CN210110734U

CN210110734U - But automatic collection formula silicon chip guide device

Info

Publication number: CN210110734U
Application number: CN201921072964.1U
Authority: CN
Inventors: 向永富
Original assignee: Suzhou Puzhi Automation Technology Co Ltd
Current assignee: Suzhou Puzhi Automation Technology Co Ltd
Priority date: 2019-07-10
Filing date: 2019-07-10
Publication date: 2020-02-21
Anticipated expiration: 2029-07-10

Abstract

The utility model relates to an automatic collecting type silicon wafer guide device, which comprises an upper plate, a lower plate, a cylinder, a moving part, a carrier and a conveying assembly; the upper plate is connected with the lower plate through a cylinder, the lower plate is provided with an air cylinder and a positioning frame, the positioning frame is provided with an inductor, the positioning frame corresponds to the position of a moving part, the moving part is connected with the lower plate through a piston rod of the air cylinder, the carrier is connected with the air cylinder through the moving part, the upper plate is provided with a through groove and a sliding groove, the conveying assembly corresponds to the position of the through groove, the conveying assembly is provided with a vertical groove, the carrier is provided with a transverse groove, and the vertical groove corresponds to the transverse groove. The utility model provides a but automatic collection formula silicon chip guide device has improved work efficiency, has reduced the device cost, has practiced thrift manufacturing cost.

Description

But automatic collection formula silicon chip guide device

Technical Field

The utility model relates to a silicon chip field of carrying, concretely relates to but automatic collection formula silicon chip guide device.

Background

The chip made of silicon chip is a famous "Shen calculator" with remarkable computing power, and the silicon chip is a common element in the electronic industry and needs to be carried for many times in the production process.

In the process that the silicon wafer is conveyed to the designated position, the silicon wafer is inserted into the carrier by a special inserting mechanism after being guided by the guide device, the guide device cannot directly place the silicon wafer into the carrier, the device cost is high, and the working efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims at: the silicon wafer guide device capable of automatically collecting the silicon wafers is provided, and the problems are solved.

In order to achieve the above object, the present invention provides the following technical solutions:

an automatic collecting type silicon wafer guide device comprises an upper plate, a lower plate, a cylinder, a moving part, a carrier and a conveying assembly; the upper plate is connected with the lower plate through a cylinder, the lower plate is provided with an air cylinder and a positioning frame, the positioning frame is provided with an inductor, the positioning frame corresponds to the position of a moving part, the moving part is connected with the lower plate through a piston rod of the air cylinder, the carrier is connected with the air cylinder through the moving part, the upper plate is provided with a through groove and a sliding groove, the conveying assembly corresponds to the position of the through groove, the conveying assembly is provided with a vertical groove, the carrier is provided with a transverse groove, and the vertical groove corresponds to the transverse groove.

Furthermore, the inductor corresponds to the position of the moving part, a clamping groove is formed in the carrier, a clamping block is arranged on the moving part, a conveying belt is arranged on the conveying assembly, the sliding groove corresponds to the through groove in position, and the vertical groove and the transverse groove are perpendicular to each other.

Furthermore, the inductor has a plurality ofly, draw-in groove and fixture block size cooperate, the conveyer belt is corresponding about leading to the groove position, the cross slot is parallel with upper plate width direction, the spout is located the department of keeping away from conveying subassembly on the upper plate, the carrier is corresponding with leading to the groove position, the draw-in groove is located the carrier and keeps away from on the face of cross slot.

Furthermore, the induction surface of the inductor faces the moving part, the clamping block is connected with the carrier through a clamping groove, the clamping groove penetrates through the surface, close to the lower plate, of the carrier, the clamping groove is parallel to the length direction of the upper plate, the carrier is matched with the through groove in size, a motor is arranged on the conveying assembly, and the motor is specifically a stepping motor.

