CN210072005U - Chip fusing control structure and fusing jig - Google Patents
Chip fusing control structure and fusing jig Download PDFInfo
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- CN210072005U CN210072005U CN201920665748.1U CN201920665748U CN210072005U CN 210072005 U CN210072005 U CN 210072005U CN 201920665748 U CN201920665748 U CN 201920665748U CN 210072005 U CN210072005 U CN 210072005U
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Abstract
A chip fusing control structure and a fusing jig. The chip fusing control structure comprises: a first regulated power supply; a second regulated power supply; a relay having an input terminal, a ground terminal, a normally open terminal, a common terminal, and a normally closed terminal; the input end is connected with the first voltage-stabilized power supply; the grounding end is grounded; a fuse circuit comprising a plurality of conductive thimble; the fuse protection circuit comprises a chip to be fused, a fuse protection circuit and a control circuit, wherein the chip to be fused is provided with a first fuse control pin, a second fuse control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through the conductive thimble, the second fusing control pin is connected to the public end through the conductive thimble, and the input pin is connected to the second voltage-stabilizing power supply.
Description
Technical Field
The utility model relates to a chip fusing field especially relates to a chip fusing control structure and fusing tool.
Background
Some platform schemes need to fuse a chip download port and the like before the chip module leaves a factory, so as to protect software contained in the chip from being illegally tampered or read. For example, after a high level is added outside a specific pin, a chip such as a single chip microcomputer MCU or a CPU can blow a fuse wire inside through generated current, so that a program in the chip becomes unreadable and can only run, and the fusing function plays a role.
When fusing, a fusing jig is generally required to be connected with the GPIO terminal of the chip, and a rising edge or a falling edge is output to trigger the relevant chip die to fuse the corresponding PIN (PIN PIN) so as to fuse the download port. However, at the moment when the chip module is just powered on, the output state of the GPIO terminal is uncontrollable, which causes false triggering and leads to abnormal fusing.
For more details on the conventional method for preventing the chip fuse from being blown out by mistake, refer to the chinese patent application CN 106443399A.
SUMMERY OF THE UTILITY MODEL
The utility model provides a problem provide a chip fusing control structure to prevent the chip from triggering the unusual fusing that leads to by mistake, prevent the mistake fusing of chip promptly.
In order to solve the above problem, the utility model provides a chip fusing control structure, include: a first regulated power supply; a second regulated power supply; a relay having an input terminal, a ground terminal, a normally open terminal, a common terminal, and a normally closed terminal; the input end is connected with the first voltage-stabilized power supply; the grounding end is grounded; a fuse circuit comprising a plurality of conductive thimble; the fuse protection circuit comprises a chip to be fused, a fuse protection circuit and a control circuit, wherein the chip to be fused is provided with a first fuse control pin, a second fuse control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through the conductive thimble, the second fusing control pin is connected to the public end through the conductive thimble, and the input pin is connected to the second voltage-stabilizing power supply.
In order to solve the above problem, the utility model provides another kind of chip fusing control structure, include: a regulated power supply; a relay having an input terminal, a ground terminal, a normally open terminal, a common terminal, and a normally closed terminal; the input end is connected with the stabilized voltage power supply; the grounding end is grounded; a fuse circuit comprising a plurality of conductive thimble; the fuse protection circuit comprises a chip to be fused, a fuse protection circuit and a control circuit, wherein the chip to be fused is provided with a first fuse control pin, a second fuse control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through the conductive thimble, and the second fusing control pin is connected to the common end through the conductive thimble; a low dropout linear regulator having a power input terminal, a regulated output terminal, a first ground terminal, and a second ground terminal; the power supply input end is connected with the stabilized voltage power supply, and the stabilized voltage output end is connected with the input pin; the first grounding end is grounded; the second grounding end is connected with the grounding pin through the conductive thimble.
In order to solve the problem, the utility model also provides a fusing tool, include as above chip fusing control structure.
Optionally, the fusing jig comprises a supporting base, a lower base plate, a mold carrying disc, a supporting frame, a pressing plate, a pressing spring and a pressing handle; the lower cushion plate is fixed on the working table surface of the supporting base, and the conductive thimble protrudes out of the surface of the lower cushion plate; the mould carrying disc is provided with a working carrying position, the mould carrying disc is arranged on the lower base plate in a lifting manner, a through hole is formed in the periphery of the working carrying position of the mould carrying disc, and when the mould carrying disc descends, the conductive thimble can protrude from the through hole; the pressing plate is arranged on the pressing spring, and the pressing spring is sleeved on the guide rod of the support frame; the handle is fixed on the pressing plate through a rotating connection structure.
