CN210086713U - Heat-insulation decorative integrated board and heat-insulation system with same - Google Patents
Heat-insulation decorative integrated board and heat-insulation system with same Download PDFInfo
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- CN210086713U CN210086713U CN201920821612.5U CN201920821612U CN210086713U CN 210086713 U CN210086713 U CN 210086713U CN 201920821612 U CN201920821612 U CN 201920821612U CN 210086713 U CN210086713 U CN 210086713U
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Abstract
The utility model discloses a heat preservation and decoration integrated plate and a heat preservation system with the same, wherein the integrated plate comprises a heat preservation layer, at least one side of the heat preservation layer is fixed with a surface substrate through a composite layer, the surface substrate comprises at least one layer of hollow heat insulation layer, the hollow heat insulation layer comprises an inner substrate, an outer substrate and hollow grids which are arranged in the inner substrate and the outer substrate and are respectively and fixedly connected with the inner substrate and the outer substrate, and the hollow grids and the inner substrate and the outer substrate form a plurality of hollow cavities; and a facing layer is arranged on the outer surface of the outer substrate of the hollow heat insulation layer at the outermost layer in one of the surface substrates. The utility model discloses a face base plate adopts the cavity design, and coefficient of heat conductivity is littleer, has promoted heat preservation energy-saving effect, makes the anchor of connecting piece and face base plate reasonable more, firm, and the face base plate adopts the cavity grid system, and the stability can be far superior to the unified board of biography, more non-deformable.
Description
Technical Field
The utility model relates to a heat preservation is decorated intergral template, specifically speaking are heat preservation is decorated intergral template and is had the heat preservation system of this intergral template.
Background
At present, a surface substrate (shown in figure 1) of the existing heat-insulating and decorating integrated plate is a single-layer silicon fiber pressure plate which has the advantages of high heat conductivity coefficient, high water absorption rate, easy pulverization after freeze thawing and easy expansion and deformation at high temperature in summer to cause cracking. The thickness of the surface substrate of the existing heat-preservation and decoration integrated plate is 7 mm and 8mm, the surface substrate is provided with a groove, the depth of the groove is about 4mm, and the connecting piece is clamped in the groove.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned technical problems, an integrated thermal insulation and decoration board and a thermal insulation system having the same are provided.
The utility model discloses a technical means as follows:
a heat-insulation and decoration integrated plate comprises a heat-insulation layer, wherein a surface substrate is fixed on at least one side of the heat-insulation layer through a composite layer, the surface substrate comprises at least one layer of hollow heat-insulation layer, the hollow heat-insulation layer comprises an inner substrate, an outer substrate and hollow grids, the hollow grids are arranged in the inner substrate and the outer substrate and are respectively and fixedly connected with the inner substrate and the outer substrate, and a plurality of hollow cavities are formed by the hollow grids, the inner substrate and the outer substrate;
and a facing layer is arranged on the outer surface of the outer substrate of the hollow heat insulation layer at the outermost layer in one of the surface substrates.
The composite layer is a glue coating layer, and the heat insulation layer and the surface substrate are fixedly connected through glue.
The insulating layer can be one of polystyrene board (EPS), extruded polystyrene board (EPX), polyurethane board, rock wool board, siliceous polystyrene board or honeycomb board.
The thickness of the inner substrate and the outer substrate is 1-4 mm, and the thickness of the hollow cavity is 2-20 mm.
The hollow cavity is polyhedral.
The outer edge of the outer substrate provided with the decorative layer is shorter than the outer edge of the inner substrate matched with the outer substrate by 1-6 mm.
The outer edge of the hollow heat insulation layer is provided with a connecting cavity.
The surface substrate is made of high-temperature resin materials with reinforcing fibers inside, so that the surface substrate made of the materials is high-temperature resistant, high in strength, good in folding resistance and impact resistance and low in water absorption rate.