The utility model has the advantages that: the utility model provides a but automatic collection formula silicon chip guide device, uses through upper plate, hypoplastron, cylinder, motion, carrier and conveying subassembly mutually supporting, realizes the effect that guider directly inserts the silicon chip in the carrier, has improved work efficiency, has reduced the device cost, has practiced thrift manufacturing cost.

Drawings

Fig. 1 is the utility model relates to an overall structure axonometric drawing of automatic collection formula silicon chip guide device.

Fig. 2 is an axonometric view of another overall structure of the automatic collecting type silicon wafer guiding device of the present invention.

Fig. 3 is an axonometric view of another overall structure of the automatic collecting type silicon wafer guiding device of the present invention.

In the figure: 1. an upper plate; 2. a lower plate; 3. a cylinder; 4. a positioning frame; 5. an inductor; 6. a cylinder; 7. a moving member; 71. a clamping block; 8. a carrier; 81. a card slot; 82. a transverse groove; 9. a through groove; 10. a chute; 11. a transfer assembly; 111. a conveyor belt; 112. a vertical slot; 113. an electric motor.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1 to 3, an automatic collecting type silicon wafer guiding apparatus includes an upper plate 1, a lower plate 2, a column 3, a moving member 7, a carrier 8, and a conveying assembly 11; the upper plate 1 is connected with the lower plate 2 through a column 3, the lower plate 2 is provided with an air cylinder 6 and a positioning frame 4, the positioning frame 4 is provided with an inductor 5 for limiting the position of a carrier 8 on a moving part 7 and inducing whether the carrier 8 is on the moving part 7 or not, the positioning frame 4 corresponds to the position of the moving part 7 and is used for limiting the position of the carrier 8 on the moving part 7, the moving part 7 is connected with the lower plate 2 through a piston rod of the air cylinder 6, the carrier 8 is connected with the air cylinder 6 through the moving part 7, the upper plate 1 is provided with a through groove 9 and a sliding groove 10, the through groove 9 is used for ensuring that a silicon wafer on a vertical groove 112 can be inserted into a transverse groove 82 on the carrier 8, the conveying assembly 11 corresponds to the position of the through groove 9, the conveying assembly 11 is provided with a vertical groove 112 for clamping the silicon wafer, the carrier 8 is provided with a, the vertical groove 112 corresponds to the transverse groove 82, the sensor 5 and the transmission assembly 11 are both electrically connected with an external control system, and the cylinder 6 is electrically connected with the external control system through an electromagnetic valve.

The inductor 5 is corresponding to the position of the moving part 7, the carrier 8 is provided with a clamping groove 81 for connecting with a clamping block 71 on the moving part 7, the moving part 7 is provided with the clamping block 71, the conveying assembly 11 is provided with a conveying belt 111 for driving a silicon wafer to move, the sliding groove 10 is corresponding to the position of the through groove 9, the vertical groove 112 and the transverse groove 82 are perpendicular to each other and used for clamping the silicon wafer in the vertical groove 112 when the transverse groove 82 on the carrier 8 moves upwards.

The inductor 5 has a plurality of, draw-in groove 81 and fixture 71 size cooperate, the conveyer belt 111 corresponds with logical groove 9 position, horizontal groove 82 is parallel with upper plate 1 width direction, spout 10 is located upper plate 1 and is kept away from conveying component 11 department, carrier 8 corresponds with logical groove 9 position, draw-in groove 81 is located carrier 8 and is kept away from the plane of horizontal groove 82.

The induction surface of the inductor 5 faces the moving part 7, the fixture block 71 is connected with the carrier 8 through the clamping groove 81, the clamping groove 81 penetrates through the surface of the carrier 8 close to the lower plate 2, the silicon wafer can drive the carrier 8 to slide when the conveying assembly 11 drives, the clamping groove 81 is parallel to the length direction of the upper plate 1, the carrier 8 is matched with the through groove 9 in size, the conveying assembly 11 is provided with a motor 113, the motor 113 is specifically a stepping motor, and the motor 113 is electrically connected with an external control system.

