CN210207818U - Cleaning device for copper-plated substrate after development - Google Patents
Cleaning device for copper-plated substrate after development Download PDFInfo
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- CN210207818U CN210207818U CN201920871783.9U CN201920871783U CN210207818U CN 210207818 U CN210207818 U CN 210207818U CN 201920871783 U CN201920871783 U CN 201920871783U CN 210207818 U CN210207818 U CN 210207818U
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Abstract
The utility model discloses a cleaning device for the copper-plated substrate after development, which comprises a machine body, a transmission mechanism and a cleaning mechanism which are arranged in the machine body, and a copper-plated substrate which is placed on the transmission mechanism; a waste liquid groove is formed in the bottom of the machine body; the transmission mechanism comprises a transmission frame and a plurality of transmission rollers which are arranged at intervals along the transmission direction of the transmission mechanism; the transmission roller penetrates through the transmission frame and is in transmission connection with the transmission motor; the cleaning mechanism comprises a cleaning water tank, a high-pressure water pump arranged in the cleaning water tank, a cleaning main pipe connected with the water outlet end of the high-pressure water pump, and an upper cleaning branch pipe and a lower cleaning branch pipe connected with the cleaning main pipe; the upper cleaning branch pipe and the lower cleaning branch pipe are symmetrically arranged on the upper side and the lower side of the transmission roller; the utility model discloses a belt cleaning device behind copper-plated substrate development can wash the upper and lower surface of copper-plated substrate simultaneously, spouts away the developer that remains on copper-plated substrate two sides, washes more thoroughly, and washes more stably.
Description
Technical Field
The utility model relates to a belt cleaning device behind copper facing base plate development belongs to ceramic copper facing board development cleaning equipment technical field.
Background
With the rapid development of science and technology and the pursuit of higher quality of life for human beings, the application characteristics of many products tend to be extremely strict, so that the use of newly developed materials becomes a necessary means, today's IC packaging process is affected by the pursuit of better transmission efficiency and smaller size (e.g., electronic components of mobile phones and mini-notebook computers), so the industry has invested considerable research expenses in this area, after many years of research, the utility model is a ceramic substrate made of ceramic material, the ceramic substrate has excellent insulation, chemical stability, electromagnetic property, high hardness, high thermal conductivity, wear resistance and high temperature resistance, the efficiency of the ceramic substrate is much better than that of the conventional substrate, and thus the frequency of the ceramic substrate is higher and higher.
However, after the metal layer and the conductive layer are attached to the ceramic substrate by thermal compression, the dry film layer is attached to the conductive layer, and the exposure, development and etching operations are performed to leave the required metal layer and conductive layer to form the circuit; the developed plate is often required to be cleaned in the processing process of the ceramic substrate for removing the developing solution on the plate, but the existing cleaning device cannot simultaneously clean the upper surface and the lower surface of the plate, the cleaning effect is poor, and the plate is often displaced and the like during high-pressure washing, so that the cleaning solution is remained; therefore, in order to solve the above problems, it is necessary to design a new cleaning apparatus for cleaning a copper-plated substrate after development.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a belt cleaning device after copper-plated substrate development can wash the upper and lower surface of copper-plated substrate simultaneously, spouts away the developer that remains on copper-plated substrate two sides, washes more thoroughly, and washes more stably.
The utility model discloses a cleaning device for the copper-plated substrate after development, which comprises a machine body, a transmission mechanism and a cleaning mechanism which are arranged in the machine body, and a copper-plated substrate which is arranged on the transmission mechanism; a waste liquid groove is formed in the bottom of the machine body;
the transmission mechanism comprises a transmission frame and a plurality of transmission rollers which are arranged at intervals along the transmission direction of the transmission mechanism; the transmission roller penetrates through the transmission frame and is in transmission connection with the transmission motor;
the cleaning mechanism comprises a cleaning water tank, a high-pressure water pump arranged in the cleaning water tank, a cleaning main pipe connected with the water outlet end of the high-pressure water pump, and an upper cleaning branch pipe and a lower cleaning branch pipe connected with the cleaning main pipe; the upper cleaning branch pipe and the lower cleaning branch pipe are symmetrically arranged on the upper side and the lower side of the transmission roller; the upper cleaning branch pipe is of an annular structure, and a plurality of first high-pressure spray pipes are arranged at the center of the upper cleaning branch pipe at intervals; a plurality of first high-pressure nozzles are arranged on the first high-pressure spray pipe, and spray holes of the first high-pressure nozzles face downwards; the lower cleaning branch pipe is of an annular structure, and a plurality of second high-pressure spray pipes are arranged at the center of the lower cleaning branch pipe at intervals; a plurality of second high-pressure nozzles are arranged on the second high-pressure spray pipe, spray holes of the second high-pressure nozzles face upwards, the copper-plated substrate is placed on a transmission roller of the transmission mechanism, a transmission motor is started, and the transmission roller is driven to drive the copper-plated substrate to move towards the interior of the machine body until the center of the cleaning mechanism; starting a high-pressure water pump, pumping cleaning liquid in a cleaning water tank to an upper cleaning branch pipe and a lower cleaning branch pipe through a cleaning main pipe, respectively spraying the cleaning liquid to the upper surface and the lower surface of the copper-plated substrate through a first high-pressure nozzle and a second high-pressure nozzle on a first high-pressure spray pipe and a second high-pressure spray pipe, respectively cleaning the upper surface and the lower surface of the copper-plated substrate, and spraying away residual developing solution on the two surfaces of the copper-plated substrate; and drying the cleaned copper-plated substrate and outputting the dried copper-plated substrate.
Further, the transmission roller is in transmission connection with a transmission motor through a transmission belt or a transmission chain wheel, and the transmission motor acts to drive the transmission belt or the transmission chain wheel to rotate, so that the transmission is driven to rotate, and the copper-plated substrate is driven to move towards the cleaning mechanism; wherein, the driving belt and the driving chain wheel are the existing devices, and the specific structure and the working principle thereof are not described in detail.
As a preferred embodiment, the driving roller is formed by splicing a plurality of driving joints end to end; the driving wheel is arranged in the center of the driving section, and the length of the driving roller can be adjusted according to the length of the copper-plated substrate, so that the stability during driving is improved.
As a preferred embodiment, inside the machine body, two sides above the conveying roller are provided with limit baffles; the copper-plated substrate is positioned between the two limiting baffles, so that the copper-plated substrate can be prevented from shifting under the flushing action of high-pressure flushing to influence the cleaning effect.
As a preferred embodiment, a dustproof door is arranged on the top cover of the machine body above the cleaning mechanism; the lower edge of the dustproof door is integrally fixed with the sealing ring, so that the phenomenon that cleaning liquid splashes out of the machine body during cleaning to pollute the external environment can be avoided.
Furthermore, an electromagnetic switch valve is respectively arranged on the upper cleaning branch pipe and the lower cleaning branch pipe.
Compared with the prior art, the utility model discloses a cleaning device after copper-plated substrate development, the washing liquid in will wasing the water tank is pumped to the upper washing branch pipe and is washd the branch pipe down through wasing the house steward, and spray the washing liquid to the upper and lower face of copper-plated substrate respectively through first high pressure nozzle and second high pressure nozzle on first high pressure spray tube and the second high pressure spray tube, wash the upper and lower surface of copper-plated substrate respectively, spray away the remaining developer of copper-plated substrate both sides, wash more thoroughly; in addition, the copper-plated substrate is arranged between the two limiting baffles, so that the copper-plated substrate can be prevented from shifting under the flushing action of high-pressure flushing, and the stability of high-pressure flushing is improved.
Drawings
Fig. 1 is a schematic view of the external structure of the present invention.
Fig. 2 is a schematic diagram of the internal structure of the present invention.
Fig. 3 is a schematic structural diagram of the cleaning mechanism of the present invention.
The parts in the drawings are marked as follows: 1-machine body, 2-copper-plated substrate, 3-transmission frame, 4-transmission roller, 5-cleaning water tank, 6-high-pressure water pump, 7-cleaning main pipe, 8-upper cleaning branch pipe, 9-lower cleaning branch pipe, 10-first high-pressure spray pipe, 11-first high-pressure spray nozzle, 12-second high-pressure spray pipe, 13-second high-pressure spray nozzle, 14-transmission wheel, 15-limit baffle, 16-dustproof door, 17-sealing ring, 18-electromagnetic switch valve and 19-waste liquid tank.
Detailed Description
The cleaning device for the copper-plated substrate after development as shown in fig. 1 to 3 comprises a machine body 1, a transmission mechanism and a cleaning mechanism which are arranged in the machine body 1, and a copper-plated substrate 2 which is arranged on the transmission mechanism; a waste liquid groove 19 is arranged at the bottom of the machine body 1;
the transmission mechanism comprises a transmission frame 3 and a plurality of transmission rollers 4 which are arranged at intervals along the transmission direction of the transmission mechanism; the transmission roller 4 penetrates through the transmission frame 3 and is in transmission connection with a transmission motor (not shown);
the cleaning mechanism comprises a cleaning water tank 5, a high-pressure water pump 6 arranged in the cleaning water tank 5, a cleaning main pipe 7 connected with the water outlet end of the high-pressure water pump 6, and an upper cleaning branch pipe 8 and a lower cleaning branch pipe 9 connected with the cleaning main pipe 7; the upper cleaning branch pipe 8 and the lower cleaning branch pipe 9 are symmetrically arranged on the upper side and the lower side of the transmission roller 4; the upper cleaning branch pipe 8 is of an annular structure, and a plurality of first high-pressure spray pipes 10 are arranged at the center of the upper cleaning branch pipe at intervals; a plurality of first high-pressure nozzles 11 are arranged on the first high-pressure spray pipe 10, and spray holes of the first high-pressure nozzles 11 face downwards; the lower cleaning branch pipe 9 is of an annular structure, and a plurality of second high-pressure spray pipes 12 are arranged at intervals in the center of the lower cleaning branch pipe; the second high-pressure nozzle 12 is provided with a plurality of second high-pressure nozzles 13, and the spray holes of the second high-pressure nozzles 13 face upwards.
The driving roller 4 is in driving connection with a driving motor through a driving belt or a driving chain wheel.
The transmission roller 4 is formed by splicing a plurality of transmission sections end to end; a driving wheel 14 is arranged in the center of the driving joint.
Limiting baffles 15 are arranged on two sides of the upper part of the conveying roller 4 in the machine body 1; the copper-plated substrate 2 is positioned between the two limit baffles 15.
A dustproof door 16 is covered at the top of the machine body 1 above the cleaning mechanism; and a sealing ring 17 is integrally fixed on the lower edge of the dustproof door 16.
An electromagnetic switch valve 18 is respectively arranged on the upper cleaning branch pipe 8 and the lower cleaning branch pipe 9.
The cleaning device for the copper-plated substrate after development of the utility model places the copper-plated substrate on the driving roller of the transmission mechanism, starts the transmission motor, drives the driving roller to drive the copper-plated substrate to move towards the interior of the machine body until the center of the cleaning mechanism; starting a high-pressure water pump, pumping cleaning liquid in a cleaning water tank to an upper cleaning branch pipe and a lower cleaning branch pipe through a cleaning main pipe, respectively spraying the cleaning liquid to the upper surface and the lower surface of the copper-plated substrate through a first high-pressure nozzle and a second high-pressure nozzle on a first high-pressure spray pipe and a second high-pressure spray pipe, respectively cleaning the upper surface and the lower surface of the copper-plated substrate, and spraying away residual developing solution on the two surfaces of the copper-plated substrate; drying the cleaned copper-plated substrate and outputting the dried copper-plated substrate; the transmission roller is formed by splicing a plurality of transmission joints end to end, and the length of the transmission roller can be adjusted according to the length size of the copper-plated substrate so as to improve the stability during transmission; the copper-plated substrate is placed between the two limiting baffles, so that the copper-plated substrate can be prevented from shifting under the flushing action of high-pressure flushing to influence the cleaning effect; a dustproof door is covered at the top of the machine body; and the lower edge of the dustproof door is integrally fixed with the sealing ring, so that the cleaning liquid can be prevented from splashing out of the machine body during cleaning to pollute the external environment.
