CN210142648U - Novel connection piece structure of diode encapsulation - Google Patents
Novel connection piece structure of diode encapsulation Download PDFInfo
- Publication number
- CN210142648U CN210142648U CN201921448936.5U CN201921448936U CN210142648U CN 210142648 U CN210142648 U CN 210142648U CN 201921448936 U CN201921448936 U CN 201921448936U CN 210142648 U CN210142648 U CN 210142648U
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- China
- Prior art keywords
- connection piece
- chip
- base plate
- fixedly connected
- piece structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8534—Bonding interfaces of the connector
- H01L2224/85345—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel connection piece structure of diode encapsulation, including first connection piece structure and second connection piece structure, first connection piece structure includes first chip base plate, the equal fixedly connected with pin in both sides of first chip base plate, the first chip of top fixedly connected with of first chip base plate. The utility model discloses a first connection piece structure, second connection piece structure, first chip base plate, the pin, the cooperation of first connection piece and first epoxy is used, can effectually solve traditional connection piece and the nearer problem that causes the electric leakage to puncture of chip position, increase one plastic technology after accomplishing connection piece edge punching press, make connection piece edge form the warpage, and then keep away from the chip with the connection piece edge, connection piece can be better more filling epoxy to the space between the chip, avoid the probability that the chip is punctured, can effectively avoid the production of punching press end burr, thereby reduce the risk of connection piece burr overlap joint short circuit by a wide margin.
Description
Technical Field
The utility model relates to a diode technical field specifically is a novel connection piece structure of diode encapsulation.
Background
This product mainly is applied to the car, household electrical appliances, communications facilities, industrial equipment etc. current connection piece structure of the same type is the industry standard type, and traditional connection piece generally adopts smooth structure with chip bonding end edge, and the connection piece edge is nearer with the chip position after welding is accomplished with the chip to the connection piece of level and smooth structure, easily causes the electric leakage to puncture, and the connection piece of level and smooth structure easily produces the burr in the punching press position in the punching press manufacturing process simultaneously, and the burr easily causes the overlap joint short circuit in welding process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel connection piece structure of diode encapsulation possesses the high advantage of security, and it is nearer with the chip position to have solved traditional connection piece edge, easily punctures the chip, and the connection piece punching press position that causes in the punching press process produces the burr, easily causes the problem of overlap joint short circuit with the chip.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel connection piece structure of diode encapsulation, includes first connection piece structure and second connection piece structure, first connection piece structure includes first chip base plate, the equal fixedly connected with pin in both sides of first chip base plate, the first chip of top fixedly connected with of first chip base plate, the first connection piece of top fixedly connected with of first chip, the bottom on first connection piece right side and the top contact of first chip base plate, the first epoxy of rear end fixedly connected with of first chip base plate, the right-hand member of first connection piece is the perk form.
Preferably, the second connecting piece structure comprises a second chip substrate, a second chip is fixedly connected to the top of the second chip substrate, a second connecting piece is fixedly connected to the top of the second chip, a second epoxy is fixedly connected to the rear end of the second chip substrate, and the two ends of the second connecting piece are both warped.
Preferably, the top and bottom of the first chip are fixedly connected to the first connection piece and the first chip substrate, respectively, by soldering.
Preferably, the top and the bottom of the second chip are fixedly connected with the second connecting sheet and the second chip substrate respectively through soldering.
Preferably, the first chip substrate and the second chip substrate are both made of copper.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a first connection piece structure, second connection piece structure, first chip base plate, the pin, the cooperation of first connection piece and first epoxy is used, can effectually solve traditional connection piece and the nearer problem that causes the electric leakage to puncture of chip position, increase one plastic technology after accomplishing connection piece edge punching press, make connection piece edge form the warpage, and then keep away from the chip with the connection piece edge, connection piece can be better more filling epoxy to the space between the chip, avoid the probability that the chip is punctured, can effectively avoid the production of punching press end burr, thereby reduce the risk of connection piece burr overlap joint short circuit by a wide margin.
2. The utility model discloses a set up first chip base plate, can play the effect of bearing first chip and conduction current, through setting up the pin, can switch on circuit to the circuit board, through setting up first chip, can realize device electrical property function, through setting up first connection piece, can switch on circuit to the pin, the right-hand member of first connection piece is the warpage form simultaneously, can increase the contact distance with first chip, avoid the electric leakage to puncture, through setting up first epoxy, can play insulating and protection inner structure's effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic front view of a second connecting sheet structure of the present invention.
In the figure: 1. a first connecting tab structure; 2. a second connecting piece structure; 3. a first chip substrate; 4. a pin; 5. a first chip; 6. a first connecting piece; 7. a first epoxy; 8. a second chip substrate; 9. a second chip; 10. a second connecting sheet; 11. a second epoxy.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The components adopted by the utility model are all universal standard components or components known by the technicians in the field, and the structure and the principle of the components are known by the technicians through technical manuals or conventional experimental methods.
