CN210167334U

CN210167334U - Silicon wafer separating device

Info

Publication number: CN210167334U
Application number: CN201921323746.0U
Authority: CN
Inventors: 信广志
Original assignee: Tianjin Chuangyuda Photovoltaic Technology Co Ltd
Current assignee: Tianjin Chuangyuda Photovoltaic Technology Co Ltd
Priority date: 2019-08-15
Filing date: 2019-08-15
Publication date: 2020-03-20
Anticipated expiration: 2029-08-15

Abstract

The application discloses silicon chip burst device, basin including rectangular shape, the basin is the initiating terminal along length direction's one end, and the other end is the end, is close to the initiating terminal in the basin and is provided with the burst groove, and the burst groove is kept away from one side of initiating terminal and is opened and form the burst export, and the burst inslot is provided with burst mechanism, and the one side that lies in the burst export in the basin is provided with transmission device. The silicon wafer slicing device is high in transmission success rate, long in service life and cost-saving.

Description

Silicon wafer separating device

Technical Field

The present disclosure relates generally to the field of silicon wafer processing equipment, and more particularly, to a silicon wafer slicing apparatus.

Background

Solar energy is a clean renewable energy source. The cost of fossil energy is restrained by energy conservation and emission reduction, and the market prospect of solar photovoltaic power generation is wide.

The processing of the monocrystalline silicon wafer comprises the steps of firstly squaring a monocrystalline silicon rod and then slicing, the processing of the polycrystalline silicon wafer comprises the steps of cutting a polycrystalline silicon ingot and then slicing, and the processing of the quasi-monocrystalline silicon wafer comprises the steps of cutting the quasi-monocrystalline silicon ingot and then slicing. In summary, slicing is one of the indispensable processes in the processing process of the crystalline silicon solar cell. The silicon wafers obtained after slicing are stacked together and need to be inserted into a silicon wafer bearing box for transportation after being sliced, and the silicon wafers are very difficult to slice because of the characteristics of thinness and brittleness.

Silicon chip burst carries out the burst in aqueous, need do a bigger basin, put into the basin to the silicon chip that overlaps together, then adopt the water pump to draw water in the basin and spout the circulation mode that sprays into in the basin again and make the silicon chip reach the effect of burst, take out the silicon chip from the basin through the belt pulley behind the burst, transmit to the inserted sheet process, the belt uses after a period, easy deformation, influence the transmission success rate, and the belt that warp damages the silicon chip easily, need often change the belt, processing cost is higher.

Disclosure of Invention

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a silicon wafer slicing apparatus with high transmission success rate, long service life and cost saving.

The application provides a silicon wafer slicing device which comprises a strip-shaped water tank; one end of the water tank along the length direction is a starting end, and the other end of the water tank is a tail end; a slicing groove is arranged in the water tank close to the starting end; one side of the slicing groove, which is far away from the starting end, is opened to form a slicing outlet; a slicing mechanism is arranged in the slicing groove;

a conveying mechanism is arranged on one side of the water tank, which is positioned at the slicing outlet; the transmission mechanism comprises a fixed rod arranged on one side of the slicing outlet; a fixed block is fixedly arranged in the middle of the fixed rod; one side of the fixed block, which is close to the slicing groove, is fixedly provided with a vertical blocking piece; the top end of the baffle plate is rotatably provided with a rotating rod in a penetrating way; the rotating rod is arranged in a direction vertical to the direction from the starting end to the tail end; a plurality of rubber rollers are fixedly sleeved on the rotating rod at the two sides of the blocking piece at uniform intervals; a first motor for driving the rotating rod to rotate is arranged on one side of the water tank; one side of each adjacent rubber roller, which is close to the slicing groove, is provided with a water suction hole; a driving rubber roller is arranged above the rubber roller; a second motor for driving the driving rubber roller to rotate is arranged on one side of the water tank; one side of the driving rubber roller close to the starting end is provided with a driven rubber roller; a shaft lever is arranged above the driven rubber roller; two ends of the driven rubber roll are rotatably connected with the shaft lever through a connecting sheet; one side of the shaft lever close to the tail end is provided with a transmission rubber roller; a third motor for driving the transmission rubber roller to rotate is arranged on one side of the water tank; the rotation linear speeds of the driving rubber roller and the transmission rubber roller are the same; an air hole is formed in one side, close to the transmission rubber roller, of the middle part of the shaft lever; the shaft lever is symmetrically provided with position sensors at two sides of the air hole.

