CN210072478U - Protective structure for memory bank and slot of desktop computer - Google Patents

Protective structure for memory bank and slot of desktop computer Download PDF

Info

Publication number
CN210072478U
CN210072478U CN201920476332.5U CN201920476332U CN210072478U CN 210072478 U CN210072478 U CN 210072478U CN 201920476332 U CN201920476332 U CN 201920476332U CN 210072478 U CN210072478 U CN 210072478U
Authority
CN
China
Prior art keywords
memory
slot
mainboard
memory bank
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920476332.5U
Other languages
Chinese (zh)
Inventor
席毅林
林嘉
彭娜芬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang Jiayan Technology Co Ltd
Original Assignee
Nanchang Jiayan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang Jiayan Technology Co Ltd filed Critical Nanchang Jiayan Technology Co Ltd
Priority to CN201920476332.5U priority Critical patent/CN210072478U/en
Application granted granted Critical
Publication of CN210072478U publication Critical patent/CN210072478U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model belongs to the technical field of computer hardware, concretely relates to protective structure of desktop computer memory and slot, protective structure includes: the hardware unit comprises a mainboard, a memory slot and a memory bank; the memory slot is arranged on the mainboard and is electrically connected with the mainboard; the end part of the memory bank is inserted into the memory slot, and the memory bank is electrically connected with the memory slot at the connecting position; the contact sealing tape covers a seam between the memory and the memory slot, the upper edge of the contact sealing tape is tightly attached to the surface of the memory strip, and the lower edge of the contact sealing tape extends to the mainboard and is suitable for wrapping a gap between the memory strip and the memory slot; the surface sealing part is arranged on the outer surface of the memory bank; and the bottom sealing part covers a gap between the contact sealing belt and the main board. The circuit connection structure of each part in the hardware unit is hermetically isolated from the outside through the structure, so that the structure has excellent performance of normally working in a high-humidity environment.

