CN210073836U - Semiconductor packaging mechanism with antenna assembly - Google Patents
Semiconductor packaging mechanism with antenna assembly Download PDFInfo
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- CN210073836U CN210073836U CN201920896015.9U CN201920896015U CN210073836U CN 210073836 U CN210073836 U CN 210073836U CN 201920896015 U CN201920896015 U CN 201920896015U CN 210073836 U CN210073836 U CN 210073836U
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Abstract
The utility model discloses a semiconductor packaging mechanism with antenna module relates to the encapsulation technology field, this semiconductor packaging mechanism with antenna module, including fixed establishment, sealing mechanism and antenna mechanism, fixed establishment's external fixed surface is connected with sealing mechanism, one side joint of sealing mechanism has antenna mechanism. This semiconductor packaging mechanism with antenna module sets up antenna mechanism on this packaging mechanism, has not only improved the wholeness of semiconductor with packaging mechanism, has still reduced the volume of antenna module and semiconductor packaging mechanism totality to the space that equipment occupied has been reduced, place the semiconductor in fixed establishment's inside and fixed, antenna mechanism is connected with the semiconductor in the fixed establishment, sealing mechanism detains at fixed establishment's surface and in antenna mechanism joint, use sealed glue to do sealed processing with seam crossing at last, the encapsulation of antenna module and semiconductor has just been accomplished, and the installation procedure is simple and firm.
Description
Technical Field
The utility model relates to a packaging technology field specifically is semiconductor packaging mechanism with antenna module.
Background
The "packaging technology" is a technology for packaging an integrated circuit with an insulating plastic or ceramic material, and a semiconductor package is naturally a technology for packaging a semiconductor with an insulating plastic or ceramic material, and taking a CPU as an example, the volume and appearance actually seen are not the size and appearance of a real CPU core, but are a product in which elements such as a CPU core are packaged. Packaging techniques are necessary and critical for semiconductors. Because the semiconductor is isolated from the outside, the electric performance degradation caused by the corrosion of the semiconductor by impurities in the air can be prevented. On the other hand, the packaged semiconductor is also more convenient to install and transport.
However, the conventional semiconductor package mechanism is separated from the antenna assembly, and thus occupies a large space when installed for use.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a semiconductor packaging mechanism with antenna module has solved current semiconductor packaging mechanism and has been partd with the antenna module, occupies the problem in great space when the installation is used.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
the semiconductor packaging mechanism with the antenna assembly comprises a fixing mechanism, a sealing mechanism and an antenna mechanism, wherein the sealing mechanism is fixedly connected to the outer surface of the fixing mechanism, and the antenna mechanism is clamped on one side of the sealing mechanism;
the fixing mechanism comprises a storage box, wiring slots and connecting columns, wherein a plurality of wiring slots are formed in one side of the top of the storage box, and three connecting columns are fixedly connected inside the storage box;
the sealing mechanism comprises a sealing cover, wire clamping grooves, connecting holes and antenna grooves, wherein a plurality of wire clamping grooves are formed in one side face of the sealing cover, three connecting holes are formed in the top of the sealing cover, and the antenna grooves are formed in one side of the top of the sealing cover;
the antenna mechanism comprises a rectangular cylinder, an antenna and a threading hole, the antenna is fixedly connected inside the rectangular cylinder, and the threading hole is formed in one side of the rectangular cylinder.
Optionally, the fixing mechanism is fixedly connected with the inside of the sealing cover of the sealing mechanism through the storage box.
Optionally, the sealing mechanism is clamped with the outer surface of the rectangular cylinder of the antenna mechanism through the antenna slot.
Optionally, the number of the wiring slot is the same as that of the wire clamping slot, and the positions of the wiring slot and the wire clamping slot correspond to each other.
Optionally, the connecting column is matched with the connecting hole in size, and the connecting column is inserted into the connecting hole.
Optionally, the size of the antenna slot is matched with the size of the rectangular cylinder.
(III) advantageous effects
The utility model provides a semiconductor packaging mechanism with antenna module possesses following beneficial effect:
(1) this semiconductor packaging mechanism with antenna module, through setting up antenna mechanism, the antenna inserts the inside and fixed of a rectangle section of thick bamboo, the connecting wire of antenna runs through to the outside of a rectangle section of thick bamboo from the pinhole department, make the connecting wire with put the semiconductor in the thing box and be connected, then detain sealed lid at the surface of putting the thing box, the antenna groove then with a rectangle section of thick bamboo joint, thereby set up antenna mechanism on this packaging mechanism, semiconductor and packaging mechanism's wholeness has not only been improved, the holistic volume of antenna module and semiconductor packaging mechanism has still been reduced, thereby the space that equipment occupied has been reduced.
(2) This semiconductor packaging mechanism with antenna module through setting up fixed establishment, sealing mechanism and antenna mechanism, places the semiconductor in fixed establishment's inside and fixed, then is connected the semiconductor in antenna mechanism and the fixed establishment, and sealing mechanism detains at fixed establishment's surface and in antenna mechanism joint, uses sealed glue to do sealed processing with the seam crossing of fixed establishment, sealing mechanism and antenna mechanism at last to accomplish the encapsulation of antenna module and semiconductor, reached simple and firm purpose of installation procedure.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the fixing mechanism of the present invention;
fig. 3 is a schematic structural view of the sealing mechanism of the present invention;
fig. 4 is a schematic structural diagram of the antenna mechanism of the present invention.
In the figure: 1-fixing mechanism, 101-storage box, 102-wiring groove, 103-connecting column, 2-sealing mechanism, 201-sealing cover, 202-wire clamping groove, 203-connecting hole, 204-antenna groove, 3-antenna mechanism, 301-rectangular cylinder, 302-antenna and 303-threading hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, the present invention provides a technical solution:
the semiconductor packaging mechanism with the antenna assembly comprises a fixing mechanism 1, a sealing mechanism 2 and an antenna mechanism 3, wherein the sealing mechanism 2 is fixedly connected to the outer surface of the fixing mechanism 1, the seam between the fixing mechanism 1 and the sealing mechanism 2 is sealed by sealant so as to achieve a sealing effect, the antenna mechanism 3 is clamped on one side of the sealing mechanism 2, and the seam between the sealing mechanism 2 and the antenna mechanism 3 is sealed by the sealant so as to achieve the sealing effect;
the fixing mechanism 1 comprises an object placing box 101, a plurality of wire bunching grooves 102 and connecting columns 103, wherein the plurality of wire bunching grooves 102 are formed in one side of the top of the object placing box 101, a semiconductor is placed inside the object placing box 101 through the arrangement of the object placing box 101, a conducting wire of the semiconductor extends to the outside of the object placing box 101 through being clamped with the wire bunching grooves 102 through the arrangement of the wire bunching grooves 102, three connecting columns 103 are fixedly connected to the inside of the object placing box 101, through the arrangement of the connecting columns 103, the semiconductor can be clamped, the purpose of fixing the semiconductor is achieved, the semiconductor is prevented from sliding inside the object placing box 101, and the semiconductor is spliced with the connecting holes 203, so that the connecting area of the object placing box;
the sealing mechanism 2 comprises a sealing cover 201, a wire clamping groove 202, a connecting hole 203 and an antenna groove 204, wherein a plurality of wire clamping grooves 202 are formed in one side face of the sealing cover 201, the sealing cover 201 is buckled on the outer surface of the object placing box 101 through the arrangement of the sealing cover 201, the purpose of packaging a semiconductor is achieved, the wire clamping groove 202 is clamped with a conducting wire extending out of the semiconductor through the arrangement of the wire clamping grooves 202, the conducting wire is clamped between the wire clamping groove 202 and a wire bunching groove 102 up and down, the purpose of fixing the conducting wire is achieved, three connecting holes 203 are formed in the top of the sealing cover 201, the connecting holes 203 are sleeved on the outer surface of a connecting column 103 through the arrangement of the connecting holes 203, the connecting area of the object placing box 101 and the sealing cover 201 is increased, the connecting firmness is increased, the antenna groove 204 is formed in one side of the top of the sealing cover, enhancing transmission of the antenna signal;
As an optional technical solution of the utility model:
As an optional technical solution of the utility model:
the sealing mechanism 2 is clamped with the outer surface of the rectangular cylinder 301 of the antenna mechanism 3 through the antenna slot 204, and the seam between the antenna slot 204 and the rectangular cylinder 301 is sealed by sealant, so that the sealing performance and the connection firmness of the device are ensured.
As an optional technical solution of the utility model:
the number of the wiring slots 102 is the same as that of the wire clamping slots 202, and the positions of the wiring slots 102 and the wire clamping slots 202 correspond to each other, so that the semiconductor conducting wires are clamped between the wiring slots 102 and the wire clamping slots 202 up and down, and the purpose of fixing the conducting wires is achieved.
As an optional technical solution of the utility model:
the connecting column 103 is matched with the connecting hole 203 in size, the connecting column 103 is connected with the connecting hole 203 in an inserting mode, and the gap between the connecting column 103 and the connecting hole 203 is sealed by using sealant, so that the sealing performance and the connection firmness of the device are guaranteed.
As an optional technical solution of the utility model:
the size of the antenna groove 204 is matched with that of the rectangular cylinder 301.
