CN210073558U

CN210073558U - Vehicle-mounted power supply device

Info

Publication number: CN210073558U
Application number: CN201921168140.4U
Authority: CN
Inventors: 王飞; 江宝迪; 吴壬华
Original assignee: Shenzhen Shinry Technologies Co Ltd
Current assignee: Shenzhen Shinry Technologies Co Ltd
Priority date: 2019-07-23
Filing date: 2019-07-23
Publication date: 2020-02-14
Anticipated expiration: 2029-07-23

Abstract

The application discloses vehicle mounted power supply device includes: a housing and a plurality of electronic components; the shell is provided with a plurality of accommodating cavities corresponding to the number of the plurality of electronic elements, and the plurality of electronic elements are respectively arranged in the plurality of accommodating cavities; a cooling liquid flow channel is arranged on the other side of the shell back to the plurality of accommodating cavities, and cooling liquid is arranged in the cooling liquid flow channel; the heat generated by the electronic components during operation is conducted to the cooling liquid flow channel through the shell and is taken away by the cooling liquid. Through the cooperation that holds chamber and coolant liquid runner, can reduce electronic component and occupy vehicle power supply unit's space to electronic component's heat-sinking capability is improved.

Description

Vehicle-mounted power supply device

Technical Field

The present application relates to a vehicle-mounted power supply device, and more particularly, to a vehicle-mounted power supply device.

Background

At present, electronic elements such as inductors of a vehicle-mounted power supply need to occupy a large space for installation, and the heat dissipation capacity of the electronic elements such as the inductors is poor. When the vehicle-mounted power supply works, electronic elements such as the inductor are easy to cause element faults due to untimely heat dissipation, and the electronic elements such as the inductor occupy larger space and are not beneficial to arrangement of other electronic elements of the vehicle-mounted power supply.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a vehicle mounted power supply device to solve the relatively poor and great problem of occupation space of current vehicle mounted power supply heat dissipation.

In order to solve the above technical problem, the present application provides an on-vehicle power supply apparatus, including: a housing and a plurality of electronic components; the shell is provided with a plurality of accommodating cavities corresponding to the number of the electronic elements, and the electronic elements are respectively arranged in the accommodating cavities; the shell is provided with a cooling liquid flow channel at the other side back to the accommodating cavities, and the cooling liquid flow channel is used for cooling liquid to flow; the heat generated by the electronic components during operation is conducted to the cooling liquid flow channel through the shell and is taken away by the cooling liquid.

In one embodiment, the housing includes a bottom wall and a side wall; the side wall surrounds the bottom wall, corresponding distances extend towards the inner surface and the outer surface of the bottom wall, an inner space is formed between the part of the side wall extending towards the inner surface of the bottom wall and the bottom wall, and the accommodating cavities are formed on the inner surface of the bottom wall of the shell and located in the inner space; the coolant flow channel is located on one side of the outer surface of the bottom wall.

In one embodiment, the bottom wall is formed with a plurality of protrusions protruding from an outer surface thereof toward an inner surface thereof, wherein the plurality of protrusions are in communication with the coolant flow channel; the plurality of bosses are arranged in an array, and the plurality of bosses, the bottom wall and the side wall jointly form the plurality of accommodating cavities.

In one embodiment, the bottom wall is formed by a plurality of protrusions protruding from the outer surface of the bottom wall in the direction toward the inner surface of the bottom wall, wherein the plurality of protrusions are communicated with the cooling liquid channel; be equipped with a plurality of barricades on the diapire, a plurality of bellying and a plurality of the barricade is the array setting, and the bellying the barricade the diapire with the lateral wall forms jointly a plurality of chambeies that hold.

In one embodiment, the housing is provided with a water inlet and a water outlet; the water inlet and the water outlet are arranged on one side of the side wall opposite to the inner space at intervals, and penetrate through the side wall to be communicated with the cooling liquid flow channel; the water inlet is used for supplying the cooling liquid to enter the cooling liquid flow channel, and the water outlet is used for supplying the cooling liquid to be discharged from the cooling liquid flow channel so as to realize water-cooling heat dissipation.

In one embodiment, the housing further comprises a limiting wall; the limiting wall is positioned on one side of the outer surface of the bottom wall and surrounds the bottom wall; the limiting wall and the bottom wall form the cooling liquid flow channel with an opening; the vehicle-mounted power supply device further comprises a cover plate, and the cover plate is used for covering the opening and the shell, so that a closed cooling liquid flow channel is formed.