Optionally, the relay is fixed on the left side surface or the right side surface of the supporting base.
Optionally, the relay is fixed to the side of the supporting base by screws.
Optionally, the low dropout regulator is located beside the support frame.
Optionally, the front side of the supporting base is further provided with a power switch and a reset switch, the power switch is a ship-shaped switch, and the reset switch is a button-type switch.
Optionally, a communication serial port is further arranged on the right side face or the left side face of the supporting base.
Optionally, the work table of the supporting base is further provided with a first binding post and a second binding post.
The utility model discloses in one of them aspect of technical scheme, the relay passes through the fusing circuit, realizes and treats the corresponding connection of fusing chip, and the first fusing control pin of treating fusing chip promptly passes through electrically conductive thimble is connected to the end of opening always of relay, and the second fusing control pin of treating fusing chip is connected to the common port of relay through electrically conductive thimble. Under the whole circuit structure, the first fusing control pin and the second fusing control pin of the chip to be fused are disconnected by default, and the chip to be fused can be tested in various ways. Subsequently, the fuse circuit can be powered on (powered on), and the power-on signal can trigger the normally open end and the common end of the relay through the corresponding conductive thimble (i.e., make the normally open end and the common end be conducted), at this moment, two fuse pins (a first fuse control pin and a second fuse control pin) of the chip to be fused are closed. After the electric signal really used for fusing is transmitted through the conductive thimble, the first fusing control pin and the second fusing control pin of the chip to be fused can be fused. With such a structure, the function of preventing erroneous fusing can be achieved.
Drawings
FIG. 1 is a schematic diagram of a chip fuse control structure in the embodiment;
FIG. 2 is a diagram of a chip fuse control structure in another embodiment;
FIG. 3 is a schematic view of an exemplary embodiment of a fuse fixture;
FIG. 4 is a schematic view of another angle of the fuse fixture in the embodiment;
FIG. 5 is a schematic view of the fusing tool without the lower pad and the die carrier pressed together and the product module placed thereon;
FIG. 6 is a schematic view showing the fusing jig in which the lower pad and the die carrier are pressed together without a product module being placed;
FIG. 7 is a schematic view showing the lower pad and the mold carrier in the fusing jig, and the product module is placed thereon.
Detailed Description
The problem of false fusing exists in current chip fusing control structure, for this reason, inventor designs a new chip fusing control structure to solve the not enough of current existence.
For a clearer illustration, the present invention will be described in detail with reference to the accompanying drawings.
An embodiment of the present invention provides a chip fusing control structure, as shown in fig. 1. It includes first regulated power supply 110, second regulated power supply 120, relay 130, fusing circuit 140 and chip 150 to be fused.
The input terminal of relay 130 is connected to first regulated power supply 110. The ground terminal of the relay 130 is grounded.
The fuse circuit 140 includes a plurality of conductive pins, not shown in fig. 1, which can be referred to in the following embodiments. The fuse circuit 140 also serves as a fuse circuit, and in the present embodiment, a corresponding fuse current can be provided.
The chip to be blown 150 has a first blow control pin (GPO 0 in the chip to be blown 150), a second blow control pin (PROG _ cause in the chip to be blown 150), an input pin (VIN in the chip to be blown 150), and a ground pin (GND in the chip to be blown 150). In order to make the chip 150 to be blown undergo the corresponding test and blowing, the input pin of the chip 150 to be blown is connected to the second regulated power supply 120.
The first fuse control pin of the chip 150 to be fused is connected to the normally open end of the relay 130 through the conductive thimble, and the second fuse control pin of the chip 150 to be fused is connected to the common end of the relay 130 through the conductive thimble. In this connection, relay 130 is instead open by default, rather than closed. The normally open and common terminals of relay 130 are closed only after waiting for a subsequent corresponding trigger signal. With the circuit structure, the chip 150 to be blown can be prevented from being blown by mistake due to false triggering. In contrast, this circuit configuration enables the normally open terminal and the common terminal of the trigger relay 130 to be closed by applying a corresponding trigger signal after waiting for the corresponding test to be completed, and then the corresponding fuse to be blown.
