CN210156194U

CN210156194U - Coil manufactured based on wafer process

Info

Publication number: CN210156194U
Application number: CN201921214814.XU
Authority: CN
Inventors: 蒋乐跃; 李大来; 亚历克斯·瑞宾斯基
Original assignee: Aceinna Transducer Systems Co Ltd
Current assignee: Aceinna Transducer Systems Co Ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-03-17
Anticipated expiration: 2029-07-30

Abstract

The utility model relates to a coil based on disk technology makes, it includes: a substrate; a first surface patterned metal on the first surface of the substrate; a second surface patterned metal on the second surface of the substrate; two rows of via metals extending from the first surface to the second surface of the substrate, each row of via metals comprising one or more spaced via metals, wherein the first surface patterned metal is interconnected to the second surface patterned metal by the via metals, wherein the substrate is formed by the wafer scribe. The utility model discloses in can be through disk technology, batch nature is high-efficient, the coil of low-cost preparation high accuracy, this coil can be used for generating or induction electromagnetic field.

Description

Coil manufactured based on wafer process

Technical Field

The utility model relates to a microdevice field especially relates to a coil based on disk technology makes.

Background

A coil is widely used in an inductance device as one of electronic components. However, it is difficult to manufacture high-precision coils in batch at high efficiency and low cost.

Therefore, it is necessary to provide a solution to the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a coil based on disk technology makes, it can be through disk technology, batch nature, high efficiency, low cost are made out, and the precision is high.

In order to solve the above technical problem, according to the utility model discloses an aspect, the utility model provides a coil, it includes: a substrate; a first surface patterned metal on the first surface of the substrate; a second surface patterned metal on the second surface of the substrate; two rows of through hole metals extending from the first surface to the second surface of the substrate, each row of through hole metals including one or more spaced through hole metals, wherein the first surface patterned metal is interconnected with the second surface patterned metal through the through hole metals, wherein the substrate is formed by wafer dicing, the first surface patterned metal is obtained by depositing and patterning metal on the first surface of a wafer, and the through hole metals and the second surface patterned metal are obtained by depositing and patterning metal on the second surface of the wafer etched with through holes.

Compared with the prior art, the utility model discloses in can be through disk technology, batch nature, high-efficient, the low-cost coil of preparation high accuracy. The coil may be used to generate or induce an electromagnetic field.

Drawings

Fig. 1 is a schematic diagram of a manufacturing process of a coil according to a first embodiment of the present invention.

FIG. 2 is a schematic top view of a coil manufactured based on the manufacturing method shown in FIG. 1;

FIG. 3 is a schematic sectional view taken along line A-A of the coil shown in FIG. 2;

fig. 4 is a schematic diagram illustrating a manufacturing process of a coil according to a second embodiment of the present invention;

FIG. 5 is a schematic top view of a coil manufactured based on the manufacturing method shown in FIG. 4;

FIG. 6 is a cross-sectional view taken along line B-B based on the coil shown in FIG. 5;

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be given with reference to the accompanying drawings and preferred embodiments.

The utility model provides a manufacturing approach of coil, it can be through disk technology, the various coils of batch nature, high efficiency, low-cost preparation high accuracy, this coil can be used for generating or the induced electromagnetic field, can be applied to inductance device, fluxgate sensor, electromagnetic induction coil, radio frequency receiving and dispatching and/or integrated circuit inductance.

Fig. 1 is a schematic diagram of a manufacturing process of a coil according to a first embodiment of the present invention. The coil is a chip-scale coil that can be made small and can be integrated into a chip. Referring to fig. 1, the method for manufacturing a coil according to the present invention in a first embodiment includes the following steps:

step 1, depositing metal on the front surface of a wafer 101 and patterning to obtain a patterned metal 102 on the front surface, as shown in 100a of fig. 1;

step 2, turning over the wafer 101 to prepare for back etching, and attaching a sticky sheet film 103(DAF) on the patterned metal 102 on the front side, as shown in 100b of FIG. 1;

step 3, etching a through hole 104 on the back surface of the wafer 101 by using a back V-groove process, wherein in this embodiment, the through hole is a V-groove, and the through hole 104 extends from the back surface to the front surface, as shown in 100c of fig. 1;

and 4, depositing metal on the reverse side of the wafer 101 etched with the through hole 104 and patterning to obtain a through hole metal 105 and a patterned metal 106 on the reverse side, as shown in 100d of fig. 1.

And step 5, dicing the wafer 101 to obtain a plurality of mutually independent coils 100n, as shown in fig. 2 and 3.

FIG. 2 is a schematic top view of a coil manufactured based on the manufacturing method shown in FIG. 1; fig. 3 is a schematic sectional view along line a-a based on the coil shown in fig. 2. As shown in fig. 2 and 3, each coil 100n comprises a substrate 101n, a patterned metal 102n on a front side located on a front surface of the substrate 101n, a patterned metal 106n on a back side located on a back surface of the substrate 101n, and two rows of via metals 105n extending from the front side to the back side of the substrate 101n, wherein each row of via metals 105n comprises one or more spaced via metals 105n, wherein the patterned metal 102n on the front side is interconnected with the back patterned metal 106n through the via metals 105 n. The patterned metal 102n on the front side, the via metal 105n and the patterned metal 106n on the back side are interconnected to form a spiral coil around the substrate 101n, wherein the substrate 101n is formed by dicing the wafer 101. The number of turns of the spiral coil can be 1 turn or multiple turns, so that the spiral coil can be designed according to requirements.

