CN210100748U - Improved hot press forming and bonding simple device - Google Patents
Improved hot press forming and bonding simple device Download PDFInfo
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- CN210100748U CN210100748U CN201920822708.3U CN201920822708U CN210100748U CN 210100748 U CN210100748 U CN 210100748U CN 201920822708 U CN201920822708 U CN 201920822708U CN 210100748 U CN210100748 U CN 210100748U
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- 238000003825 pressing Methods 0.000 claims abstract description 60
- 238000007906 compression Methods 0.000 claims description 18
- 230000006835 compression Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000003856 thermoforming Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 abstract description 18
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 2
- 239000002861 polymer material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model discloses an improved hot press forming and bonding simple device, which comprises a screwing bolt and a pressure device; the pressure device is sequentially connected with an upper fixing plate, an upper pressing plate, a lower pressing plate and a lower fixing plate from top to bottom through guide pillars, and a pressed object is arranged on the lower pressing plate; the upper pressure plate is also provided with a plane bearing, the upper part of the plane bearing is connected with a plane bearing pressure plate, and the screwing bolt penetrates through the upper fixing plate to apply pressure on the plane bearing pressure plate; when the screwing bolt moves downwards, the upper pressure plate is driven to slide downwards through the plane bearing plate and is pressed on a pressed object placed on the lower pressure plate. Compared with common hot pressing and bonding equipment with equivalent price, the defect that constant pressure cannot be kept in the heating process is overcome; the utility model discloses it has great using value and potentiality to make and similar processing field at micro-fluidic chip.
Description
Technical Field
The utility model relates to a simple and easy device of improved generation hot pressing bonding, it belongs to organic matter pattern shaping, encapsulation processing field, is particularly useful for the preparation and the encapsulation field of micro-fluidic chip pipeline.
Background
Hot pressing techniques are commonly used for hot press forming and hot press bonding. The hot press molding is to transfer a pattern on a mold to a polymer material by applying a specific pressure and a specific temperature to a mold (e.g., a metal mold) with a raised pattern made of a polymer material at a temperature below the glass transition temperature of the polymer material. The thermocompression bonding means that two high molecular polymer materials are bonded under a specific pressure and a specific temperature below the glass transition temperature of the polymers.
At present, hot press molding and hot press bonding processes are widely applied to processing processes of various civil polymer products, and are also applied to research and development of many scientific research technologies, such as research and development and manufacturing fields of microfluidic chips.
The current hot pressing and bonding device tends to have two directions. One direction is that the device has complete functions but high price, the hot-pressing bonding device can realize real-time control of temperature and pressure, and is mainly used for the condition of very high requirements on hot pressing and bonding, and the market price of the hot-pressing and bonding device is about more than 10 ten thousand RMB; the other direction is that the material tends to be simple, the temperature and the pressure are not controllable, the material is mainly used for the condition that the requirements on hot pressing and bonding are not high, and the price is about thousands of yuan. The common simple hot-pressing device adopts a mode of four guide posts to fix the table top, is difficult to match and is easy to clamp when in operation; in the pressing process, the metal is used for hard pressing of the organic material, so that the pressure is difficult to maintain after the organic material is deformed; in addition, the metal block is easy to drop and break the organic material in the using process.
Disclosure of Invention
The utility model overcomes prior art is not enough, provides a simple and easy device of improved generation hot briquetting and bonding, is applicable to and keeps invariable pressure among the heating process.
The utility model discloses an adopt following technical scheme to realize:
an improved hot press forming and bonding simple device comprises a screwing bolt and a pressure device; the pressure device is sequentially connected with an upper fixing plate, an upper pressing plate, a lower pressing plate and a lower fixing plate from top to bottom through guide pillars, and a pressed object is arranged on the lower pressing plate; the method is characterized in that: the upper pressure plate is also provided with a plane bearing, the upper part of the plane bearing is connected with a plane bearing pressure plate, and the screwing bolt penetrates through the upper fixing plate to apply pressure on the plane bearing pressure plate; when the screwing bolt moves downwards, the upper pressure plate is driven to slide downwards through the plane bearing plate and is pressed on a pressed object placed on the lower pressure plate.
