CN210072525U - Heat radiation structure applied to storage controller - Google Patents
Heat radiation structure applied to storage controller Download PDFInfo
- Publication number
- CN210072525U CN210072525U CN201920892000.5U CN201920892000U CN210072525U CN 210072525 U CN210072525 U CN 210072525U CN 201920892000 U CN201920892000 U CN 201920892000U CN 210072525 U CN210072525 U CN 210072525U
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- CN
- China
- Prior art keywords
- heat dissipation
- heating panel
- heat
- storage controller
- copper pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a be applied to storage controller's heat radiation structure, including two backup pads, two backup pads constitute the installing frame through four support columns, be provided with the installation cover on the support column, be provided with first heating panel through the copper pipe on the installation cover, be provided with storage controller between the first heating panel, the copper pipe is intraductal to inlay in first heating panel, be provided with first heat radiation structure on the copper pipe, the installing frame rear side is provided with the second heating panel, first heating panel passes through second heat radiation structure and is connected with the second heating panel, be provided with a plurality of fan mounting brackets on the second heating panel, be provided with the fan in the fan mounting bracket. The utility model discloses can absorb the heat that storage controller work produced fast and distribute away, guarantee the stable normal work of storage controller, and can adapt to the storage controller of different models size, easy to assemble, the practicality is strong.
Description
Technical Field
The utility model relates to a be applied to storage controller's heat radiation structure belongs to heat-radiating equipment technical field.
Background
The memory controller is a device that performs necessary control of memory access according to a certain timing rule, and includes control of address signals, data signals, and various command signals, so that the master device can use memory resources on the memory according to its own requirements.
The storage controller can produce a large amount of heat at the during operation, but current storage controller's heat abstractor radiating effect is unsatisfactory, and most models are fixed, are difficult to the storage controller of the different models size of adaptation, designs a heat radiation structure who is applied to storage controller now and solves above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a be applied to storage controller's heat radiation structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be applied to memory controller's heat radiation structure, includes two backup pads, and two backup pads constitute the installing frame through four spinal branch daggers, be provided with the installing cover on the support column, be provided with first heating panel through the copper pipe on the installing cover, be provided with memory controller between the first heating panel, the copper pipe is intraductal to inlay in first heating panel, be provided with first heat radiation structure on the copper pipe, the installing frame rear side is provided with the second heating panel, first heating panel passes through the second heat radiation structure and is connected with the second heating panel, be provided with a plurality of fan mounting brackets on the second heating panel, be provided with the fan in the fan mounting bracket, be provided with control switch in the bottom sprag board of installing frame, first heat radiation structure and fan and control switch electric connection, the last external connection line that is provided with.
Preferably, first heating panel includes copper, aluminum plate, copper pipe and heat conduction silica gel, copper and aluminum plate sealing connection, be provided with heat conduction silica gel on the copper, heat conduction silica gel and the sealed laminating of storage controller, the copper pipe is even embedded in aluminum plate.
Preferably, the first heat dissipation structure comprises an aluminum plate, the aluminum plate is arranged on the copper pipe on the first heat dissipation plate, a fan mounting frame is arranged on the aluminum plate, and a fan is arranged on the fan mounting frame.
Preferably, the second heat radiation structure includes slider, spout and heat conduction silica gel, the spout symmetry sets up on the second heating panel, the slider sets up on the copper pipe on first heating panel, the slider is installed in the spout, be provided with heat conduction silica gel on the slider, the slider is the copper billet.
Preferably, the mounting sleeve is provided with a fixing screw, and the rear side of the second heat dissipation plate is wave crest-shaped.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model relates to a be applied to storage controller's heat radiation structure absorbs the heat that storage controller work produced and transmits for first heat radiation structure and second heating panel through the first heat dissipation board that sets up for the heat distributes away fast, improves the radiating efficiency, guarantees storage controller's stable normal work.