Preferably, the slicing mechanism comprises a track groove arranged on a base plate in the slicing groove; the track groove is arranged along the direction from the starting end to the tail end; a push plate vertical to the track groove is arranged in the slicing groove; the bottom end of the push plate is fixedly provided with a sliding block; the sliding block can be clamped in the track groove in a sliding way; an electric manipulator is arranged between the wall surface close to the starting end in the slicing groove and the push plate; horizontal through grooves are symmetrically arranged on two side walls of the slicing groove perpendicular to the track groove direction; the through groove is arranged close to the tail end; the outer sides of the two through grooves are fixedly provided with first water spraying strips; one side of the first water spraying strip, which is close to the through groove, is uniformly provided with a plurality of first water spraying holes along the horizontal direction; second water spraying strips are symmetrically arranged on two sides of the upper part of the slicing groove close to the tail end; one side of the second water spraying strip close to the slicing groove is uniformly provided with a plurality of second water spraying holes along the horizontal direction.

Preferably, one side of the bottom end of the connecting sheet, which is far away from the driving rubber roll, is integrally provided with a counterweight sheet.

Preferably, a bearing rod is arranged between the driving rubber roller and the transmission rubber roller.

Preferably, a conveyor belt is arranged on one side, close to the tail end, of the top of the transmission rubber roller.

Preferably, a bearing plate is arranged between the transmission rubber roller and the conveyor belt.

Compared with the prior art, the beneficial effects of this application are:

the silicon wafer separating device is provided with a transmission mechanism, stacked silicon wafers are separated by the separating mechanism and then pushed to be close to the transmission mechanism, water is absorbed by a water absorption hole to drive water flow to enable the separated silicon wafers to be attached to a separation blade, a plurality of rubber rollers rotate to enable the silicon wafers to move upwards, the silicon wafers move upwards to enter a position between a driving rubber roller and a driven rubber roller, the driven rubber roller presses the silicon wafers tightly under the action of gravity, the silicon wafers continue to move upwards under the driving of the driving rubber roller, high-pressure gas blown out from air holes in a shaft rod presses the silicon wafers tightly on a transmission rubber roller, meanwhile, a position sensor detects that the silicon wafers are transmitted, the rubber rollers stop operating through a control mechanism, the subsequent silicon wafers do not transmit upwards any more, the silicon wafers move to the top end of the transmission rubber roller under the driving of the transmission rubber roller, continue to be transmitted in the, and finishing the next separated silicon wafer transmission. The structure design is reasonable, the operation continuity is good, and the transmission success rate is high.

In the silicon wafer separating device, the transmission belt is replaced by the arrangement of the groups of rubber rollers in the process of moving the silicon wafer upwards, the rubber rollers are more durable, the service life of equipment is prolonged, and the construction cost is reduced.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural diagram of a silicon wafer slicing apparatus according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is a schematic structural diagram of the driven rubber roller.