Further, the periphery of the upper pressure plate is hung on the upper fixing plate through four groups of tension springs.
Further, the lower pressure plate is supported above the lower fixing plate through four groups of compression springs.
The ball sliding rails are arranged on the guide pillars between the upper pressing plate and the lower pressing plate, and the upper pressing plate is provided with a pressing ring which is matched with the ball sliding rails to slide.
The pressing ring is arranged in the upper pressing plate hole, and the upper pressing plate hole and the pressing ring are in interference fit; the compression ring and the ball slide rail are in small clearance fit, and the ball slide rail and the guide pillar are in interference fit.
And four round holes are formed at four corners of the lower pressing plate and are in small clearance fit with the ball slide rails.
And the upper cover of the plane bearing is fixedly connected with the plane bearing plate, and the lower cover of the plane bearing is fixedly connected with the upper pressure plate.
Has the advantages that:
1) compared with a common simple hot-press bonding device, the hot-press bonding device has the advantages that the lower press plate and the compression spring are added, so that pressure loss caused by deformation of a compression object can be avoided in the using process, and constant pressure can be maintained.
2) Compared with a common simple hot-pressing bonding device, the hot-pressing bonding device has the advantages that the pressing ring and the ball sliding rail are added, so that the upper pressing plate is smoother in the pressing process, and the phenomenon of blocking possibly occurring is avoided.
3) Compared with a common simple hot-pressing device, the hot-pressing device is additionally provided with the tension spring, so that the situation that the pressed object is broken due to falling of the upper pressing plate caused by carelessness when the pressed object is placed is avoided.
4) Compared with a common simple hot-pressing device, the flat bearing is added, the hard friction of a screwing bolt on an upper pressing plate in the pressurizing process is avoided, and then the lubrication transmission from torque to pressure is realized.
5) The manufacturing cost of the device is far lower than that of hot pressing and bonding equipment with temperature control and constant pressure performance on the market; compared with common hot pressing and bonding equipment with equivalent price, the defect that constant pressure cannot be kept in the heating process is overcome; the utility model discloses it has great using value and potentiality to make and similar processing field at micro-fluidic chip.
Drawings
FIG. 1 is a cross-sectional view of an exemplary embodiment of a simple apparatus for thermoforming and bonding;
FIG. 2 is a top view of an exemplary embodiment of a simplified apparatus for thermoforming and bonding;
FIG. 3 is a sectional top view of the upper fixing plate and the upper pressing plate in the embodiment;
FIG. 4 is a detail A of FIG. 3;
FIG. 5 is a sectional top view of the upper platen and the lower platen in the embodiment;
FIG. 6 is a sectional top view of the lower platen and the lower fixing plate in the embodiment;
in the figure, 1-screwing bolt, 2-upper fixing plate, 3-plane bearing pressing plate, 4-upper pressing plate, 5-lower pressing plate, 6-lower fixing plate, 7-tension spring, 8-compression spring, 9-guide post, 10-ball sliding rail, 11-pressing ring, 12-plane bearing, 13-compression object and 14-fixing screw.
Detailed Description
The following specific examples further illustrate the present invention, but the scope of the present invention is not limited thereto.
As shown in fig. 1-6, the present invention discloses an improved simple device for hot press forming and bonding, which comprises a tightening bolt and a pressure device; the pressure device is sequentially connected with an upper fixing plate 2, an upper pressure plate 4, a lower pressure plate 5 and a lower fixing plate 6 from top to bottom through guide posts; the screwing bolt 1 penetrates through the upper fixing plate 2 and is positioned above the plane bearing pressing plate 3; the upper pressing plate 4 is provided with a plane bearing pressing plate 3 connected through a plane bearing 12; when the screwing bolt 1 moves downwards, the upper pressure plate is driven to slide downwards through the plane bearing plate and is pressed on a pressed object 13 placed on the lower pressure plate 5; a tension spring 7 is arranged between the upper fixing plate 2 and the upper pressure plate 4; the tightening bolt 1 is used for applying a pressing force; the upper fixing plate 2 is used for fixing the screwing bolt 1; the plane bearing pressure plate 3 is used for transmitting the pressure for screwing the bolt 1 to the plane bearing 12; the upper press plate 4 is used for pressing the pressed object 13; the lower platen 5 is used for supporting the pressed object 13; the plane bearing 12 is used for converting the torque transmitted by the tightening bolt 1 into plane pressure; the fixing screw 14 is used for fixing the upper plate and the lower plate; the upper cover of the plane bearing is fixedly connected with the plane bearing plate, and the lower cover of the plane bearing is fixedly connected with the upper pressure plate 4.
The further design is that: a compression spring 7 is arranged between the lower pressure plate 5 and the lower fixing plate 6; the periphery of the upper pressure plate is hung on an upper fixing plate 6 through four groups of tension springs 7; the lower pressure plate 5 is supported above the lower fixing plate 6 through four groups of compression springs; the lower fixing plate 6 is used for fixing four guide posts 9 and supporting the whole device; the tension spring 7 is used for pulling the upper pressure plate 4 to avoid dropping and smashing a pressed object; the compression spring 8 is used for maintaining the compression force of the compression object 13 during operation.
The further design is that: a ball slide rail 10 is arranged on a guide pillar 9 between the upper pressing plate 4 and the lower pressing plate 5, and the upper pressing plate 4 is provided with a pressing ring 11 which is matched with the ball slide rail 10 to slide; the guide posts 9 are used for supporting the four-layer plate; the ball slide rail 10 can freely slide on the guide post 9 through the upper pressure plate 4; the press ring 11 is used for the matched sliding of the upper press plate 4 and the ball slide rail 10.
The pressing ring 11 is arranged in a hole of the upper pressing plate 4, and the hole of the upper pressing plate is in interference fit with the pressing ring 11; the pressing ring 11 and the ball slide rail 10 are in small clearance fit, and the ball slide rail 10 and the guide pillar 9 are in interference fit.
As shown in fig. 1 and 2, the device adopts a threaded fit between a tightening bolt 1 and an upper pressure plate 4, and applies downward pressure in the tightening process of the tightening bolt 1; the upper fixing plate 2 and the four guide posts 9 are fixed by four fixing screws 14; as shown in fig. 1, 3 and 4, the tightening bolt 1 presses the plane bearing pressing plate 3 downwards, the plane bearing pressing plate 3 is fixedly connected with the upper piece of the plane bearing 12, the upper piece rotates along with the tightening bolt to apply pressure, and the lower piece and the upper pressing plate are relatively static; the upper pressing plate 4 is connected with the upper fixing plate 2 at the center of four side edges by four tension springs 7, so that the upper pressing plate 4 is slightly pulled to prevent the upper pressing plate 4 from falling down and smashing a pressed object 13; four round holes are formed at four angular positions of the upper pressure plate 4 and are used for freely sliding on the guide posts 9; in order to realize free sliding, the upper pressure plate hole is firstly assembled with the perforated pressure ring 11 in an interference fit mode, the perforated pressure ring 11 is in small clearance fit with the ball slide rail 10 to realize free sliding, and the ball slide rail 10 is in interference fit with the guide pillar 9; as shown in fig. 1 and 5, four round holes are formed at four corners of the lower pressing plate 5, and are in close clearance fit with the ball slide rails 10, and the object to be pressed 13 is placed on the lower pressing plate 5 and bears the pressure between the upper pressing plate and the lower pressing plate; as shown in fig. 1 and 6, four guide posts 9 and the lower fixing plate 5 are fixed by four fixing screws 14, and compression springs 8 are sleeved on the four guide posts 9 between the lower fixing plate 5 and the lower fixing plate 6 for maintaining a constant pressure during heating and pressurizing.
The use method of the device is as follows:
1) firstly, carrying out torque pressure calibration on an improved hot-pressing bonding device by adopting a torque wrench and a pressure sensor to obtain a relation graph of torque and pressure; the torque pressure calibration mode is that a pressure sensor is placed at the center of the lower pressure plate 5, and the pressure sensor is set to be zero; a torque wrench is adopted to screw the bolt 1, and in the process of screwing, the pressure readings of the corresponding torque wrench and the pressure sensor are recorded in gradient from the reading of the pressure sensor; fitting the obtained data into a curve to obtain a relation graph of torque and pressure; the torque pressure curve obtained by adopting the calibrated improved hot-pressing bonding device is more accurate compared with the torque pressure curve obtained by theoretical calculation.