Description

Protective structure for memory bank and slot of desktop computer
Technical Field
The utility model belongs to the technical field of computer hardware, concretely relates to protective structure of desktop computer memory and slot.
Background
For the computer of convenient configuration different demands, desktop computer's DRAM corresponds the connection through the memory slot with the circuit board mostly, therefore desktop computer's DRAM and memory slot contact are arranged densely, the space in the memory slot deposits steam easily in humid environment, steam condenses when ambient temperature is low, easily form the short circuit between the contact, probably lead to other devices on memory and the mainboard to damage when serious, consequently need protect above-mentioned structure, with the situation of avoiding appearing components and parts damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a protective structure of desktop computer DRAM and slot to avoid using the desktop computer situation that components and parts damage appears easily in humid environment.
The utility model provides a protective structure of desktop computer memory strip and slot, include: the hardware unit comprises a mainboard, a memory slot and a memory bank; the memory slot is arranged on the mainboard and is electrically connected with the mainboard; the end part of the memory bank is inserted into the memory slot, and the memory bank is electrically connected with the memory slot at the connecting position; the contact sealing tape covers a seam between the memory and the memory slot, the upper edge of the contact sealing tape is tightly attached to the surface of the memory strip, and the lower edge of the contact sealing tape extends to the mainboard and is suitable for wrapping a gap between the memory strip and the memory slot; the surface sealing part is arranged on the outer surface of the memory bank; and the bottom sealing part covers a gap between the contact sealing belt and the mainboard.
In the above-described protective structure for a memory stick and a slot of a desktop computer, it is further preferable that the face seal covers an upper edge of the contact seal tape.
The protection structure for memory banks and slots of desktop computers as described above further preferably further includes a memory chip, and the memory chip is packaged on the memory bank.
In the above protective structure for a memory bank and a slot of a desktop computer, it is further preferable that a gap is formed between the memory chip and the outer surface of the memory bank, and a glue filling portion is disposed at the periphery of the gap and adapted to seal the gap.
The utility model discloses still disclose desktop computer memory strip and slot's protective structure's processing method for the protective structure of processing desktop computer memory strip and slot, including following step: s1: preprocessing, installing the memory strip packaged with the memory chip into a memory slot of a mainboard to obtain a hardware unit; s2: the contact protection is realized by adopting an insulating waterproof adhesive tape to tightly wrap the seam between the memory strip and the memory slot in the hardware unit in the S1 so as to form a contact sealing tape; s3: surface protection, namely coating the exposed outer surface of the memory bank and the edge of the contact seal tape on the surface of the memory bank by using pouring sealant to form a surface sealing part; s4: and bottom seam protection, namely coating the connecting position of the memory slot and the mainboard and the edge of the contact sealing tape on the surface of the memory slot by using pouring sealant to form a bottom sealing part.
In the method for processing the protection structure of the memory bank and the slot of the desktop computer, step S1 preferably includes: s11: packaging protection, namely coating the memory strip packaged with the memory chip with a tearable shielding adhesive to obtain an integrated memory strip; s12: encapsulating and protecting, namely encapsulating a gap between the memory chip and the memory bank in the integrated memory bank by using an encapsulating adhesive in a heating environment to ensure that the atmospheric pressure in the gap is smaller than the outside atmospheric pressure to form an encapsulating part; s13: assembling, namely assembling the memory slot and the mainboard, removing the tearable shielding glue on the surface of the integrated memory strip, and installing the integrated memory strip into the memory slot to obtain the hardware unit.
In the method for processing the protective structure for the memory bank and the slot of the desktop computer, it is further preferable that the potting adhesive is a two-component organic resin potting adhesive.
The processing method of the protective structure for the memory bank and the slot of the desktop computer further preferably selects that the viscosity of the two-component organic resin pouring sealant is not less than 1000 mpa.s.
In the method for processing the protective structure for the memory bank and the slot of the desktop computer, it is further preferable that the width of the insulating waterproof tape in step S2 is 8-10mm, and the thickness of the insulating waterproof tape is 0.2-0.5 mm.
Compared with the prior art, the utility model has the following advantage:
the utility model discloses an above-mentioned structure and processing technology are completely airtight isolated with desktop computer memory strip and slot electronic circuit part and external, do not influence each electronic components heat dissipation simultaneously to make above-mentioned structure possess can be under the high humid environment excellent performance of normal work. The utility model provides an it is the flexible body to irritate behind gluey portion, contact sealing strip, face seal portion and the solidification of end seal portion, demolish easily and do not harm components and parts, can help the maintenance and the change of later stage chip.
Drawings
Fig. 1 is a cross-sectional view of a protective structure for memory banks and slots of a desktop computer according to the present invention;
fig. 2 is a schematic structural diagram of a protection structure of a memory bank and a slot of a desktop computer according to the present invention;
fig. 3 is a flow chart of the processing method of the protection structure for memory bank and slot of the middle desktop computer of the present invention;
fig. 4 is a flowchart of the processing method of the protection structure for the memory bank and the slot of the middle desktop computer of the present invention.
Description of reference numerals:
1-mainboard, 2-memory slot, 3-memory bank, 4-memory chip, 5-golden finger, 6-contact sealing tape, 7-surface sealing part, 8-bottom sealing part, 9-glue pouring part and 10-periphery sealing part.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-2, the protection structure for memory banks and slots of a desktop computer disclosed in this embodiment includes: the hardware unit comprises a mainboard 1, a memory slot 2 and a memory bank 3; the memory slot 2 is installed on the mainboard 1 and is electrically connected with the mainboard 1; the end part of the memory bank 3 is inserted into the memory slot 2, and the contact of the memory bank 3 is electrically connected with the contact of the memory slot 2; the contact sealing tape 6 covers a seam between the memory and the memory slot 2, the upper edge of the contact sealing tape 6 is tightly attached to the surface of the memory strip 3, and the lower edge of the contact sealing tape extends to the mainboard 1 and is suitable for sealing the memory strip 3 and the memory slot 2; the surface sealing part 7 is arranged on the outer surface of the memory bank 3; and the bottom sealing part 8 is used for covering the gap between the contact sealing belt 6 and the main board 1.
Preferably, the face seal 7 covers the edge of the contact seal 6.
Further, a memory chip 4 is mounted on the memory bank 3, and the memory chip 4 is packaged on the memory bank 3; a gap is arranged between the memory chip 4 and the outer surface of the memory bank 3, a glue filling part 9 is arranged on the periphery of the gap, and the glue filling part 9 is suitable for sealing the gap.
The protection structure in this embodiment can be conveniently applied to a narrow memory bank 3 (single-sided narrow common bank) without a heat sink and with a memory chip 4 soldered on the same side of the memory bank 3, and the memory bank 3 with an auxiliary heat sink or a heat dissipation vest needs to be processed after the auxiliary heat sink or the heat dissipation vest is removed, and then the auxiliary heat sink and the heat dissipation vest are replaced after the protection structure is processed.
In the above structure, the glue filling portion 9 is adapted to completely and airtightly isolate the gap between the memory chip 4 and the memory bank 3 from the outside, and the gap and the outside air form a negative pressure to further enhance the effect of completely and airtightly isolating from the outside. The contact seal belt 6 is suitable for sealing a gap between the memory bank 3 and the memory slot 2 in the hardware unit, and water vapor is prevented from invading an electric connection part between the memory bank 3 and the memory slot 2 from the gap. The surface sealing part 7 is arranged on the outer surface of the memory bank 3, and particularly, the surface sealing part 7 positioned in the middle of the memory bank 3 is suitable for covering electronic components with exposed surfaces of the memory bank 3 and is combined with the glue filling part 9 to form a whole; the height of the whole body does not exceed 1mm of the height of the upper surface of the memory chip 4, so that the memory chip 4 or other components higher than the memory chip 4 are not covered. When the memory bank 3 is mounted with an auxiliary heat sink or a heat dissipation vest, the height of the upper surface of the whole formed by the surface sealing part 7 and the encapsulating part 9 should not be higher than the height of the upper surface of the memory chip 4. The edge of the face seal 7 covers the contact seal 6 on the memory stripe 3, and is suitable for providing enhanced protection for the contact seal 6, and further improving the air-isolating effect. The arrangement of the face seal 7 is suitable for isolating the memory bank 3 and the memory chips 4 and other components arranged on the memory bank 3 from water vapor. The bottom sealing portion 8 is adapted to seal the gap between the memory card and the motherboard 1, and also seal the edge of the contact sealing tape 6, so as to provide enhanced protection for the contact sealing tape 6. This application is through the setting of contact banding 6, face seal portion 7, underseal portion 8 and encapsulating portion 9 promptly, makes electronic circuit connection position between mainboard 1, memory slot 2, memory strip 3 and the memory chip 4 keeps apart with the complete airtight of outside air in the hardware unit, and then makes the hardware unit can normally work under the supersaturated extreme environment of vapor.
As shown in fig. 3-4, further, the present embodiment also discloses a processing method for the above desktop computer memory bank 3 and the protection structure of the slot, where the processing method includes the following steps:
s1: preprocessing, installing a memory bank 3 packaged with a memory chip into a memory slot 2 of a mainboard 1 to obtain a hardware unit;
s2: the contact protection is carried out, wherein an insulating waterproof adhesive tape is adopted to cover the seam between the memory strip 3 and the memory slot 2 of the hardware unit in the S1, so as to form a contact sealing tape 6;
s3: surface protection, namely coating the outer surface of the memory bank 3 and the edge of the contact seal tape 6 on the surface of the memory bank 3 by using pouring sealant to form a surface sealing part 7;
s4: and bottom seam protection, namely coating the connecting position of the memory slot 2 and the mainboard 1 and the edge of the contact sealing tape 6 on the surface of the memory slot 2 by using pouring sealant to form a bottom sealing part 8.
Further, step S1 includes:
s11: packaging protection, namely coating the memory strip 3 packaged with the memory chip 4 with a tearable shielding adhesive, and curing the memory strip to obtain an integrated memory strip 3;
s12: encapsulating and protecting, namely encapsulating a gap between the memory chip 4 in the integrated memory strip 3 and the memory strip 3 by using an encapsulating adhesive to ensure that the atmospheric pressure in the gap is smaller than the outside atmospheric pressure to form an encapsulating part;
s13: assembling the memory slot 2 and the mainboard 1, removing the tearable masking glue on the surface of the integrated memory strip 3, and installing the integrated memory strip 3 into the memory slot 2 to obtain a hardware unit.
The method comprises the assembly and protection of a hardware structure, because most of the purchased integrated memory banks are packaged with memory chips, the assembly part is that the memory banks 3 are correspondingly installed with the mainboard 1 through the memory slots 2, and the protection of the structure is divided into two parts, one part is the protection of the structure between the memory chips 4 and the memory banks 3, and the other part is the protection of the structure between the memory banks 3 and the mainboard 1.
Therefore, step S11 of step S1 is performed to remove the sticker and the label on the integrated memory bank and remove the auxiliary heat sink or the heat dissipation vest disposed on the memory bank 3. And then coating the memory strip 3 packaged with the memory chip 4 with a tearable shielding adhesive, specifically coating the contact part (golden finger 5) of the memory strip 3 and the bayonet parts at two ends of the memory strip 3 with the tearable shielding adhesive so as to prevent the contamination of a protective material from influencing the normal use of the product. The adopted tearable masking adhesive should satisfy the condition of no residue peeling and need to maintain the working performance under a certain heating condition. Specifically, the temperature resistance of the tearable shielding adhesive can meet the requirement of one hour of exposure at 120 ℃, and the tearable shielding adhesive is a material which is universal in the industry and can be directly obtained by purchase.
Then, step S12 is performed, a potting adhesive is used to pot and seal the gap between the memory chip 4 and the memory bar 3 in the integrated memory bar 3, so that the atmospheric pressure in the gap is smaller than the outside atmospheric pressure, and a potting part is formed; specifically, the gap can be filled and sealed in a heating state, so that the gap is in a negative pressure state, and meanwhile, the solidification of the filling and sealing part is facilitated, wherein the heating temperature is the upper limit temperature of the hardware unit in a working state at room temperature, for example, the filling is carried out in an environment of 80 ℃.
And step S13, removing the tearable masking tape, assembling the integrated memory stripe 3, the memory slot 2 and the motherboard 1 together, checking that the connection is good and the memory works normally, and completing step S1.
In step S1, the packaging, protection, and hardware unit assembly between the memory chip 4 and the memory bank 3 are completed, and then steps S2, S3, and S4 are performed in sequence.
In step S2, the insulating and waterproof tape is mainly silicone or other functional tape, and besides insulating and waterproof, the tape is flexible, has no adhesive residue when peeled off, and has a certain heat dissipation property. When the memory strip is pasted, the lower edge of the insulating waterproof adhesive tape extends along the surface of the memory slot 2 to cover the position close to the mainboard 1, the upper edge is tightly attached to the surface of the memory strip 3, and meanwhile, in order to enable the insulating waterproof adhesive tape to be tightly attached to the bonding surface at the corner as far as possible, the adopted insulating waterproof adhesive tape also has the characteristic of thin thickness. Preferably, the glass fiber substrate blue film white organic silicon double-sided heat conduction adhesive tape with the width of 8-10mm and the thickness of 0.2-0.5mm is selected in practical operation.
In step S3, coating the outer surface of the memory bank 3 and the edge of the contact sealing tape 6 on the surface of the memory bank 3 with a potting adhesive to form a surface sealing portion 7; the pouring sealant not only covers the gap between the contact sealing tape 6 and the memory bar 3, but also covers other components welded on the surface of the memory bar 3 and exposed except the memory chip 4. Besides the insulating, waterproof and heat-conducting properties, the adopted pouring sealant is not too hard after being cured, so that the pouring sealant can be conveniently removed when the memory needs to be repaired or replaced. In addition, in order to prevent the glue solution from permeating into the golden finger 5 to contaminate the contact due to capillary action, the viscosity of the used potting glue is more than 1000mPa.s (empirical reference value, upper limit of viscosity of three-proofing paint). Preferably, the engineering chooses the RTVS189 two-component silicone resin pouring sealant, which is the cured RTVS189(A/B) silicone elastomer, which is supplied as a two-component suit material and consists of A, B two-component liquid components, wherein when the two components are mixed by 1: when the weight ratio or the volume ratio of 1 is fully mixed, the mixed liquid can be solidified into a flexible elastomer.
In step S4, a potting adhesive is used to cover the lower edge of the contact tape and the gap between the memory slot 2 and the paper board, so as to form a bottom sealing portion 8 structure. And finally, covering other gaps on the peripheries of the buckles at the two ends of the memory slot 2 by using insulating waterproof heat-conducting silica gel to form a peripheral sealing part 10 structure. The performance requirements of the bottom sealing part 8 and the peripheral sealing part 10 are the same as those of the surface sealing part 7, and RTVS189 two-component silicone resin pouring sealant is selected in engineering. And the golden finger 5 part of the memory bank 3 and the contact part of the memory slot 2 are completely isolated from the outside in an airtight way, and the protection process is finished.
The protection process completely and airtightly isolates the memory bank of the desktop computer and the electronic circuit part of the memory slot thereof from the outside, and simultaneously does not influence the heat dissipation of each electronic component. Through tests, the hardware unit treated by the protection process can normally work in a water vapor supersaturation environment with the relative humidity of 100% and liquid dewing in the air. Meanwhile, the protective materials selected in the processing technology of the hardware unit protective structure can be removed, and the protective components are not damaged in the processes of removing the protective process and implementing the protective process, so that the product repair is not influenced. Meanwhile, the process has no special structural requirements on the protected components, is suitable for various existing commercially available memory products, and is also suitable for small-batch customized processing.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (4)

