CN210109657U - Silicon optical chip with automatic temperature adjustment function - Google Patents
Silicon optical chip with automatic temperature adjustment function Download PDFInfo
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- CN210109657U CN210109657U CN201920506119.4U CN201920506119U CN210109657U CN 210109657 U CN210109657 U CN 210109657U CN 201920506119 U CN201920506119 U CN 201920506119U CN 210109657 U CN210109657 U CN 210109657U
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Abstract
The utility model discloses a temperature automatically regulated's silicon optical chip, silicon optical chip internal integration have heater and temperature sensor, and temperature sensor is used for perception silicon optical chip's temperature, and the temperature of temperature sensor perception is higher then the electric current through the heater is more little. The temperature of the silicon optical chip is automatically adjusted, digital communication of an external MCU is avoided, the cost of components is saved, and the control flow is simplified. Simultaneously the utility model discloses a silicon optical chip heater heating efficiency is higher, and temperature variation is comparatively steady.
Description
Technical Field
The utility model belongs to the technical field of the optical communication technique and specifically relates to indicate a temperature automatically regulated's silicon optical chip.
Background
With the coming of 5G wireless communication, the requirements of people on information capacity, speed and cost are more and more urgent, silicon-based optoelectronics develops rapidly by virtue of high integration, becomes a research hotspot and a key technology in the field of optical communication, and silicon photons are expected to play an important role in the field of 100G and higher-rate Ethernet in the future. At present, the light emitting and receiving devices used in the field of optical communication are various in types and expensive in price, and along with the improvement of transmission rate, the proportion of the cost of the optical device is greatly improved, and the large-scale application of the optical device is limited. The integration of the silicon optical platform will greatly reduce the cost and the process realization difficulty of the optical device. However, since the silicon material has a large thermo-optic coefficient and a strong temperature sensitivity, the optical performance of the silicon material is significantly affected by the temperature, and thus the silicon material must be overcome in the design of the device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming among the prior art silicon optical chip's temperature sensitivity is strong, and its optical property receives the temperature influence easily, leads to the shortcoming that work efficiency reduces, provides a temperature automatically regulated's silicon optical chip.
The utility model aims at realizing through the following technical scheme:
a heater and a temperature sensor are integrated in the silicon optical chip, the temperature sensor is used for sensing the temperature of the silicon optical chip, and the higher the temperature sensed by the temperature sensor is, the smaller the current passing through the heater is. The silicon optical chip needs to work in a certain temperature range, and the service performance is affected by overhigh or overlow temperature, so that the silicon optical chip capable of automatically adjusting the temperature needs to be designed.
Preferably, one end of the temperature sensor is connected with the power supply, the other end of the temperature sensor is simultaneously connected with one end of the divider resistor and one end of the heater, the other end of the divider resistor is grounded, and the other end of the heater is grounded. According to the traditional silicon optical chip, a temperature adjusting structure comprises a temperature sensor, a divider resistor, an analog-to-digital converter, a heater and a microcontroller, after the temperature is reduced, the divided voltage of the temperature sensor is reduced, the divided voltage of the divider resistor is increased, after the voltage passes through the analog-to-digital converter, the microcontroller performs program operation to judge whether the heating power is increased or reduced, and then the heater is heated by driving current; on the contrary, when the temperature rises, the partial pressure of the temperature sensor rises, the partial pressure of the partial pressure resistor decreases, the voltage is calculated by a microcontroller program after passing through the analog-digital converter, whether the heating power is increased or decreased is judged, and then the current is driven to heat the heater. In the scheme, after the temperature is reduced, the partial pressure of the temperature sensor is reduced, the partial pressure of the partial pressure resistor is increased, so that the current of the heater is increased, and the heating power is improved; on the contrary, after the temperature rises, the partial pressure of the temperature sensor rises, the partial pressure of the partial pressure resistor decreases, the current of the heater decreases, and the heating power decreases. Compared with the prior art, the temperature of the silicon optical chip is automatically adjusted, digital communication of an external MCU is avoided, component cost is saved, and a control flow is simplified.
Preferably, a thermal expansion material is provided between the heater and the temperature sensor, and the thermal expansion material is used for adjusting the distance between the heater and the temperature sensor. Because the volume of the silicon optical chip is smaller, the heater can generate heat when heating, and the normal judgment of the temperature sensor on the temperature is influenced, therefore, in the heating process of the heater, the temperature rises, the thermal expansion material expands, the distance between the heater and the temperature sensor becomes longer, the temperature sensed by the temperature sensor is reduced compared with the temperature sensed when the thermal expansion material is not added, the heating power of the heater is increased, the heating time is prolonged, the whole temperature change is more stable, and the same is true when the temperature is reduced. Compared with the case that the thermal expansion material is not added, the temperature change sensed by the temperature sensor is obvious, so that the heating power is unstable, and the heating power is stable when the thermal expansion material is added, so that the silicon optical chip has higher working efficiency.
Preferably, the surface of the thermal expansion material is coated with an insulating material.
Preferably, the thermally expandable material is a thermoplastic chemical.
A method for adjusting a silicon optical chip with automatically adjusted temperature is based on the silicon optical chip with automatically adjusted temperature and comprises the following steps:
Preferably, the timer starts to count when the temperature sensed by the temperature sensor exceeds a set first threshold or is lower than a set second threshold, and when the temperature sensed by the temperature sensor still exceeds the set first threshold or is lower than the set second threshold after the timer counts time exceeding the set time, the heater is failed, and the silicon optical chip stops working. The design protects the safety of the silicon optical chip.
The beneficial effects of the utility model are that, silicon optical chip temperature automatically regulated has avoided outside MCU's digital communication, has saved the components and parts cost, has simplified control flow. Simultaneously the utility model discloses a silicon optical chip heater heating efficiency is higher, and temperature variation is comparatively steady.
Drawings
Fig. 1 is a circuit diagram of the present invention;
FIG. 2 is a prior art circuit connection diagram;
fig. 3 is a schematic view of the structure of the thermal expansion material arrangement.
Wherein: 1. the device comprises a temperature sensor, 2, a divider resistor, 3, a heater, 4, an analog-to-digital converter, 5, a microcontroller, 6, a thermal expansion material, 7 and an insulating material.
Detailed Description
The invention is further described below with reference to the drawings and examples.
Example 1: a silicon optical chip with automatic temperature regulation is disclosed, as shown in figure 1, a heater 3 and a temperature sensor 1 are integrated in the silicon optical chip, the temperature sensor is used for sensing the temperature of the silicon optical chip, and the higher the temperature sensed by the temperature sensor is, the smaller the current passing through the heater is. One end of the temperature sensor is connected with the power supply, the other end of the temperature sensor is simultaneously connected with one end of the divider resistor 2 and one end of the heater, the other end of the divider resistor is grounded, and the other end of the heater is grounded.
A method for adjusting a silicon optical chip with automatically adjusted temperature comprises the following steps:
As shown in fig. 2, a conventional silicon optical chip has a temperature adjustment structure including a temperature sensor, a voltage dividing resistor, an analog-to-digital converter, a heater and a microcontroller, wherein when the temperature is lowered, the voltage division of the temperature sensor is lowered, the voltage division of the voltage dividing resistor is raised, and after passing through the analog-to-digital converter 4, the voltage is subjected to program operation by the microcontroller 5 to determine whether to increase or decrease the heating power, and then the heater is heated by driving current; on the contrary, when the temperature rises, the partial pressure of the temperature sensor rises, the partial pressure of the partial pressure resistor decreases, the voltage is calculated by a microcontroller program after passing through the analog-digital converter, whether the heating power is increased or decreased is judged, and then the current is driven to heat the heater. In the scheme, after the temperature is reduced, the partial pressure of the temperature sensor is reduced, the partial pressure of the partial pressure resistor is increased, so that the current of the heater is increased, and the heating power is improved; on the contrary, after the temperature rises, the partial pressure of the temperature sensor rises, the partial pressure of the partial pressure resistor decreases, the current of the heater decreases, and the heating power decreases. Compared with the prior art, the temperature of the silicon optical chip is automatically adjusted, digital communication of an external MCU is avoided, component cost is saved, and a control flow is simplified.
Example 2: a silicon optical chip with automatic temperature regulation has the same principle and implementation method as those of embodiment 1, except that a thermal expansion material 6 is arranged between a heater and a temperature sensor, and the thermal expansion material is used for adjusting the distance between the heater and the temperature sensor, as shown in FIG. 3. The surface of the thermal expansion material is wrapped with an insulating material 7. The thermally expansive material is a thermoplastic chemical.
The above-described embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the scope of the claims.
Claims (4)
1. A silicon optical chip with automatic temperature adjustment is characterized in that a heater and a temperature sensor are integrated in the silicon optical chip, the temperature sensor is used for sensing the temperature of the silicon optical chip, the higher the temperature sensed by the temperature sensor is, the smaller the current passing through the heater is, a thermal expansion material is arranged between the heater and the temperature sensor, and the thermal expansion material is used for adjusting the distance between the heater and the temperature sensor.
2. The silicon optical chip for automatic temperature adjustment according to claim 1, wherein one end of the temperature sensor is connected to a power supply, the other end of the temperature sensor is connected to one end of the voltage dividing resistor and one end of the heater, the other end of the voltage dividing resistor is grounded, and the other end of the heater is grounded.
3. The silicon optical chip for automatic temperature adjustment as claimed in claim 1, wherein the surface of the thermal expansion material is coated with an insulating material.
4. The self-temperature regulating silicon optical chip as claimed in claim 3, wherein the thermal expansion material is a thermoplastic chemical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920506119.4U CN210109657U (en) | 2019-04-15 | 2019-04-15 | Silicon optical chip with automatic temperature adjustment function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920506119.4U CN210109657U (en) | 2019-04-15 | 2019-04-15 | Silicon optical chip with automatic temperature adjustment function |
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| CN210109657U true CN210109657U (en) | 2020-02-21 |
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| CN201920506119.4U Active CN210109657U (en) | 2019-04-15 | 2019-04-15 | Silicon optical chip with automatic temperature adjustment function |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110058622A (en) * | 2019-04-15 | 2019-07-26 | 杭州芯耘光电科技有限公司 | A kind of the silicon optical chip and adjusting method of temperature automatic adjustment |
| CN110058622B (en) * | 2019-04-15 | 2024-10-22 | 杭州芯耘光电科技有限公司 | Silicon optical chip capable of automatically adjusting temperature and adjusting method |
-
2019
- 2019-04-15 CN CN201920506119.4U patent/CN210109657U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110058622A (en) * | 2019-04-15 | 2019-07-26 | 杭州芯耘光电科技有限公司 | A kind of the silicon optical chip and adjusting method of temperature automatic adjustment |
| CN110058622B (en) * | 2019-04-15 | 2024-10-22 | 杭州芯耘光电科技有限公司 | Silicon optical chip capable of automatically adjusting temperature and adjusting method |
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