2) Stacking the pressed object 13 and placing the stacked pressed object at the center of the lower pressing plate 5;
3) screwing a bolt 1 by using a torque wrench, obtaining a torque pressure relation graph of the torque wrench according to the step 1, and setting by taking actually required pressure as a reference;
4) putting the pressurized device into a heating furnace, and determining the heating temperature according to actual needs;
5) the heated device is taken out of the heating furnace, the pressure is relieved by reversely turning the torque wrench, and the pressed object 13 is taken down.
The utility model discloses improved traditional simple and easy hot press unit, realized that pressure is adjustable to keep the constant voltage in the use, adopted ball slide rail 10 to make when using the slip between top board 4 and guide pillar 9 more smooth and easy, added and drawn spring 7 and effectively protected pressurized object 13.
Claims (7)
1. An improved hot press forming and bonding simple device comprises a screwing bolt and a pressure device; the pressure device is sequentially connected with an upper fixing plate, an upper pressing plate, a lower pressing plate and a lower fixing plate from top to bottom through guide pillars, and a pressed object is arranged on the lower pressing plate; the method is characterized in that: the upper pressure plate is also provided with a plane bearing, the upper part of the plane bearing is connected with a plane bearing pressure plate, and the screwing bolt penetrates through the upper fixing plate to apply pressure on the plane bearing pressure plate; when the screwing bolt moves downwards, the upper pressure plate is driven to slide downwards through the plane bearing plate and is pressed on a pressed object placed on the lower pressure plate.
2. The improved hot press forming and bonding apparatus as claimed in claim 1, wherein: the periphery of the upper pressure plate is hung on the upper fixing plate through four groups of tension springs.
3. The improved hot press forming and bonding apparatus as claimed in claim 1, wherein: the lower pressure plate is supported above the lower fixing plate through four groups of compression springs.
4. The improved hot press forming and bonding apparatus as claimed in claim 1, wherein: the ball sliding rails are arranged on the guide pillars between the upper pressing plate and the lower pressing plate, and the upper pressing plate is provided with a pressing ring which is matched with the ball sliding rails to slide.
5. The improved thermoforming and bonding simplified device as claimed in claim 4, wherein: the compression ring is arranged in the upper compression plate hole, and the upper compression plate hole and the compression ring are in interference fit; the compression ring and the ball slide rail are in small clearance fit, and the ball slide rail and the guide pillar are in interference fit.
6. The improved thermoforming and bonding simplified device as claimed in claim 4, wherein: four round holes are arranged at four corners of the lower pressing plate and are in small clearance fit with the ball slide rails.
7. The improved hot press forming and bonding apparatus as claimed in claim 1, wherein: the upper cover of the plane bearing is fixedly connected with the plane bearing plate, and the lower cover of the plane bearing is fixedly connected with the upper pressure plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920822708.3U CN210100748U (en) | 2019-06-03 | 2019-06-03 | Improved hot press forming and bonding simple device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920822708.3U CN210100748U (en) | 2019-06-03 | 2019-06-03 | Improved hot press forming and bonding simple device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210100748U true CN210100748U (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920822708.3U Expired - Fee Related CN210100748U (en) | 2019-06-03 | 2019-06-03 | Improved hot press forming and bonding simple device |
Country Status (1)
| Country | Link |
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| CN (1) | CN210100748U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314645A (en) * | 2020-02-27 | 2021-08-27 | 山东浪潮华光光电子股份有限公司 | Manufacturing method of GaAs-based LED manual bonding |
-
2019
- 2019-06-03 CN CN201920822708.3U patent/CN210100748U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314645A (en) * | 2020-02-27 | 2021-08-27 | 山东浪潮华光光电子股份有限公司 | Manufacturing method of GaAs-based LED manual bonding |
| CN113314645B (en) * | 2020-02-27 | 2022-07-12 | 山东浪潮华光光电子股份有限公司 | Manufacturing method of GaAs-based LED manual bonding |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200221 |