When the semiconductor packaging box is used, a semiconductor is placed inside the storage box 101, the connecting column 103 is connected with the semiconductor in a clamped mode, the semiconductor is fixed, the semiconductor is prevented from sliding inside the storage box 101, then conducting wires of the semiconductor are connected with the wire bunching grooves 102 in a clamped mode one by one, the antenna 302 is inserted into the rectangular cylinder 301 and fixed, a connecting wire of the antenna 302 penetrates through the wire threading hole 303 to the outside of the rectangular cylinder 301, the connecting wire is connected with the semiconductor inside the storage box 101, then the sealing cover 201 is buckled on the outer surface of the storage box 101, the conducting wires are clamped up and down between the wire bunching groove 202 and the wire bunching groove 102, the conducting wires are fixed, the connecting hole 203 is connected with the connecting column 103, the antenna groove 204 is connected with the rectangular cylinder 301 in a clamped mode, then sealing treatment is carried out on joints of the fixing mechanism 1, the.
In summary, in the semiconductor packaging mechanism with the antenna assembly, when in use, the antenna mechanism 3 is arranged, the antenna 302 is inserted into the rectangular cylinder 301 and fixed, the connecting wire of the antenna 302 penetrates from the wire threading hole 303 to the outside of the rectangular cylinder 301, so that the connecting wire is connected with the semiconductor in the storage box 101, then the sealing cover 201 is buckled on the outer surface of the storage box 101, the antenna groove 204 is clamped with the rectangular cylinder 301, thereby the antenna mechanism is arranged on the packaging mechanism, the integrity of the semiconductor and the packaging mechanism is improved, the overall volume of the antenna assembly and the semiconductor packaging mechanism is reduced, the space occupied by the equipment is reduced, the semiconductor is placed and fixed in the fixing mechanism 1 by arranging the fixing mechanism 1, the sealing mechanism 2 and the antenna mechanism 3, and then the antenna mechanism 3 is connected with the semiconductor in the fixing mechanism 1, the sealing mechanism 2 is buckled on the outer surface of the fixing mechanism 1 and is clamped with the antenna mechanism 3, and finally, the sealing glue is used for sealing the joint of the fixing mechanism 1, the sealing mechanism 2 and the antenna mechanism 3, so that the antenna assembly and the semiconductor are packaged, and the purposes of simple and firm installation procedure are achieved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. Semiconductor packaging mechanism with antenna module, including fixed establishment (1), sealing mechanism (2) and antenna mechanism (3), its characterized in that:
the outer surface of the fixing mechanism (1) is fixedly connected with a sealing mechanism (2), and one side of the sealing mechanism (2) is clamped with an antenna mechanism (3);
the fixing mechanism (1) comprises a storage box (101), wire bundling grooves (102) and connecting columns (103), wherein a plurality of wire bundling grooves (102) are formed in one side of the top of the storage box (101), and three connecting columns (103) are fixedly connected inside the storage box (101);
the sealing mechanism (2) comprises a sealing cover (201), wire clamping grooves (202), connecting holes (203) and antenna grooves (204), wherein a plurality of wire clamping grooves (202) are formed in one side face of the sealing cover (201), three connecting holes (203) are formed in the top of the sealing cover (201), and the antenna grooves (204) are formed in one side of the top of the sealing cover (201);
antenna mechanism (3) are including a rectangle section of thick bamboo (301), antenna (302) and through wires hole (303), the inside fixedly connected with antenna (302) of a rectangle section of thick bamboo (301), through wires hole (303) have been seted up to one side of a rectangle section of thick bamboo (301).
2. The semiconductor packaging mechanism with an antenna assembly of claim 1,
the fixing mechanism (1) is fixedly connected with the inside of a sealing cover (201) of the sealing mechanism (2) through the storage box (101).
3. The semiconductor packaging mechanism with an antenna assembly of claim 1,
and the sealing mechanism (2) is clamped with the outer surface of the rectangular cylinder (301) of the antenna mechanism (3) through the antenna slot (204).
4. The semiconductor packaging mechanism with an antenna assembly of claim 1,
the number of the wiring harness slots (102) is the same as that of the wire clamping slots (202), and the positions of the wiring harness slots and the wire clamping slots correspond to each other.
5. The semiconductor packaging mechanism with an antenna assembly of claim 1,
the connecting column (103) is matched with the connecting hole (203) in size, and the connecting column (103) is inserted into the connecting hole (203).
6. The semiconductor packaging mechanism with an antenna assembly of claim 1,
the size of the antenna slot (204) is matched with that of the rectangular cylinder (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920896015.9U CN210073836U (en) | 2019-06-14 | 2019-06-14 | Semiconductor packaging mechanism with antenna assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920896015.9U CN210073836U (en) | 2019-06-14 | 2019-06-14 | Semiconductor packaging mechanism with antenna assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210073836U true CN210073836U (en) | 2020-02-14 |
Family
ID=69457703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920896015.9U Active CN210073836U (en) | 2019-06-14 | 2019-06-14 | Semiconductor packaging mechanism with antenna assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210073836U (en) |
-
2019
- 2019-06-14 CN CN201920896015.9U patent/CN210073836U/en active Active
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