CN210211221U - Die glue inlet material-handle-free device - Google Patents
Die glue inlet material-handle-free device Download PDFInfo
- Publication number
- CN210211221U CN210211221U CN201921026972.2U CN201921026972U CN210211221U CN 210211221 U CN210211221 U CN 210211221U CN 201921026972 U CN201921026972 U CN 201921026972U CN 210211221 U CN210211221 U CN 210211221U
- Authority
- CN
- China
- Prior art keywords
- water
- mouth
- storage tank
- river
- free device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a mould advances jiao kou does not have material handle device, concretely relates to mould technical field, including mould, mouth of a river way, water-cooling mechanism and heat conduction mechanism, the upper surface of mould has set firmly two sets of mouth of a river ways, one side that the mouth of a river was said is provided with water-cooling mechanism, and the opposite side that the mouth of a river was said is provided with heat conduction mechanism. The utility model discloses in through having set up mouth of a river way and water-cooling mechanism, can make the coolant liquid say inside slow flow at the mouth of a river, make the low temperature in the coolant liquid can more effectual transmission to the mouth of a river say material department in to cooperation semiconductor refrigeration piece and micropump, the good water-cooling effect has been guaranteed in the circulation refrigeration, makes mouth of a river say inside can not produce the connection waste material, the effectual material of having practiced thrift has reduced economic cost, has higher practical application and worth, the facilitate promotion.
Description
Technical Field
The utility model relates to the technical field of mold, more specifically say, the utility model relates to a mould advances jiao kou does not have material handle device.
Background
The BMC is a thermosetting material, a heating device is arranged in a normal mold glue inlet flow channel, the BMC material is heated and molded, and then the BMC material and a product are demoulded and released together, so that a water gap is generated, wherein the water gap refers to a joint part of a frame and a part formed when a model is poured in a factory, and is also called as a 'soup gap', and the water gap means an inlet and an outlet for the heated liquid plastic to flow.
But its when the in-service use, still there are more shortcomings, the mould advances the position department of jiao kou, because all use heating device to make its solidification, produces easily and connects the waste material, has increased economic cost to still need the later stage to process it and polish, increased staff's work load, be unfavorable for production.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's above-mentioned defect, the embodiment of the utility model provides a mould advances jiao kou does not have material handle device, through having set up mouth of a river way and water-cooling mechanism, can make the coolant liquid say inside slow flow at the mouth of a river, make the low temperature in the coolant liquid can more effectual transmission to the mouth of a river say interior material department, and cooperation semiconductor refrigeration piece and micropump, the circulation refrigeration, good water-cooling effect has been guaranteed, make the mouth of a river say inside can not produce the connection waste material, the effectual material of having practiced thrift, economic cost is reduced, higher practical application is worth, and the promotion is convenient for.
In order to achieve the above object, the utility model provides a following technical scheme: a material handle-free device for a glue inlet of a mold comprises the mold, water port channels, a water cooling mechanism and a heat conduction mechanism, wherein two groups of water port channels are fixedly arranged on the upper surface of the mold, the water cooling mechanism is arranged on one side of each water port channel, and the heat conduction mechanism is arranged on the other side of each water port channel;
the water inlet channel comprises an outer shell, an inner shell is arranged in the outer shell, a blocking piece is arranged between the outer shell and the inner shell, water flow channels are arranged on the upper side and the lower side of the blocking piece, a convex edge part is arranged above the inner shell, a water inlet is formed in one side of the outer shell, and a water outlet is formed in one side of the outer shell close to the lower part of the water inlet;
the water cooling mechanism is including first storage water tank, be provided with the semiconductor refrigeration piece on the first storage water tank inner wall, and the micropump is installed to the inside bottom of first storage water tank, the micropump delivery end rigid coupling has first pipe, two sets of inlet tubes are installed to first pipe one end, first storage water tank side surface has set firmly the second pipe, second pipe one end branch is equipped with two sets of outlet pipes.
In a preferred embodiment, the heat conducting mechanism includes a second water storage tank, one end of the second water storage tank is fixedly connected with a drain pipe, a thermometer is embedded in the front surface of the second water storage tank, one end of the second water storage tank is fixedly provided with a heat conducting rod along the horizontal direction, and one end of the heat conducting rod is fixedly connected with a heat absorbing plate.
In a preferred embodiment, the outer shell and the inner shell are of one-piece design.
In a preferred embodiment, the baffle and the water channel are designed in a spiral structure.
