CN210182332U

CN210182332U - Crystal grinding device

Info

Publication number: CN210182332U
Application number: CN201921148605.XU
Authority: CN
Inventors: Ping Yu; 俞平
Original assignee: Zhejiang Xintai Communication Technology Co ltd
Current assignee: Zhejiang Xintai Communication Technology Co ltd
Priority date: 2019-12-13
Filing date: 2019-12-13
Publication date: 2020-03-24
Anticipated expiration: 2029-12-13

Abstract

The utility model discloses a crystal grinder, grind the box and be located and grind the box and grind the brilliant board of year between the box down including last grinding box and, down, it is articulated through the articulated elements that sets up in one side with grinding box down to go up grinding box, the lower terminal surface that goes up grinding box is provided with the cylinder that the symmetry set up, the output fixed mounting of cylinder has the connecting plate, fixed mounting has motor one on the connecting plate, output through connection board and fixed mounting of motor one have last mounting panel, grind the interior fixedly connected with pivot of box down, this utility model discloses it is rational in infrastructure, through setting up mounting panel and lower mounting panel to install the abrasive disc and can grind the wafer both sides terminal surface on carrying the brilliant board simultaneously on last mounting panel and lower mounting panel, improve grinding efficiency.

Description

Crystal grinding device

Technical Field

The utility model relates to a wafer processing technology field, in particular to crystal grinder.

Background

The wafer is used as a light transmission device of an imaging device, and a grinding machine is generally used when the surface of the wafer is ground and polished during processing. The existing grinding machine generally adopts a single-side grinding mode to grind and polish the surface of the wafer, and the front side and the back side of the wafer are generally required to be grinded and polished. Therefore, when the conventional wafer surface is polished, two processes are required, i.e., the front and back surfaces of the wafer need to be polished separately, which is relatively complex and inefficient.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a crystal grinder.

The above technical purpose of the present invention can be achieved by the following technical solutions:

a crystal polishing device comprises an upper polishing box, a lower polishing box and a crystal carrying plate positioned between the upper polishing box and the lower polishing box, the upper grinding box and the lower grinding box are hinged through a hinge piece arranged on one side, the lower end surface of the upper grinding box is provided with symmetrically arranged air cylinders, the output end of the cylinder is fixedly provided with a connecting plate, a first motor is fixedly arranged on the connecting plate, the output end of the first motor penetrates through the connecting plate and is fixedly provided with an upper mounting plate, a rotating shaft is fixedly connected in the lower grinding box, the rotating shaft is rotatably connected with a lower mounting plate, a toothed ring is fixedly arranged on the side edge of the lower mounting plate, grinding sheets are arranged on the upper mounting plate and the lower mounting plate, the grinding sheet can be dismantled in last mounting panel and lower mounting panel respectively, one side of grinding box still is provided with and is used for driving down mounting panel pivoted drive arrangement down.

By adopting the technical scheme, the device is provided with the upper mounting plate and the lower mounting plate, and the grinding sheets are arranged on the upper mounting plate and the lower mounting plate, so that the end faces of two sides of the wafer on the crystal carrying plate can be simultaneously ground, and the grinding efficiency is improved.

Preferably, the driving device comprises a driving box fixedly installed on one side of the lower grinding box, a second motor is fixedly installed at the bottom of an inner cavity of the driving box, a gear is fixedly installed at an output end of the second motor, a strip-shaped hole is formed in the joint of the driving box and the lower grinding box, and one side of the gear penetrates through the strip-shaped hole and is meshed with the gear ring.

By adopting the technical scheme, the second motor is started, the output end of the second motor rotates to drive the gear to rotate, the gear is meshed with the toothed ring, so that the toothed ring and the lower mounting plate are driven to rotate, and the grinding sheet on the lower mounting plate grinds the lower end surface of the wafer.

Preferably, the crystal carrying plate is provided with a plurality of crystal holes for placing the wafers.

By adopting the technical scheme, the wafer can be fixed by the crystal carrying plate, and the upper top surface and the lower top surface of the wafer are positioned outside the crystal hole after the wafer is clamped into the clamping hole.

Preferably, the upper mounting plate and the lower mounting plate are both provided with clamping holes, the grinding sheet is provided with elastic clamping blocks, and the clamping blocks are embedded in the clamping holes, and the size of the clamping holes is slightly smaller than that of the elastic clamping blocks.

Adopt above-mentioned technical scheme, through mutually supporting of card hole and elasticity fixture block, can realize abrasive disc and last mounting panel and the quick installation and the dismantlement of mounting panel down, the size in card hole is slightly less than the size of elasticity fixture block simultaneously, can make the elasticity fixture block go into the fixture block after the card, the elasticity fixture block carries out the chucking through elasticity to the card hole, improves the volume firmness between abrasive disc and last mounting panel and the lower mounting panel.

Preferably, support legs are fixedly arranged at four corners of the bottom of the lower grinding box, and anti-skidding sleeves are sleeved on the support legs.

Adopt above-mentioned technical scheme, so set up, can improve the frictional force between the device and the ground, avoid the device phenomenon that rocks appear when the operation.

Preferably, a water outlet pipe is fixedly mounted on one side of the lower grinding box, and a cover cap is connected to the water outlet pipe in a threaded manner.

By adopting the technical scheme, when the grinding fluid in the lower grinding box reaches a certain height, the cover cap is taken down from the water outlet of the water outlet pipe by rotating the cover cap, the grinding fluid in the lower grinding box can be discharged, and the liquid discharge efficiency is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the present invention;

FIG. 3 is a cross-sectional view of the present invention;

fig. 4 is a top sectional view of the lower grinding box of the present invention.

Reference numerals: 1. putting the grinding box on the grinding box; 2. a lower grinding box; 3. a crystal carrying plate; 4. a cylinder; 5. a connecting plate; 6. a first motor; 7. an upper mounting plate; 8. a rotating shaft; 9. a lower mounting plate; 10. a toothed ring; 11. a polishing sheet; 12. a drive device; 121. a drive box; 122. a second motor; 123. a gear; 13. crystal pores; 14. a clamping hole; 15. an elastic clamping block; 16. a support leg; 17. a water outlet pipe; 18. and (7) capping.

Detailed Description

The following is only the preferred embodiment of the present invention, the protection scope is not limited to this embodiment, and all technical solutions belonging to the idea of the present invention should belong to the protection scope of the present invention. It should also be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and such modifications and decorations should also be regarded as the protection scope of the present invention.

As shown in fig. 1 to 4, a crystal polishing apparatus includes an upper polishing box 1, a lower polishing box 2, and a crystal carrying plate 3 located between the upper polishing box 1 and the lower polishing box 2, wherein the crystal carrying plate 3 has a plurality of crystal holes 13 for placing wafers, the crystal carrying plate 3 is configured to fix the wafers, and when the wafers are inserted into the clamping holes 14, the upper and lower top surfaces of the wafers are located outside the crystal holes 13.

The upper grinding box 1 and the lower grinding box 2 are hinged through a hinge piece arranged on one side, the lower end face of the upper grinding box 1 is provided with symmetrically arranged air cylinders 4, the output end of the air cylinder 4 is fixedly provided with a connecting plate 5, the connecting plate 5 is fixedly provided with a motor I6, the output end of the motor I6 penetrates through the connecting plate 5 and is fixedly provided with an upper mounting plate 7, the lower grinding box 2 is internally and fixedly connected with a rotating shaft 8, the rotating shaft 8 is rotatably connected with a lower mounting plate 9, the side edge of the lower mounting plate 9 is fixedly provided with a toothed ring 10, the upper mounting plate 7 and the lower mounting plate 9 are provided with grinding sheets 11, the grinding sheets 11 are respectively detachable from the upper mounting plate 7 and the lower mounting plate 9, the upper mounting plate 7 and the lower mounting plate 9 are both provided with clamping holes 14, the grinding sheets 11 are provided with elastic clamping blocks 15, the clamping blocks are embedded in the clamping holes 14, the, can realize abrasive sheet 11 and last mounting panel 7 and lower mounting panel 9's quick installation and dismantlement, the size of calorie hole 14 slightly is less than the size of elasticity fixture block 15 simultaneously, can make elasticity fixture block 15 after the fixture block is gone into to the card, elasticity fixture block 15 carries out the chucking through elasticity to calorie hole 14, improves the firmness between abrasive sheet 11 and last mounting panel 7 and the lower mounting panel 9.

One side of lower grinding box 2 still is provided with and is used for driving mounting panel 9 pivoted drive arrangement 12 down, and drive arrangement 12 includes drive box 121 of fixed mounting in grinding box 2 one side down, and the bottom fixed mounting of drive box 121 inner chamber has motor two 122, and the output fixed mounting of motor two 122 has gear 123, and the strip hole has been seted up with the junction of grinding box 2 down to drive box 121, and one side of gear 123 passes the strip hole and meshes mutually with ring gear 10.

Wherein, the equal fixed mounting in bottom four corners of lower grinding box 2 has stabilizer blade 16, and the cover is equipped with anti-skidding cover on the stabilizer blade 16, so sets up, can improve the frictional force between the device and the ground, avoids the device phenomenon that appears rocking when the operation.

One side fixed mounting of lower grinding box 2 has outlet pipe 17, and threaded connection has block 18 on the outlet pipe 17, when the lapping liquid in the lower grinding box 2 reachd a take the altitude, through rotating block 18, takes off block 18 from outlet pipe 17's delivery port department, can discharge the lapping liquid in the lower grinding box 2, improves flowing back efficiency.

When the grinding device is used, a worker firstly clamps a wafer into a wafer hole 13 and places the wafer in the lower mounting plate 9, then covers the grinding box 1, starts the air cylinder 4, the output end of the air cylinder 4 moves downwards to drive the connecting plate 5 and the upper mounting plate 7 on the connecting plate 5 to move downwards, so that the grinding sheet 11 on the upper mounting plate 7 tightly presses the wafer carrying plate 3, then starts the first motor 6 and the second motor 122, the rotating directions of the first motor 6 and the second motor 122 are opposite, the reduction of grinding efficiency caused by the rotation of the wafer carrying plate 3 driven by the same-direction rotation of the first motor 6 and the second motor 122 can be effectively avoided, the rotation of the upper mounting plate 7 driven by the rotation of the first motor 6 and the rotation of the second motor 122 drive the rotation of the gear 123, the gear 123 is meshed with the toothed ring 10, so as to drive the toothed ring 10 and the lower mounting plate 9 to rotate, so as to grind two sides of the wafer on the wafer carrying, and stopping running and taking out the wafer until the wafer is flush with the wafer carrying plate 3.

Claims

1. A crystal grinding device comprises an upper grinding box (1), a lower grinding box (2) and a crystal carrying plate (3) positioned between the upper grinding box (1) and the lower grinding box (2), wherein the upper grinding box (1) and the lower grinding box (2) are hinged through a hinge piece arranged on one side, the crystal grinding device is characterized in that the lower end face of the upper grinding box (1) is provided with symmetrically arranged air cylinders (4), the output end of each air cylinder (4) is fixedly provided with a connecting plate (5), a motor I (6) is fixedly arranged on each connecting plate (5), the output end of each motor I (6) penetrates through each connecting plate (5) and is fixedly provided with an upper mounting plate (7), a rotating shaft (8) is fixedly connected in the lower grinding box (2), a lower mounting plate (9) is rotatably connected on each rotating shaft (8), and a toothed ring (10) is fixedly arranged on the side edge of the lower mounting plate (9), the grinding device is characterized in that grinding sheets (11) are arranged on the upper mounting plate (7) and the lower mounting plate (9), the grinding sheets (11) can be respectively detached from the upper mounting plate (7) and the lower mounting plate (9), and a driving device (12) for driving the lower mounting plate (9) to rotate is further arranged on one side of the lower grinding box (2).

2. The crystal grinding device according to claim 1, wherein the driving device (12) comprises a driving box (121) fixedly installed at one side of the lower grinding box (2), a second motor (122) is fixedly installed at the bottom of an inner cavity of the driving box (121), a gear (123) is fixedly installed at an output end of the second motor (122), a strip-shaped hole is formed at the joint of the driving box (121) and the lower grinding box (2), and one side of the gear (123) penetrates through the strip-shaped hole and is meshed with the gear ring (10).

3. A crystal grinding device according to claim 2, characterized in that the crystal carrying plate (3) is provided with a plurality of crystal holes (13) for placing wafers.

4. A crystal grinding device according to claim 3, wherein the upper mounting plate (7) and the lower mounting plate (9) are both provided with clamping holes (14), the grinding plate (11) is provided with elastic clamping blocks (15), the clamping blocks are embedded in the clamping holes (14), and the size of the clamping holes (14) is slightly smaller than that of the elastic clamping blocks (15).

5. The crystal grinding device according to claim 4, characterized in that four corners of the bottom of the lower grinding box (2) are fixedly provided with support legs (16), and the support legs (16) are sleeved with anti-slip sleeves.

6. A crystal grinder as claimed in claim 5, characterised in that a water outlet pipe (17) is fixedly mounted on one side of the lower grinding box (2), and a cap (18) is screwed on the water outlet pipe (17).