Reference numbers in the figures: 1. a water tank; 2. a slicing groove; 3. a slicing mechanism; 4. a transport mechanism; 5. a conveyor belt;

21. a slicing outlet;

31. a track groove; 32. pushing the plate; 33. a slider; 34. an electric manipulator; 35. a through groove; 36. A first water-spraying bar; 37. a first water spray hole; 38. a second water-spraying strip; 39. a second water jet hole;

41. fixing the rod; 42. a fixed block; 43. a baffle plate; 44. a rotating rod; 45. a rubber roller; 46. A first motor; 47. a water suction hole; 48. an active rubber roller; 49. a second motor; 410. a driven rubber roller; 411. a shaft lever; 412. connecting sheets; 413. driving the rubber roller; 414. a third motor; 415. Air holes; 416. a position sensor; 417. a weight plate; 418. a bearing rod;

51. a bearing plate.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 to 3, an embodiment of the present application provides a silicon wafer slicing apparatus, including a strip-shaped water tank 1, wherein the water tank 1 contains circulating water for separating silicon wafers; one end of the water tank 1 along the length direction is a starting end 11, the other end of the water tank is a tail end 12, and the separated silicon wafers are transmitted from the starting end 11 to the tail end 12; a slicing groove 2 is arranged in the water tank 1 and close to the starting end 11; one side of the slicing groove 2 far away from the starting end 11 is opened to form a slicing outlet 21; the slicing groove 2 is internally provided with a slicing mechanism 3, the silicon wafers which are cut and stacked together are placed in the slicing groove 2, slicing processing is carried out by the slicing mechanism 3, and the separated silicon wafers are output one by one through a slicing outlet 21;

a transmission mechanism 4 is arranged on one side of the water tank 1 at the slicing outlet 21 and is used for transmitting the separated silicon wafers to a subsequent sheet inserting process; the conveying mechanism 4 comprises a fixed rod 41 arranged on one side of the slicing outlet 21; a fixed block 42 is fixedly arranged in the middle of the fixed rod 41; a vertical baffle plate 43 is fixedly arranged on one side of the fixing block 42 close to the plate dividing groove 2; the top end of the baffle plate 43 is rotatably provided with a rotating rod 44 in a penetrating way; the rotating rod 44 is arranged perpendicular to the direction from the starting end 11 to the tail end 12; a plurality of rubber rollers 45 are fixedly sleeved on the rotating rod 44 at the two sides of the baffle 43 at uniform intervals; a first motor 46 for driving the rotating rod 44 to rotate is arranged on one side of the water tank 1, and the first motor 46 drives the plurality of rubber rollers 45 to rotate through the rotating rod 44; one side between the adjacent rubber rollers 45 close to the slicing groove 2 is provided with a water suction hole 47; the water suction holes 47 are all communicated with a water pump arranged in the water tank 1, the water pump pumps water through the water suction holes 47 and then returns to the water tank 1, so that the water suction holes 47 generate adsorption force, the silicon wafer is attached to the rubber rollers 45, and the rubber rollers 45 drive the silicon wafer to be conveyed upwards.

A driving rubber roller 48 is arranged above the rubber roller 45; a second motor 49 for driving the driving rubber roller 48 to rotate is arranged on one side of the water tank 1; a driven rubber roller 410 is arranged on one side of the driving rubber roller 48 close to the starting end 11; a shaft rod 411 is arranged above the driven rubber roller 410; two ends of the driven rubber roller 410 are rotatably connected with the shaft rod 411 through a connecting piece 412; the driving rubber roller 48 is matched with the driven rubber roller 410 to continuously transmit the silicon wafers conveyed by the rubber roller 45 upwards, and the driven rubber roller 410 is tightly attached to the driving rubber roller 48 by gravity by taking the shaft rod 411 as an axis, so that sufficient pressure can be provided for the silicon wafers in transmission, and the silicon wafers are driven by the driving rubber roller 48 to be transmitted upwards.

One side of the shaft lever 411 close to the tail end 12 is provided with a transmission rubber roller 413; a third motor 414 for driving the transmission rubber roller 413 to rotate is arranged on one side of the water tank 1; the rotation linear speeds of the driving rubber roller 48 and the transmission rubber roller 413 are the same, so that the silicon wafer cannot be rubbed relatively when being transmitted between the driving rubber roller 48 and the transmission rubber roller 413, and the silicon wafer is prevented from being damaged; an air hole 415 is formed in one side, close to the transmission rubber roller 413, of the middle part of the shaft rod 411; the shaft 411 is symmetrically provided with position sensors 416 at both sides of the air hole 415.