In a preferred embodiment, one end of the water inlet pipe is fixedly connected with the water inlet, and one end of the water outlet pipe is fixedly connected with the water outlet.
In a preferred embodiment, the upper surface of the first water storage tank is provided with a water filling port, and the front surface of the first water storage tank is embedded with a visible window, and the inside of the visible window is provided with scale marks.
In a preferred embodiment, the first water storage tank contains cooling liquid inside, and the cooling liquid comprises alcohol and purified water.
In a preferred embodiment, the front surface of the drain pipe is embedded with an opening and closing valve.
In a preferred embodiment, the second water storage tank and the heat absorbing plate are connected together through a heat conducting rod, and the heat absorbing plate is designed in an annular structural type.
The utility model discloses a technological effect and advantage:
1. the utility model discloses in through having set up mouth of a river way and water cooling mechanism, can make the coolant liquid flow slowly in mouth of a river way inside, make the low temperature in the coolant liquid can more effectively transmit to the material department in the mouth of a river way, and cooperate semiconductor refrigeration piece and micropump, the circulation refrigeration has guaranteed good water cooling effect, can not produce the connection waste material inside making the mouth of a river way, the material of effectual having practiced thrift has reduced economic cost, has higher practical application value, the facilitate promotion;
2. the utility model discloses in through having set up heat conduction mechanism, can effectually retrieve the heat that produces in the material forming process to turn into heat energy storage with it in aqueous, with this to water heat utilization, improved the utilization ratio of resource.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural view of the water gap passage of the present invention.
Fig. 3 is a schematic structural diagram of the middle housing and the convex edge portion of the present invention.
Fig. 4 is an enlarged schematic structural view of a portion a in fig. 1 according to the present invention.
Fig. 5 is a schematic structural view of the middle heat conducting mechanism of the present invention.
The reference signs are: the device comprises a mould 1, a water outlet channel 2, an outer shell 21, an inner shell 22, a convex edge 23, a blocking sheet 24, a water channel 25, a water inlet 26, a water outlet 27, a water cooling mechanism 3, a first water storage tank 31, a semiconductor refrigerating sheet 32, a micropump 33, a first guide pipe 34, a water inlet pipe 35, a second guide pipe 36, a water outlet pipe 37, a heat conduction mechanism 4, a second water storage tank 41, a water outlet pipe 42, a 43 thermometer, a 44 heat conduction rod and a 45 heat absorption plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The device comprises a mould 1, water gap channels 2, a water cooling mechanism 3 and a heat conduction mechanism 4, wherein the upper surface of the mould 1 is fixedly provided with two groups of water gap channels 2, one side of each water gap channel 2 is provided with the water cooling mechanism 3, and the other side of each water gap channel 2 is provided with the heat conduction mechanism 4;
the water channel 2 comprises an outer shell 21, an inner shell 22 is arranged in the outer shell 21, a blocking piece 24 is arranged between the outer shell 21 and the inner shell 22, water channels 25 are arranged on the upper side and the lower side of the blocking piece 24, a convex edge portion 23 is arranged above the inner shell 22, a water inlet 26 is formed in one side of the outer shell 21, and a water outlet 27 is formed in one side of the outer shell 21 close to the lower portion of the water inlet 26;
the water cooling mechanism 3 comprises a first water storage tank 31, a semiconductor refrigerating sheet 32 is arranged on the inner wall of the first water storage tank 31, a micro pump 33 is arranged at the bottom end inside the first water storage tank 31, a first guide pipe 34 is fixedly connected to the water outlet end of the micro pump 33, two water inlet pipes 35 are arranged at one end of the first guide pipe 34, a second guide pipe 36 is fixedly arranged on the side surface of the first water storage tank 31, and two water outlet pipes 37 are respectively arranged at one end of the second guide pipe 36;
the outer shell 21 and the inner shell 22 are designed in an integrated mode;
the baffle plate 24 and the water channel 25 are designed in a spiral structure;
one end of the water inlet pipe 35 is fixedly connected with the water inlet 26, and one end of the water outlet pipe 37 is fixedly connected with the water outlet 27;
a water filling port is formed in the upper surface of the first water storage tank 31, a visual window is embedded in the front surface of the first water storage tank 31, and scale marks are arranged in the visual window;
the first water storage tank 31 contains cooling liquid, and the cooling liquid comprises alcohol and purified water.
