CN210093122U - Power management chip - Google Patents
Power management chip Download PDFInfo
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- CN210093122U CN210093122U CN201920120310.5U CN201920120310U CN210093122U CN 210093122 U CN210093122 U CN 210093122U CN 201920120310 U CN201920120310 U CN 201920120310U CN 210093122 U CN210093122 U CN 210093122U
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- power supply
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Abstract
The present disclosure relates to power management chips. A power management chip is provided, including a first pin, a second pin, a third pin, a fourth pin, a fifth pin, and a sixth pin, wherein: the first pin, the second pin, the third pin and the fourth pin are sequentially arranged on the first side of the power management chip; the sixth pin is arranged on the second side of the power management chip; the first side is opposite to the second side; the first pin is a chip grounding pin; the second pin is a chip power supply pin; the third pin is a suspension pin or an over-temperature protection pin for realizing the over-temperature protection function of the flyback switching power supply circuit; the fourth pin is an output voltage detection pin and is used for detecting the output voltage of the flyback switching power supply circuit; the fifth pin is a switch current detection pin and is used for detecting the current flowing through the power switch when the power switch arranged in the power management chip is switched on; the sixth pin is the drain pin of the power switch built into the power management chip.
Description
Description of divisional applications
The application is a divisional application of a Chinese utility model patent application with the application date of 2018, 7, month and 4, the application number of 201821056103.X, and the title of a power management chip.
Technical Field
The utility model relates to a circuit field, more specifically relates to a power management chip.
Background
With the continuous development of electronic technology, electronic products are more and more miniaturized, and especially, the miniaturization requirement is also provided in the field of power supplies. In practical application, a power management chip with a built-in power switch and high integration is popular in the market. At present, power management chips integrated with power switches and packaged in a chip are adopted in batches on 5-18W power supply products, but how to realize miniaturization, low cost and high integration on 24-48W power supplies becomes the focus of competition of power management chip manufacturers.
SUMMERY OF THE UTILITY MODEL
In view of one or more of the problems set forth above, the present invention provides a novel power management chip.
According to the utility model discloses power management chip, including first pin, second pin, third pin, fourth pin, fifth pin and sixth pin, wherein: the first pin, the second pin, the third pin and the fourth pin are sequentially arranged on the first side of the power management chip; the sixth pin is arranged on the second side of the power management chip; the first side is opposite the second side.
In some embodiments, the first pin is a feedback signal input pin for receiving an output feedback signal indicative of an output voltage of the flyback switching power supply circuit; the second pin is an output overvoltage and over-temperature protection pin and is used for realizing an overvoltage protection function for the output voltage of the flyback switching power supply circuit and an over-temperature protection function for the flyback switching power supply circuit; the third pin is a chip power supply pin; the fourth pin is a switch current detection pin and is used for detecting the current flowing through the power switch when the power switch arranged in the power management chip is switched on; the fifth pin is a chip grounding pin; the sixth pin is the drain pin of the power switch built into the power management chip. When the power management chip is applied to a flyback switching power supply circuit comprising an optocoupler feedback component, the first pin is connected to the optocoupler feedback component positioned on the secondary winding side of a transformer in the flyback switching power supply circuit; the second pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a first resistor and is connected to a reference ground through a first diode and a thermistor; the third pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component consisting of a second diode and a first capacitor, and is connected to alternating-current voltage through a second resistor; the fourth pin is connected to the reference ground through a third resistor; the fifth pin is connected to the reference ground; the sixth pin is connected to the primary winding of the transformer in the flyback switching power supply circuit.
In some embodiments, the first pin is a chip ground pin; the second pin is a chip power supply pin; the third pin is a suspended pin; the fourth pin is an output voltage detection pin and is used for detecting the output voltage of the flyback switching power supply circuit; the fifth pin is a switch current detection pin and is used for detecting the current flowing through the power switch when the power switch arranged in the power management chip is switched on; the sixth pin is the drain pin of the power switch built into the power management chip. When the power management chip is applied to a flyback switching power supply circuit which does not include the optocoupler feedback component: the first pin is connected to a reference ground; the second pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component consisting of a diode and a capacitor, and is connected to alternating-current voltage through a first resistor; the third pin is connected to the reference ground through the thermistor; the fourth pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a second resistor; the fifth pin is connected to the reference ground through a third resistor; the sixth pin is connected to the primary winding of the transformer in the flyback switching power supply circuit.
In some embodiments, the first pin is a chip ground pin; the second pin is a chip power supply pin; the third pin is an over-temperature protection pin and is used for realizing an over-temperature protection function of the flyback switching power supply circuit; the fourth pin is an output voltage detection pin and is used for detecting the output voltage of the flyback switching power supply circuit; the fifth pin is a switch current detection pin and is used for detecting the current flowing through the power switch when the power switch arranged in the power management chip is switched on; the sixth pin is the drain pin of the power switch built into the power management chip. When the power management chip is applied to a flyback switching power supply circuit which does not comprise an optocoupler feedback component, the first pin is connected to a reference ground; the second pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component consisting of a diode and a capacitor, and is connected to alternating-current voltage through a first resistor; the third pin is connected to the reference ground through the thermistor; the fourth pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a second resistor; the fifth pin is connected to the reference ground through a third resistor; the sixth pin is connected to the primary winding of the transformer in the flyback switching power supply circuit.
According to the utility model discloses power management chip can be used in switching power supply circuit to reduce the components and parts number in the switching power supply circuit, reduce the cost, thereby realize switching power supply circuit's miniaturization.
Drawings
The invention may be better understood from the following description of particular embodiments thereof taken in conjunction with the accompanying drawings, in which:
fig. 1 is a package diagram showing a power management chip according to a first embodiment of the present invention;
FIG. 2 is a circuit diagram of an application circuit of the power management chip shown in FIG. 1;
fig. 3 is a package diagram showing a power management chip according to a second embodiment of the present invention;
FIG. 4 is a circuit diagram of an application circuit of the power management chip shown in FIG. 3;
fig. 5 is a package diagram showing a power management chip according to a third embodiment of the present invention;
fig. 6 is a circuit diagram showing an application circuit of the power management chip shown in fig. 5.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. In the drawings, the thickness of regions and layers may be exaggerated for clarity. In the drawings, the same reference numerals denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the main technical ideas of the invention.
According to the utility model discloses power management chip embeds has power switch (MOS), and it can be used in switching power supply circuit in order to reduce the components and parts number among the switching power supply circuit, and the cost is reduced to realize switching power supply circuit's miniaturization.
Fig. 1 is a package diagram showing a power management chip according to a first embodiment of the present invention. As shown in fig. 1, the power management chip includes six pins, namely pin a to pin F, wherein: pin a is a feedback signal input pin (FB); pin B is the output overvoltage and overtemperature protection Pin (PRT); pin C is a chip supply pin (VCC); pin D is the switch current detection pin (CS); pin E is the chip ground pin (GND); pin F is the DRAIN pin (DRAIN) of the power switch built into the power management chip; pins A to E are sequentially arranged on a first side of the power management chip, pin F is arranged on a second side of the power management chip, and the first side is opposite to the second side.
Fig. 2 is a circuit diagram of an application circuit of the power management chip shown in fig. 1. As shown in fig. 2, when the power management chip shown in fig. 1 is applied to a flyback switching power supply circuit including an optocoupler feedback component:
pin a is connected to an optocoupler feedback component located on the secondary winding side of a transformer in the flyback switching power supply circuit as shown by dashed line ①, the optocoupler feedback component transmits an output feedback signal representative of the output voltage of the flyback switching power supply circuit to pin a of the power management chip (i.e., pin a is used to receive the output feedback signal representative of the output voltage of the switching power supply circuit).
Pin B is connected to the auxiliary winding of the transformer in the flyback switching power supply circuit through a resistor R1, as shown by a dotted line ②, the resistor R1 indirectly samples the output voltage of the flyback switching power supply circuit and transmits the sampling result to the pin B of the power management chip, so that the power management chip can realize the overvoltage protection function on the output voltage of the flyback switching power supply circuit, and meanwhile, the pin B also comprises a diode D1 and a thermistor ROTPAnd the power management chip is connected to a reference ground so as to detect the temperature inside the flyback switching power supply circuit, thereby realizing the over-temperature protection function of the flyback switching power supply circuit.