1. The utility model provides a protective structure of desktop computer memory strip and slot which characterized in that includes:
the hardware unit comprises a mainboard, a memory slot and a memory bank; the memory slot is arranged on the mainboard and is electrically connected with the mainboard; the end part of the memory bank is inserted into the memory slot, and the memory bank is electrically connected with the memory slot at the connecting position;
the contact sealing tape covers a seam between the memory and the memory slot, the upper edge of the contact sealing tape is tightly attached to the surface of the memory strip, and the lower edge of the contact sealing tape extends to the mainboard and is suitable for wrapping a gap between the memory strip and the memory slot;
the surface sealing part is arranged on the outer surface of the memory bank;
and the bottom sealing part covers a gap between the contact sealing belt and the mainboard.
2. The desktop computer memory bank and slot guard structure of claim 1, wherein the face seal covers an upper edge of the contact seal.
3. The desktop computer memory bank and socket guarding structure according to claim 2, further comprising a memory chip, wherein the memory chip is packaged on the memory bank.
4. The protective structure for the memory bar and the slot of the desktop computer as claimed in claim 3, wherein a gap is formed between the memory chip and the outer surface of the memory bar, and a glue filling portion is disposed at the periphery of the gap and adapted to seal the gap.
CN201920476332.5U 2019-04-09 2019-04-09 Protective structure for memory bank and slot of desktop computer Active CN210072478U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920476332.5U CN210072478U (en) 2019-04-09 2019-04-09 Protective structure for memory bank and slot of desktop computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920476332.5U CN210072478U (en) 2019-04-09 2019-04-09 Protective structure for memory bank and slot of desktop computer

Publications (1)

Publication Number Publication Date
CN210072478U true CN210072478U (en) 2020-02-14

Family

ID=69436362

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920476332.5U Active CN210072478U (en) 2019-04-09 2019-04-09 Protective structure for memory bank and slot of desktop computer

Country Status (1)

Country Link
CN (1) CN210072478U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110058657A (en) * 2019-04-09 2019-07-26 南昌嘉研科技有限公司 The safeguard structure and processing method of a kind of desktop computer memory bar and slot

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110058657A (en) * 2019-04-09 2019-07-26 南昌嘉研科技有限公司 The safeguard structure and processing method of a kind of desktop computer memory bar and slot
CN110058657B (en) * 2019-04-09 2024-03-08 南昌嘉研科技有限公司 Protection structure of memory bar and slot of desktop computer and processing method

Similar Documents

Publication Publication Date Title
JP2815324B2 (en) Chip carrier having a single encapsulant and method of forming
US5355016A (en) Shielded EPROM package
KR100263723B1 (en) Flexible film semiconductor package
EP0689243B1 (en) Semiconductor device assembly
TWI462193B (en) Fingerprint sensor chip package method and its package structure
JPH01206658A (en) Packaged electronic device having circumferential carrier structures made of different materials
JPH0846098A (en) Equipment and method for forming direct heat conduction path
JPS6436496A (en) Carrier element incorporated into identification card
CN210072478U (en) Protective structure for memory bank and slot of desktop computer
TW201820569A (en) Fingerprint recognition module and manufacturing method thereof
US5956601A (en) Method of mounting a plurality of semiconductor devices in corresponding supporters
CN107464792A (en) Thin film flip chip packaging structure
CN105989364A (en) Method for manufacturing sensing device
CN205670301U (en) Water-fastness electronic tag
CN110058657B (en) Protection structure of memory bar and slot of desktop computer and processing method
US20230309237A1 (en) Packaging structure, lens module, and electronic device
JP2009260260A (en) Semiconductor device, and method of manufacturing the same
US20200152482A1 (en) Semiconductor device and method for producing the semiconductor device
CN211236920U (en) Fingerprint identification chip packaging module, fingerprint identification module and electronic equipment
JP2007160915A (en) Mounting method of flash memory card
CN216925891U (en) Waterproof barometer
CN212113688U (en) Chip packaging structure and electronic equipment
CN209674374U (en) A kind of solid state hard disk and slot safeguard structure
JP2003086925A (en) Printed board with moisture-proofing structure and its manufacturing method
JPH0870057A (en) Hybrid ic

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant