CN210154720U - High-sensitivity electronic skin - Google Patents
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- CN210154720U CN210154720U CN201920933853.9U CN201920933853U CN210154720U CN 210154720 U CN210154720 U CN 210154720U CN 201920933853 U CN201920933853 U CN 201920933853U CN 210154720 U CN210154720 U CN 210154720U
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Abstract
The utility model relates to a high sensitivity electron skin, include: a first flexible substrate: the outer surface wraps up the first encapsulation layer, and the internal surface is the first base that has regular shape or irregular shape, and this first base's surface is scribbled first conducting layer, and the second flexible substrate: the outer surface wraps up the second encapsulation layer, the internal surface is the second base that has irregular shape, and the surface of this second base scribbles the second conducting layer, and the second base sets up with first base relatively, and the internal surface of first flexible substrate and second flexible substrate all is equipped with the electrode. Compared with the prior art, the utility model discloses sensitivity is high, the linearity is wide, has batch production's prospect.
Description
Technical Field
The utility model belongs to the technical field of the pressure sensor technique and specifically relates to a high sensitivity electron skin is related to.
Background
The electronic device is used for simulating human skin, so that the electronic device becomes an emerging research field to arouse great interest of researchers, and has wide application prospect in the fields of artificial intelligence and human-computer interaction. However, conventional rigid electronic devices are characterized by being hard and brittle, difficult to withstand large deformations, and unsuitable for integration on soft non-planar surfaces. Therefore, a new electronic product, i.e., a flexible electronic device, which breaks through the conventional rigid electronic device, becomes a focus of attention of researchers. The novel flexible electronic device monitors the state of an object by detecting pressure, temperature and humidity, and is mainly used in the fields of human body signal monitoring, artificial limb skin, robots and the like.
The currently common electronic skins are based on four mechanisms including a pressure resistance mechanism, a capacitance mechanism, a piezoelectric mechanism, and a triboelectric mechanism. Among them, sensors based on the piezoresistive mechanism have been widely used due to their simple manufacturing process and low cost.
In the electronic skin manufacturing process based on the pressure resistance effect, the preparation of the pressure resistance material and the manufacturing of the structure are involved. The nano material has excellent electrical and mechanical properties, and can be widely applied, and common nano materials comprise carbon black, carbon nano tubes, graphene and conductive silver nanowires. The special substrate structure helps to obtain high-sensitivity electronic skin, and three-dimensional structures with regular microstructure sequences, such as hemispheres, pyramids and cylinders, have been used for manufacturing high-sensitivity electronic skin.
While research in electronic skins has achieved many results, it also faces many challenges, major problems including: 1. such as insufficient device sensitivity, multi-directional pressure measurement, and narrow linear range. 2. The manufacturing process is complicated and mass production is difficult to achieve. Therefore, there is a need to provide a new process to solve the above technical problems.
Chinese patent CN108139282A discloses a method and apparatus for a sensitive force sensor comprising an electronic force sensor having a first opposing electrode and a second opposing electrode. The first and second opposing electrodes are configured to produce an output indicative of a force applied to the electronic force sensor. The electronic force sensor further includes a plurality of recoverably-deformable structures disposed between the first and second opposing electrodes and having a plurality of conductive-resistive elements. Each recoverably-deformable structure includes at least one of a variable conductor and a variable resistor, and is configured and arranged with properties that set a force sensitivity of the electronic force sensor. However, the deformed structure in this patent is a single regular structure, which results in that the distribution of force is not uniform over the device when deformed by a force, which results in that the sensitivity of the device varies greatly over a small pressure range, and is unstable.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high sensitivity electron skin for overcoming the difficult problem that device sensitivity is not high enough among the prior art, multi-direction pressure measurement, linear range is narrow and manufacturing process is complicated, with high costs, can be applied to human signal monitoring and human-computer interaction field.
The purpose of the utility model can be realized through the following technical scheme:
a high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is wrapped by the first packaging layer, the inner surface of the first substrate is a first substrate with a regular shape, the surface of the first substrate is coated with a first conductive layer,
a second flexible substrate: the outer surface of the second substrate is wrapped by the second packaging layer, the inner surface of the second substrate is a second substrate with an irregular shape, the surface of the second substrate is coated with a second conductive layer, the second substrate is arranged opposite to the first substrate,
and electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate.
The first flexible substrate, the second flexible substrate, the first base with the regular shape or the irregular shape and the second base with the irregular shape are arranged in the middle of the first flexible substrate and the second flexible substrate and combined to form a sandwich structure, a packaging layer wraps the outside of the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
The regular shape is pyramidal, cylindrical, hemispherical or conical.