The pin C is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component composed of a diode D2 and a capacitor C1, and is connected to an alternating voltage through a resistor R2 as shown by a dotted line ③, the alternating voltage is rectified by the rectifying component composed of a diode D2 and a capacitor C1, and then the power management chip is supplied with power through the pin C.
Pin D is connected to ground reference (GND) through resistor R3 as shown by dashed line ④, pin D detects the current flowing through the power switch built into the power management chip when it is turned on.
Pin E is connected to reference ground, as shown by dashed line ⑤, pin E serves as a ground pin for the power management chip.
Pin F is connected to the primary winding of the transformer in the flyback switching power supply circuit, as shown by dashed line ⑥, pin F serves as the drain pin of the power switch built into the power management chip.
Fig. 3 is a package diagram showing a power management chip according to a second embodiment of the present invention. As shown in fig. 3, the power management chip includes six pins, pin a to pin F, wherein: pin a is the chip ground pin (GND); pin B is the chip supply pin (VCC); pin C is a free leg (NC); pin D is the output voltage detection pin (FB); pin E is the switch current detection pin (CS); pin F is the DRAIN pin (DRAIN) of the power switch built into the power management chip; pins A to E are sequentially arranged on a first side of the power management chip, pin F is arranged on a second side of the power management chip, and the first side is opposite to the second side.
Fig. 4 is a circuit diagram of an application circuit of the power management chip shown in fig. 3. As shown in fig. 4, when the power management chip shown in fig. 3 is applied to a flyback switching power supply circuit that does not include an optocoupler feedback component:
pin A is connected to reference ground, as shown by dashed line ①, pin A acts as a ground pin for the power management chip.
The pin B is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component composed of a diode D2 and a capacitor C1, and is connected to alternating-current voltage through a resistor R2. as shown by a dotted line ③, the alternating-current voltage is rectified through the rectifying component composed of a diode D2 and a capacitor C1, and then power is supplied to the power management chip through the pin B.
The pin C is suspended.
Pin D is connected to the auxiliary winding of the transformer in the flyback switching power supply circuit through resistor R4 as shown by dashed line ④, pin D detects the voltage on the auxiliary winding of the transformer during the demagnetization phase of the transformer in the flyback switching power supply circuit through a resistor voltage division manner, thereby indirectly sampling the output voltage of the flyback switching power supply circuit.
Pin E is connected to ground reference (GND) through resistor R6 as shown by dashed line ⑤, pin E detects current flowing through a power switch built into the power management chip when the power switch is turned on.
Pin F is connected to the primary winding of the transformer in the flyback switching power supply circuit, as shown by dashed line ⑥, pin F serves as the drain pin of the power switch built into the power management chip.
Fig. 5 is a package diagram showing a power management chip according to a third embodiment of the present invention. As shown in fig. 5, the power management chip includes six pins, pin a to pin F, wherein: pin a is the chip ground pin (GND); pin B is the chip supply pin (VCC); pin C is an over temperature protection pin (RT); pin D is the output voltage detection pin (FB); pin E is the switch current detection pin (CS); pin F is the DRAIN pin (DRAIN) of the power switch built into the power management chip; pins A to E are sequentially arranged on a first side of the power management chip, pin F is arranged on a second side of the power management chip, and the first side is opposite to the second side.
Fig. 6 is a circuit diagram of an application circuit of the power management chip shown in fig. 5. As shown in fig. 6, when the power management chip shown in fig. 5 is applied to a flyback switching power supply circuit that does not include an optocoupler feedback component:
pin A is connected to reference ground, as shown by dashed line ①, pin A acts as a ground pin for the power management chip.
The pin B is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component composed of a diode D2 and a capacitor C1, and is connected to alternating-current voltage through a resistor R2. as shown by a dotted line ②, the alternating-current voltage is rectified through the rectifying component composed of a diode D2 and a capacitor C1, and then power is supplied to the power management chip through the pin B.
Pin C passing through thermistor ROTPPin C is used to detect the temperature inside the flyback switching power supply circuit as shown by the dashed line ③, thereby implementing the over-temperature protection function for the flyback switching power supply circuit.