A heat insulation system comprises a plurality of integrated plates, wherein the integrated plates are sequentially spliced and distributed on a base wall body, one side of each integrated plate, far away from a finishing coat, is fixedly connected with the base wall body through a bonding layer, and a plurality of connecting pieces are arranged between every two adjacent integrated plates;
the connecting piece comprises a fixing plate and a connecting plate, one end of the fixing plate is fixedly connected with the base layer wall through an expansion nail, the connecting plate is fixedly connected with the other end of the fixing plate through a bolt and a nut, one end, far away from the fixing plate, of the connecting plate is provided with a connecting end which is perpendicular to the connecting plate, the connecting plate is fixedly connected with the middle of the connecting end, two ends of the connecting end penetrate into connecting cavities of two adjacent integrated plates respectively, the part, penetrating into the connecting cavities, of the connecting end is fixedly connected with the connecting cavities through structural adhesive, and the structural adhesive seals the connecting cavities;
and the gap between two adjacent integrated plates is filled with weather-resistant glue for filling the gap.
And a foam strip is filled between two adjacent heat-insulating layers.
The fixed plate include with the basic unit wall body pass through inflation nail fixed connection's stiff end and with stiff end fixed connection and perpendicular to the stress end of stiff end, stress serve be equipped with bolt matched with rectangular shape through-hole I, be equipped with on the connecting plate with bolt matched with rectangular shape through-hole II, the bolt passes in proper order rectangular shape pass through I with rectangular shape through-hole II and pass through the nut will the connecting plate with stress end fixed connection.
The length of link is 20 ~ 120 mm.
The utility model has the advantages of it is following:
1. the surface substrate adopts a hollow design, the heat conductivity coefficient is smaller, the heat-preservation and energy-saving effects are improved, the heat conductivity coefficient of the traditional substrate is 0.57, and the heat conductivity coefficient of the surface substrate provided by the utility model is 0.028 which is far lower than that of the traditional substrate; the energy-saving effect of the traditional substrate added to the existing 80 mm-thick benzene plate reaches 70%, and the energy-saving effect of 80% can be achieved by adding the single-layer hollow heat-insulating layer to the 80 mm-thick benzene plate provided by the invention.
2. The hollow design of the surface substrate enables the anchoring of the connecting piece and the surface substrate to be more reasonable and firmer. Traditional connecting piece can only go into 8mm (each 4mm in both sides), the utility model provides a 20mm ~ 120mm (each 30 ~ 60mm in both sides) can go into to the connecting piece of heat preservation system.
3. The surface substrate adopts a hollow grid system, the stability is far better than that of a transmission uniform plate, and the surface substrate is not easy to deform.
4. The weight is lighter, the weight is lighter under the same thickness, and the weight of the surface substrate of the prior integrated board reaches 12.8kg/m2The weight of the surface substrate of the integrated board provided by the utility model can reach 6.5kg/m2。
Based on the reason, the utility model discloses can extensively promote in fields such as thermal insulation system.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a conventional integrated board in the background art of the present invention.
Fig. 2 is a front view of a body plate in embodiment 1 of the present invention.
Fig. 3 is a sectional view taken along line a-a in fig. 2.
Fig. 4 is a front view of an integrated board in embodiment 2 of the present invention.
Fig. 5 is a sectional view taken along line B-B in fig. 4.
Fig. 6 is a front view of an integrated plate according to embodiment 3 of the present invention.
Fig. 7 is a cross-sectional view taken along line C-C in fig. 6.
Fig. 8 is a front view of an integrated plate according to embodiment 4 of the present invention.
Fig. 9 is a cross-sectional view taken along line D-D in fig. 8.
Fig. 10 is a front view of an integrated board in embodiment 5 of the present invention.
Fig. 11 is a cross-sectional view taken along line E-E of fig. 10.
Fig. 12 is a front view of an integrated plate according to embodiment 6 of the present invention.
FIG. 13 is a sectional view taken along line F-F in FIG. 12
Fig. 14 is a front view of the thermal insulation system according to embodiment 7 of the present invention.
Fig. 15 is a sectional view taken along line G-G in fig. 14.
Fig. 16 is an enlarged view of a portion I in fig. 15.