Fig. 4 is a schematic diagram of a manufacturing process of a second embodiment of the method for manufacturing a coil according to the present invention. Referring to fig. 4, a method for manufacturing a coil according to the present invention in a second embodiment includes the following steps:

step 1, depositing metal on the front surface of a wafer 201 and patterning to obtain a patterned metal 202 on the front surface, as shown in 200a of fig. 4;

step 2, turning over the wafer 201 to prepare for back etching, and attaching a sticky sheet film 203(DAF) on the patterned metal 202 on the front side, as shown in 200b of fig. 4;

step 3, etching a through hole 204 on the back side of the wafer 201 by using a Through Silicon Via (TSV) process, wherein in this embodiment, the through hole is a deep hole, and the through hole 204 extends from the back side to the front side, as shown in 200c of fig. 4;

and 4, depositing metal on the reverse side of the wafer 201 etched with the through hole 204 and patterning to obtain a through hole metal 205 and a patterned metal 206 on the reverse side, as shown in 200d of fig. 4.

And step 5, dicing the wafer 201 to obtain a plurality of mutually independent coils 200n, as shown in fig. 5 and 6.

FIG. 5 is a schematic top view of a coil manufactured based on the manufacturing method shown in FIG. 4; fig. 6 is a schematic sectional view along line B-B based on the coil shown in fig. 5. As shown in fig. 5 and 6, each coil 200n includes a substrate 201n, a patterned metal 202n on a front side on a front surface of the substrate 201n, a patterned metal 206n on a back side on a back surface of the substrate 201n, and two rows of via metals 205n extending from the front side to the back side of the substrate 201n, wherein each row of via metals 205n includes one or more spaced via metals 205n, wherein the patterned metal 202n on the front side is interconnected with the patterned metal 206n on the back side by the via metals 205 n. The patterned metal 202n on the front side, the via metal 205n, and the patterned metal 206n on the back side are interconnected to form a spiral coil around the substrate 201n, wherein the substrate 201n is one of a plurality of substrates diced from the wafer 201.

In an alternative embodiment, turning the wafer 201 in step 2 of the manufacturing method may be performed selectively, as long as the subsequent steps 3 and 4 are ensured. The step 2 of attaching the adhesive sheet film to the patterned metal on the front surface may be performed after the step 4, and the adhesive sheet film may be attached before the step 5, or the step of attaching the adhesive sheet film to the patterned metal on the back surface may be performed.

For convenience of description, the steps 1, 2, 3 and 4 are described in sequence, but the sequence of each step can be adjusted as required. For example, steps 3 and 4 are performed first, and then step 1 is performed.

In an alternative embodiment, the patterning step in step 1 may be performed immediately after the metal deposition in step 1, or may be performed in a subsequent process, for example, after steps 2, 3, or 4, or the patterning step in step 4 may be performed immediately after the metal deposition, or may be performed in a subsequent process.

In the above description, the "front side" may also be replaced with the "first surface", the "back side" may also be replaced with the "second surface", and the wafer may also be referred to as a wafer. The "helix" herein may be a standard helical shape, but more refers to a non-standard helical shape, such as the irregular helically ascending shape shown in fig. 2 and 5.

In the above description, the through-hole may represent a hole as shown in 200c of fig. 4, a V-groove as shown in 100c of fig. 1, or a hole having other shapes that can penetrate the disc.

The utility model provides a manufacturing method of coil can be through wafer level technology, the coil of batch nature, high efficiency, low-cost preparation high accuracy. The coil may be used to generate or induce an electromagnetic field, and may be applied to inductive devices, fluxgate sensors, electromagnetic induction coils, radio frequency transceivers and/or integrated circuit inductors.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.

The features of the embodiments and embodiments described herein above may be combined with each other without conflict.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A coil manufactured based on a wafer process, comprising:

a substrate;

a first surface patterned metal on the first surface of the substrate;

a second surface patterned metal on the second surface of the substrate;

two rows of through hole metals extending from the first surface to the second surface of the substrate, each row of through hole metals including one or more spaced through hole metals, wherein the first surface patterned metal is interconnected with the second surface patterned metal through the through hole metals, wherein the substrate is formed by wafer dicing, the first surface patterned metal is obtained by depositing and patterning metal on the first surface of a wafer, and the through hole metals and the second surface patterned metal are obtained by depositing and patterning metal on the second surface of the wafer etched with through holes.

2. A wafer process based coil as claimed in claim 1, wherein the first surface patterned metal, the via metal and the second surface patterned metal are interconnected to form a spiral coil around the substrate.