpointed the judgement mark partially, base plate layer is counterpointed the judgement mark partially and is aligned with the termination line, and ends in within the termination line, initiating line and the distance of exceeding specification judgement line limit and surpass specification and judge line length C, and the length of its Y direction is the equidifferent degressive setting.

2. The substrate layer misalignment test strip of claim 1, wherein the substrate layer misalignment determination marker is U-shaped, saw-toothed, curved, or stepped.

3. The substrate layer offset alignment test strip of claim 1 or 2, wherein the substrate layer offset alignment determination markers are equally spaced serrations.

4. The substrate layer misalignment test strip of claim 1 or 2, wherein the substrate layer misalignment position determination markers are unequally spaced serrations.