Fig. 17 is a top view of a connector according to embodiment 7 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
As shown in fig. 2-3, an insulation and decoration integrated board, the integrated board 1 includes an insulation layer 2, a surface substrate 4 is fixed on one side of the insulation layer 2 through a composite layer 3, the surface substrate 4 includes a layer of hollow insulation layer 5, the hollow insulation layer 5 includes an inner substrate 51, an outer substrate 52 and a hollow grid 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected to the inner substrate 51 and the outer substrate 52, respectively, the hollow grid 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54;
the outer surface of the outer substrate 52 is provided with a finishing layer 55.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 100 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4mm, namely, the thickness of the whole substrate 4 is 9 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
The size of the integrated plate is 1120mm multiplied by 2440mm multiplied by 109 mm.
Example 2
As shown in fig. 4-5, an insulation and decoration integrated board, the integrated board 1 includes an insulation layer 2, two sides of the insulation layer 2 are fixed with a surface substrate 4 through a composite layer 3, the surface substrate 4 includes a layer of hollow insulation layer 5, the hollow insulation layer 5 includes an inner substrate 51, an outer substrate 52 and a hollow grid 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected with the inner substrate 51 and the outer substrate 52, respectively, the hollow grid 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54;
one of the two outer substrates 52 is provided with a finishing layer 55 on the outer surface of the outer substrate 52.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 80 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 provided with the finishing layer 55 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
Example 3
As shown in fig. 6-7, an insulation and decoration integrated board, the integrated board 1 includes an insulation layer 2, two sides of the insulation layer 2 are fixed with a surface substrate 4 through a composite layer 3, the surface substrate 4 includes a plurality of hollow insulation layers 5 (both including two layers in this embodiment), the hollow insulation layers 5 include an inner substrate 51, an outer substrate 52, and hollow grids 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected to the inner substrate 51 and the outer substrate 52, respectively, and the hollow grids 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54; and the hollow cavities 54 in the multilayer hollow heat insulation layer 5 are arranged in a staggered mode.
One of the two outer substrates 52 is provided with a finishing layer 55 on the outer surface of the outer substrate 52.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 80 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 provided with the finishing layer 55 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
Example 4
As shown in fig. 8-9, an integrated thermal insulation and decoration plate 1 includes an insulation layer 2, two sides of the insulation layer 2 are fixed with a face substrate 4 through a composite layer 3, the face substrate 4 disposed on one side of the insulation layer 2 includes a plurality of layers of hollow insulation layers 5 (in this embodiment, two layers), the face substrate 4 disposed on the other side of the insulation layer 2 includes a single-layer hollow insulation layer 5, the hollow insulation layer 5 includes an inner substrate 51, an outer substrate 52, and hollow grids 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected with the inner substrate 51 and the outer substrate 52, respectively, and the hollow grids 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54;
the outer surface of the outer substrate 52 of the single-layer heat insulation layer 5 is provided with a finishing layer 55.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 80 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 provided with the finishing layer 55 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
Example 5
As shown in fig. 10-11, an integrated thermal insulation and decoration plate 1 includes an insulation layer 2, two sides of the insulation layer 2 are fixed with a face substrate 4 through a composite layer 3, the face substrate 4 disposed on one side of the insulation layer 2 includes a plurality of layers of hollow insulation layers 5 (in this embodiment, two layers), the face substrate 4 disposed on the other side of the insulation layer 2 includes a single-layer hollow insulation layer 5, the hollow insulation layer 5 includes an inner substrate 51, an outer substrate 52, and hollow grids 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected with the inner substrate 51 and the outer substrate 52, respectively, and the hollow grids 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54; and the hollow cavities 54 in the multilayer hollow heat insulation layer 5 are arranged in a staggered mode.
The outer surface of the outer substrate 52 of the heat insulation layer 5 at the outermost layer in the multilayer heat insulation layers 5 is provided with a finishing layer 55.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 80 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 provided with the finishing layer 55 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
Example 6
As shown in fig. 12-13, an insulation and decoration integrated board, the integrated board 1 includes an insulation layer 2, a surface substrate 4 is fixed on one side of the insulation layer 2 through a composite layer 3, the surface substrate 4 includes a plurality of hollow insulation layers 5 (in this embodiment, two layers are included), the surface substrate 4 disposed on the other side of the insulation layer 2 includes a single-layer hollow insulation layer 5, the hollow insulation layer 5 includes an inner substrate 51, an outer substrate 52, and hollow grids 53 disposed in the inner substrate 51 and the outer substrate 52 and fixedly connected to the inner substrate 51 and the outer substrate 52, respectively, and the hollow grids 53 and the inner substrate 51 and the outer substrate 52 form a plurality of hollow cavities 54; two sets of the hollow cavities 54 are arranged in a staggered manner.
The outer surface of the outer substrate 52 of the heat insulation layer 5 at the outermost layer in the multilayer heat insulation layers 5 is provided with a finishing layer 55.
The composite layer 3 is a glue coating layer, and the heat preservation layer 2 and the surface substrate 4 are fixedly connected through glue.
The heat-insulating layer 2 is a benzene plate with the thickness of 80 mm.
The thickness of the outer substrate 52 is 2mm, the thickness of the inner substrate 51 is 3mm, and the thickness of the hollow cavity 54 is 4 mm.
The hollow cavity 54 is a cuboid, and the size of the hollow cavity is 80mm × 80mm × 4 mm.
The outer edge of the outer substrate 52 provided with the finishing layer 55 is shorter than the outer edge of the inner substrate 51 by 4 mm.
The outer edge of the hollow heat insulation layer 5 is provided with a connecting cavity 56.
Example 7
As shown in fig. 2, 3 and 14-17, an insulation system includes a plurality of integrated boards 1 according to embodiment 1, the integrated boards 1 are sequentially spliced and distributed on a base wall 6, one side of each integrated board 1 away from a finishing layer 55 is fixedly connected with the base wall 6 through an adhesive layer 7, and a plurality of connectors 8 are arranged between two adjacent integrated boards 1;
the connecting piece 8 comprises a fixing plate 81 and a connecting plate 82, one end of the fixing plate 81 is fixedly connected with the base wall 6 through an expansion nail 83, the connecting plate 82 is fixedly connected with the other end of the fixing plate 81 through a bolt 84 and a nut 85, one end of the connecting plate 82 far away from the fixing plate 81 is provided with a connecting end 86 which is perpendicular to the connecting plate 82, the connecting plate 82 is fixedly connected with the middle part of the connecting end 86, two ends of the connecting end 86 respectively penetrate into the connecting cavities 56 of two adjacent integrated plates 1, and the part of the connecting end 86 penetrating into the connecting cavity 56 is fixedly connected with the connecting cavity 56 through a structural adhesive 87;
the gap between two adjacent integrated plates 1 is filled with the weather-resistant glue 9 filling the gap, the weather-resistant glue 9 enters the connecting cavity 56 and seals the connecting cavity 56, and the weather-resistant glue 9 exceeds the outer edge of the outer substrate 52 by 2 mm.
And a foam strip 21 is filled between two adjacent heat-insulating layers 2.
Fixed plate 81 include with basic unit's wall 6 passes through inflation nail 83 fixed connection's stiff end 811 and with stiff end 811 fixed connection and perpendicular to the stress end 812 of stiff end 811, be equipped with on stress end 812 with I813 of bolt 84 matched with rectangular shape through-hole, be equipped with on the connecting plate 82 with II 821 of bolt 84 matched with rectangular shape through-hole, bolt 84 passes in proper order rectangular shape through I813 with II 821 of rectangular shape through-hole passes through nut 85 will connecting plate 82 with stress end 812 fixed connection.
The length of the connecting end 86 is 100 mm.
