CN210103835U

CN210103835U - High-temperature-resistant release film

Info

Publication number: CN210103835U
Application number: CN201822075592.XU
Authority: CN
Inventors: 姜涛
Original assignee: XIAMEN YIYANG ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: Yabei Technology Xiamen Co ltd
Priority date: 2018-12-11
Filing date: 2018-12-11
Publication date: 2020-02-21
Anticipated expiration: 2028-12-11

Abstract

The utility model provides a high temperature resistant type membrane relates to from type membrane technical field, including the substrate layer, a side of substrate layer forms the corona layer, the surface on corona layer forms organosilicon release layer. The utility model discloses a high temperature resistant is from type membrane, simple structure, rationally, corona treatment is carried out on high temperature resistant substrate layer surface, forms the corona layer, then high temperature resistant organosilicon release agent coats again, the solidification forms organosilicon from type layer, the remaining power of connecing of silicone oil can reach more than 90%, surface silicon content is below every square of 0.2G, effectively reduces the risk that silicon shifted, and specially adapted needs high temperature resistant product, for example, need through the fixed heat conduction double faced adhesive tape of UV etc..

Description

High-temperature-resistant release film

Technical Field

The utility model belongs to the technical field of from type membrane technique and specifically relates to a high temperature resistant is from type membrane.

Background

At present, the PET release film commonly used is a normal-temperature release film, the release film has the highest temperature resistance of 80 ℃, but some special products need to be used under the high-temperature condition, the temperature resistance requirement is 200 ℃, the process can be changed in the face of the market requirement, the temperature resistance problem of the release film cannot be solved, the cost is increased, the requirement of the product is met on the premise of sacrificing the production efficiency, and the high-temperature resistant release film is urgently needed according to the market requirement.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a high temperature resistant is from type membrane.

The utility model discloses specifically adopt following technical scheme to realize:

the utility model provides a high temperature resistant release film, includes the substrate layer, a side of substrate layer forms the corona layer, the surface of corona layer forms organosilicon release layer.

Preferably, the substrate layer is made of polyethylene terephthalate.

Preferably, the thickness of the base material layer is 50-75 μm, the light transmittance is 92-95%, and the haze is 1.5-2%.

Preferably, the thickness of the corona layer is 2-4 μm, and the power of corona treatment of the corona layer is 12-22 KW.

Preferably, the silicone release layer adopts polydimethylsiloxane.

Preferably, the thickness of the organic silicon release layer is 2-4 mu m, and the release force is 3-100G.

The utility model provides a high temperature resistant is from type membrane, its beneficial effect lies in: simple structure, reasonable, high temperature resistant substrate layer surface is formed with the corona layer, then coats formation high temperature resistant organosilicon and leaves the type layer again, and the remaining adhesion force of silicone oil can reach more than 90%, and surface silicon content is below 0.2G per square, effectively reduces the risk that silicon shifted, and the specially adapted needs high temperature resistant product.

Drawings

Fig. 1 is a schematic sectional view of the high temperature resistant release film of the present invention.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 1, the high temperature resistant release film provided by the present embodiment includes a substrate layer 1, a corona layer 2 is formed on one side of the substrate layer 1, and an organic silicon release layer 3 is formed on the surface of the corona layer 2.

In the embodiment, the substrate layer 1 is made of polyethylene terephthalate to form a high-temperature resistant PET substrate layer, the thickness of the high-temperature resistant PET substrate layer is 50-75 μm, the light transmittance is 92-95%, the haze is 1.5-2%, and the temperature resistance can reach 250 ℃; performing corona treatment on the surface of the base material layer, wherein the treatment power is 12-22 KW, and the thickness of the formed corona layer 2 is 2-4 microns; coating a layer of high-temperature-resistant organic silicon release agent, such as polydimethylsiloxane, on the surface of the corona layer 2, and fixing the mixture in a UV curing mode to form an organic silicon release layer 3, wherein the thickness of the organic silicon release layer is 2-4 mu m, and the release force is 3-100G.

The high temperature resistant of this embodiment is from type membrane, simple structure, it is reasonable, corona treatment is carried out on high temperature resistant substrate layer surface, form the corona layer, then high temperature resistant organosilicon release agent coats, the solidification forms organosilicon release layer, the remaining adhesion force of silicone oil can reach more than 90%, surface silicon content is below 0.2G every square, effectively reduce the risk that silicon shifted, specially adapted needs high temperature resistant product, for example, need through fixed heat conduction double faced adhesive tape of UV etc..

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a high temperature resistant is from type membrane, its characterized in that, includes the substrate layer, a side of substrate layer forms corona layer, the surface of corona layer forms organosilicon release layer, organosilicon is less than 0.2 g/square meter from the silicon content on type layer surface, corona layer's thickness is 2 ~ 4 mu m, corona layer carries out corona treatment's power and is 12 ~ 22 KW.

2. The high temperature resistant release film according to claim 1, wherein: the substrate layer adopts the polyethylene terephthalate material.

3. The high temperature resistant release film according to claim 2, wherein: the thickness of the substrate layer is 50-75 mu m, the light transmittance is 92-95%, and the haze is 1.5-2%.

4. The high temperature resistant release film according to claim 1, wherein: the organic silicon release layer adopts polydimethylsiloxane.

5. The high temperature resistant release film according to claim 4, wherein: the thickness of the organic silicon release layer is 2-4 mu m, and the release force is 3-100G.