CN210156426U - LED die bond quantitative glue adding instrument - Google Patents

LED die bond quantitative glue adding instrument Download PDF

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Publication number
CN210156426U
CN210156426U CN201920894100.1U CN201920894100U CN210156426U CN 210156426 U CN210156426 U CN 210156426U CN 201920894100 U CN201920894100 U CN 201920894100U CN 210156426 U CN210156426 U CN 210156426U
Authority
CN
China
Prior art keywords
quantitative
push rod
movable rod
glue
die bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920894100.1U
Other languages
Chinese (zh)
Inventor
谭亮
朱富斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Rectangular Group Ltd By Share Ltd
Original Assignee
Shenzhen Rectangular Group Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Rectangular Group Ltd By Share Ltd filed Critical Shenzhen Rectangular Group Ltd By Share Ltd
Priority to CN201920894100.1U priority Critical patent/CN210156426U/en
Application granted granted Critical
Publication of CN210156426U publication Critical patent/CN210156426U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a LED gu brilliant glue ration adds gluey appearance, to gu brilliant glue during use places the cavity indoor rigid, promote the push rod and make push rod and solid brilliant glue in close contact with, prevent moving back the pole under the elasticity of spring with push rod in close contact with, through the ratchet principle, prevent that the use from retreating at the push rod, guarantee the point precision of gluing, mediate the movable rod, the movable rod passes through one-way tooth cooperation drive push rod on pawl and the push rod and moves forward the extrusion admittedly brilliant glue realization and go out to glue, displacement process through the quantitative lug restriction pawl on the ration ring realizes quantitative effect, rotate the ration ring, realize quantitative control and regulation through the quantitative lug that differs in length, the movable rod returns to the throne under the effect of circle spring at last, this device simple structure, and convenient operation, the production efficiency is improved, less solid brilliant glue is extravagant, the processing cost has been reduced.

Description

LED die bond quantitative glue adding instrument
Technical Field
The utility model relates to a LED production and processing field specifically is a LED gu brilliant glue ration adds appearance of gluing.
Background
The technology of cementing is adopted in the production and processing technology of the LED, in order to ensure the production quality of the LED lamp, strict requirements are imposed on the cementing quantity of the cementing technology, the conventional manual cementing is realized, the control of the cementing quantity completely depends on the working experience of production workers, the labor is difficult, the production efficiency is low, the price of the die bonding glue for cementing the LED lamp is high, the improper control of the cementing quantity generates great waste to the die bonding glue, and the production cost is improved.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model
The utility model provides a technical scheme as follows that above-mentioned technical problem took:
an LED die bond quantitative glue adding instrument comprises a cavity 1, a connecting flange 2, a quantitative ring 3, a push rod 4 and a movable rod 5, wherein the cavity 1 is in a strip-shaped tubular shape, the cavity 1 is used for storing die bond, the front end of the cavity 1 is in a conical shape and used for fixing the die bond, the cavity 1 is in threaded connection with the connecting flange 2, the connecting flange 2 is sleeved with the quantitative ring 3, the quantitative ring 3 can rotate relative to the connecting flange 2, the quantitative ring 3 is provided with a plurality of quantitative bumps 31, the quantitative bumps 31 are different in length, the cavity 1, the connecting flange 2 and the quantitative ring 3 are sleeved on the push rod 4, the push rod 4 is uniformly provided with one-way teeth 41, the two sides of the connecting flange are respectively provided with a handle 21 and the movable rod 5, an anti-withdrawing rod 7 is fixed on the handle 21 in a sliding manner, the anti-withdrawing rod 7 is used for preventing the leg rod 4 from withdrawing, the anti-withdrawing rod 4 is sleeved with a spring 8 which, the movable rod 5 is rotatably connected with the connecting flange 2, a convex block 22 is arranged on the connecting flange 2 and used for limiting the degree of freedom of the movable rod 5, a pawl 6 is fixedly arranged on the movable rod in a rotating mode, and the pawl 6 is located behind the quantitative ring 3. Mediate movable rod 5, movable rod 5 drives push rod 4 forward displacement through the one-way tooth 41 cooperation drive of pawl 6 and push rod 4, reaches quantitative effect through the displacement process of the quantitative lug 31 restriction pawl 6 on the ration ring 3, rotates quantitative ring 3 and realizes quantitative regulation through the quantitative lug 31 of different length, prevents that the pole adopts the ratchet principle, prevents that the push rod from retreating and improving and add the gluey precision.
Preferably, the rotating shafts of the movable rod 5 and the pawl 6 are sleeved with coil springs, the movable rod returns under the action of the coil springs, and the pawl is always in close contact with the push rod 4 under the action of the elastic force of the coil springs.
Preferably, the side wall of the chamber 1 is provided with a visible through hole 11. The residual amount of the die bonding glue in the chamber 1 can be conveniently observed through the through hole 11.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The present invention will be described in detail with reference to the accompanying drawings so that the above advantages of the present invention can be more clearly understood.
FIG. 1 is a schematic structural view of an LED die bond quantitative glue adding instrument of the present invention;
fig. 2 is a schematic view of a quantitative ring 3 of the quantitative glue adding instrument for LED die bond glue.
Detailed Description
The present invention will be described in detail with reference to the following specific embodiments.
As shown in fig. 1-2, an LED die bond quantitative glue adding instrument comprises a chamber 1, a connecting flange 2, a quantitative ring 3, a push rod 4 and a movable rod 5, wherein the chamber 1 is in a strip-shaped tubular shape, the chamber 1 is used for storing die bond, the front end of the chamber 1 is in a conical shape and is used for fixing die bond, the chamber 1 is in threaded connection with the connecting flange 2, the connecting flange 2 is sleeved with the quantitative ring 3, the quantitative ring 3 can rotate relative to the connecting flange 2, the quantitative ring 3 is provided with a plurality of quantitative bumps 31, the quantitative bumps 31 are different in length, the chamber 1, the connecting flange 2 and the quantitative ring 3 are sleeved on the push rod 4, the push rod 4 is uniformly provided with one-way teeth 41, the two sides of the connecting flange are respectively provided with a handle 21 and the movable rod 5, an anti-return rod 7 is fixed on the handle 21 in a sliding manner, and the anti-return rod 7 is used for preventing the leg rod, prevent moving back and be equipped with spring 8 and handle 21 butt on the pole 4, the movable rod 5 rotates with flange 2 to be connected, flange 2 is last to be equipped with lug 22 and is used for restricting the degree of freedom of movable rod 5, it is fixed with pawl 6 to rotate on the movable rod, and pawl 6 is located the rear of ration ring 3. Mediate movable rod 5, movable rod 5 drives push rod 4 forward displacement through the one-way tooth 41 cooperation drive of pawl 6 and push rod 4, reaches quantitative effect through the displacement process of the quantitative lug 31 restriction pawl 6 on the ration ring 3, rotates quantitative ring 3 and realizes quantitative regulation through the quantitative lug 31 of different length, prevents that the pole adopts the ratchet principle, prevents that the push rod from retreating and improving and add the gluey precision.
Preferably, the rotating shafts of the movable rod 5 and the pawl 6 are sleeved with coil springs, the movable rod returns under the action of the coil springs, and the pawl is always in close contact with the push rod 4 under the action of the elastic force of the coil springs.
Preferably, the side wall of the chamber 1 is provided with a visible through hole 11. The residual amount of the die bonding glue in the chamber 1 can be conveniently observed through the through hole 11.
The utility model relates to a quantitative glue adding instrument for LED die bond glue, when in use, the die bond glue is placed in a cavity 1 for fixation, a push rod 4 is pushed to lead a push rod 4 to be in close contact with the die bond glue, a return-proof rod 7 is in close contact with the push rod 4 under the elasticity of a spring 8, by the ratchet principle, the backward movement of the push rod 4 in the using process is prevented, the dispensing precision is ensured, the movable rod 5 is kneaded, the movable rod 5 drives the push rod 4 to move forwards to extrude the die bond glue by the cooperation of the pawl 6 and the one-way teeth 41 on the push rod 4 to realize the glue discharging, the quantitative effect is realized by limiting the displacement process of the pawls 6 through the quantitative lugs 31 on the quantitative ring 3, the quantitative ring 3 is rotated, quantitative control and regulation are realized through quantitative lugs 31 different in length, and finally the movable rod 5 returns under the action of the coil spring.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (3)

1. The LED die bond quantitative glue adding instrument is characterized by comprising a cavity (1), a connecting flange (2), a quantitative ring (3), a push rod (4) and a movable rod (5), wherein the cavity (1) is in a strip-shaped tubular shape, the cavity (1) is used for storing die bond glue, the front end of the cavity (1) is conical and used for fixing the die bond glue, the cavity (1) is in threaded connection with the connecting flange (2), the connecting flange (2) is sleeved with the quantitative ring (3), the quantitative ring (3) can rotate relative to the connecting flange (2), the quantitative ring (3) is provided with a plurality of quantitative lugs (31), the quantitative lugs (31) are different in length, the cavity (1), the connecting flange (2) and the quantitative ring (3) are sleeved on the push rod (4), the push rod (4) is uniformly provided with one-way teeth (41), the two sides of the connecting flange are respectively provided with a handle (21) and the movable rod (5), handle (21) are gone up the slip and are fixed with and prevent moving back pole (7), prevent moving back pole (7) and be used for preventing leg pole (4) and roll back, prevent moving back pole (7) and go up the cover and be equipped with spring (8) and handle (21) butt, movable rod (5) rotate with flange (2) and be connected, flange (2) are last to be equipped with lug (22) and are used for restricting the degree of freedom of movable rod (5), it is fixed with pawl (6) to rotate on the movable rod, and pawl (6) are located the rear of ration ring (3).
2. The LED die bond glue quantitative glue adding instrument according to claim 1, characterized in that: and coil springs are sleeved on the rotating shafts of the movable rod (5) and the pawl (6).
3. The LED die bond glue quantitative glue adding instrument according to claim 1, characterized in that: the side wall of the chamber (1) is provided with a visible through hole (11).
CN201920894100.1U 2019-06-14 2019-06-14 LED die bond quantitative glue adding instrument Expired - Fee Related CN210156426U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920894100.1U CN210156426U (en) 2019-06-14 2019-06-14 LED die bond quantitative glue adding instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920894100.1U CN210156426U (en) 2019-06-14 2019-06-14 LED die bond quantitative glue adding instrument

Publications (1)

Publication Number Publication Date
CN210156426U true CN210156426U (en) 2020-03-17

Family

ID=69762845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920894100.1U Expired - Fee Related CN210156426U (en) 2019-06-14 2019-06-14 LED die bond quantitative glue adding instrument

Country Status (1)

Country Link
CN (1) CN210156426U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200317

Termination date: 20210614