The regular shape is preferably pyramidal.
The irregular shape is the surface shape of ground glass, the surface shape of a textured silicon wafer or the surface shape of sand paper.
The first flexible substrate is a polydimethylsiloxane substrate.
The second flexible substrate is a polydimethylsiloxane substrate.
The first conducting layer is a multi-walled carbon nanotube, graphene, reduced graphene oxide or conducting silver nanowire layer.
The second packaging layer is a multi-walled carbon nanotube, graphene, reduced graphene oxide or conductive silver nanowire layer.
And the inner surfaces of the first flexible substrate and the second flexible substrate are respectively connected with metal leads as electrodes by using a conductive silver paste or an electric welding method.
The first substrate and the second substrate are placed face to face, and a device is packaged by using a polyimide or polydimethylsiloxane bonding method.
The application provides a device with a sandwich structure, wherein the sandwich structure is irregular in layer, regular in layer or irregular in layer, the structural design enables the working mechanism of the device to change, the tip structure enables the device to show high sensitivity when the device is subjected to tiny force, and in the prior art, when the device is subjected to force deformation by a single regular structure, the force distribution is uneven on the device, so that the sensitivity of the device is greatly changed in a small pressure range, and the sensitivity is unstable. However, when a uniform structure and a non-uniform structure are combined together or a structure in which both the structures are non-uniform is used, the shape of each region of the non-uniform structure is not uniform, and the entire device is deformed when receiving a force, so that the force is distributed relatively uniformly over the entire structure, and the change in sensitivity is relatively stable over a relatively wide pressure range. The manufacturing process of the electronic skin is complex and costly, which results in limited application thereof.
Compared with the prior art, the utility model has the advantages of high sensitivity, wide linearity, the electron skin of preparation adopts bilayer structure, and wherein the one deck adopts regular structure or irregular structure, another layer to adopt irregular shape structure, has reduced the area of contact of upper and lower surface, has increased the contact resistance of upper and lower surface, has improved forced induction's sensitivity. Due to the uniformity of the stress deformation of the irregular structure, the pressure change is uniformly borne by the base body, so that the sensitivity change shows wider linearity. Among the prior art, generally adopt single regular shape design to improve the sensitivity of electron skin, the utility model discloses a bilayer structure design of two-layer irregular structure or the irregular one deck regular structure of one deck has produced the electron skin that has high sensitivity and wide linearity.
Drawings
Fig. 1 is a schematic structural diagram of a high-sensitivity electronic skin.
In the figure, 1-first encapsulation layer, 2-first flexible substrate, 3-first conductive layer, 4-second flexible substrate, 5-second conductive layer, 6-second encapsulation layer, 7-electrode.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
Example 1
The high-sensitivity electronic skin is structurally shown in fig. 1 and comprises a first flexible substrate 2 and a second flexible substrate 4 which are oppositely arranged. The outer surface of the first flexible substrate 2 wraps the first packaging layer 1, the inner surface is a first base with a regular shape, the surface of the first base is coated with a first conductive layer 3, the outer surface of the second flexible substrate 4 wraps the second packaging layer 6, the inner surface is a second base with an irregular shape, and the surface of the second base is coated with a second conductive layer 5. Electrodes 7 are provided on the inner surfaces of the first flexible substrate 2 and the second flexible substrate 4. The second base is arranged opposite to the first base, so that the first flexible substrate 2 and the second flexible substrate 4 are arranged opposite to each other to form a sandwich structure, a layer of packaging layer is wrapped outside the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
The flexible substrate with the regular pyramid surface is manufactured by combining a photoetching technology, a wet etching technology and a die casting technology, a conductive layer is obtained by depositing through a drop casting technology, and the flexible substrate with the irregular structure is manufactured through the die casting technology.
In the embodiment, the substrate is made of polydimethylsiloxane, so that the device has good flexibility and ductility, and the device shows good toughness after being used for multiple times. The conductive layer material adopts the multi-walled carbon nano tube, and the material has excellent electrical property and mechanical property, thereby ensuring the excellent mechanical property and electrical property of the device. The surface structure of the upper substrate is regular pyramid, the surface of the lower substrate is irregular undulation, the whole structure is a sandwich structure, the contact area of the upper part and the lower part is reduced, the contact resistance of the contact surface is improved, and the device has high sensitivity. When the irregular fluctuation of the lower surface is stressed, the whole surface is deformed integrally, and the force is dispersed uniformly, so that the sensitivity of the device has a larger linear range.