The gap between the heat preservation layers 2 of two adjacent integrated boards 1 is 4mm, the stress end 812 is 2mm thick, and the connecting board 82 is 2mm thick, namely the distance between the stress end 812 and the connecting board 82 is equal to the distance between the two adjacent heat preservation layers 2 after the stress end 812 and the connecting board 82 are stacked, and the place without the stress end 812 and the connecting board 82 is filled with the foam strip 21; the distance between the outer substrates 52 of the two adjacent integrated plates 1 is 10mm, the distance between the inner substrates 51 of the two adjacent integrated plates 1 is 2mm, and the weather-resistant glue 9 is filled at the position to achieve the effects of sealing, water proofing and heat preservation. The link 86 penetrates one the length of connecting chamber 56 is 50mm, and connecting chamber 56 passes through 87 is sealed for the structure, and will the link 86 with connecting chamber 56 is fixed, in this embodiment the link 86 gets into connecting chamber 56's distance is greater than the distance that link 86 got into face base plate 4 among the prior art far away, can be better prevent dropping of face base plate 4, and is fixed more firmly.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (9)
1. The heat-insulation and decoration integrated plate is characterized by comprising a heat-insulation layer, wherein a surface substrate is fixed on at least one side of the heat-insulation layer through a composite layer, the surface substrate comprises at least one layer of hollow heat-insulation layer, the hollow heat-insulation layer comprises an inner substrate, an outer substrate and hollow grids, the hollow grids are arranged in the inner substrate and the outer substrate and are respectively and fixedly connected with the inner substrate and the outer substrate, and the hollow grids and the inner substrate and the outer substrate form a plurality of hollow cavities;
and a facing layer is arranged on the outer surface of the outer substrate of the hollow heat insulation layer at the outermost layer in one of the surface substrates.
2. The integrated thermal insulating and decorative board as claimed in claim 1, wherein: the thickness of the inner substrate and the outer substrate is 1-4 mm, and the thickness of the hollow cavity is 2-20 mm.
3. The integrated thermal insulating and decorative board as claimed in claim 1, wherein: the hollow cavity is polyhedral.
4. The integrated thermal insulating and decorative board as claimed in claim 1, wherein: the outer edge of the outer substrate provided with the decorative layer is shorter than the outer edge of the inner substrate matched with the outer substrate by 1-6 mm.
5. The integrated thermal insulating and decorative board as claimed in claim 1, wherein: the outer edge of the hollow heat insulation layer is provided with a connecting cavity.
6. An insulation system, comprising a plurality of integrated boards according to any one of claims 1 to 5, wherein the plurality of integrated boards are sequentially spliced and distributed on a base wall, one side of each integrated board, which is far away from the veneer layer, is fixedly connected with the base wall through an adhesive layer, and a plurality of connecting pieces are arranged between two adjacent integrated boards;
the connecting piece comprises a fixing plate and a connecting plate, one end of the fixing plate is fixedly connected with the base layer wall through an expansion nail, the connecting plate is fixedly connected with the other end of the fixing plate through a bolt and a nut, one end, far away from the fixing plate, of the connecting plate is provided with a connecting end which is perpendicular to the connecting plate, the connecting plate is fixedly connected with the middle of the connecting end, two ends of the connecting end penetrate into connecting cavities of two adjacent integrated plates respectively, the part, penetrating into the connecting cavities, of the connecting end is fixedly connected with the connecting cavities through structural adhesive, and the structural adhesive seals the connecting cavities;
and the gap between two adjacent integrated plates is filled with weather-resistant glue for filling the gap.
7. An insulation system according to claim 6, wherein a foam strip is filled between two adjacent insulation layers.
8. An insulation system according to claim 6, characterized in that: the fixed plate include with the basic unit wall body pass through inflation nail fixed connection's stiff end and with stiff end fixed connection and perpendicular to the stress end of stiff end, stress serve be equipped with bolt matched with rectangular shape through-hole I, be equipped with on the connecting plate with bolt matched with rectangular shape through-hole II, the bolt passes in proper order rectangular shape pass through I with rectangular shape through-hole II and pass through the nut will the connecting plate with stress end fixed connection.
9. An insulation system according to claim 6, characterized in that: the length of link is 20 ~ 120 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920821612.5U CN210086713U (en) | 2019-05-31 | 2019-05-31 | Heat-insulation decorative integrated board and heat-insulation system with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920821612.5U CN210086713U (en) | 2019-05-31 | 2019-05-31 | Heat-insulation decorative integrated board and heat-insulation system with same |
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| CN210086713U true CN210086713U (en) | 2020-02-18 |
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| CN201920821612.5U Active CN210086713U (en) | 2019-05-31 | 2019-05-31 | Heat-insulation decorative integrated board and heat-insulation system with same |
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