Referring to fig. 1-2, a novel connection pad structure for diode packaging comprises a first connection pad structure 1 and a second connection pad structure 2, wherein the second connection pad structure 2 comprises a second chip substrate 8, a second chip 9 is fixedly connected to the top of the second chip substrate 8, a second connection pad 10 is fixedly connected to the top of the second chip 9, a second epoxy 11 is fixedly connected to the rear end of the second chip substrate 8, both ends of the second connection pad 10 are warped, the top and the bottom of the second chip 9 are respectively fixedly connected to the second connection pad 10 and the second chip substrate 8 by soldering, the first connection pad structure 1 comprises a first chip substrate 3, pins 4 are fixedly connected to both sides of the first chip substrate 3, a first chip 5 is fixedly connected to the top of the first chip substrate 3, the top and the bottom of the first chip 5 are respectively fixedly connected to the first connection pad 6 and the first chip substrate 3 by soldering, the first chip substrate 3 and the second chip substrate 8 are made of copper, the top of the first chip 5 is fixedly connected with a first connecting sheet 6, the bottom of the right side of the first connecting sheet 6 is contacted with the top of the first chip substrate 3, the rear end of the first chip substrate 3 is fixedly connected with a first epoxy 7, the right end of the first connecting sheet 6 is in a warping shape, the first chip substrate 3 is arranged to bear the first chip 5 and conduct current, the circuit can be conducted to the circuit board by arranging the pins 4, the electrical function of the device can be realized by arranging the first chip 5, the circuit can be conducted to the pins 4 by arranging the first connecting sheet 6, meanwhile, the right end of the first connecting sheet 6 is in the warping shape, the contact distance between the first chip substrate 5 and the circuit board can be increased, electric leakage breakdown can be avoided, the effect of insulating and protecting the internal structure can be realized by arranging the first epoxy 7, through first connection piece structure 1, second connection piece structure 2, first chip base plate 3, pin 4, first connection piece 6 and first epoxy 7's cooperation is used, can effectually solve the problem that traditional connection piece and chip position are more likely to cause the electric leakage to puncture, increase one plastic technology after accomplishing connection piece edge punching press, make connection piece edge form the warpage, and then keep away from the chip with the connection piece edge, connection piece to the space between the chip filling epoxy that can be better more, avoid the probability that the chip is punctured, can effectively avoid the production of punching press end burr, thereby reduce the risk of connection piece burr overlap joint short circuit by a wide margin.
When the welding device is used, a shaping process is added after the edges of the first connecting sheet 6 and the second connecting sheet 10 are punched, so that the edges of the first connecting sheet 6 and the second connecting sheet 10 are warped, and the problems of electric leakage breakdown and lap short circuit caused by burrs in the welding process are avoided.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A novel connection piece structure of diode encapsulation, includes first connection piece structure (1) and second connection piece structure (2), its characterized in that: first connection piece structure (1) includes first chip base plate (3), the equal fixedly connected with pin (4) in both sides of first chip base plate (3), the first chip of top fixedly connected with (5) of first chip base plate (3), the first connection piece of top fixedly connected with (6) of first chip (5), the bottom on first connection piece (6) right side contacts with the top of first chip base plate (3), the rear end fixedly connected with first epoxy (7) of first chip base plate (3), the right-hand member of first connection piece (6) is the perk form.
2. The novel connection pad structure of diode package of claim 1, wherein: second connection piece structure (2) include second chip base plate (8), top fixedly connected with second chip (9) of second chip base plate (8), top fixedly connected with second connection piece (10) of second chip (9), the rear end fixedly connected with second epoxy (11) of second chip base plate (8), the both ends of second connection piece (10) are the perk form.
3. The novel connection pad structure of diode package of claim 1, wherein: the top and the bottom of the first chip (5) are fixedly connected with the first connecting piece (6) and the first chip substrate (3) through soldering respectively.
4. The novel connection pad structure of diode package of claim 2, wherein: the top and the bottom of the second chip (9) are fixedly connected with the second connecting sheet (10) and the second chip substrate (8) through soldering respectively.
5. The novel connection pad structure of diode package of claim 1, wherein: the first chip substrate (3) and the second chip substrate (8) are both made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921448936.5U CN210142648U (en) | 2019-09-03 | 2019-09-03 | Novel connection piece structure of diode encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921448936.5U CN210142648U (en) | 2019-09-03 | 2019-09-03 | Novel connection piece structure of diode encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210142648U true CN210142648U (en) | 2020-03-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921448936.5U Active CN210142648U (en) | 2019-09-03 | 2019-09-03 | Novel connection piece structure of diode encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210142648U (en) |
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2019
- 2019-09-03 CN CN201921448936.5U patent/CN210142648U/en active Active
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