The manufacturing method of the electronic skin comprises the following steps:
step one, manufacturing an inverted pyramid silicon template through a photoetching technology and a wet etching technology. The square array layout is designed first, and then the photolithographic mask is fabricated. Growing silicon nitride on the surface of the silicon wafer as a protective layer, then coating photoresist on the silicon nitride for photoetching, and developing. And etching the silicon nitride in the pattern area by using a reactive ion etching process. And after slicing, etching the silicon wafer by using a wet etching method to obtain the inverted pyramid silicon die. And finally, removing the photoresist on the surface of the mold by using acetone, and cleaning.
Step two, preparing polydimethylsiloxane and curing agent according to the mass ratio of 10:1-15:1, uniformly stirring on a magnetic stirrer, and vacuumizing to completely remove bubbles.
And step three, pouring the prepared polydimethylsiloxane solution on the surface of the template, standing, and naturally leveling. And (4) after heating and curing, peeling the film to obtain the pyramid structure substrate.
Step four, washing the purchased ground glass by using an ethanol solution, and repeating the step three to obtain the substrate with the irregular surface.
And fifthly, adding the multi-walled carbon nano-tubes into deionized water, and ultrasonically treating the mixture in an ultrasonic cleaning machine to disperse the multi-walled carbon nano-tubes.
And step six, sucking the prepared carbon nano tube dispersion liquid by using an injector, dripping the carbon nano tube dispersion liquid on the surface of the film, heating and curing to obtain the film with the multi-wall carbon nano tubes uniformly dispersed on the surface.
And step seven, adhering copper leads on one ends of the two films respectively by using conductive silver paste.
And step eight, placing the two films in a face-to-face mode, and packaging the device with polyimide to obtain the electronic skin sensor.
Example 2
A high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is coated with a first packaging layer made of polyimide, the inner surface of the first substrate is a cylindrical regular shape and made of polydimethylsiloxane, and a first conducting layer made of a multi-walled carbon nanotube is coated on the surface of the first substrate;
a second flexible substrate: a second packaging layer with an outer surface coated with polydimethylsiloxane, and a second substrate with an inner surface of irregular shape, for example, a ground glass surface shape, coated with a second conductive layer made of graphene;
the second substrate is disposed opposite to the first substrate. Therefore, the first flexible substrate, the second flexible substrate, the first base with the regular shape and the second base with the irregular shape which are arranged in the middle of the first flexible substrate and the second flexible substrate are combined to form a sandwich structure, a layer of packaging layer wraps the outside of the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
And metal electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate and are connected to the conductive layer by conductive silver paste.
The preparation method of the high-sensitivity electronic skin comprises the following steps:
preparation of regular-shaped substrate:
obtaining a regular cylindrical template with an inverted shape by utilizing a photoetching technology;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 15:1 to prepare a polydimethylsiloxane solution;
pouring a polydimethylsiloxane solution on the surface of the template by using a casting method, and heating and curing to obtain a first substrate with a regular shape on the inner surface;
preparation of irregular-shaped substrate:
selecting a substrate with a rough surface structure as a template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 10:1 to prepare a polydimethylsiloxane solution;
pouring the polydimethylsiloxane solution on the ground glass by using a casting method, and heating and curing to obtain a second substrate with an irregular inner surface;
placing the conducting layer material in deionized water, and preparing a conducting layer material solution by adopting ultrasonic stirring;
manufacturing a first conductive layer and a second conductive layer on the inner surfaces of the first substrate and the second substrate by using a drop casting method;
connecting a metal lead on the conducting layer by using conductive silver paste as an electrode, and performing high-temperature curing treatment;
and placing the first substrate and the second substrate face to face, and packaging the device by using a polyimide bonding method to prepare the high-sensitivity electronic skin.
Example 3
A high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is coated with a first packaging layer made of polydimethylsiloxane, the inner surface of the first packaging layer is a first substrate which is made of polydimethylsiloxane in a hemispherical regular shape, and a first conducting layer made of reduced graphene oxide is coated on the surface of the first substrate;
a second flexible substrate: a second packaging layer with an outer surface coated with polydimethylsiloxane, and a second substrate with an inner surface of irregular shape, for example, a ground glass surface shape, coated with a second conductive layer made of reduced graphene oxide;
the second substrate is disposed opposite to the first substrate. Therefore, the first flexible substrate, the second flexible substrate, the first base with the regular shape and the second base with the irregular shape which are arranged in the middle of the first flexible substrate and the second flexible substrate are combined to form a sandwich structure, a layer of packaging layer wraps the outside of the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
And metal electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate and are connected to the conducting layer by welding.
