CN210129485U - Semiconductor wafer measuring unit convenient to clamp - Google Patents
Semiconductor wafer measuring unit convenient to clamp Download PDFInfo
- Publication number
- CN210129485U CN210129485U CN201921195519.4U CN201921195519U CN210129485U CN 210129485 U CN210129485 U CN 210129485U CN 201921195519 U CN201921195519 U CN 201921195519U CN 210129485 U CN210129485 U CN 210129485U
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- semiconductor wafer
- tightly welded
- screw rod
- clamp
- micro motor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000005259 measurement Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 abstract description 6
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor wafer measuring equipment, in particular to a semiconductor wafer measuring unit convenient for clamping, which comprises a device main body, wherein a cavity communicated with the outside is arranged in the device main body, a clamping device is arranged in the cavity, the clamping device comprises an operating platform arranged on the bottom wall of the cavity, a bottom clamping plate arranged in a horizontal shape is welded on a rectangular block closely, and a top clamping plate is arranged above the bottom clamping plate; still be equipped with fixture on the rectangular block, be equipped with micro motor on the roof of recess, micro motor's output shaft end has first lead screw in close welding, and one side of first lead screw is equipped with the second lead screw. The utility model discloses labour saving and time saving, easy operation is swift, realizes stabilizing the centre gripping to the semiconductor wafer piece, conveniently measuration work.
Description
Technical Field
The utility model relates to a semiconductor wafer piece measuring equipment technical field specifically is a semiconductor wafer piece measuring unit convenient to centre gripping.
Background
The semiconductor wafer is one of semiconductor materials, and when the semiconductor wafer is manufactured, the semiconductor wafer needs to be measured, and a semiconductor wafer measuring unit is needed during measurement. In view of the above, a semiconductor wafer measuring unit with an easy clamping is proposed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor wafer piece measuring unit convenient to centre gripping to solve the general semiconductor wafer piece measuring unit who provides in the above-mentioned background art and when using, be not convenient for carry out the centre gripping to the semiconductor wafer piece, and then can bring more inconvenient problem for the user.
In order to achieve the above object, the utility model provides a following technical scheme:
a semiconductor wafer measuring unit convenient to clamp comprises a device main body, wherein a cavity communicated with the outside is arranged in the device main body, a clamping device is arranged in the cavity, the clamping device comprises an operating platform arranged on the bottom wall of the cavity, a convex block is arranged on the operating platform, a rectangular block is arranged on the right side surface of the convex block, a bottom clamping plate arranged in a horizontal shape is welded on the rectangular block closely, a top clamping plate is arranged above the bottom clamping plate, and two symmetrical threaded holes are arranged in a tail end plate body of the top clamping plate; still be equipped with fixture on the rectangular block, fixture is including inseparable welding at protective housing on the rectangular block, be equipped with the recess that is linked together with the external world in the protective housing, be equipped with micro motor on the roof of recess, micro motor's the terminal inseparable welding of output shaft has first lead screw, one side of first lead screw is equipped with the second lead screw, first lead screw and the second lead screw all passes and corresponds the screw hole and with threaded connection between the screw hole, the top inseparable welding of second lead screw has the pivot, the pivot with conveyer belt sliding connection who links to each other end to end between micro motor's the output shaft, the top inseparable welding of pivot has the primary shaft, the outer lane inseparable welding of primary shaft is in on the roof of recess.
Preferably, the top wall and the bottom wall of the cavity are both tightly bonded with sliding rails.
Preferably, the positions of the two slide rails are opposite to each other, and two slide rails are arranged on one side surface adjacent to each other and provided with slide grooves which are arranged along the length direction of the slide rails and communicated with the outside.
Preferably, two door plates which are symmetrical to each other are arranged between the two sliding rails, and the door plates are located in the sliding grooves and are in sliding connection with the sliding grooves.
Preferably, an upper convex disc and a lower convex disc which are symmetrical to each other are tightly welded on the output shaft of the micro motor and the rotating shaft.
Preferably, the conveyor belt is located between two convex discs arranged up and down.