The utility model discloses the distance can be adjusted to the first heating panel that sets up for the storage controller of co-altitude can be installed between first heating panel, and the storage controller of the different models size of adaptation is convenient for install. The utility model discloses simple structure, convenient operation, the practicality is strong.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a front view of the present invention;
fig. 3 is a side view of the present invention;
FIG. 4 is a distribution diagram of copper pipes on the first heat sink plate according to the present invention;
in the figure: 1. a support plate; 2. a support pillar; 3. installing a frame; 4. installing a sleeve; 5. a copper pipe; 6. a first heat dissipation plate; 7. a first heat dissipation structure; 8. a second heat dissipation plate; 9. a second heat dissipation structure; 10. a fan mounting bracket; 11. a fan; 12. a control switch; 13. an outer connecting wire; 14. a copper plate; 15. an aluminum plate; 16. heat conducting silica gel; 17. a storage controller; 18. a slider; 19. a chute; 20. and fixing the screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-4, the present invention provides a technical solution: a heat dissipation structure applied to a storage controller comprises two support plates 1, wherein the two support plates 1 form an installation frame 3 through four support columns 2, an installation sleeve 4 is arranged on each support column 2, a first heat dissipation plate 6 is arranged on each installation sleeve 4 through a copper pipe 5, a storage controller 17 is arranged between the first heat dissipation plates 6, the copper pipes 5 are embedded in the first heat dissipation plates 6, a first heat dissipation structure 7 is arranged on each copper pipe 5, a second heat dissipation plate 8 is arranged on the rear side of each installation frame 3, the first heat dissipation plates 6 are connected with the second heat dissipation plates 8 through second heat dissipation structures 9, a plurality of fan installation frames 10 are arranged on the second heat dissipation plates 8, fans 11 are arranged in the fan installation frames 10, a control switch 12 is arranged on the support plate 1 at the bottom end of each installation frame 3, and the first heat dissipation structures 7 and the fans 11 are electrically connected with the control switch 12, an external connecting wire 13 is arranged on the control switch 12.
Further, first heating panel 6 includes copper 14, aluminum plate 15, copper pipe 5 and heat conduction silica gel 16, copper 14 and aluminum plate 15 sealing connection, be provided with heat conduction silica gel 16 on the copper 14, heat conduction silica gel 16 and the sealed laminating of storage controller 17, copper pipe 5 is even embedded in aluminum plate 15.
Further, the first heat dissipation structure 7 includes an aluminum plate 15, the aluminum plate 15 is disposed on the copper pipe 5 on the first heat dissipation plate 6, the aluminum plate 15 is provided with a fan mounting bracket 10, and the fan mounting bracket 10 is provided with a fan 11.
Further, second heat radiation structure 9 includes slider 18, spout 19 and heat conduction silica gel 16, spout 19 symmetry sets up on second heating panel 8, slider 18 sets up on copper pipe 5 on first heating panel 6, slider 18 is installed in spout 19, be provided with heat conduction silica gel 16 on slider 18, slider 18 is the copper billet.
Further, a fixing screw 20 is arranged on the mounting sleeve 4, the second heat dissipation plate 8 is an aluminum plate 15, and the rear side of the second heat dissipation plate 8 is wave crest-shaped.
The working principle is as follows: the utility model relates to a be applied to heat radiation structure of storage controller, during the use, the position of the mounting sleeve 4 on the support column 2 in the adjustment installing frame 3 for the distance between the first heating panel 6 is fit for the height of storage controller 17, install storage controller 17 between first heating panel 6, make the heat conduction silica gel 16 on the first heating panel 6 tightly laminate on storage controller 17, fix the position of first heating panel 6 through the set screw 20 on the mounting sleeve 4, then switch on the outer connecting wire 13 on the control switch 12 the power; during operation, the heat conducting silica gel 16 on the first heat dissipation plate 6 transfers the heat generated by the operation of the memory controller 17 to the copper plate 14, the copper plate 14 absorbs heat quickly and transfers the absorbed heat to the aluminum plate 15 for heat dissipation, meanwhile, the copper pipe 5 embedded on the aluminum plate 15 transfers the heat to the first heat dissipation structure 7 and the second heat dissipation structure 9, the fan 11 in the first heat dissipation structure 7 and the fan 11 on the second heat dissipation plate 8 are turned on by the control switch 12, the aluminum plate 15 in the first heat dissipation structure 7 absorbs the heat on the copper pipe 5 and simultaneously dissipates the heat quickly under the action of the fan 11, the slide block 18 in the second heat dissipation structure 9 absorbs the heat of the copper pipe 5 and transfers the heat to the second heat dissipation plate 8 through the heat conducting silica gel 16, the heat dissipation speed can be accelerated through the wave crest structure of the second heat dissipation plate 8, and the heat dissipation efficiency is further improved by matching with the fan 11, the utility model discloses a heat dissipation, the radiating efficiency is improved, the installation of being convenient for simultaneously, can the not storage controller 17 of the different models size of adaptation, the practicality is strong.
It is worth noting that: the whole device is controlled by the master control button, and the equipment matched with the control button is common equipment, so that the device belongs to the existing well-known technology, and the electrical connection relation and the specific circuit structure of the device are not repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a be applied to heat radiation structure of storage controller which characterized in that: the heat dissipation device comprises two supporting plates (1), wherein the two supporting plates (1) form an installation frame (3) through four supporting columns (2), an installation sleeve (4) is arranged on each supporting column (2), a first heat dissipation plate (6) is arranged on each installation sleeve (4) through a copper pipe (5), a storage controller (17) is arranged between the first heat dissipation plates (6), the copper pipes (5) are embedded in the first heat dissipation plates (6), a first heat dissipation structure (7) is arranged on each copper pipe (5), a second heat dissipation plate (8) is arranged on the rear side of the installation frame (3), the first heat dissipation plates (6) are connected with the second heat dissipation plates (8) through second heat dissipation structures (9), a plurality of fan installation frames (10) are arranged on the second heat dissipation plates (8), fans (11) are arranged in the fan installation frames (10), and control switches (12) are arranged on the bottom supporting plates (1) of the installation frame (3), the first heat dissipation structure (7) and the fan (11) are electrically connected with the control switch (12), and an external connecting wire (13) is arranged on the control switch (12).
2. The heat dissipation structure applied to the memory controller according to claim 1, wherein: first heating panel (6) include copper (14), aluminum plate (15), copper pipe (5) and heat conduction silica gel (16), copper (14) and aluminum plate (15) sealing connection, be provided with heat conduction silica gel (16) on copper (14), heat conduction silica gel (16) and storage controller (17) are sealed to be laminated, copper pipe (5) are evenly embedded in aluminum plate (15).
3. The heat dissipation structure applied to the memory controller according to claim 1, wherein: first heat radiation structure (7) include aluminum plate (15), aluminum plate (15) set up on copper pipe (5) on first heating panel (6), be provided with fan mounting bracket (10) on aluminum plate (15), be provided with fan (11) on fan mounting bracket (10).
4. The heat dissipation structure applied to the memory controller according to claim 1, wherein: second heat radiation structure (9) include slider (18), spout (19) and heat conduction silica gel (16), spout (19) symmetry sets up on second heating panel (8), slider (18) set up on copper pipe (5) on first heating panel (6), install in spout (19) slider (18), be provided with heat conduction silica gel (16) on slider (18), slider (18) are the copper billet.
5. The heat dissipation structure applied to the memory controller according to claim 1, wherein: be provided with set screw (20) on installation cover (4), second heating panel (8) are aluminum plate (15), second heating panel (8) rear side is the crest form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920892000.5U CN210072525U (en) | 2019-06-13 | 2019-06-13 | Heat radiation structure applied to storage controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920892000.5U CN210072525U (en) | 2019-06-13 | 2019-06-13 | Heat radiation structure applied to storage controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210072525U true CN210072525U (en) | 2020-02-14 |
Family
ID=69457518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920892000.5U Expired - Fee Related CN210072525U (en) | 2019-06-13 | 2019-06-13 | Heat radiation structure applied to storage controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210072525U (en) |
-
2019
- 2019-06-13 CN CN201920892000.5U patent/CN210072525U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 |