In this embodiment, the voltage of the first regulated power supply 110 may be 5V, and the voltage of the second regulated power supply 120 may be 4V.
In this embodiment, the relay 130 may be a digital display, adjustable relay integrating power cycle, and a multifunctional delay relay triggered by high and low levels. The specific product can be a relay with the certificate number of 2015010304817074 of cloud electronics limited of Dongguan city. Depending on the characteristics of the relay 130, it may be that the normally open end and the common end are closed within a period of time after receiving the trigger signal, and the specific time may be, for example, 4 seconds, or may be more than 5 seconds.
In the chip fuse control structure provided by this embodiment, the relay 130 is connected to the chip 150 to be fused through the fuse circuit, that is, the first fuse control pin of the chip 150 to be fused is connected to the normally open end of the relay 130 through the conductive thimble, and the second fuse control pin of the chip 150 to be fused is connected to the common terminal of the relay 130 through the conductive thimble. In cooperation with other circuit structures shown in fig. 1, the first fuse control pin and the second fuse control pin of the chip 150 to be fused are disconnected by default under the whole circuit structure, and at this time, various tests are performed on the chip 150 to be fused. Subsequently, the fuse circuit 140 may be powered on (i.e., powered on), and this power-on signal can trigger (i.e., make conductive) the normally-open end and the common end of the relay 130 through the corresponding conductive pins, at this time, two fuse pins (the first fuse control pin and the second fuse control pin) of the chip 150 to be fused are closed. After that, after the electric signal for fusing is transmitted through the conductive thimble, the first fusing control pin and the second fusing control pin of the chip 150 to be fused can be fused. This shows that the above structure can prevent erroneous fusing.
The embodiment of the present invention provides still another chip fusing control structure, please refer to fig. 2, which includes: a regulated power supply 210; a relay 220, the relay 220 having an input terminal (VIN), a ground terminal (GND), a normally open terminal (IO1), a common terminal (IO) and a normally closed terminal (IO 2); the input end of the relay 220 is connected with the regulated power supply 210; the ground terminal of the relay 220 is grounded; a fuse circuit 230, the fuse circuit 230 including a plurality of conductive pins (not shown, please refer to the corresponding contents of the subsequent embodiments); the chip 240 to be fused is provided with a first fusing control pin, a second fusing control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through a conductive thimble, and the second fusing control pin is connected to the common end through a conductive thimble; a low dropout regulator 250, the low dropout regulator 250 having a power input terminal, a regulated output terminal, a first ground terminal and a second ground terminal; the power input end is connected with a stabilized voltage power supply 210, and the stabilized voltage output end is connected with an input pin; the first grounding end is grounded; the second grounding end is connected with the grounding pin through the conductive thimble.
In this embodiment, the voltage of the regulated power supply 210 may be 5V.
In this embodiment, the relay 220 may be a digital display, adjustable, integrated power and cycle relay, and is a multi-functional delay relay triggered by high and low levels. The specific product can be a relay with the certificate number of 2015010304817074 of cloud electronics limited of Dongguan city.
In this embodiment, the principle of preventing false fusing of the corresponding circuit is basically the same as that of fig. 1. The difference is that in FIG. 2, a low dropout linear regulator 250 is employed to convert regulated power supply 210 to a power supply that can be used by the fuse chip 240, thereby omitting another regulated power supply. This can also be directly compared with fig. 1. This way, not only is another power supply omitted, but also, after passing through the low dropout regulator 250, the power supply provided to the chip 240 to be blown is more stable. Namely, the low dropout regulator 250 ensures that the voltage and current supplied by the regulated power supply 210 to the chip 240 to be blown can be stabilized.
The utility model also provides a fusing tool, fusing tool can include as above figure 1 and the shown arbitrary chip fusing control structure of figure 2. The embodiment is specifically described with the chip fusing control structure shown in fig. 2.
The fuse fixture includes a chip fuse control structure (circuit structure) corresponding to the embodiment shown in fig. 2, and please refer to fig. 3 and fig. 4 for further structure. FIG. 3 is a schematic view of an embodiment of a fuse fixture, and FIG. 4 is a schematic view of another angle of the fuse fixture.
As shown in fig. 3 and 4, the fusing jig of the present embodiment includes a supporting base 9, a lower pad 5, a mold tray 4, a supporting frame 12 (see fig. 4), a pressing plate 2, a pressing spring 10, and a pressing handle 1. Fig. 3 shows that the die tray 4 is used to place a chip 3 to be fused (corresponding to the chip 240 to be fused in fig. 2), and the chip 3 to be fused may be a communication module (chip) or the like. Fig. 4 shows that the fuse fixture further has a first terminal 13 and a second terminal 14 on the working platform of the supporting base 9. Fig. 4 also shows that the relay 11 (corresponding to the relay 220 in fig. 2) and the low dropout regulator 15 (corresponding to the low dropout regulator 250 in fig. 2) of the fusing jig are located beside the supporting frame 12.
Fig. 3 also shows that the upper surface of the support base 9 is rectangular, i.e. the support base 9 has a rectangular work surface. Correspondingly, the supporting base 9 also has four sides. The front side (front side) of the supporting base 9 is further provided with a power switch 6 and a reset switch 7, wherein the power switch 6 is a boat-shaped switch, and the reset switch is a button switch (tact switch). And the right side of the supporting base 9 is also provided with a communication serial port 8, and the communication serial port 8 is used for communication connection with other related equipment. In other embodiments, a communication serial port may be provided on the left side surface of the supporting base.
As shown in fig. 4, the relay 11 (corresponding to the relay 220 in fig. 2) is fixed to the left side surface of the supporting base 9 (note that fig. 4 shows the back surface and the left side surface of the supporting base 9). In other embodiments, the relay may be disposed on the right side of the support base or elsewhere.
As shown in fig. 4, in this embodiment, the relay is fixed to the side surface of the supporting base by screws. This manner of attachment is directly effective.
Referring to fig. 3 and 4, the support frame 12 is a generic term that includes a plurality of structures. The pressing handle 1 is matched with a corresponding structure on the support frame 12 to form a mechanism capable of driving the pressing plate 2 to press downwards. The pressing handle 1 is connected to the pressing plate 2 through a corresponding mechanism, so that the pressing plate 2 can be driven to move up and down, and refer to fig. 3 specifically.
Referring to fig. 3, the lower pad 5 is a flat hexahedron, the lower pad 5 is fixed on the table top of the supporting base 9, and the supporting frame 12 is fixed beside the lower pad 5, please refer to fig. 5, fig. 6 and fig. 7, the conductive thimble 51 of the fusing circuit 230 (please refer to fig. 2) protrudes out of the surface of the lower pad 5.
Referring to fig. 3, the pressing plate 2 is disposed on the pressing spring 10, and the pressing spring 10 is sleeved on a guide rod (not labeled) of the supporting frame 12.
As can be seen from fig. 3, 5, 6 and 7, the mold carrier 4 has a work loading position 40 (see fig. 5), and the mold carrier 4 is arranged on the lower mat 5 in a liftable manner. The mold carrier 4 has through holes (not labeled) around the active sites 40 through which conductive pins 51 protrude when the mold carrier 4 is lowered, and in particular fig. 6, shows the pins 51 protruding from the through holes. And fig. 7 shows the situation that the chip 3 to be fused is placed behind the working loading position 40.
It should be noted that, as shown in fig. 5 and 7, it can be specifically seen how the mold carrier 4 is arranged on the lower mat 5 so as to be able to rise and fall. In particular by means of a spring (not shown) fitted over the support bar 50. The support bar 50 is fixed to the rectangular work surface of the support base 9 and passes through a corresponding slot (not labeled) in the lower backing plate 5. The mould carrier 4 is arranged on top of the spring and the mould carrier 4 also has corresponding holes (not labelled) through which the support rods 50 pass. With this configuration, the die tray 4 may be depressed by pressure or may be returned to its original shape by being rebounded and raised after the external force is removed.
The number of the support rods 50 may be two, or three or more. The number of the corresponding slotted holes and holes is equal to the number of the supporting rods 50.
Fig. 5, 6 and 7 further show that a notch 41 is formed on the side of the working loading position 40 of the mold carrying plate 4, and the notch 41 is provided to facilitate the picking and placing of the chip 3 to be fused.
Fig. 4 shows that the low dropout regulator 15 is located beside the support frame 12.
In this embodiment, a positive electrode of a regulated power supply (not shown in fig. 3 to 7, please refer to fig. 2) is connected to the first terminal 13, and a negative electrode of the regulated power supply is connected to the second terminal 14. Specifically, the regulated power supply may have positive and negative poles connected to first and second terminals 13 and 14 by wires with clips (the respective wires and clips are not shown in fig. 3 and 4).
According to the above, the fusing jig provided by the embodiment can be used for testing the chip to be fused, can be used for fusing the chip to be fused, and can prevent mistaken fusing.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention, and the scope of the present invention is defined by the appended claims.
Claims (10)
1. A chip fusing control structure, comprising:
a first regulated power supply;
a second regulated power supply;
a relay having an input terminal, a ground terminal, a normally open terminal, a common terminal, and a normally closed terminal; the input end is connected with the first voltage-stabilized power supply; the grounding end is grounded;
a fuse circuit comprising a plurality of conductive thimble;
the fuse protection circuit comprises a chip to be fused, a fuse protection circuit and a control circuit, wherein the chip to be fused is provided with a first fuse control pin, a second fuse control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through the conductive thimble, the second fusing control pin is connected to the public end through the conductive thimble, and the input pin is connected to the second voltage-stabilizing power supply.
2. A chip fusing control structure, comprising:
a regulated power supply;
a relay having an input terminal, a ground terminal, a normally open terminal, a common terminal, and a normally closed terminal; the input end is connected with the stabilized voltage power supply; the grounding end is grounded;
a fuse circuit comprising a plurality of conductive thimble;
the fuse protection circuit comprises a chip to be fused, a fuse protection circuit and a control circuit, wherein the chip to be fused is provided with a first fuse control pin, a second fuse control pin, an input pin and a grounding pin; the first fusing control pin is connected to the normally-open end through the conductive thimble, and the second fusing control pin is connected to the common end through the conductive thimble;
a low dropout linear regulator having a power input terminal, a regulated output terminal, a first ground terminal, and a second ground terminal; the power supply input end is connected with the stabilized voltage power supply, and the stabilized voltage output end is connected with the input pin; the first grounding end is grounded; the second grounding end is connected with the grounding pin through the conductive thimble.
3. A fusing jig, comprising the chip fusing control structure of claim 1 or 2.
4. The fusing jig of claim 3, wherein the fusing jig comprises a supporting base, a lower backing plate, a mold carrying disc, a supporting frame, a pressing plate, a pressing spring and a pressing handle;
the lower cushion plate is fixed on the working table surface of the supporting base, and the conductive thimble protrudes out of the surface of the lower cushion plate;
the mould carrying disc is provided with a working carrying position, the mould carrying disc is arranged on the lower base plate in a lifting manner, a through hole is formed in the periphery of the working carrying position of the mould carrying disc, and when the mould carrying disc descends, the conductive thimble can protrude from the through hole;
the pressing plate is arranged on the pressing spring, and the pressing spring is sleeved on the guide rod of the support frame;
the handle is fixed on the pressing plate through a rotating connection structure.
5. The fusing jig of claim 4, wherein the relay is fixed to the left side or the right side of the supporting base.
6. The fusing jig of claim 5, wherein the relay is fixed to the side of the supporting base by screws.
7. The fuse fixture of claim 6, wherein the LDO is located beside the support frame.
8. The fusing jig of claim 7, wherein the front side of the supporting base further comprises a power switch and a reset switch, the power switch is a boat-type switch, and the reset switch is a button-type switch.
9. The fusing jig of claim 8, wherein a communication serial port is further provided on the right side or the left side of the supporting base.
10. The fusing jig of any one of claims 4 to 9, wherein the working table of the supporting base further has a first terminal and a second terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920665748.1U CN210072005U (en) | 2019-05-10 | 2019-05-10 | Chip fusing control structure and fusing jig |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920665748.1U CN210072005U (en) | 2019-05-10 | 2019-05-10 | Chip fusing control structure and fusing jig |
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| CN210072005U true CN210072005U (en) | 2020-02-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112630628A (en) * | 2021-03-08 | 2021-04-09 | 上海伟测半导体科技股份有限公司 | Fuse device and method for polysilicon process fuse |
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2019
- 2019-05-10 CN CN201920665748.1U patent/CN210072005U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112630628A (en) * | 2021-03-08 | 2021-04-09 | 上海伟测半导体科技股份有限公司 | Fuse device and method for polysilicon process fuse |
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