Preferably, the first screw rod and the bottom rod body of the second screw rod are both tightly welded with second bearings, and the second bearings are tightly welded on the rectangular blocks.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a clamping device who sets up utilizes bottom splint as the support base that supports the semiconductor wafer piece, utilizes the micro motor work in the fixture to drive the lead screw and rotates, further drives top splint downstream, the realization will be in the semiconductor wafer piece on the bottom splint and carry out stable centre gripping, convenient operation, and the structure is more stable, it measures the unit when using to have solved general semiconductor wafer piece, be not convenient for carry out the centre gripping to the semiconductor wafer piece, and then can bring more inconvenient problem for the user.
2. The utility model discloses a second bearing that sets up guarantees that first lead screw and second lead screw are more stable in the pivoted, also can carry on spacingly to the motion of top splint simultaneously, avoids top splint to drop from first lead screw and second lead screw, has solved the semiconductor wafer piece measuring unit of general centre gripping of being convenient for when using, and the lead screw structure is insecure to appear easily, causes the problem that top splint can't play better clamping effect.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is an exploded view of embodiment 1 of the present invention;
fig. 3 is a schematic structural view of the slide rail of the present invention;
fig. 4 is an exploded view of the clamping device of the present invention;
fig. 5 is an exploded view of the clamping mechanism of the present invention;
fig. 6 is a schematic structural view of the top splint of the present invention;
fig. 7 is a schematic structural view of embodiment 2 of the present invention.
In the figure: 1. a device main body; 10. a cavity; 11. a slide rail; 111. a chute; 12. a door panel; 2. a clamping device; 20. an operation table; 21. a bump; 211. a rectangular block; 22. a bottom clamping plate; 23. a top clamping plate; 231. a threaded hole; 24. a clamping mechanism; 241. a protective shell; 242. a groove; 243. a micro motor; 244. a first lead screw; 245. a second lead screw; 246. a rotating shaft; 247. a convex disc; 248. a conveyor belt; 249. a first bearing; 3. a second bearing.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Example 1
A semiconductor wafer measuring unit convenient for clamping is disclosed, as shown in fig. 1 to 6, and comprises a device main body 1, wherein a cavity 10 communicated with the outside is arranged in the device main body 1, slide rails 11 are tightly adhered on the top wall and the bottom wall of the cavity 10 close to the position of a notch of the cavity, the positions of the two slide rails 11 are opposite to each other, slide grooves 111 which are arranged along the length direction of the slide rails 11 and communicated with the outside are arranged on one side surface of the two adjacent slide rails 11, two door panels 12 which are symmetrical to each other are arranged between the two slide rails 11, the door panels 12 are positioned in the slide grooves 111 and are in sliding connection with the slide grooves 111, and the door panels 12 can be conveniently opened or closed by sliding the door;
the clamping device 2 is arranged in the cavity 10, the clamping device 2 comprises an operating table 20 tightly welded on the bottom wall of the cavity 10, a lug 21 is tightly welded on the operating table 20, a rectangular block 211 horizontally arranged is arranged on the right side surface of the lug 21, and the rectangular block 211 and the lug 21 are of an integrally formed structure, so that the structure is firmer; a bottom clamping plate 22 which is horizontally arranged is tightly welded on the rectangular block 211, a top clamping plate 23 is arranged above the bottom clamping plate 22, and two threaded holes 231 which are symmetrical to each other and communicated with the outside are arranged in a plate body at the tail end of the top clamping plate 23 close to the rectangular block 211; the rectangular block 211 is further provided with a clamping mechanism 24, the clamping mechanism 24 comprises a protective shell 241 tightly welded on the rectangular block 211, a groove 242 communicated with the outside is formed in the protective shell 241, a notch of the groove 242 is arranged towards one side of the top clamping plate 23, part of the plate body of the top clamping plate 23 is positioned in the groove 242, a micro motor 243 is arranged on the top wall of the groove 242, a fixing base is arranged on the micro motor 243, a plurality of threaded holes communicated with the outside are formed in the fixing base, threaded holes communicated with the outside are also formed in the position, opposite to the threaded holes in the fixing base, on the top wall of the groove 242, the fixing base on the micro motor 243 is fixedly installed on the top wall of the groove 242 through fastening screws, and the structure of the fixing base;
a first lead screw 244 arranged vertically is tightly welded at the tail end of an output shaft of the micro motor 243, a second lead screw 245 arranged vertically is arranged on one side of the first lead screw 244, and the first lead screw 244 and the second lead screw 245 both penetrate through the corresponding threaded hole 231 and are in threaded connection with the threaded hole 231, so that the top clamping plate 23 can be driven to move up and down when the first lead screw 244 and the second lead screw 245 rotate;
the rotating shaft 246 is tightly welded at the top end of the second lead screw 245, the rotating shaft 246 is in sliding connection with the output shaft of the micro motor 243 through the end-to-end conveyor belt 248, that is, the conveyor belt 248 sleeves the output shaft of the micro motor 243 and the rotating shaft 246 and is in sliding connection with the output shaft of the micro motor 243 and the rotating shaft 246, so that the rotation of the output shaft of the micro motor 243 can drive the rotating shaft 246 to rotate, and the rotation direction of the output shaft of the micro motor 243 can be consistent with the rotation direction of the rotating shaft 246 due to the sliding connection of the conveyor belt 248.
The top end of the rotating shaft 246 is tightly welded with a first bearing 249, the rotating shaft 246 is tightly welded on an inner ring of the first bearing 249, and an outer ring of the first bearing 249 is tightly welded on the top wall of the groove 242, so that the rotating shaft 246 is ensured to rotate more smoothly.
In this embodiment, the output shaft of the micro motor 243 and the rotating shaft 246 are both tightly welded with two upper and lower symmetric convex discs 247, and the conveyor belt 248 is located between the two upper and lower convex discs 247, so that the conveyor belt 248 is limited, and the conveyor belt 248 is prevented from separating from the output shaft of the micro motor 243 or the rotating shaft 246.
Specifically, the micro motor 243 may be a ZGA 37-37 RG series micro speed-adjustable forward/reverse rotation direct current speed-reducing motor manufactured by Zhejiang Zhenjiangchi motors Limited, and a circuit and a power supply matched with the speed-adjustable forward/reverse rotation direct current speed-reducing motor are also provided by the manufacturer; furthermore, the utility model discloses in relate to circuit and electronic components and module be prior art, the technical staff in the field can realize completely, no longer gives unnecessary details here, the utility model discloses the content of protection also does not relate to the improvement to software and method.
In this embodiment, the semiconductor wafer sheet placed on the bottom clamp plate 22 is supported by the bottom clamp plate 22, the clamping mechanism 24 is arranged, the micro motor 243 is used to drive the first lead screw 244 and the second lead screw 245 to rotate, the top clamp plate 23 is further driven to move, stable clamping of the semiconductor wafer sheet is realized, and the semiconductor wafer sheet measuring unit is convenient to operate, and solves the problem that when the general semiconductor wafer sheet measuring unit is used, the semiconductor wafer sheet is not convenient to clamp, and further more inconvenience is brought to a user.
Example 2
In operation, to ensure that the first and second lead screws 244, 245 rotate more stably, therefore, the first lead screw 244 and the second lead screw 245 are modified based on embodiment 1, and as a preferred embodiment, as shown in fig. 7, the second bearings 3 are tightly welded to the bottom rod bodies of the first lead screw 244 and the second lead screw 245, the first lead screw 244 and the second lead screw 245 are tightly welded to the inner ring of the second bearing 3, the outer ring of the second bearing 3 is tightly welded to the rectangular block 211, so as to ensure that the structures of the first lead screw 244 and the second lead screw 245 are firmer, meanwhile, the normal rotation of the first lead screw 244 and the second lead screw 245 is facilitated, so that the problems that when a general semiconductor wafer measuring unit which is convenient to clamp is used, the lead screw structure is insecure easily, and the problem that the top clamping plate cannot play a good clamping effect is caused.