The silicon wafer is tightly pressed on the transmission rubber roller 413 by high-pressure gas blown out from the air hole 415 on the shaft rod 411, meanwhile, the position sensor 416 detects that the silicon wafer is transmitted, the control mechanism of the device stops the rubber roller 45 from running, the subsequent silicon wafer is not transmitted upwards any more, the silicon wafer is driven by the transmission rubber roller 413 to move to the top end of the transmission rubber roller 413, the silicon wafer is continuously transmitted along the horizontal direction and enters the subsequent process, and after the silicon wafer leaves the area of the position sensor 416, the rubber roller 45 continuously runs to finish the transmission of the next separated silicon wafer.

In a preferred embodiment, as shown in fig. 1 and 2, the slicing mechanism 3 includes a track groove 31 disposed on a bottom plate in the slicing groove 2; the track groove 31 is arranged along the direction from the starting end 11 to the tail end 12; a push plate 32 vertical to the track groove 31 is arranged in the slicing groove 2; the bottom end of the push plate 32 is fixedly provided with a slide block 33; the sliding block 33 is slidably engaged with the track groove 31, so that the push plate 32 can slide along the track groove 31; an electric manipulator 34 is arranged between the wall surface close to the starting end 11 in the slicing groove 2 and the push plate 32, the electric manipulator 34 can push the push plate 32 to slide along the track groove 31, and the push plate 32 pushes the silicon wafers in the slicing groove 2 to move towards the slicing outlets 21; horizontal through grooves 35 are symmetrically arranged on two side walls of the splitting groove 2 perpendicular to the track groove 31 direction; the through slots 35 are disposed proximate the distal end 12; the outer sides of the two through grooves 35 are fixedly provided with first water spraying strips 36; one side of the first water spraying strip 36 close to the through groove 35 is uniformly provided with a plurality of first water spraying holes 37 along the horizontal direction; the two sides of the slicing groove 2 above the tail end 12 are symmetrically provided with second water spraying strips 38; a plurality of second water spraying holes 39 are uniformly arranged on one side of the second water spraying strip 38 close to the slicing groove 2 along the horizontal direction.

The first water spray holes 37 and the second water spray holes 39 are communicated to another water pump, the water pump pumps water in the water tank, the water is sprayed to the stacked silicon wafers through the first water spray holes 37 and the second water spray holes 39, the stacked silicon wafers are separated by high-pressure water flow, and the separated silicon wafers are sent out of the wafer separation groove 2 through the push plate 32.

In a preferred embodiment, a weight plate 417 is integrally arranged on one side of the bottom end of the connecting piece 412 away from the driving rubber roller 48, so that the pressure of the driven rubber roller 410 on the silicon wafer is increased, and the transmission of the silicon wafer is smoother.

In a preferred embodiment, a carrying rod 418 is arranged between the driving rubber roller 48 and the transmission rubber roller 413, and plays a carrying role in the process that the silicon wafer is transmitted to the transmission rubber roller 413 from the driving rubber roller 48, so that the smoothness of transmission is ensured.

In a preferred embodiment, a conveyor belt 5 is arranged on one side of the top of the driving rubber roller 413 close to the tail end 12 and is used for conveying the silicon wafer carried by the driving rubber roller 413 to the next process.