The utility model discloses a theory of operation does: after the work, the external carrying mechanism carries the silicon wafer to the space between the two sides of the conveying component 11, the vertical slot 112 moves along with the conveying belt 111 on the conveying component 11 to sequentially clamp the silicon wafer carried by the external carrying mechanism, so as to drive the silicon wafer to move forward, and after the motor 113 runs for a period of time: after the silicon wafer on the vertical groove 112 reaches the moving part 7, the external carrying mechanism carries the carrier 8 onto the moving part 7, the carrier 8 tightly pushes against the sensor 5 on the positioning frame 4, the sensor 5 outputs a signal to an external control system, at the moment, a piston rod of the cylinder 6 extends out under the control of the external control system to drive the moving part 7 to move upwards, and then the carrier 8 clamped with the moving part 7 reaches the space between the conveying assemblies 11 at two sides through the through groove 9; when the silicon wafer in the vertical groove 112 of the conveying assembly 11 is inserted into the horizontal groove 82, the silicon wafer drives the carrier 8 to slide towards the sliding groove 10 through the horizontal groove 82 under the driving of the conveying assembly 11, at this time, the clamping groove 81 on the carrier 8 and the fixture block 71 on the moving part 7 slide, the further carrier 8 completely reaches the sliding groove 10 and slides on the sliding groove 10, the carrier 8 is fully inserted with the silicon wafer, finally, the carrier 8 and the silicon wafer are carried to the designated position by an external carrying mechanism, and the above steps are repeated until the work is finished.

The above examples are provided for further illustration of the present invention, but do not limit the present invention to these specific embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be understood as being within the protection scope of the present invention.

Claims

1. The utility model provides a but automatic collection formula silicon chip guide device which characterized in that: comprises an upper plate (1), a lower plate (2), a cylinder (3), a moving part (7), a carrier (8) and a conveying assembly (11); the upper plate (1) is connected with the lower plate (2) through the cylinder (3), the lower plate (2) is provided with the cylinder (6) and the positioning frame (4), the positioning frame (4) is provided with the inductor (5), the positioning frame (4) corresponds to the moving part (7), the moving part (7) is connected with the lower plate (2) through the piston rod of the cylinder (6), the carrier (8) is connected with the cylinder (6) through the moving part (7), the upper plate (1) is provided with the through groove (9) and the sliding groove (10), the conveying assembly (11) corresponds to the through groove (9), the conveying assembly (11) is provided with the vertical groove (112), the carrier (8) is provided with the transverse groove (82), and the vertical groove (112) corresponds to the transverse groove (82).

2. The silicon wafer guiding device capable of automatically collecting silicon wafers as claimed in claim 1, wherein: the sensor (5) corresponds to the moving part (7), a clamping groove (81) is formed in the carrier (8), a clamping block (71) is arranged on the moving part (7), a conveying belt (111) is arranged on the conveying assembly (11), the sliding groove (10) corresponds to the through groove (9), and the vertical groove (112) and the transverse groove (82) are perpendicular to each other.

3. The silicon wafer guiding device capable of automatically collecting silicon wafers as claimed in claim 2, wherein: inductor (5) have a plurality ofly, draw-in groove (81) and fixture block (71) size cooperate, conveyer belt (111) are corresponding about logical groove (9) position, cross slot (82) are parallel with upper plate (1) width direction, spout (10) are located and keep away from conveying subassembly (11) department on upper plate (1), carrier (8) are corresponding with logical groove (9) position, draw-in groove (81) are located carrier (8) and keep away from on the face of cross slot (82).

4. The silicon wafer guiding device capable of automatically collecting silicon wafers as claimed in claim 3, wherein: the induction surface of inductor (5) is towards motion piece (7), fixture block (71) are connected with carrier (8) through draw-in groove (81), draw-in groove (81) link up the face that carrier (8) are close to hypoplastron (2), draw-in groove (81) are parallel with upper plate (1) length direction, carrier (8) and logical groove (9) size cooperate, be provided with motor (113) on conveying assembly (11), motor (113) specifically are step motor.