CN210182545U

CN210182545U - Combiner

Info

Publication number: CN210182545U
Application number: CN201921344676.7U
Authority: CN
Inventors: Lanlan Zhu; 朱兰兰; Ruihua Xie; 谢瑞华; Wei Luo; 罗伟
Original assignee: Rosenberger Technologies Co Ltd
Current assignee: Prologis Communication Technology Suzhou Co Ltd
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2020-03-24
Anticipated expiration: 2029-08-19

Abstract

The utility model discloses a combiner, which comprises a first substrate, a second substrate and a public bottom plate arranged between the first substrate and the second substrate, wherein the first substrate and the second substrate respectively comprise a signal layer, a signal shielding stratum and a dielectric layer positioned between the signal layer and the signal shielding stratum, and the signal shielding stratum of the two substrates are respectively positioned at two sides of the public bottom plate; the signal layers of the two substrates respectively comprise at least two filters with different frequency bands, the input end of each filter on each signal layer is respectively used as one input end of the combiner, and the output end of each filter is connected with the output end of the combiner. The utility model discloses not only improve the isolation between each way signal, also reduced the sectional area of combiner moreover.

Description

Combiner

Technical Field

The utility model belongs to the technical field of the mobile communication technique and specifically relates to a combiner is related to.

Background

In the design of the combiner, a PCB double-sided board is usually adopted, and a shielding box is covered on the PCB double-sided board. The PCB combiner is in contact with the bottom of the shielding box and is a ground surface, and the surface facing the box cover is a combiner graph surface.

In the design of traditional PCB board combiner, can all design all band filters that need to combine on same face, add between each signal passband and beat the ground connection hole and set up box body metal isolation wall to reduce the signal crosstalk between each combination passband, thereby guarantee the isolation between them.

However, the traditional design is not high in integration level, and the designed finished shielding box body is large in surface area and inconvenient to install.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide a combiner that the integrated level is high.

In order to achieve the above object, the utility model provides a following technical scheme: a combiner comprises a first substrate, a second substrate and a common bottom plate, wherein the common bottom plate is arranged between the first substrate and the second substrate and separates the two substrates, the first substrate and the second substrate respectively comprise a signal layer, a signal shielding stratum and a dielectric layer positioned between the signal layer and the signal shielding stratum, and the signal shielding strata of the two substrates are respectively positioned at two sides of the common bottom plate; the signal layers of the two substrates respectively comprise at least two filters with different frequency bands, the input end of each filter on each signal layer is respectively used as one input end of the combiner, and the output end of each filter is connected with the output end of the combiner.

Preferably, the combiner further includes a shielding box, and the first substrate, the second substrate and the common bottom plate are all accommodated in the shielding box.

Preferably, the shielding box comprises a box body, an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are respectively fixed on the upper end face and the lower end face of the box body in a covering mode.

Preferably, an accommodating space is formed in the box body, the common bottom plate is located in the box body and divides the accommodating space into a first accommodating space and a second accommodating space, and the first substrate and the second substrate are accommodated in the first accommodating space and the second accommodating space respectively.

Preferably, the combiner further includes a separation wall, and the separation wall is disposed between every two adjacent filters on each layer of signal layer.

Preferably, the partition wall is disposed in the shielding box.

Preferably, the partition wall is integrally formed with the shield case.

Preferably, each of the filters is printed on the corresponding dielectric layer in the form of a microstrip line.

Preferably, the first substrate and the second substrate are both PCB boards.

Preferably, the signal layers of the two substrates are respectively a group of filters, and the two groups of filters are obtained by grouping signals to be combined according to the frequency band.

Preferably, the filters of adjacent frequency bands are respectively disposed on the two signal layers of the two substrates.

Preferably, the outputs of each of said filters are connected by conductors.

Preferably, the common bottom plate is provided with an opening penetrating up and down, and the conductor penetrates through the opening and is communicated with the output ends of the filters of the two substrates.

The utility model has the advantages that:

1. the utility model discloses a shielding box with public bottom plate, respectively place a PCB board in the box from top to bottom, the different wave filter of passband frequency distributes on every PCB board, only one side design wave filter metallic pattern with traditional PCB compares, the design of two PCB boards, because the sectional area of every PCB board is about original 50% size, so show the consumptive material that has reduced the wave filter box body, reduce cost, and weight also obviously is superior to traditional scheme, the integrated level is high, be convenient for install.

2. Because any adjacent passbands are designed in different boxes, the public bottom plate is arranged in the middle of the passbands for separation, and the separation walls are arranged among the signal passbands, the signal crosstalk among the combined passbands is reduced, and the isolation between the adjacent passbands is greatly improved.

3. Because two PCBs are adopted, the finished product qualification rate is improved compared with the original design of one PCB.

Drawings

Fig. 1 is a schematic view of the split structure of the present invention;

FIG. 2 is a schematic view of a split structure of the reverse side of FIG. 1;

fig. 3 is a schematic sectional structure of the present invention;

fig. 4 is a schematic perspective view of the present invention;

FIG. 5 is a schematic perspective view of the present invention (with the upper cover removed);

FIG. 6 is a schematic top view of the structure of FIG. 5;

fig. 7 is a schematic sectional view in the direction of C-C in fig. 6.

Reference numerals:

10. the signal shielding structure comprises a first substrate, 11, a signal layer, 12, a dielectric layer, 13, a signal shielding stratum, 14, a perforation, 20, a second substrate, 30, a shielding box, 31, a box body, 32, an upper cover plate, 33, a lower cover plate, 34, a common bottom plate, 341, an opening, 342, a conductor, 35, a first accommodating space, 36, a second accommodating space, 37, a separation wall, 38, a signal input interface, 39 and a signal output interface.

Detailed Description

The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.

The utility model discloses a combiner adopts two PCB board designs, and the different wave filter of distribution passband frequency is showing the sectional area that has reduced the wave filter on every PCB board.

Referring to fig. 1 and fig. 2, a combiner according to an embodiment of the present invention includes a first substrate 10, a second substrate 20, and a common bottom plate 34, and in implementation, both the first substrate 10 and the second substrate 20 can be PCB boards, specifically PCB multi-layer boards. In this embodiment, the first substrate 10 and the second substrate 20 have substantially the same structure, and as shown in fig. 3, each substrate specifically includes a signal layer 11, a dielectric layer 12, and a signal shielding stratum 13, wherein the dielectric layer 12 is located between the signal layer 11 and the signal shielding stratum 13, and the signal layers 11 of the two substrates are metal pattern signal layers, and compared with the existing PCB where only one metal pattern signal layer is designed, two PCBs are adopted, thereby realizing the design of the double-sided metal pattern signal layers, reducing the sectional area of the PCB, and further significantly reducing the consumable items of the filter box.

Specifically, the signal layer 11 of first base plate 10 and the signal layer 11 of second base plate 20 all include the different wave filters of two at least frequency bands, are wave filter metal pattern signal layer promptly, only one side design wave filter metal pattern signal layer with current PCB board compares, the utility model discloses a with the wave filter of original distribution on the same face of PCB board divide into two sets ofly, two sets of wave filters that form after grouping arrange respectively on two signal layers of two PCB boards.

When grouping, the utility model discloses a signal that will combine is divided into two sets ofly according to the passband frequency height, and preferably divides the filter pattern of adjacent passband to different groups to the realization sets up the filter pattern of adjacent passband to two different signal layers on, certainly also is not limited to this kind of grouping arrangement structure. If there are 4 signals that need to be combined (for convenience of description, defined as pass band one, pass band two, pass band three and pass band four respectively), the frequency bands are 3000 + 3600MHz, 3800 + 4600MHz, 5100 + 6000MHz and 6200 + 7000MHz respectively, because the pass band one and the pass band two pass bands are adjacent, the pass band three and the pass band four pass bands are adjacent, then, when grouping, it may be preferable to group pass band one, pass band two into different groups, pass band three, pass band four into different groups, for example, in the two divided sets of filters, one set of filter is the first pass band and the third pass band, and the other set of filter is the second pass band and the fourth pass band, that is, the first pass band and the third pass band are disposed on the signal layer of one of the PCBs, such as the signal layer 11 of the first substrate 10, another set of pass bands two and four are disposed on signal layers of another PCB board, such as signal layer 11 of second substrate 20. The utility model discloses owing to will be adjacent each other the passband design on the signal layer of different base plates, when reducing the sectional area of PCB board, also improved the isolation between adjacent each passband greatly.