The above-mentioned embodiment is only the preferred embodiment of the present invention, so all the equivalent changes or modifications made by the structure, features and principles of the present invention are included in the claims of the present invention.
Claims (6)
1. The utility model provides a cleaning device after copper facing base plate development which characterized in that: comprises a machine body, a transmission mechanism and a cleaning mechanism which are arranged in the machine body, and a copper-plated substrate which is arranged on the transmission mechanism; a waste liquid groove is formed in the bottom of the machine body;
the transmission mechanism comprises a transmission frame and a plurality of transmission rollers which are arranged at intervals along the transmission direction of the transmission mechanism; the transmission roller penetrates through the transmission frame and is in transmission connection with the transmission motor;
the cleaning mechanism comprises a cleaning water tank, a high-pressure water pump arranged in the cleaning water tank, a cleaning main pipe connected with the water outlet end of the high-pressure water pump, and an upper cleaning branch pipe and a lower cleaning branch pipe connected with the cleaning main pipe; the upper cleaning branch pipe and the lower cleaning branch pipe are symmetrically arranged on the upper side and the lower side of the transmission roller; the upper cleaning branch pipe is of an annular structure, and a plurality of first high-pressure spray pipes are arranged at the center of the upper cleaning branch pipe at intervals; a plurality of first high-pressure nozzles are arranged on the first high-pressure spray pipe, and spray holes of the first high-pressure nozzles face downwards; the lower cleaning branch pipe is of an annular structure, and a plurality of second high-pressure spray pipes are arranged at the center of the lower cleaning branch pipe at intervals; and a plurality of second high-pressure nozzles are arranged on the second high-pressure spray pipe, and spray holes of the second high-pressure nozzles face upwards.
2. The post-development cleaning apparatus for a copper-plated substrate according to claim 1, characterized in that: the driving roller is in transmission connection with a driving motor through a driving belt or a driving chain wheel.
3. The post-development cleaning apparatus for a copper-plated substrate according to claim 1, characterized in that: the transmission roller is formed by splicing a plurality of transmission sections end to end; and a driving wheel is arranged in the center of the driving joint.
4. The post-development cleaning apparatus for a copper-plated substrate according to claim 1, characterized in that: limiting baffles are arranged on two sides above the conveying roller inside the machine body; the copper-plated substrate is positioned between the two limiting baffles.
5. The post-development cleaning apparatus for a copper-plated substrate according to claim 1, characterized in that: a dustproof door is covered at the top of the machine body above the cleaning mechanism; and a sealing ring is integrally fixed on the lower edge of the dustproof door.
6. The post-development cleaning apparatus for a copper-plated substrate according to claim 1, characterized in that: and the upper cleaning branch pipe and the lower cleaning branch pipe are respectively provided with an electromagnetic switch valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920871783.9U CN210207818U (en) | 2019-06-11 | 2019-06-11 | Cleaning device for copper-plated substrate after development |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920871783.9U CN210207818U (en) | 2019-06-11 | 2019-06-11 | Cleaning device for copper-plated substrate after development |
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| Publication Number | Publication Date |
|---|---|
| CN210207818U true CN210207818U (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920871783.9U Active CN210207818U (en) | 2019-06-11 | 2019-06-11 | Cleaning device for copper-plated substrate after development |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113485077A (en) * | 2021-07-28 | 2021-10-08 | 摩泰金属科技(常州)有限公司 | Rubber washing machine for processing and producing stainless steel templates |
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2019
- 2019-06-11 CN CN201920871783.9U patent/CN210207818U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113485077A (en) * | 2021-07-28 | 2021-10-08 | 摩泰金属科技(常州)有限公司 | Rubber washing machine for processing and producing stainless steel templates |
| CN113485077B (en) * | 2021-07-28 | 2022-04-12 | 摩泰金属科技(常州)有限公司 | Rubber washing machine for processing and producing stainless steel templates |
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