In one embodiment, the portion of the side wall of the housing extending toward the outer surface of the bottom wall and the bottom wall of the housing form the coolant flow passage having an opening, and the vehicle-mounted power supply device further includes a cover plate; the cover plate is used for covering the opening and the shell, and therefore the closed cooling liquid flow channel is formed.

In one embodiment, the bottom wall is provided with a threaded column on the inner surface corresponding to the accommodating cavity, and the electronic element is provided with a through hole; the threaded column is used for being in threaded connection with a screw penetrating through the through hole so as to fix the electronic component in the accommodating cavity.

In an embodiment, the vehicle-mounted power supply device further includes a potting adhesive, and the potting adhesive is used for injecting each electronic element into the accommodating cavity to encapsulate the electronic element after the electronic element is accommodated in the corresponding accommodating cavity.

In one embodiment, the electronic component is an inductive component.

This application can reduce electronic component and occupy vehicle power supply unit's space through holding the chamber to through the cooperation heat dissipation of coolant liquid runner, can improve electronic component's such as inductance heat-sinking capability. Further, the service life of the vehicle-mounted power supply device is prolonged.

Drawings

Fig. 1 is a partial schematic view of a vehicle-mounted power supply apparatus according to an embodiment of the present application.

FIG. 2 is a partial schematic view of the in-vehicle power supply apparatus of FIG. 1 from another perspective

Fig. 3 is an exploded schematic view of the in-vehicle power supply apparatus of fig. 1.

Fig. 4 is a partial schematic view of the in-vehicle power supply device of fig. 1 with electronic components removed.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

The embodiment of the application provides a vehicle-mounted power supply device 10, and the vehicle-mounted power supply device 10 can optimize the installation of electronic components such as inductors and the like so as to reduce the space occupied by the electronic components in the vehicle-mounted power supply device 10. In addition, the heat dissipation capacity of electronic elements such as inductors and the like is improved by the matching heat dissipation of the cooling liquid flow channel; further, the service life of the in-vehicle power supply device 10 is improved.

As shown in fig. 1 to 4, the in-vehicle power supply apparatus 10 includes: a housing 100 and a plurality of electronic components 120. Wherein the housing 100 is substantially rectangular parallelepiped in shape, and a part of the rectangular parallelepiped housing 100 is illustrated in the drawing; however, the housing 100 may be substantially hemispherical or semi-ellipsoidal, or other shapes, as desired.

In one embodiment, the housing 100 has accommodating cavities 115 corresponding to the number of the electronic components 120, and the electronic components 120 are respectively disposed in the accommodating cavities 115. The electronic components 120 are separated by the accommodating cavities, so that each electronic component 120 can independently dissipate heat without being influenced by other electronic components 120 during operation; and the receiving cavity 115 can define a space occupied by the electronic component 120 to facilitate the installation of other electronic components 120.

It should be understood that in fig. 1 to 4, the electronic component 120 is illustrated by an inductive component as an example, but the type of the electronic component 120 should not be limited thereto.

In one embodiment, in order to further improve the heat dissipation capability of the electronic component 120, the housing 100 is provided with a cooling fluid channel 130 on the other side opposite to the accommodating cavity 115, and the cooling fluid channel 130 is used for flowing a cooling fluid (not shown). Heat generated by the plurality of electronic components 120 during operation is conducted to the cooling fluid channel 130 through the housing 100 and is carried away by the cooling fluid.

Wherein the cooling liquid is injected into the cooling liquid flow channel 130 from the outside, flows along the channel in the cooling liquid flow channel 130 to take away the heat generated when the electronic component 120 operates, and then is discharged out of the cooling liquid flow channel 130; thereby, the electronic component 120 or the accommodating cavity 115 has a relatively constant temperature to ensure the normal operation of the vehicle-mounted power supply device 10.

In some embodiments, as shown in fig. 1 to 4, the in-vehicle electronic device 10 is exemplarily provided with six accommodating cavities 115, and each accommodating cavity 115 accommodates one electronic component 120.

In one embodiment, the housing 100 includes a bottom wall 101 and a side wall 102. The side wall 102 surrounds the bottom wall 101, and the side wall 102 extends towards both the inner surface 1011 and the outer surface 1012 of the bottom wall 101 by a respective distance to form different structures. Specifically, the portion of the side wall 102 extending toward the inner surface 1011 of the bottom wall 101 forms an inner space 105 with the bottom wall 101, and the inner space 105 is the inside of the in-vehicle power supply device 10. The plurality of receiving cavities 115 are formed on the inner surface 1011 of the bottom wall 101 of the housing 100 and are located within the interior space 105. As shown in fig. 2, the coolant flow channel 130 is provided on one side of an outer surface 1012 of the bottom wall 101, that is, the coolant flow channel 130 is located outside the in-vehicle power supply apparatus 10 with respect to the internal space 105. Since the coolant enters and exits from the coolant flow channel 130, the coolant flow channel 130 is disposed outside the vehicle-mounted power supply device 10, so that on one hand, the electronic component failure caused by coolant leakage can be prevented; on the other hand, the coolant flow path 130 is convenient for an operator to inspect and maintain.

Wherein the length of the side wall 102 extending towards the inner surface 1011 and the outer surface 1012 of the bottom wall 101 may be the same or different. In some embodiments, the sidewall 102 extends a greater length toward the inner surface 1011 of the bottom wall 101 than the sidewall 102 extends toward the outer surface 1012 of the bottom wall 101.

In particular, the side wall 102 extends towards the inner surface 1011 of the bottom wall 101 for a greater length than the side wall 102 extends towards the outer surface 1012 of the bottom wall 101. Thereby making the volume of the inner space 105 larger than the volume of the coolant flow passage 130. The larger volume of the inner space 105 is used for accommodating various types of components (including the electronic components 120) and circuit boards, and the smaller volume of the coolant flow channel is used for carrying away heat generated by the components during operation, so that the inner space 105 has a relatively stable operating temperature and ensures the normal operation of the components.

As shown in fig. 1, in an embodiment, the bottom wall 101 is formed with a plurality of protrusions 111 formed by the protrusion of the outer surface 1012 towards the inner surface 1011; it should be understood that the convex portion 111 is a concave portion 111 formed by the bottom wall 101 being concave from the outer surface 1012 toward the inner surface 1011 and having an opening on the outer surface 1012 side and being convex on the inner surface 1011 side. The bottom wall 101 is further provided with a plurality of retaining walls 112 in the inner space 105; specifically, the plurality of retaining walls 112 are disposed on the inner surface 1011 of the bottom wall 101. The plurality of protrusions 111 and the plurality of retaining walls 112 are arranged in an array, and the protrusions 111, the retaining walls 112, the bottom wall 101 and the side walls 102 jointly enclose to form the plurality of accommodating cavities 115. Specifically, each of the protrusions 111 communicates with the coolant flow channel 130, and specifically, each of the protrusions 111 communicates with the coolant flow channel 130 through an opening provided on the outer surface 1012 side. And the cooling liquid flowing in from the cooling liquid flow passage 130 is provided inside each of the bosses 111. Based on this, the electronic component 120 can conduct heat to the coolant channel 130 and the outside through the protruding portion 111, the retaining wall 112, the bottom wall 101 and the side wall 102, so as to further enhance the heat dissipation effect of the electronic component 120.

Wherein the volume of the cooling liquid flow channel 130 is increased by the plurality of protrusions 111, and the capacity of the cooling liquid flow channel 130 for receiving cooling liquid is improved; accordingly, the distance required for the bottom wall 101 to conduct heat can be shortened by the coolant inside the boss 111, thereby improving the heat dissipation capability of the in-vehicle power supply apparatus 10.

Further, referring to fig. 1 and fig. 4, the retaining wall 112 is a plate-shaped structure fixedly disposed on the inner surface 1011 of the bottom wall 101, and the volume of the retaining wall 112 of the plate-shaped structure is smaller than that of the protrusion 111. Therefore, the vehicle-mounted power supply device 10 can achieve both the heat dissipation function of the electronic component 120 and the volume reduction of the electronic component 120 through the cooperation of the protruding portion 111 and the retaining wall 112.

In another embodiment, the bottom wall is formed with a plurality of protrusions 111 formed by the outer surface 1012 thereof protruding toward the inner surface 1011 thereof. Also, as described above, the convex portion 111 is a concave portion which is formed by recessing the bottom wall 101 from the outer surface 1012 toward the inner surface 1011 and has an opening on the outer surface 1012 side and is convex on the inner surface 1011 side. The plurality of protrusions 111 are arranged in an array, and form the plurality of accommodating cavities together with the bottom wall 101 and the side wall 102. The cooling liquid is provided on the outer surface 1012 side of the bottom wall 101 of the protruding portion 111, that is, the cooling liquid is provided in the recessed portion formed by the protruding portion 111.

Unlike the combination of the protruding portion 111 and the retaining wall 112 in the previous embodiment, this embodiment replaces the retaining wall 112 in the previous embodiment with the protruding portion 111, that is, the receiving cavity is formed by the protruding portion 111, the bottom wall 101 and the side wall 102. More specifically, in the middle region remote from the side wall 102, a receiving cavity is formed by enclosing a plurality of protrusions between and cooperating with the bottom wall 101, while in the region close to the side wall 102, a receiving cavity is formed by enclosing the protrusions with the side wall 102 and cooperating with the bottom wall 101. Therefore, the vehicle-mounted power supply device 10 has a stronger heat dissipation capability through the protruding portion 111, and timely takes away heat generated by the electronic component 120 during operation.

In some embodiments, the protrusion 111 formed by the bottom wall 101 being recessed toward the inner space 105 is integrally formed with the housing 100 by a process such as injection molding. The retaining wall 112 of the plate-shaped structure and the housing 100 are integrally formed through processes such as injection molding, or the retaining wall 112 of the plate-shaped structure is fixedly arranged on the inner surface 1011 of the bottom wall 101 through viscose connection and the like.

As shown in fig. 1, in one embodiment, the housing 100 is provided with a water inlet 141 and a water outlet 142. The water inlet 141 and the water outlet 142 are spaced apart from each other on a side of the sidewall 102 facing away from the inner space 105. The water inlet 141 and the water outlet 142 communicate with the coolant flow channel 130 through the sidewall 102. In order to reduce the space occupied by the water inlet 141 and the water outlet 142, the water inlet 141 and the water outlet 142 are arranged in the same direction in fig. 1 to 3; in addition, the water inlet 141 and the water outlet 142 may be disposed in different orientations.

Specifically, the water inlet 141 is used for allowing cooling liquid to enter the cooling liquid flow channel 130, and the water outlet 142 is used for allowing the cooling liquid to be discharged from the cooling liquid flow channel 130 to realize water-cooling heat dissipation.

As shown in fig. 2, in one embodiment, the housing 100 includes a retaining wall 155, and the retaining wall 155 is located on the outer surface 1012 side of the bottom wall 101. The retaining wall 155 surrounds the outer surface 1012 of the bottom wall 101, and the cooling fluid channel 130 having an opening (not shown) is formed in the bottom wall 101; the vehicle-mounted power supply apparatus 10 further includes a cover plate 150, and the opening formed by the retaining wall 155 and the bottom wall 101 is closed by the cover plate 150, thereby forming a closed coolant flow passage 130.

In another embodiment, the portion of the side wall 102 of the housing 100 extending toward the outer surface 1011 of the bottom wall 101 forms the coolant flow channel with an opening (not shown) with the bottom wall 101 of the housing 100, and the vehicle-mounted power device 10 further includes a cover plate 150. The cover plate 150 is used for covering the opening and covering the housing 100. Further, the coolant flow passage is formed to be closed between the cover plate 150 and the housing 100.

It should be understood that, under the condition of the same height, the cooling liquid channel formed by the limiting wall 155 and the bottom wall 101 has a smaller volume than the cooling liquid channel formed by the side wall 102 and the bottom wall 101, and the cooling liquid channel formed by the side wall 102 and the bottom wall 101 has a stronger heat dissipation capability, so that different cooling liquid channels can be selected according to the heat dissipation requirement.

In addition, the closed coolant flow channel realizes the circulation of the coolant in the coolant flow channel through the water inlet 141 and the water outlet 142, and the cover plate 150 can facilitate the inspection and maintenance of the coolant flow channel 130 by an operator.

Referring to fig. 3 and fig. 4, in an embodiment, the bottom wall 101 is provided with a threaded column 160 at an inner surface 1011 corresponding to the accommodating cavity 115, and the electronic component 120 is provided with a through hole 125; the screw post 160 is used to screw with a screw 170 passing through the through hole 125, so as to fix the electronic component 120 in the accommodating cavity 115.

