CN210210008U - Chemical mechanical polishing cooling device - Google Patents
Chemical mechanical polishing cooling device Download PDFInfo
- Publication number
- CN210210008U CN210210008U CN201920993130.8U CN201920993130U CN210210008U CN 210210008 U CN210210008 U CN 210210008U CN 201920993130 U CN201920993130 U CN 201920993130U CN 210210008 U CN210210008 U CN 210210008U
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- CN
- China
- Prior art keywords
- polishing
- cooling water
- chemical mechanical
- cooling
- head
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 101
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 239000000126 substance Substances 0.000 title claims abstract description 41
- 239000000498 cooling water Substances 0.000 claims abstract description 59
- 230000000694 effects Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The utility model discloses a chemical mechanical polishing cooling device, include: a grinding head; a cooling water inlet which is accessed from the middle of the upper surface of the grinding head; a cooling water outlet which is connected out from the middle of the upper surface of the grinding head; and a cooling water passage disposed adjacent to a polishing surface of the polishing head, the cooling water passage, the cooling water inlet, and the cooling water outlet constituting a circulation passage.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field especially relates to a chemical mechanical polishing cooling device.
Background
Chemical Mechanical Polishing (CMP) is a very important process in semiconductor manufacturing equipment. In a chemical mechanical polishing process, the temperature of the polishing region is very important to the process, and overheating may pose a potential defect risk.
In order to overcome the heat generated by mechanical polishing in the chemical mechanical polishing process and achieve the purpose of controlling the surface temperature of the wafer, the prior art has a cooling water loop installed below the wafer polishing platform to control the temperature of the polishing platform. As shown in particular in figure 1. However, in this heavy proposal, the whole grinding platform is cooled, and the actual heat generation is mainly concentrated between the grinding head and the contacted silicon wafer, so the cooling effect is general.
There is the cooling effect not good to current chemical mechanical polishing equipment cooling at grinding platform, can't realize carrying out the problem of quick, effectively cooling to the bistrique of heat gathering, the utility model provides a chemical mechanical polishing cooling device can show and reduce and avoid above-mentioned problem even.
SUMMERY OF THE UTILITY MODEL
There is the cooling effect not good to current chemical mechanical polishing equipment cooling at grinding platform, can't realize carrying out the problem of quick, effective cooling to the bistrique of heat gathering, according to the utility model discloses an embodiment provides a chemical mechanical polishing cooling device, include:
a grinding head;
a cooling water inlet which is accessed from the middle of the upper surface of the grinding head;
a cooling water outlet which is connected out from the middle of the upper surface of the grinding head; and
and a cooling water passage provided in close proximity to a polishing surface of the polishing head, the cooling water passage constituting a circulation passage together with the cooling water inlet and the cooling water outlet.
In an embodiment of the present invention, the cooling water inlet is connected to the cooling water passage from a position of the edge of the polishing head near the polishing surface after being connected to the polishing head from the middle of the upper surface of the polishing head, and is connected to the cooling water outlet from a position of the polishing head near the polishing surface at the middle of the polishing head.
In an embodiment of the present invention, the cooling water outlet is connected to the cooling water passage from a position of the edge of the polishing head near the polishing surface after being connected to the polishing head from the middle of the upper surface of the polishing head.
In an embodiment of the present invention, the cooling water inlet is connected to the cooling water passage from a position near the polishing surface in the middle of the polishing head after being connected to the polishing head from the middle of the upper surface of the polishing head, and is connected to the cooling water outlet from a position near the polishing surface at the edge of the polishing head.
In one embodiment of the present invention, the cooling water passage is located on a surface of the grinding head near the grinding surface and parallel to the grinding surface.
In an embodiment of the present invention, the cooling water passage has a circular planar layout.
In an embodiment of the present invention, the cooling water passage is formed in a spiral annular planar layout.
The utility model provides a chemical mechanical polishing cooling device utilizes to set up the cooling water return circuit on the bistrique of chemical mechanical polishing equipment, directly cools off bistrique and wafer. Based on the utility model discloses a this kind of chemical mechanical polishing cooling device can solve current chemical mechanical polishing equipment and cool off at grinding platform and have the cooling effect not good, can't realize carrying out quick, the problem of effectively cooling to the bistrique of heat gathering, improves the defect of chemical mechanical polishing technology.
Drawings
To further clarify the above and other advantages and features of various embodiments of the present invention, a more particular description of various embodiments of the invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.
Fig. 1 is a schematic diagram illustrating cooling of a conventional chemical mechanical polishing apparatus at a polishing platen.
Fig. 2 illustrates a cross-sectional view of a chemical mechanical polishing cooling device 200 formed in accordance with an embodiment of the present invention.
Fig. 3 illustrates a top cross-sectional view of a chemical mechanical polishing cooling device 200 formed in accordance with an embodiment of the present invention.
Detailed Description
In the following description, the present invention is described with reference to embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention. Similarly, for purposes of explanation, specific numbers, materials, and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the invention may be practiced without specific details. Further, it should be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.
Reference in the specification to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.
It should be noted that, the embodiments of the present invention describe the process steps in a specific order, however, this is only for the convenience of distinguishing the steps, and not for limiting the sequence of the steps.
The utility model provides a chemical mechanical polishing cooling device utilizes to set up the cooling water return circuit on the bistrique of chemical mechanical polishing equipment, directly cools off bistrique and wafer. Based on the utility model discloses a this kind of chemical mechanical polishing cooling device can solve current chemical mechanical polishing equipment and cool off at grinding platform and have the cooling effect not good, can't realize carrying out the problem quick, effectively cooling to the grinding head of heat gathering, improves the defect of chemical mechanical polishing technology.
A cmp cooling apparatus according to an embodiment of the present invention is described in detail with reference to fig. 2 and 3. Fig. 2 illustrates a cross-sectional view of a chemical mechanical polishing cooling device 200 formed in accordance with an embodiment of the present invention; fig. 3 illustrates a top cross-sectional view of a chemical mechanical polishing cooling device 200 formed in accordance with an embodiment of the present invention. As shown in fig. 2 and 3, the chemical mechanical polishing cooling device 200 further includes a polishing head 210, a cooling water inlet 230, a cooling water outlet 240, and a cooling water passage 250.
The polishing head 210 is a polishing head of a conventional chemical mechanical polishing apparatus, and when performing chemical mechanical polishing, the polishing head 210 is located above the silicon wafer 220, and a polishing pad and a polishing liquid (not shown) are disposed between the polishing head 210 and the silicon wafer 220. Generally, a certain amount of time is required to increase the grinding and polishing speed.
The cooling water inlet 230 enters from the middle of the upper portion of the polishing head 210 and then enters the cooling water channel 250 from the edge of the polishing area.
The cooling water outlet 240 also leads from the upper middle of the polishing head 210 and connects to the cooling water passage 250 at a middle position of the polishing area.
The cooling water channel 250 is connected to the cooling water inlet 230 from the edge of the polishing head 210, and then arranged in a spiral-like arrangement in the vicinity of the silicon wafer polishing area of the polishing head 230, and connected to the cooling water outlet 240 at the middle of the polishing area. Thereby realizing that the cooling water enters the cooling water passage 250 from the cooling water inlet 230 and then flows out from the cooling water outlet 240, and realizing the water cooling effect.
However, it should be understood by those skilled in the art that the arrangement of the cooling water passage 250 may be other annular arrangements, and the number of the annular turns may be appropriately adjusted according to the requirements of the cooling apparatus.
Based on the utility model provides a this kind of chemical mechanical polishing cooling device utilizes to set up the cooling water return circuit on the bistrique of chemical mechanical polishing equipment, directly cools off bistrique and wafer. Based on the utility model discloses a this kind of chemical mechanical polishing cooling device can solve current chemical mechanical polishing equipment and cool off at grinding platform and have the cooling effect not good, can't realize carrying out the problem quick, effectively cooling to the grinding head of heat gathering, improves the defect of chemical mechanical polishing technology.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims (7)
1. A chemical mechanical polishing cooling device, comprising:
a grinding head;
a cooling water inlet which is accessed from the middle of the upper surface of the grinding head;
a cooling water outlet which is connected out from the middle of the upper surface of the grinding head; and
and a cooling water passage provided inside the polishing head and adjacent to a polishing surface of the polishing head, the cooling water passage constituting a circulation passage with the cooling water inlet and the cooling water outlet.
2. The chemical mechanical polishing cooling apparatus of claim 1, wherein the cooling water inlet is connected to the cooling water passage from a position near the polishing surface at the edge of the polishing head after being connected from the middle of the upper surface of the polishing head, and is finally connected to the cooling water outlet from a position near the polishing surface at the middle of the polishing head.
3. The chemical mechanical polishing cooling apparatus of claim 1, wherein the cooling water outlet is connected to the cooling water passage from a position near the polishing surface of the polishing head after being connected to the polishing head from the middle of the upper surface of the polishing head.
4. The chemical mechanical polishing cooling apparatus of claim 3, wherein the cooling water inlet is connected to the cooling water passage from a position near the polishing surface at the middle of the polishing head after being connected from the middle of the upper surface of the polishing head, and is finally connected to the cooling water outlet from a position near the polishing surface at the edge of the polishing head.
5. The chemical mechanical polishing cooling device of claim 1, wherein said cooling water passage is located on a surface of said polishing head near said polishing surface and parallel to said polishing surface.
6. The chemical mechanical polishing cooling device of claim 1, wherein the cooling water passages are in an annular planar configuration.
7. The chemical mechanical polishing cooling device of claim 1, wherein the cooling water passages are in a spiral annular plan layout.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920993130.8U CN210210008U (en) | 2019-06-28 | 2019-06-28 | Chemical mechanical polishing cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920993130.8U CN210210008U (en) | 2019-06-28 | 2019-06-28 | Chemical mechanical polishing cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210210008U true CN210210008U (en) | 2020-03-31 |
Family
ID=69934662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920993130.8U Expired - Fee Related CN210210008U (en) | 2019-06-28 | 2019-06-28 | Chemical mechanical polishing cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210210008U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111843832A (en) * | 2020-07-30 | 2020-10-30 | 赣州市业润自动化设备有限公司 | Water-cooled grinding head for chemical mechanical grinding |
-
2019
- 2019-06-28 CN CN201920993130.8U patent/CN210210008U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111843832A (en) * | 2020-07-30 | 2020-10-30 | 赣州市业润自动化设备有限公司 | Water-cooled grinding head for chemical mechanical grinding |
| CN111843832B (en) * | 2020-07-30 | 2021-09-07 | 广东汉岂工业技术研发有限公司 | Water-cooled grinding head for chemical mechanical grinding |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 |
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| CF01 | Termination of patent right due to non-payment of annual fee |