Pin D is connected to the auxiliary winding of the transformer in the flyback switching power supply circuit through resistor R4 as shown by dashed line ④, pin D detects the voltage on the auxiliary winding of the transformer during the demagnetization phase of the transformer in the flyback switching power supply circuit through a resistor voltage division manner, thereby indirectly sampling the output voltage of the flyback switching power supply circuit.
Pin E is connected to ground reference (GND) through resistor R6 as shown by dashed line ⑤, pin E detects current flowing through a power switch built into the power management chip when the power switch is turned on.
Pin F is connected to the primary winding of the transformer in the flyback switching power supply circuit, as shown by dashed line ⑥, pin F serves as the drain pin of the power switch built into the power management chip.
Here, it should be noted that the power management chips shown in fig. 1, fig. 3, and fig. 5 may adopt different packaging forms, for example, TO-252 packaging, the mark point at the lower left corner of the front surface of the chip represents the starting point of the pin of the chip, and the pins a TO F are the first TO sixth pins of the power management chip in turn. Taking fig. 1 as an example, pin a is a first pin, pin B is a second pin, pin C is a third pin, pin D is a fourth pin, pin E is a fifth pin, and pin F is a sixth pin.
According to the utility model discloses power management chip can be used in switching power supply circuit to reduce the components and parts number in the switching power supply circuit, reduce the cost, thereby realize switching power supply circuit's miniaturization.
The invention is not limited to the specific configurations described above and shown in the figures. A detailed description of known configurations is omitted herein for the sake of brevity. The configuration of the present invention is not limited to the specific configuration described and illustrated, and various changes, modifications, and additions may be made by those skilled in the art after appreciating the spirit of the present invention.
Claims (2)
1. A power management chip comprises a first pin, a second pin, a third pin, a fourth pin, a fifth pin, and a sixth pin, wherein:
the first pin, the second pin, the third pin and the fourth pin are sequentially arranged on a first side of the power management chip;
the sixth pin is arranged on the second side of the power management chip;
the first side is opposite the second side;
the first pin is a chip grounding pin;
the second pin is a chip power supply pin;
the third pin is a suspension pin or an over-temperature protection pin for realizing an over-temperature protection function of the flyback switching power supply circuit;
the fourth pin is an output voltage detection pin and is used for detecting the output voltage of the flyback switching power supply circuit;
the fifth pin is a switch current detection pin and is used for detecting the current flowing through the power switch when the power switch arranged in the power management chip is switched on;
the sixth pin is a drain pin of the power switch embedded in the power management chip.
2. The power management chip of claim 1, wherein when the power management chip is applied to a flyback switching power supply circuit that does not include an optocoupler feedback component:
the first pin is connected to a reference ground;
the second pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a rectifying component consisting of a diode and a capacitor, and is connected to alternating-current voltage through a first resistor;
the third pin is suspended when being a suspended pin, or is connected to a reference ground through a thermistor when being an over-temperature protection pin;
the fourth pin is connected to an auxiliary winding of a transformer in the flyback switching power supply circuit through a second resistor;
the fifth pin is connected to a reference ground through a third resistor;
the sixth pin is connected to a primary winding of a transformer in the flyback switching power supply circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920120310.5U CN210093122U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821056103.XU CN208986842U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
| CN201920120310.5U CN210093122U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821056103.XU Division CN208986842U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
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| Publication Number | Publication Date |
|---|---|
| CN210093122U true CN210093122U (en) | 2020-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821056103.XU Active CN208986842U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
| CN201920120310.5U Active CN210093122U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821056103.XU Active CN208986842U (en) | 2018-07-04 | 2018-07-04 | Power management chip |
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| CN (2) | CN208986842U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111223850B (en) * | 2020-04-17 | 2020-08-14 | 四川明泰电子科技有限公司 | Bidirectional control sensor IC circuit chip |
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- 2018-07-04 CN CN201821056103.XU patent/CN208986842U/en active Active
- 2018-07-04 CN CN201920120310.5U patent/CN210093122U/en active Active
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| CN208986842U (en) | 2019-06-14 |
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