CN210208978U

CN210208978U - Water-saving soldering tin cooling device

Info

Publication number: CN210208978U
Application number: CN201920633269.1U
Authority: CN
Inventors: Chunlin Lai; 赖春林
Original assignee: Xinfeng Hongye Electronics Co Ltd
Current assignee: Xinfeng Hongye Electronics Co Ltd
Priority date: 2019-05-06
Filing date: 2019-05-06
Publication date: 2020-03-31
Anticipated expiration: 2029-05-06

Abstract

The utility model relates to a water-saving soldering tin cooling device, which comprises a cooling tank and supporting legs positioned at the bottom of the cooling tank, wherein a sieve plate is arranged in the cooling tank, the sieve plate is provided with a water outlet, the top end of the sieve plate is provided with a filter cartridge enclosing the water outlet, the bottom of the cooling tank is provided with a water outlet pipe opposite to the water outlet, the top end of the water outlet pipe extends to the bottom of the sieve plate, wherein the top end of the water outlet pipe is outwards turned with a turned edge which is tightly attached to the bottom of the sieve plate, the sieve plate is provided with a bolt which is locked on the turned edge, the bottom in the cooling tank is provided with a recovery tank which is connected with the outlet end of the water outlet pipe, wherein the recovery tank is provided with a return pipe which extends into the cooling tank at the top of the sieve plate, the return pipe is provided with a water pump, and a circle of water inlet pipe positioned at the bottom of the sieve plate is also arranged in the cooling tank, wherein water spray holes are uniformly formed in the side wall of the inner side of the circle of water inlet pipe. The utility model discloses simple structure, convenient to use.

Description

Water-saving soldering tin cooling device

Technical Field

The invention relates to the technical field of soldering tin auxiliary equipment, in particular to a water-saving soldering tin cooling device.

Background

Soldering is a process widely involved in industry, and soldering is essential in the production of the electronic industry. After soldering the product, the product needs to be cooled rapidly. In automatic soldering tin production, a water cooling mode of putting a product into a cooling water tank is often adopted.

The existing device comprises a cooling tank and a bracket for supporting the cooling tank, wherein the bottom end of the cooling tank is connected with a water outlet pipe 7, and the top end of the cooling tank is provided with a water inlet pipe.

However, when the temperature of water in the cooling tank rises and the water needs to be replaced, the water is directly discharged through the water outlet pipe, so that the waste of the water is caused, the water resource cannot be recycled, and the water-saving device is not in accordance with the concept of saving water.

Disclosure of Invention

The invention aims to provide a water-saving soldering tin cooling device.

The technical problem of the invention is mainly solved by the following technical scheme:

a water-saving soldering tin cooling device comprises a cooling tank and supporting legs positioned at the bottom of the cooling tank, wherein a sieve plate is arranged in the cooling tank, a water outlet is arranged on the sieve plate, a filter cartridge for enclosing the water outlet is arranged at the top end of the sieve plate, the edge of the sieve plate is also bent upwards to be tightly attached to the inner side wall of the cooling tank, the folded edge is locked on the side wall of the cooling tank through a bolt, a water outlet pipe right opposite to the water outlet is arranged at the bottom of the cooling tank, the top end of the water outlet pipe extends to the bottom of the sieve plate, the top end of the water outlet pipe is outwards folded and folded with a turned edge tightly attached to the bottom of the sieve plate, the sieve plate is provided with a bolt locked on the turned edge, the bottom in the cooling tank is provided with a recovery tank connected with the outlet end of the water outlet pipe, a return pipe extending, wherein the inner side wall of the ring of water inlet pipe is uniformly provided with water spray holes.

Preferably, a water injection pipe connected with the water inlet pipe is arranged on the side wall of the cooling tank.

Preferably, the top end of the filter cylinder is not lower than the top end level of the cooling tank.

Preferably, a drain pipe is arranged on the bottom wall of the cooling tank.

Preferably, the pore diameter of the sieve plate is larger than that of the filter cartridge.

Preferably, the distance between the water inlet pipe and the bottom end of the cooling tank is 4-7 cm.

The invention has the beneficial effects that:

1. after the liquid in the cooling tank is filled, the product to be cooled after soldering tin can be placed at the top of the sieve plate, impurities on the surface of the product fall off and are mixed in the liquid to be precipitated, and the impurities are precipitated to the bottom of the cooling tank through the aperture of the sieve plate, so that the purposes of impurity precipitation and product cooling are achieved.

2. The outlet pipe still can play the supporting role to the sieve middle zone through the turn-ups, thereby reduce the middle department of sieve because of the unsettled problem that easily sinks or bends of great area, and when the cooling tank is interior to carry out cooling operation, can open the outlet pipe and make the liquid of being heated by the product can flow into in the outlet port through the cartridge filter, and carry out natural cooling or artificial compulsory intervention cooling by the outlet pipe inflow in the accumulator tank, and through the refrigerated liquid through water pump and back flow to the cooling tank in recycle, thereby reach water-saving purpose.

3. Liquid is injected into the water inlet pipe through the water injection pipe and is guided into the cooling tank through the water spray holes, wherein the liquid in the water inlet pipe surges towards the middle area of the cooling tank from the periphery, so that the surface of the sprayed cooling liquid is enlarged, and the temperature of the liquid at each position in the cooling tank is balanced.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1;

fig. 3 is another partial enlarged view of fig. 1.

In the figure: 1. cooling bath, 2, sieve, 3, delivery port, 4, cartridge filter, 5, hem, 6, bolt, 7, outlet pipe, 8, turn-ups, 9, accumulator, 10, back flow, 11, water pump, 12, inlet tube, 13, hole for water spraying, 14, water injection pipe, 15, drain pipe.