The implementation mode is specifically as follows: after the material is formed, the semiconductor refrigerating sheet 32 is controlled to refrigerate the internal refrigerating fluid, the micro pump 33 works, the generated suction force sucks the internal refrigerating fluid into the first conduit 34, the internal refrigerating fluid sequentially passes through the water inlet pipe 35 and the water inlet 26 and is then transmitted between the outer shell 21 and the inner shell 22, the internal refrigerating fluid rotates along the water flow channel 25 on the blocking piece 24 and flows downwards, finally, the cooled fluid directly falls into the first water storage tank 31 through the water outlet 27, the water outlet pipe 37 and the second conduit 36 sequentially, the circulation is repeated in the way to cool the position of the water channel 2, the design can enable the cooling fluid to slowly flow in the water channel 2, the low temperature in the cooling fluid can be more effectively transmitted to the material in the water channel 2, and the semiconductor refrigerating sheet 32 and the micro pump 33 are matched to carry out circulation refrigeration, so that a good water cooling effect is ensured, and no connecting waste material is generated in the water channel 2, effectively saves materials, reduces economic cost, has higher practical application value and is convenient for popularization.
The mold glue inlet material handle-free device shown in fig. 1 and fig. 5 further comprises a heat conducting mechanism 4, wherein the heat conducting mechanism 4 is arranged on one side of the water inlet channel 2, the heat conducting mechanism 4 comprises a second water storage tank 41, one end of the second water storage tank 41 is fixedly connected with a drain pipe 42, a thermometer 43 is embedded in the front surface of the second water storage tank 41, one end of the second water storage tank 41 is fixedly provided with a heat conducting rod 44 along the horizontal direction, and one end of the heat conducting rod 44 is fixedly connected with a heat absorbing plate 45;
an opening and closing valve is embedded in the front surface of the drain pipe 42;
the second water storage tank 41 and the heat absorbing plate 45 are connected together through a heat conducting rod 44, and the heat absorbing plate 45 is designed in an annular structural formula.
The implementation mode is specifically as follows: after the material shaping, can produce certain heat, the absorber plate 45 laminating of annular structural design is at the surface of protruding edge portion 23, inside heat directly transmits to the absorber plate 45 on, through heat conduction pole 44, directly transmit the inside aquatic of second storage water tank 41, promote the temperature of water, observe by thermometer 43, in case after the high temperature, just directly outwards discharge through drain pipe 42 and utilize, such design, can effectually retrieve the heat that produces among the material forming process, thereby it stores in the aquatic to turn into heat energy with it, with this heat utilization to water, the utilization ratio of resource has been improved.
The utility model discloses the theory of operation:
referring to the attached drawings 1-4 of the specification, by arranging the water opening channel 2 and the water cooling mechanism 3, the cooling liquid can slowly flow in the water opening channel 2, so that the low temperature in the cooling liquid can be more effectively transferred to the material in the water opening channel 2, and the semiconductor refrigerating sheet 32 and the micro pump 33 are matched for circulating refrigeration, so that a good water cooling effect is ensured, no connecting waste is generated in the water opening channel 2, the material is effectively saved, the economic cost is reduced, the water cooling device has high practical application value and is convenient to popularize;
referring to the attached drawings 1 and 5 of the specification, by arranging the heat conducting mechanism 4, heat generated in the material forming process can be effectively recovered, so that the heat is converted into heat energy to be stored in water, the water is heated and utilized, and the utilization rate of resources is improved.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a mould advances jiao kou does not have material handle device, includes mould (1), mouth of a river way (2), water-cooling mechanism (3) and heat conduction mechanism (4), its characterized in that: two groups of water gap channels (2) are fixedly arranged on the upper surface of the die (1), a water cooling mechanism (3) is arranged on one side of each water gap channel (2), and a heat conduction mechanism (4) is arranged on the other side of each water gap channel (2);
the water inlet channel (2) comprises an outer shell (21), an inner shell (22) is arranged in the outer shell (21), a blocking piece (24) is arranged between the outer shell (21) and the inner shell (22), water channels (25) are arranged on the upper side and the lower side of the blocking piece (24), a convex edge part (23) is arranged above the inner shell (22), a water inlet (26) is formed in one side of the outer shell (21), and a water outlet (27) is formed in one side of the outer shell (21) close to the lower part of the water inlet (26);
water-cooling mechanism (3) are including first storage water tank (31), be provided with semiconductor refrigeration piece (32) on first storage water tank (31) inner wall, and first storage water tank (31) inside bottom installs micropump (33), micropump (33) water outlet end rigid coupling has first pipe (34), two sets of inlet tubes (35) are installed to first pipe (34) one end, first storage water tank (31) side surface has set firmly second pipe (36), second pipe (36) one end branch is equipped with two sets of outlet pipes (37).
2. The die glue inlet material handle-free device according to claim 1, characterized in that: the heat conducting mechanism (4) comprises a second water storage tank (41), a drain pipe (42) is fixedly connected to one end of the second water storage tank (41), a thermometer (43) is embedded into the front surface of the second water storage tank (41), a heat conducting rod (44) is fixedly arranged at one end of the second water storage tank (41) in the horizontal direction, and a heat absorbing plate (45) is fixedly connected to one end of the heat conducting rod (44).
3. The die glue inlet material handle-free device according to claim 1, characterized in that: the outer shell (21) and the inner shell (22) are designed in an integrated mode.
4. The die glue inlet material handle-free device according to claim 1, characterized in that: the baffle plate (24) and the water flow channel (25) are designed to be in a spiral structure.
5. The die glue inlet material handle-free device according to claim 1, characterized in that: one end of the water inlet pipe (35) is fixedly connected with the water inlet (26), and one end of the water outlet pipe (37) is fixedly connected with the water outlet (27).
6. The die glue inlet material handle-free device according to claim 1, characterized in that: a water filling port is formed in the upper surface of the first water storage tank (31), a visual window is embedded in the front surface of the first water storage tank (31), and scale marks are arranged inside the visual window.
7. The die glue inlet material handle-free device according to claim 6, characterized in that: the first water storage tank (31) is internally filled with cooling liquid, and the cooling liquid comprises alcohol and purified water.
8. The die glue inlet material handle-free device according to claim 2, characterized in that: and an opening and closing valve is embedded in the front surface of the drain pipe (42).
9. The die glue inlet material handle-free device according to claim 2, characterized in that: the second water storage tank (41) is connected with a heat absorption plate (45) through a heat conduction rod (44), and the heat absorption plate (45) is designed in an annular structural type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921026972.2U CN210211221U (en) | 2019-07-03 | 2019-07-03 | Die glue inlet material-handle-free device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921026972.2U CN210211221U (en) | 2019-07-03 | 2019-07-03 | Die glue inlet material-handle-free device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210211221U true CN210211221U (en) | 2020-03-31 |
Family
ID=69935806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921026972.2U Active CN210211221U (en) | 2019-07-03 | 2019-07-03 | Die glue inlet material-handle-free device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210211221U (en) |
-
2019
- 2019-07-03 CN CN201921026972.2U patent/CN210211221U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206677045U (en) | A kind of cooling water tank for being used to after auto parts punching press cool down | |
| CN210211221U (en) | Die glue inlet material-handle-free device | |
| CN201816196U (en) | Integral type water cooling device | |
| CN110696234B (en) | Quick cooling mechanism of forming die | |
| CN212147431U (en) | Quick refrigerated injection mold | |
| CN210552851U (en) | Cooling device for injection molding of automobile seat plastic part | |
| CN208946619U (en) | A kind of high stable mold injection water cooling system | |
| CN217968029U (en) | Injection molding machine with cooling device | |
| CN215791366U (en) | Sunroof waterproof casing injection mold | |
| CN210911100U (en) | Barrel cooling device of sheet extruder | |
| CN208833029U (en) | The cooling cast welding cooling-water cooling device of economic benefits and social benefits | |
| CN219587904U (en) | Hydraulic station closed-loop cooling system of large forging machine | |
| CN218084084U (en) | PE tubular product production mould | |
| CN204787518U (en) | Explosion -proof cooling device | |
| CN209918863U (en) | Local cooling device for casting mold | |
| CN207290765U (en) | A kind of injection mould for condom and pickoff | |
| CN209389497U (en) | A kind of safety-type low-tension distribution box | |
| CN220698177U (en) | Casting die capable of being cooled doubly | |
| CN217529178U (en) | Die casting die biax hole cooling system structure | |
| CN210564983U (en) | Oil cooling device of air compressor | |
| CN108714652A (en) | A kind of auto parts production mold with cooling structure | |
| CN218227507U (en) | Plastic mould with strong heat dissipation performance | |
| CN208978238U (en) | Tubing vacuum shaping box | |
| CN209063446U (en) | A kind of injection mold with refrigerating function | |
| CN213797969U (en) | Porous integrative pipe cooling design water tank |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |