CN210182340U - Tin ball removing device for chip - Google Patents
Tin ball removing device for chip Download PDFInfo
- Publication number
- CN210182340U CN210182340U CN201921193551.9U CN201921193551U CN210182340U CN 210182340 U CN210182340 U CN 210182340U CN 201921193551 U CN201921193551 U CN 201921193551U CN 210182340 U CN210182340 U CN 210182340U
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- chip
- heating box
- solder balls
- conveying mechanism
- rotating
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Abstract
The utility model provides a tin ball remove device of chip, its characterized in that: the tin ball cleaning device is arranged behind the tunnel oven; the tunnel oven comprises a machine base, a heating box and a conveying mechanism; the heating box is arranged on the machine base, the conveying mechanism is arranged on the machine base and located below the heating box, one end of the heating box is an inlet end, the other end of the heating box is an outlet end, and the solder ball cleaning device is located above the conveying mechanism at the outlet end of the heating box and used for cleaning solder balls on the chip. The utility model has the advantages that: after the heating box is used for heating, the solder balls are cleaned through the solder ball cleaning device, so that the labor intensity can be reduced, and the production efficiency is improved.
Description
Technical Field
The utility model belongs to the heating equipment field especially relates to a tin ball remove device of main chip.
Background
With the development of society, people pay more attention to the environmental protection and the resource utilization, most of the existing chip solder balls are removed by manual beating, and the removal mode is high in staff operation intensity and low in efficiency.
Disclosure of Invention
An object of the utility model is to provide a tin ball remove device of chip can reduce intensity of labour, improves production efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a tin ball removing device of a chip is characterized in that: the tin ball cleaning device is arranged behind the tunnel oven;
the tunnel oven comprises a machine base, a heating box and a conveying mechanism; the heating box is arranged on the machine base, the conveying mechanism is arranged on the machine base and located below the heating box, one end of the heating box is an inlet end, the other end of the heating box is an outlet end, and the solder ball cleaning device is located above the conveying mechanism at the outlet end of the heating box and used for cleaning solder balls on the chip.
Further, the entry end and the exit end of heating cabinet all be equipped with a blow vent, blow vent top be equipped with an air pump, the exit end of air pump be provided with the exhaust tube.
Furthermore, an air outlet pipe is arranged above the exhaust pipe, and a gas filtering device is arranged at the joint of the exhaust pipe and the air outlet pipe.
Further, transport mechanism include pay-off rotating electrical machines, pay-off coupling mechanism and transmission band, pay-off coupling mechanism one end be connected with rotating electrical machines, the other end is connected with the transmission band, the transmission band be the guipure.
Furthermore, the solder ball cleaning device comprises a rotating mechanism and a plurality of cleaning brushes arranged on the rotating mechanism, wherein the cleaning brushes are positioned above the conveying mechanism.
Furthermore, rotary mechanism include a rotating electrical machines, coupling mechanism and oval rotatory chain, coupling mechanism one end be connected with rotating electrical machines, the other end is connected with oval rotatory chain, the even setting of cleaning brush on oval rotatory chain.
Furthermore, a solder ball collecting basin is arranged below the solder ball cleaning device, and the collecting basin is positioned below the conveying mechanism.
Furthermore, the tin soldering device also comprises a chip disc for mounting the chip, wherein the chip disc is provided with a plurality of through holes for tin balls to pass through.
After the technical scheme is adopted, the beneficial effects of the utility model are that: after the heating box is used for heating, the solder balls are cleaned through the solder ball cleaning device, so that the labor intensity can be reduced, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Description of the main component symbols:
1: a stand, 2: conveying mechanism, 3: heating box, 31: vent, 4: air pump, 41: exhaust tube, 42: gas filtration device, 43: outlet duct, 5: rotation mechanism, 51: rotating electrical machine, 52: elliptical rotating chain, 53: connecting mechanism, 6: cleaning brush, 7: tin ball collection basin, 8: chip tray, 81: and a through hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in FIG. 1, the present embodiment discloses a solder ball removing device for a chip, which includes a tunnel oven and a solder ball cleaning device;
the tunnel oven comprises a machine base 1, a conveying mechanism 2 and a heating box 3, wherein the heating box 3 is arranged on the machine base 1, a groove is formed in the machine base 1, and the conveying mechanism 2 is arranged in the groove and is positioned below the machine base 1; the conveying mechanism 2 comprises a feeding rotary motor, a feeding connecting mechanism and a conveying belt, one end of the feeding connecting mechanism is connected with the rotary motor, the other end of the feeding connecting mechanism is connected with the conveying belt, and the rotary motor drives the conveying belt to rotate; the transmission band is the guipure.
The entry end and the exit end of heating cabinet 3 all are equipped with a blow vent 31, and the top of blow vent 31 is equipped with an air pump 4, and the exit end of air pump 4 has connected gradually exhaust tube 41, gas filtering device 42 and outlet duct 43, and the waste gas in the heating cabinet 3 passes through the below of blow vent 31 flow direction air pump 4, and air pump 4 conveys gas filtering device 42 with waste gas suction through exhaust tube 31, and gas filtering device 42 discharges from outlet duct 43 in the nature after having filtered waste gas.
The solder ball cleaning device is arranged on one side of the outlet end of the heating box 3 and is positioned above the conveyor belt; the tin ball cleaning device comprises a rotating mechanism 5 and a plurality of cleaning brushes 6, wherein the rotating mechanism 5 comprises a rotating motor 51, an oval rotating chain 52 and a connecting mechanism 53, one end of the connecting mechanism 53 is connected with the rotating motor 51, the other end of the connecting mechanism is connected with the oval rotating chain 52, the cleaning brushes 6 are uniformly arranged on the oval rotating chain 52, a transmission belt is positioned below the cleaning brushes 6, and the cleaning brushes 6 are used for brushing tin balls adhered on a chip.
A solder ball collecting basin 7 is arranged below the solder ball cleaning device, the solder ball collecting basin 7 is used for collecting the solder balls brushed by the upper cleaning brush 6, a waste collecting box can also be arranged at the rear end of the solder ball cleaning device, and the waste collecting box is used for collecting the chips which are removed with the solder balls.
In order to more efficiently remove the solder balls on the chips, the chips can be collectively collected and arranged by a chip tray 8, and then the solder balls can be removed. Through holes 81 through which solder balls pass are formed below the chip tray 8.
The working principle is as follows:
firstly, a tunnel oven is started, chip trays 8 with chips arranged are placed in a conveying belt of a conveying mechanism 2, the conveying mechanism 2 conveys the chip trays 8 into a heating box 3 for baking, as some waste gas is generated in baking, the waste gas is discharged from air vents 31 on the inlet end and the outlet end of the heating box 3, an air pump 4 positioned above the air vents sucks out the waste gas, the waste gas is conveyed into a gas filtering device 42 through an exhaust pipe 41, and the waste gas is filtered by the gas filtering device 42 and then is discharged into the nature through an air outlet pipe 43; the conveying mechanism 2 conveys the chip tray 8 to the lower part of the solder ball cleaning device, the rotating mechanism 5 rotates, the cleaning brushes 6 on the rotating mechanism 5 clean the chips in the chip tray 8, the solder balls on the chips are cleaned, the cleaned solder balls pass through the through holes 81 at the bottom of the chip tray 8 and fall into the solder ball collecting basin 7 at the lower part, the chips which are cleaned of the solder balls are continuously conveyed forwards, and the chips are known to fall onto a waste collecting box.
To sum up, the utility model discloses can come to carry out the automation to the chip tin ball and clear away through setting up tunnel oven and tin ball cleaning device, not only reduce intensity of labour, and improve production efficiency.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention.
Claims (8)
1. A tin ball removing device of a chip is characterized in that: the tin ball cleaning device is arranged behind the tunnel oven;
the tunnel oven comprises a machine base, a heating box and a conveying mechanism; the heating box is arranged on the machine base, the conveying mechanism is arranged on the machine base and located below the heating box, one end of the heating box is an inlet end, the other end of the heating box is an outlet end, and the solder ball cleaning device is located above the conveying mechanism at the outlet end of the heating box and used for cleaning solder balls on the chip.
2. The apparatus for removing solder balls from a chip of claim 1, wherein: the inlet end and the outlet end of the heating box are provided with air vents, an air pump is arranged above the air vents, and the outlet end of the air pump is provided with an exhaust tube.
3. The apparatus for removing solder balls from a chip of claim 2, wherein: an air outlet pipe is arranged above the air exhaust pipe, and a gas filtering device is arranged at the joint of the air exhaust pipe and the air outlet pipe.
4. The apparatus for removing solder balls from a chip of claim 1, wherein: conveying mechanism include pay-off rotating electrical machines, pay-off coupling mechanism and transmission band, pay-off coupling mechanism one end be connected with rotating electrical machines, the other end is connected with the transmission band, the transmission band be the guipure.
5. The apparatus for removing solder balls from a chip of claim 1, wherein: the tin ball cleaning device comprises a rotating mechanism and a plurality of cleaning brushes arranged on the rotating mechanism, wherein the cleaning brushes are positioned above the conveying mechanism.
6. The device for removing solder balls from a chip according to claim 5, wherein: the rotating mechanism comprises a rotating motor, a connecting mechanism and an oval rotating chain, one end of the connecting mechanism is connected with the rotating motor, the other end of the connecting mechanism is connected with the oval rotating chain, and the cleaning brushes are uniformly arranged on the oval rotating chain.
7. The apparatus for removing solder balls from a chip of claim 1, wherein: the tin ball cleaning device is provided with a tin ball collecting basin below, and the collecting basin is positioned below the conveying mechanism.
8. The device for removing solder balls from a chip according to any one of claims 1 to 7, wherein: the tin ball soldering device is characterized by further comprising a chip disc for mounting a chip, wherein a plurality of through holes for tin balls to pass through are formed in the chip disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921193551.9U CN210182340U (en) | 2019-07-26 | 2019-07-26 | Tin ball removing device for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921193551.9U CN210182340U (en) | 2019-07-26 | 2019-07-26 | Tin ball removing device for chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210182340U true CN210182340U (en) | 2020-03-24 |
Family
ID=69841676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921193551.9U Active CN210182340U (en) | 2019-07-26 | 2019-07-26 | Tin ball removing device for chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210182340U (en) |
-
2019
- 2019-07-26 CN CN201921193551.9U patent/CN210182340U/en active Active
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