Detailed Description

The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings.

The utility model provides a water-saving soldering tin cooling device, includes cooling bath 1 and is located the supporting legs of its bottom, is provided with sieve 2 in cooling bath 1, wherein can place the refrigerated product after soldering tin at sieve 2 tops when cooling bath 1 interior liquid is filled up, and the impurity on the surface drops to mix and deposits behind the liquid in the product to the aperture through sieve 2 deposits to cooling bath 1 bottom, thereby realizes that impurity deposits and the refrigerated purpose of product.

Wherein 2 borders of sieve are still upwards buckled and are hugged closely hem 5 on 1 inside wall of cooling bath, and hem 5 passes through bolt 6 locking on 1 lateral wall of cooling bath for sieve 2 is unsettled to be fixed in cooling bath 1, and this also makes and to maintain clearance or change sieve 2 from dismantling down in cooling bath 1.

A water outlet 3 is arranged on the sieve plate 2, a filter cartridge 4 for enclosing the water outlet 3 is arranged at the top end of the sieve plate 2, wherein the aperture on the sieve plate 2 is larger than that of the filter cartridge 4, a water outlet pipe 7 opposite to the water outlet 3 is welded at the bottom of the cooling tank 1, the top end of the water outlet pipe 7 extends to the bottom of the sieve plate 2, as shown in figure 2, a turned edge 8 tightly attached to the bottom of the sieve plate 2 is turned outwards at the top end of the water outlet pipe 7, a bolt 6 locked on the turned edge 8 is arranged on the sieve plate 2, so that the turned edge 8 is movably connected with the sieve plate 2, the two can be freely detached, the water outlet pipe 7 can also play a supporting role for the middle area of the sieve plate 2 through the turned edge 8, thereby reducing the problem that the middle part of the sieve plate 2 is easy to collapse or bend due to suspension with a large, wherein, a return pipe 10 extending into the cooling tank 1 at the top of the sieve plate 2 is arranged on the recovery tank 8, and a water pump 11 is arranged on the return pipe 10.

When the cooling operation is performed in the cooling tank 8, the water outlet pipe 7 can be opened, so that the liquid heated by the product can flow into the water outlet 3 through the filter cartridge 4, and flow into the recovery tank 8 through the water outlet pipe 7 for natural cooling or artificial forced intervention cooling, and the cooled liquid flows back into the cooling tank 1 through the water pump 11 and the return pipe 10 for recycling, thereby achieving the purpose of saving water.

As shown in fig. 1 and 3, a circle of water inlet pipe 12 located at the bottom of the sieve plate 2 is further disposed in the cooling tank 1, wherein water spray holes 13 are uniformly disposed on the inner side wall of the circle of water inlet pipe 12, and a water injection pipe 14 connected to the water inlet pipe 12 is disposed on the side wall of the cooling tank 1, in this embodiment, the distance between the water inlet pipe 12 and the bottom end of the cooling tank 1 is 4-7 cm, liquid is injected into the water inlet pipe 12 through the water injection pipe 14 and is guided into the cooling tank 1 through the water spray holes 13, wherein the liquid in the water inlet pipe 12 flows towards the middle area of the cooling tank 1 from the periphery, so that the sprayed surface of the sprayed liquid is enlarged, and the temperature of the liquid at each position in the cooling tank 1 is relatively balanced.

In this embodiment, the top end of the filter cartridge 4 is not lower than the top end level of the cooling tank 1, so that even if the cooling tank 1 is full of liquid, the liquid will not flow directly into the water outlet 3 from the top end opening, but must first pass through the filter holes of the filter cartridge 4 to be filtered before entering the water outlet 3, and the bottom wall of the cooling tank 1 is provided with a drain pipe 15 for discharging the liquid and sediments deposited at the bottom of the cooling tank 1.

The present invention has been described in detail, but the above description is only a preferred embodiment of the present invention, and is not to be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims

1. A water-saving soldering tin cooling device comprises a cooling tank and supporting legs positioned at the bottom of the cooling tank, and is characterized in that a sieve plate is arranged in the cooling tank, a water outlet is arranged on the sieve plate, a filter cartridge enclosing the water outlet is arranged at the top end of the sieve plate, the edge of the sieve plate is also bent upwards to form a folded edge tightly attached to the inner side wall of the cooling tank, the folded edge is locked on the side wall of the cooling tank through a bolt, a water outlet pipe opposite to the water outlet is arranged at the bottom of the cooling tank, the top end of the water outlet pipe extends to the bottom of the sieve plate, a turned edge tightly attached to the bottom of the sieve plate is turned outwards at the top end of the water outlet pipe, the sieve plate is provided with a bolt locked on the turned edge, a recovery tank connected with the outlet end of the water outlet pipe is arranged, and a circle of water inlet pipe positioned at the bottom of the sieve plate is also arranged in the cooling tank, wherein water spray holes are uniformly formed in the side wall of the inner side of the circle of water inlet pipe.

2. A water-saving solder cooling apparatus as claimed in claim 1, wherein a water injection pipe connected to the water inlet pipe is provided on a side wall of the cooling bath.

3. A water-saving solder cooling apparatus according to claim 1, wherein the top end of the filter cartridge is not lower than the top end level of the cooling bath.

4. A water-saving solder cooling apparatus according to claim 1, wherein a drain pipe is provided on a bottom wall of the cooling bath.

5. A water-saving solder cooling apparatus according to claim 1, wherein the sieve plate has a larger pore size than the filter cartridge.

6. A water-saving solder cooling apparatus according to claim 1, wherein the distance between the water inlet pipe and the bottom end of the cooling bath is 4-7 cm.