In this embodiment, 4 channels of signals need to be combined, where the first passband and the second passband are disposed on the signal layer 11 of the first substrate, and the second passband and the fourth passband are disposed on the signal layer 11 of the second substrate. In this embodiment, each of the filters on each signal layer 11 is printed on the corresponding dielectric layer 12 in a microstrip line manner, that is, the filter on the signal layer 11 of the first substrate 10 is printed on the dielectric layer 12 of the first substrate 10 in a microstrip line manner, and the filter on the signal layer 11 of the second substrate 20 is printed on the dielectric layer 12 of the second substrate 20 in a microstrip line manner.

And the input end of each filter on each signal layer is respectively used as one input end of the combiner, and the output end of each filter is connected with the output end of the combiner. In this embodiment, as shown in fig. 1 and fig. 2, the input ends of the first passband and the third passband are respectively defined as an input end 1 and an input end 2 of the combiner, and the output end connected to an output end of the combiner is defined as an output end 1; similarly, the input ends of the second pass band and the fourth pass band are respectively used as an input end of the combiner, which is respectively defined as an input end 3 and an input end 4, and the output end is connected with an output end of the combiner, which is defined as an output end 2. That is, the signal of the first passband and the signal of the third passband are input through respective input terminals and then output in a combined manner through the output terminal 1, and the signal of the second passband and the signal of the fourth passband are input through respective input terminals and then output in a combined manner through the output terminal 2.

The common bottom plate 34 is disposed between the first substrate 10 and the second substrate 20, and the signal shielding ground layers 13 of the two substrates are respectively located at two sides of the common bottom plate 34. The common backplane 34 separates the signal layer 11 of the first substrate 10 from the signal layer 11 of the second substrate 20, improving the signal isolation between the respective passbands.

Further, as shown in fig. 1, fig. 2 and fig. 4, the combiner of the present invention further includes a shielding box 30, and the first substrate 10, the second substrate 20 and the common bottom plate are accommodated in the shielding box 30. In this embodiment, the shielding box 30 specifically includes a box body 31, an upper cover plate 32 and a lower cover plate 33, a containing space is formed in the box body 31, the common bottom plate 34 is located in the middle of the box body 31, in the implementation process, the common bottom plate 34 can be integrally formed with the box body 31, the containing space in the box body 31 is divided into an upper containing space and a lower containing space, which are respectively a first containing space 35 and a second containing space 36, wherein the first substrate 10 is contained in the first containing space 35, the second substrate 20 is contained in the second containing space 36, and the common bottom plate 34 serves as a common bottom plate of the two containing spaces. In the shield case 30, the signal layer 11 of the first substrate 10 faces the upper cover 32, and the signal layer 11 of the second substrate 20 faces the lower cover 33.

Preferably, as shown in fig. 1, 2 and 4, a separating wall 37 is disposed in each of the first accommodating space 35 and the second accommodating space 36, and the separating wall 37 is located between two adjacent filters of the signal layer of each substrate and is used for separating signals of two adjacent filters of the signal layer of each substrate. Specifically, the partition walls 37 are integrally formed in the corresponding accommodating spaces, and as shown in fig. 1 and 2, the first substrate 10 and the second substrate 20 are provided with through holes 14 for the corresponding partition walls 37 to pass through, and the through holes 14 penetrate through the upper and lower plate surfaces of the corresponding substrates and are located between each two adjacent filters of the substrates. In this embodiment, a partition wall 37 is disposed in the middle of the first accommodating space 35, and correspondingly, a through hole 14 is also disposed in the middle of the first substrate 10, and the through hole 14 is located between two filters of the first substrate 10; similarly, a partition wall 37 is disposed in the middle of the second receiving space 36, and correspondingly, a through hole 14 is disposed in the middle of the second substrate 20, and the through hole 14 is located between the two filters of the second substrate 20. Alternatively, if 3 filters are disposed on the signal layer 11 of the first substrate 10, the number of the partition walls 37 of the first accommodating space 35 and the number of the through holes 14 of the first substrate 10 may be two, that is, every two adjacent filters of the first substrate 10 are spaced apart by a partition wall 37.

As shown in fig. 1, fig. 2 and fig. 4, a plurality of signal input interfaces 38 and at least one signal output interface 39 are further disposed on the outer side surface of the box 31, wherein each input end of the filter on the first substrate 10 and the second substrate 20 is connected to a corresponding signal input interface 38, and the output end of the combiner is connected to the signal output interface 39. In this embodiment, there are 4 signal input interfaces 38, two of which are respectively connected to two input terminals of two filters on the first substrate 10, the other two of which are respectively connected to two input terminals of two filters on the second substrate 20, and 1 signal output interface 39 is connected to output terminals of the first substrate 10 and the second substrate 20.

In addition, as shown in fig. 5 to 7, the combined signal between the two substrates is realized by connecting the holes on the common substrate 34, specifically, the common substrate 34 is provided with a hole 341 penetrating up and down and a conductor 342 penetrating through the hole 341, one end of the conductor 342 is connected to the circuit on the signal layer 11 of the first substrate 10 connected to the output terminal, and the other end is connected to the circuit on the signal layer 11 of the second substrate 20 connected to the output terminal, that is, the circuits on the two substrates connected to the output terminal are conducted through the conductor 342 penetrating through the common substrate 34.

The technical contents and features of the present invention have been disclosed as above, however, those skilled in the art can still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention, therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various substitutions and modifications without departing from the present invention, and should be covered by the claims of the present patent application.

Claims

1. A combiner is characterized by comprising a first substrate, a second substrate and a common bottom plate, wherein the common bottom plate is arranged between the first substrate and the second substrate and separates the two substrates, the first substrate and the second substrate respectively comprise a signal layer, a signal shielding stratum and a dielectric layer positioned between the signal layer and the signal shielding stratum, and the signal shielding strata of the two substrates are respectively positioned at two sides of the common bottom plate; the signal layers of the two substrates respectively comprise at least two filters with different frequency bands, the input end of each filter on each signal layer is respectively used as one input end of the combiner, and the output end of each filter is connected with the output end of the combiner.

2. The combiner of claim 1, further comprising a shield box, wherein the first substrate, the second substrate, and the common backplane are all housed within the shield box.

3. The combiner of claim 2, wherein an accommodating space is formed in the shielding box, the common bottom plate is located in the shielding box and divides the accommodating space into a first accommodating space and a second accommodating space, and the first substrate and the second substrate are accommodated in the first accommodating space and the second accommodating space, respectively.

4. The combiner of claim 2, further comprising a separation wall disposed between every two adjacent filters on each signal layer.

5. The combiner of claim 1, wherein each of said filters is printed in microstrip lines on a respective corresponding dielectric layer.

6. The combiner of claim 1, wherein the first and second substrates are both PCB boards.

7. The combiner of claim 1, wherein the signal layers of the two substrates are each a set of filters, and the two sets of filters are obtained by grouping signals to be combined according to the frequency band.

8. The combiner of claim 7, wherein filters of adjacent frequency bands are disposed on two signal layers of two substrates, respectively.

9. The combiner of claim 1, wherein the outputs of each of the filters are connected by a conductor.

10. The combiner of claim 9, wherein the common substrate has an opening extending therethrough, and the conductor passes through the opening to connect the output terminals of the filters of the two substrates.