When the semiconductor wafer measuring unit convenient for clamping is used, a semiconductor wafer is placed on the bottom clamping plate 22, then the micro motor 243 is connected with an external power supply and works, the output shaft on the micro motor 243 rotates in a forward direction to drive the first screw rod 244 to rotate, meanwhile, the output shaft on the micro motor 243 rotates in a forward direction to drive the rotating shaft 246 connected with the micro motor through the conveyor belt 248 to rotate in a forward direction, the rotating shaft 246 rotates to drive the second screw rod 245 to rotate in a forward direction, further, the top clamping plate 23 in threaded connection with the first screw rod 244 and the second screw rod 245 is driven to move downwards, stable clamping is carried out on the semiconductor wafer, after the measurement is finished, the micro motor 243 is continuously connected with the external power supply and works, the output shaft on the micro motor rotates in a reverse direction to drive the first screw rod 244 and the second screw rod 245 to rotate in a reverse direction, thereby, the top clamping plate 23 is, the semiconductor wafer can be taken out, the operation is convenient, and the problem that the common semiconductor wafer measuring unit is inconvenient to clamp the semiconductor wafer when in use, and further brings more inconvenience to users is solved.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A semiconductor wafer measuring unit convenient for clamping comprises a device main body (1), and is characterized in that: the device is characterized in that a cavity (10) communicated with the outside is arranged in the device main body (1), a clamping device (2) is arranged in the cavity (10), the clamping device (2) comprises an operating table (20) arranged on the bottom wall of the cavity (10), a convex block (21) is arranged on the operating table (20), a rectangular block (211) is arranged on the right side surface of the convex block (21), a bottom clamping plate (22) which is arranged in a horizontal shape is tightly welded on the rectangular block (211), a top clamping plate (23) is arranged above the bottom clamping plate (22), and two symmetrical threaded holes (231) are formed in a plate body at the tail end of the top clamping plate (23); the clamping mechanism (24) is further arranged on the rectangular block (211), the clamping mechanism (24) comprises a protective shell (241) tightly welded on the rectangular block (211), a groove (242) communicated with the outside is arranged in the protective shell (241), a micro motor (243) is arranged on the top wall of the groove (242), a first screw rod (244) is tightly welded at the tail end of an output shaft of the micro motor (243), a second screw rod (245) is arranged on one side of the first screw rod (244), the first screw rod (244) and the second screw rod (245) penetrate through the corresponding threaded hole (231) and are in threaded connection with the threaded hole (231), a rotating shaft (246) is tightly welded at the top end of the second screw rod (245), and the rotating shaft (246) is in sliding connection with the output shaft of the micro motor (243) through a conveying belt (248) connected end to end, the top end of the rotating shaft (246) is tightly welded with a first bearing (249), and the outer ring of the first bearing (249) is tightly welded on the top wall of the groove (242).
2. The clamp-facilitating semiconductor wafer measurement unit of claim 1, wherein: and the top wall and the bottom wall of the cavity (10) are tightly adhered with sliding rails (11).
3. The clamp-facilitating semiconductor wafer measurement unit of claim 2, wherein: the two slide rails (11) are opposite to each other in position, and two slide rails (11) are arranged on one side surface adjacent to each other and provided with sliding grooves (111) which are arranged along the length direction of the slide rails (11) and communicated with the outside.
4. The clamp-facilitating semiconductor wafer measurement unit of claim 3, wherein: two door panels (12) which are symmetrical to each other are arranged between the two sliding rails (11), and the door panels (12) are located in the sliding grooves (111) and are in sliding connection with the sliding grooves (111).
5. The clamp-facilitating semiconductor wafer measurement unit of claim 1, wherein: an upper convex disc (247) and a lower convex disc (247) which are mutually symmetrical are tightly welded on an output shaft of the micro motor (243) and the rotating shaft (246).
6. The clamp-facilitating semiconductor wafer measurement unit of claim 5, wherein: the conveyor belt (248) is positioned between the two convex discs (247) which are arranged up and down.
7. The clamp-facilitating semiconductor wafer measurement unit of claim 1, wherein: and the second bearings (3) are tightly welded on the bottom end rod bodies of the first screw rod (244) and the second screw rod (245), and the second bearings (3) are tightly welded on the rectangular block (211).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921195519.4U CN210129485U (en) | 2019-07-28 | 2019-07-28 | Semiconductor wafer measuring unit convenient to clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921195519.4U CN210129485U (en) | 2019-07-28 | 2019-07-28 | Semiconductor wafer measuring unit convenient to clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210129485U true CN210129485U (en) | 2020-03-06 |
Family
ID=69665401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921195519.4U Active CN210129485U (en) | 2019-07-28 | 2019-07-28 | Semiconductor wafer measuring unit convenient to clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210129485U (en) |
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2019
- 2019-07-28 CN CN201921195519.4U patent/CN210129485U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231231 Address after: 212400 Building 8, 102 Chongming West Road, Jurong Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Jingdu Semiconductor Technology Co.,Ltd. Address before: No.102, Chongming West Road, Jurong Development Zone, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU YIDU TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |