CN210065919U - Back plate assembly and CVD (chemical vapor deposition) cavity - Google Patents

Abstract

The utility model belongs to the technical field of electronic equipment processing, concretely relates to back plate assembly and CVD cavity for CVD processing cavity. The utility model provides a back plate component for CVD processing cavity, including electrode backplate and heating element. Through this heating element, can heat the electrode backplate, carry out heat-conduction through the electrode backplate to whole CVD processing cavity for carry into the F ion in the cavity when wasing and keep higher temperature, maintain the reactivity, thereby improve F ion utilization efficiency.

Description

Back plate assembly and CVD (chemical vapor deposition) cavity

Technical Field

The utility model belongs to the technical field of electronic equipment processing, concretely relates to back plate assembly and CVD cavity for CVD processing cavity.

Background

In the Plasma Enhanced Chemical Vapor Deposition (PECVD) process, the deposit on the inner wall of a deposition chamber is accumulated along with the increase of the using times to form a deposition film layer, when the deposition film layer reaches a certain thickness, the deposition film layer is easy to fall off to cause particle pollutants,this will affect the surface cleanliness of the product, which in turn affects the product characteristics and subsequent packaging quality. Therefore, after a certain period of PECVD process operation, the chamber wall film needs to be cleaned by remote plasma cleaning (RPSC) technique, which works by ionizing NF₃F ions are generated and then conveyed into the chamber, and the film layer is cleaned by utilizing thermochemical reaction. However, since the F ions reach the chamber with a long stroke and a large volume, the F ions are rapidly lost in heat, and a large amount of F ions are spontaneously reduced into molecules without having to carry out a cleaning reaction, which not only results in a large amount of NF₃The problems of poor cleaning effect, overlong cleaning time, energy waste and the like can be caused due to failure and waste.

Therefore, how to actually improve the F ion utilization efficiency during cleaning is a technical problem that has not been solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome among the prior art vapor deposition cavity when wasing, the lower defect of F ion utilization ratio, and then provide a back plate subassembly and CVD cavity for the CVD cavity.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a backing plate assembly for a CVD chamber, the backing plate assembly comprising an electrode backing plate and a heating assembly connected to the electrode backing plate for heating the electrode backing plate.

The heating assembly comprises a heating plate and a heating lamp tube used for heating the heating plate, and the heating plate is attached to the upper surface of the electrode back plate.

The upper surface refers to the surface of the electrode back plate far away from the cavity.

The heating assembly comprises a temperature sensor arranged on the heating plate.

The heating temperature of the heating lamp tube is less than or equal to 400 ℃.

The temperature sensor is electrically connected with the heating lamp tube.

Also included is a cooling assembly for the electrode backing plate and the heating assembly.

The cooling assembly comprises a cooling fan arranged on the heating plate, and the cooling fan is electrically connected with the controller.

The cooling assembly comprises a cooling plate, a cavity is arranged in the cooling plate, and circulating water is filled in the cavity.

The cooling assembly further comprises a vent hole formed in the electrode back plate.

A CVD chamber comprises the back plate assembly.

Compared with the prior art, the above technical scheme of the utility model have following advantage:

1. the utility model provides a back plate component for CVD processing cavity, including electrode backplate and heating element. Through this heating element, can heat the electrode backplate, carry out heat-conduction through the electrode backplate to whole CVD processing cavity for carry into the F ion in the cavity when wasing and keep higher temperature, maintain the reactivity, thereby improve F ion utilization efficiency.

2. The utility model provides a backplate subassembly, its heating element can be including laminating in the hot plate of electrode backplate upper surface and be used for the heating fluorescent tube to the hot plate heating, heat the hot plate earlier through the heating pipe, heat the electrode backplate by the hot plate that the temperature rose again, can make the electrode backplate intensification more stable, even, are favorable to the whole synchronous intensification of cavity, reach the better effect that keeps the F ion reactivity who gets into the cavity.

3. The utility model provides a backplate subassembly can also be provided with temperature sensor, controller and cooling module to can control cavity heating temperature, ensured that the F ion can be in a suitable temperature range, furthest improves the F ion utilization ratio, and be convenient for make electrode backplate and cavity resume initial temperature fast after accomplishing the washing. The cooling assembly can be selected in an air cooling or water cooling mode, for example, a cooling fan or a cooling plate with a cavity cooled by circulating water can be selected as the cooling assembly according to the actual requirement of a production line. In order to be more beneficial to temperature reduction, through holes can be further formed in the motor back plate, air circulation is increased, and cooling is promoted.

The utility model provides a backplate subassembly can adopt the hot plate of an organic whole setting, can set up radiator fan, vent and heating fluorescent tube simultaneously on this hot plate, and the hot plate of this kind of integral type changes in realizing the modularization equipment, also changes in reequiping current cavity to the best cavity improvement effect is obtained to minimum cost.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a view of a heating assembly provided in a preferred embodiment of the present invention.

Wherein the reference numerals are as follows:

101-a heating plate; 102-heating the lamp tube; 103-a temperature sensor; 104-a controller; 105-a vent; 106-radiator fan.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the term "upper" refers to the surface of the electrode back plate away from the cavity, and the heating plate is disposed on the surface of the electrode back plate away from the cavity, so as to facilitate the uniform temperature rise of the cavity, rather than indicating or suggesting that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "connected" and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

FIG. 1 shows that the utility model provides a pair of structure of heating element in implementation mode, this heating element can set up in the electrode backplate when using and keep away from one side of cavity, and its effect is to heat the electrode backplate through heating element, makes the electrode backplate carry out heat-conduction to whole deposit cavity to make the F ion that gets into in the cavity keep higher temperature, according to the formula

Where M is the mass of the ion, V is the velocity of the ion, K is the Boltzmann constant, and T is the temperature of the ion.

From the above formula, as the temperature T increases, the speed of the ions V can be increased to maintain the activity thereof, and therefore, when the temperature of the F ions is kept high, the activity thereof is also correspondingly increased, so that the utilization efficiency of the F ions is greatly improved.

The heating assembly structure comprises a heating plate attached to the upper surface of the electrode back plate, and the heating plate can be integrally formed.

In one embodiment, the heating assembly includes a heating plate 101 on which heating lamps 102 are laid, and the heating lamps 102 may be laid uniformly in order to make the heating temperature uniform, and the heating temperature of the heating lamps 102 is less than or equal to 400 degrees in consideration of the temperature-bearing capacity of the electrode back plate.

The heating assembly further comprises a temperature sensor 103, and the temperature sensor 103 can be arranged on the heating plate to monitor the temperature of the heating plate 101. The heating assembly further comprises a controller 104, the controller 104 is electrically connected with the temperature sensor 103 and the heating lamp tube 102, before the F ions are introduced, when the temperature sensor 103 is lower than a preset temperature, the controller 104 controls the heating lamp tube 102 to start heating, when the temperature sensor 103 reaches the preset temperature, the F ions are introduced for cleaning, and after the cleaning is finished, the controller 104 controls the heating lamp tube 102 to stop heating.

Preferably, the temperature sensor 103 may also be disposed on the electrode backing plate, so as to more accurately monitor the actual temperature in the chamber. Through setting up temperature sensor 103 and controller 104, guaranteed that F ion can be in a suitable temperature range, further improve its utilization efficiency, this application does not do the position of temperature sensor specifically and restricts.

Certainly, the utility model provides a backplate subassembly also can choose the heating element of other forms for use, for example through the hot water layer or set up to electromagnetic induction heating etc. as long as can realize the heating to electrode backplate and cavity can, too much restriction is not done to its concrete form to this application.

In one embodiment, the backing plate assembly further comprises a temperature reduction assembly, wherein the temperature reduction assembly can enable the heating plate, the electrode backing plate and the chamber to return to normal temperature as soon as possible after the F ions are cleaned in the chamber.

Preferably, the cooling subassembly includes ventilation hole 105 and radiator fan 106, and ventilation hole 105 can set up the both ends at the hot plate, and radiator fan can set up the central authorities at the hot plate, and like this when setting up the radiator fan in hot plate central authorities and dispel the heat, the interior gas of cavity takes away the interior heat of cavity through the vent emergence flow, realizes rapid cooling.

Specifically, the vent 105 and the heat dissipation fan 106 may also be disposed at other positions of the heating plate or disposed on the electrode back plate, which is not specifically limited in this application, as long as both can take away the heat in the chamber, so as to achieve the purpose of rapid cooling.

In a further embodiment, the cooling assembly further comprises a cooling plate, which may be disposed on a side of the heating plate remote from the chamber. The inside cavity that specifically can be provided with of cooling plate holds modes such as circulating water through the cavity and realizes, and its and radiator fan jointly use can accelerate cooling rate, and faster recovery production improves production efficiency. The hot plate that this embodiment provided is when using, before carrying out the cavity washing, at first utilizes this heating element to heat electrode backplate and cavity to utilize temperature sensor and controller to control heating temperature, reach required temperature after, the rethread F ion, just so can be so that the F ion that gets into the cavity remains heating temperature all the time, maintains clean activity, improves clean efficiency and improves F ion utilization ratio. It should be noted that the ions introduced into the chamber in the present application may also be other ions as long as the ions can clean the chamber, the F ions mentioned in the embodiments are only a preferred solution, and any ions introduced into the chamber as long as the ions can improve the activity under the action of the backing plate assembly in the present application are within the protection scope of the present application.

After the cleaning is completed, the chamber is cooled by at least one of a fan, a vent or a cooling plate to allow the electrode backing plate to return to the initial temperature more quickly.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (8)

1. The back plate assembly is used for a CVD (chemical vapor deposition) cavity and is characterized by comprising an electrode back plate and a heating assembly, wherein the heating assembly is connected with the electrode back plate and used for heating the electrode back plate, the heating assembly comprises a heating plate, a temperature sensor arranged on the heating plate and a heating lamp tube used for heating the heating plate, and the heating plate is attached to the upper surface of the electrode back plate.

2. The backplate assembly of claim 1, wherein the heating temperature of the heating lamp is less than or equal to 400 degrees.

3. The back plate assembly of claim 2, further comprising a controller electrically connected to the temperature sensor and the heating light tube.

4. The backing plate assembly of claim 3 further comprising a temperature reduction assembly for the electrode backing plate and the heating assembly.

5. The backplate assembly of claim 4, wherein the cooling assembly comprises a heat dissipation fan disposed on the heating plate, and the heat dissipation fan is electrically connected to the controller.

6. A backplate assembly according to claim 4 in which the cooling assembly comprises a cooling plate having a cavity therein, the cavity containing circulating water.

7. The backplate assembly of claim 4, wherein the cooling assembly further comprises a vent disposed on the electrode backplate.

8. A CVD chamber comprising the backing plate assembly of any of claims 1-7.