In a preferred embodiment, a receiving plate 51 is arranged between the transmission rubber roller 413 and the conveyor belt 5, and plays a receiving role in the process that the silicon wafer is transmitted to the conveyor belt 5 by the transmission rubber roller 413, so that the smoothness of transmission is ensured.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. The silicon wafer slicing device is characterized by comprising a strip-shaped water tank (1); one end of the water tank (1) along the length direction is a starting end (11), and the other end of the water tank is a tail end (12); a slicing groove (2) is arranged in the water tank (1) and close to the starting end (11); one side of the slicing groove (2) far away from the starting end (11) is opened to form a slicing outlet (21); a slicing mechanism (3) is arranged in the slicing groove (2);

a transmission mechanism (4) is arranged on one side of the slicing outlet (21) in the water tank (1); the transmission mechanism (4) comprises a fixed rod (41) arranged on one side of the slicing outlet (21); a fixed block (42) is fixedly arranged in the middle of the fixed rod (41); a vertical baffle plate (43) is fixedly arranged on one side, close to the plate dividing groove (2), of the fixing block (42); the top end of the baffle plate (43) is rotatably provided with a rotating rod (44) in a penetrating way; the rotating rod (44) is arranged in a direction perpendicular to the direction from the starting end (11) to the tail end (12); a plurality of rubber rollers (45) are fixedly sleeved on the rotating rod (44) at the two sides of the baffle plate (43) at uniform intervals; a first motor (46) for driving the rotating rod (44) to rotate is arranged on one side of the water tank (1); one side, close to the slicing groove (2), between the adjacent rubber rollers (45) is provided with a water suction hole (47); a driving rubber roller (48) is arranged above the rubber roller (45); a second motor (49) for driving the driving rubber roller (48) to rotate is arranged on one side of the water tank (1); a driven rubber roller (410) is arranged on one side, close to the starting end (11), of the driving rubber roller (48); a shaft rod (411) is arranged above the driven rubber roller (410); the two ends of the driven rubber roller (410) are rotatably connected with the shaft lever (411) through a connecting piece (412); a transmission rubber roller (413) is arranged on one side, close to the tail end, of the shaft lever (411); a third motor (414) for driving the transmission rubber roller (413) to rotate is arranged on one side of the water tank (1); the rotation linear speed of the driving rubber roller (48) is the same as that of the transmission rubber roller (413); an air hole (415) is formed in one side, close to the transmission rubber roller (413), of the middle of the shaft rod (411); position sensors (416) are symmetrically arranged on the shaft rod (411) at two sides of the air hole (415).

2. The silicon wafer slicing device according to claim 1, wherein the slicing mechanism (3) comprises a track groove (31) arranged on a bottom plate in the slicing groove (2); the track groove (31) is arranged along the direction from the starting end (11) to the tail end (12); a push plate (32) perpendicular to the track groove (31) is arranged in the slicing groove (2); a sliding block (33) is fixedly arranged at the bottom end of the push plate (32); the sliding block (33) is slidably clamped in the track groove (31); an electric manipulator (34) is arranged between the wall surface of the slicing groove (2) close to the starting end (11) and the push plate (32); horizontal through grooves (35) are symmetrically arranged on two side walls of the slicing groove (2) perpendicular to the track groove (31) direction; the through slot (35) is arranged close to the tail end (12); the outer sides of the two through grooves (35) are fixedly provided with first water spraying strips (36); a plurality of first water spraying holes (37) are uniformly formed in one side, close to the through groove (35), of the first water spraying strip (36) along the horizontal direction; the two sides of the slicing groove (2) close to the upper part of the tail end (12) are symmetrically provided with second water spraying strips (38); a plurality of second water spraying holes (39) are uniformly formed in one side, close to the slicing groove (2), of the second water spraying strip (38) along the horizontal direction.

3. The silicon wafer slicing device according to claim 2, wherein a weight plate (417) is integrally arranged on the side of the bottom end of the connecting piece (412) far away from the active rubber roller (48).

4. The silicon wafer slicing device according to claim 3, wherein a carrying rod (418) is arranged between the driving rubber roller (48) and the transmission rubber roller (413).

5. The silicon wafer slicing device according to claim 4, wherein a conveyor belt (5) is arranged on the top of the transmission rubber roller (413) near the end (12).

6. The silicon wafer slicing device according to claim 5, wherein a receiving plate (51) is arranged between the transmission rubber roller (413) and the conveyor belt (5).