In some embodiments, the vehicle-mounted power supply device 10 further includes a potting compound (not shown) for injecting the potting compound into the accommodating cavity 115 to encapsulate the electronic components 120 after each electronic component 120 is accommodated in the corresponding accommodating cavity 115.

Specifically, the electronic component 120 is fixed in the accommodating cavity 115 by the cooperation of the threaded column 160 and the screw 170, and the potting compound is injected into the accommodating cavity 115 to encapsulate the electronic component 120.

While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the application, and it is intended that such changes and modifications be covered by the scope of the application.

Claims

1. An in-vehicle power supply device characterized by comprising: a housing and a plurality of electronic components;

the shell is provided with a plurality of accommodating cavities corresponding to the number of the electronic elements, and the electronic elements are respectively arranged in the accommodating cavities;

the shell is provided with a cooling liquid flow channel at the other side back to the accommodating cavities, and the cooling liquid flow channel is used for cooling liquid to flow; the heat generated by the electronic components during operation is conducted to the cooling liquid flow channel through the shell and is taken away by the cooling liquid.

2. The vehicular electric power supply apparatus according to claim 1, wherein the case includes a bottom wall and a side wall; the side wall surrounds the bottom wall, corresponding distances extend towards the inner surface and the outer surface of the bottom wall, an inner space is formed between the part of the side wall extending towards the inner surface of the bottom wall and the bottom wall, and the accommodating cavities are formed on the inner surface of the bottom wall of the shell and located in the inner space; the coolant flow channel is located on one side of the outer surface of the bottom wall.

3. The vehicular electric power supply apparatus according to claim 2, wherein the bottom wall is formed with a plurality of convex portions that are convex from an outer surface thereof toward an inner surface thereof, wherein the plurality of convex portions communicate with the coolant flow passage; the plurality of bosses are arranged in an array, and the plurality of bosses, the bottom wall and the side wall jointly form the plurality of accommodating cavities.

4. The vehicular electric power supply apparatus according to claim 2, wherein the bottom wall is formed with a plurality of convex portions that are convex from the outer surface of the bottom wall toward the inner surface of the bottom wall, wherein the plurality of convex portions communicate with the coolant flow passage;

be equipped with a plurality of barricades on the diapire, a plurality of bellying and a plurality of the barricade is the array setting, and the bellying the barricade the diapire with the lateral wall forms jointly a plurality of chambeies that hold.

5. The vehicular electric power source device according to claim 2, wherein the case is provided with a water inlet and a water outlet; the water inlet and the water outlet are arranged on one side of the side wall opposite to the inner space at intervals, and penetrate through the side wall to be communicated with the cooling liquid flow channel;

the water inlet is used for supplying the cooling liquid to enter the cooling liquid flow channel, and the water outlet is used for supplying the cooling liquid to be discharged from the cooling liquid flow channel so as to realize water-cooling heat dissipation.

6. The vehicular power supply apparatus according to claim 5, wherein said case further comprises a stopper wall; the limiting wall is positioned on one side of the outer surface of the bottom wall and surrounds the bottom wall; the limiting wall and the bottom wall form the cooling liquid flow channel with an opening;

the vehicle-mounted power supply device further comprises a cover plate, and the cover plate is used for covering the opening and the shell, so that a closed cooling liquid flow channel is formed.

7. The vehicular electric power supply apparatus according to claim 5, wherein a portion of the side wall of the case that extends toward the outer surface of the bottom wall forms the coolant flow passage with the bottom wall of the case, the coolant flow passage having an opening, the vehicular electric power supply apparatus further comprising a cover plate; the cover plate is used for covering the opening and the shell, and therefore the closed cooling liquid flow channel is formed.

8. The vehicular power supply apparatus according to claim 2, wherein the bottom wall is provided with a threaded post on an inner surface corresponding to the accommodation chamber, and the electronic component is provided with a through hole; the threaded column is used for being in threaded connection with a screw penetrating through the through hole so as to fix the electronic component in the accommodating cavity.

9. The vehicular power supply device according to claim 1, further comprising a potting compound for injecting the potting chamber to encapsulate the electronic components after each of the electronic components is housed in the corresponding housing chamber.

10. The vehicular power supply apparatus according to claim 1, wherein the electronic component is an inductive component.