The preparation method of the high-sensitivity electronic skin comprises the following steps:
preparation of regular-shaped substrate:
utilizing photoetching technology to obtain a regular hemispherical and inverted template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 10:1 to prepare a polydimethylsiloxane solution;
pouring a polydimethylsiloxane solution on the surface of the ground glass by using a casting method, and heating and curing to obtain a first substrate with a regular shape on the inner surface;
preparation of irregular-shaped substrate:
selecting a substrate with a rough surface structure as a template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 12:1 to prepare a polydimethylsiloxane solution;
pouring the polydimethylsiloxane solution on the ground glass by using a casting method, and heating and curing to obtain a second substrate with an irregular inner surface;
placing the conducting layer material in deionized water, and preparing a conducting layer material solution by adopting ultrasonic stirring;
manufacturing a first conductive layer and a second conductive layer on the inner surfaces of the first substrate and the second substrate by using a drop casting method;
connecting a metal lead on the conducting layer by using conductive silver paste as an electrode, and performing high-temperature curing treatment;
and placing the first substrate and the second substrate face to face, and packaging the device by using a polydimethylsiloxane bonding method to prepare the high-sensitivity electronic skin.
Example 4
A high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is wrapped by a first packaging layer made of polydimethylsiloxane, the inner surface of the first packaging layer is in a conical regular shape and made of polydimethylsiloxane, and a first conducting layer made of conducting silver nanowires is coated on the surface of the first substrate;
a second flexible substrate: a second packaging layer with the outer surface coated with polydimethylsiloxane, and a second substrate with the inner surface of irregular shape, for example, the surface of sand paper, coated with a second conductive layer made of conductive silver nanowires;
the second substrate is disposed opposite to the first substrate. Therefore, the first flexible substrate, the second flexible substrate, the first base with the regular shape and the second base with the irregular shape which are arranged in the middle of the first flexible substrate and the second flexible substrate are combined to form a sandwich structure, a layer of packaging layer wraps the outside of the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
And metal electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate and are connected to the conducting layer by welding.
The preparation method of the high-sensitivity electronic skin comprises the following steps:
preparation of regular-shaped substrate:
utilizing photoetching technology to obtain a regular inverted conical template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 15:1 to prepare a polydimethylsiloxane solution;
pouring a polydimethylsiloxane solution on the surface of the template by using a casting method, and heating and curing to obtain a first substrate with a regular shape on the inner surface;
preparation of irregular-shaped substrate:
selecting a substrate with a rough surface structure as a template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 15:1 to prepare a polydimethylsiloxane solution;
pouring the polydimethylsiloxane solution on the sand paper by using a casting method, and heating and curing to obtain a second substrate with an irregular inner surface;
placing the conducting layer material in deionized water, and preparing a conducting layer material solution by adopting ultrasonic stirring;
manufacturing a first conductive layer and a second conductive layer on the inner surfaces of the first substrate and the second substrate by using a drop casting method;
connecting a metal lead on the conducting layer by using conductive silver paste as an electrode, and performing high-temperature curing treatment;
and placing the first substrate and the second substrate face to face, and packaging the device by using a polydimethylsiloxane bonding method to prepare the high-sensitivity electronic skin.
Example 5
A high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is wrapped by a first packaging layer made of polydimethylsiloxane, the inner surface of the first packaging layer is a first substrate made of polydimethylsiloxane and in an irregular shape, and a first conducting layer made of conducting silver nanowires is coated on the surface of the first substrate;
a second flexible substrate: a second packaging layer with the outer surface coated with polydimethylsiloxane, and a second substrate with the inner surface of irregular shape, for example, the surface of sand paper, coated with a second conductive layer made of conductive silver nanowires;
the second substrate is disposed opposite to the first substrate. Therefore, the first flexible substrate, the second flexible substrate, the first base with the irregular shape and the second base with the irregular shape which are arranged in the middle of the first flexible substrate and the second flexible substrate are combined to form a sandwich structure, a layer of packaging layer wraps the outside of the sandwich structure, and the upper structure and the lower structure are fixed to be in good contact with each other.
And metal electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate and are connected to the conducting layer by welding.
The preparation method of the high-sensitivity electronic skin comprises the following steps:
preparation of regular-shaped substrate:
utilizing photoetching technology to obtain a regular inverted conical template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 15:1 to prepare a polydimethylsiloxane solution;
pouring a polydimethylsiloxane solution on the surface of the template by using a casting method, and heating and curing to obtain a first substrate with a regular shape on the inner surface;
preparation of irregular-shaped substrate:
selecting a substrate with a rough surface structure as a template;
mixing polydimethylsiloxane and a curing agent according to the mass ratio of 15:1 to prepare a polydimethylsiloxane solution;
pouring the polydimethylsiloxane solution on the sand paper by using a casting method, and heating and curing to obtain a second substrate with an irregular inner surface;
placing the conducting layer material in deionized water, and preparing a conducting layer material solution by adopting ultrasonic stirring;
manufacturing a first conductive layer and a second conductive layer on the inner surfaces of the first substrate and the second substrate by using a drop casting method;
connecting a metal lead on the conducting layer by using conductive silver paste as an electrode, and performing high-temperature curing treatment;
and placing the first substrate and the second substrate face to face, and packaging the device by using a polydimethylsiloxane bonding method to prepare the high-sensitivity electronic skin.
In the description of the present invention, it is to be understood that the terms "above," "bottom," "parallel," "intermediate," and the like are used merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The embodiments described above are intended to facilitate the understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention according to the disclosure of the present invention.
Claims (10)
1. A high-sensitivity electronic skin, comprising:
a first flexible substrate: the outer surface of the first substrate is wrapped by the first packaging layer, the inner surface of the first substrate is a first substrate with a regular shape or an irregular shape, the surface of the first substrate is coated with a first conductive layer,
a second flexible substrate: the outer surface of the second substrate is wrapped by the second packaging layer, the inner surface of the second substrate is a second substrate with an irregular shape, the surface of the second substrate is coated with a second conductive layer, the second substrate is arranged opposite to the first substrate,
and electrodes are arranged on the inner surfaces of the first flexible substrate and the second flexible substrate.
2. The high-sensitivity electronic skin as claimed in claim 1, wherein the flexible substrate and the first base with regular shape or irregular shape and the second base with irregular shape in the flexible substrate are combined together to form the electronic skin with a sandwich-like structure.
3. A high sensitivity electronic skin according to claim 1, wherein said regular shape is pyramidal, cylindrical, hemispherical or conical.
4. A high sensitivity electronic skin according to claim 3, wherein said regular shape is pyramidal.
5. A high sensitivity electronic skin according to claim 1, wherein said first flexible substrate is a polydimethylsiloxane substrate.
6. A high sensitivity electronic skin according to claim 1, wherein said second flexible substrate is a polydimethylsiloxane substrate.
7. The high-sensitivity electronic skin as claimed in claim 1, wherein the first conductive layer is a multi-walled carbon nanotube, graphene, reduced graphene oxide or conductive silver nanowire layer.
8. The high-sensitivity electronic skin as claimed in claim 1, wherein the second encapsulating layer is a multi-walled carbon nanotube, graphene, reduced graphene oxide or conductive silver nanowire layer.
9. The high-sensitivity electronic skin as claimed in claim 1, wherein the irregular shape is a ground glass surface shape, a textured silicon wafer surface shape or a sand paper surface shape.
10. The high-sensitivity electronic skin according to claim 1, wherein the inner surfaces of the first flexible substrate and the second flexible substrate are respectively connected with metal wires as electrodes by using a conductive silver paste or an electric welding method.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110231110A (en) * | 2019-06-20 | 2019-09-13 | 上海交通大学 | A kind of high sensitivity electronic skin and preparation method thereof |
| CN114754906A (en) * | 2022-03-18 | 2022-07-15 | 复旦大学 | Ultra-sensitive flexible pressure sensor inspired by biology and preparation method thereof |
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2019
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110231110A (en) * | 2019-06-20 | 2019-09-13 | 上海交通大学 | A kind of high sensitivity electronic skin and preparation method thereof |
| CN110231110B (en) * | 2019-06-20 | 2024-06-07 | 上海交通大学 | High-sensitivity electronic skin and preparation method thereof |
| CN114754906A (en) * | 2022-03-18 | 2022-07-15 | 复旦大学 | Ultra-sensitive flexible pressure sensor inspired by biology and preparation method thereof |
| CN114754906B (en) * | 2022-03-18 | 2023-09-22 | 复旦大学 | Biosensing flexible pressure sensor and preparation method thereof |
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