CN210050592U

CN210050592U - Laminated packaging structure of LED lighting chip

Info

Publication number: CN210050592U
Application number: CN201920576046.6U
Authority: CN
Inventors: 刘茜茜; 林毛毛; 谢杏梅; 李小东
Original assignee: Sichuan Suining Lipuxin Microelectronic Co Ltd
Current assignee: Sichuan Suining Lipuxin Microelectronic Co Ltd
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2020-02-11
Anticipated expiration: 2029-04-25

Abstract

The utility model discloses a LED illumination chip stromatolite packaging structure, including the encapsulation platform, the arch is all installed to splint and rectangular pipe's lower extreme one side, and is two sets of there are chip A and chip B swing joint respectively in the rectangular pipe, viscidity is connected with DAF film between chip A and the chip B and glues, chip A viscidity is connected on the lead frame, first hot-blast main, second hot-blast main and rubber coating pipe are installed to the encapsulation platform. The utility model discloses a scribble the glue pipe and scribble resin glue on the lead frame, glue through first hot-blast main and second hot-blast main and air-dry resin glue and DAF film, use the DAF film as chip laminating agent, this kind of method need change raw and other materials, replace traditional blue glue with DAF film adhesive tape, the back is accomplished to the mounting, the DAF film just sticks together with the chip, we only need paste the chip to the lead frame when the paster process on, no longer need scribble the blue glue of one deck at the lead frame, this has just simplified technology greatly.

Description

Laminated packaging structure of LED lighting chip

Technical Field

The utility model relates to a LED lamp technical field specifically is a LED illumination chip stromatolite packaging structure.

Background

Stacked chip packages are becoming the mainstream of technology development. The package technology of stacked chips, referred to as 3D package for short, is a package technology in which two or more chips are stacked in a vertical direction in the same package without changing the size of the package. The main characteristics of the 3D packaging technology include: the stacked chip package is the mainstream of the development of the packaging technology, because it conforms to the trend of the development of the packaging technology, namely: high capacity, high density, multiple functions and low cost. Compared with the traditional single-chip packaging technology, the method breaks through the limitation of realizing large capacity, high density, multiple functions and low cost by simply replacing the packaging type, and enables some packaging types which seem to be outdated to be renewed due to the appearance of the laminated technology.

At present, a single chip production process needs to be completed by secondary mounting, secondary baking and primary lead bonding, but the packaging volume is large, and the effect of packaging miniaturization cannot be achieved. Therefore, the LED lighting chip laminated packaging structure is provided.

Disclosure of Invention

An object of the utility model is to provide a LED illumination chip stromatolite packaging structure uses the DAF film as the chip laminating agent, and this kind of method need change raw and other materials, replaces traditional blue glue with DAF film adhesive tape, and the back is accomplished to the mounting, and the DAF film has just glued together with the chip, and on we only need pasted the chip to the lead frame when the paster process, no longer need scribble the blue glue of one deck at the lead frame to propose the great problem of encapsulation volume in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED illumination chip stromatolite packaging structure, includes the encapsulation platform, the rectangular pipe is installed at the top of encapsulation platform, and is two sets of the cylinder body is installed to one side of rectangular pipe, install the spring in the cylinder body, the limiting plate is installed to the one end of spring, one side fixedly connected with gangbar of limiting plate, the one end fixedly connected with splint of gangbar, the arch is all installed to splint and lower extreme one side of rectangular pipe, and is two sets of there are chip A and chip B in the rectangular pipe swing joint respectively, it glues to be connected with the DAF film between chip A and the chip B, chip A adhesive linkage is on the lead frame, first hot-blast main, second hot-blast main and rubber coating pipe are installed to the encapsulation platform.

Preferably, the first hot air pipe and the second hot air pipe are installed on a hot air blower through pipelines, and the hot air blower is installed on the packaging table.

Preferably, the packaging table is rotatably provided with a roller shaft, and the roller shaft is tangent to the roller shaft.

Preferably, one side of the two groups of rectangular tubes is provided with an observation port, and a PVC transparent plate is arranged in the observation port.

Preferably, a baffle is installed on one side of the top of the packaging table.

Preferably, the bottom of the packaging table is provided with four groups of supporting legs.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an install two sets of rectangular pipes at the encapsulation platform, place chip A and chip B in two sets of rectangular pipes respectively, the spring pressurization splint in the cylinder body fixes the chip in the rectangular pipe, in the time of the encapsulation, do benefit to and discharge the chip of below, be convenient for the lamination encapsulation between lead frame, chip A and the chip B;

2. the utility model discloses a scribble the glue pipe and scribble resin glue on the lead frame, glue through first hot-blast main and second hot-blast main and air-dry resin glue and DAF film, use the DAF film as chip laminating agent, this kind of method need change raw and other materials, replace traditional blue glue with DAF film adhesive tape, the back is accomplished to the mounting, the DAF film just sticks together with the chip, we only need paste the chip to the lead frame when the paster process on, no longer need scribble the blue glue of one deck at the lead frame, this has just simplified technology greatly.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the area A in FIG. 1;

FIG. 3 is an enlarged view of the area B in FIG. 1;

fig. 4 is a schematic view of the mounting structure of the lead frame, the chip a and the chip B of the present invention.

In the figure: the device comprises a packaging table 1, a rectangular tube 2, a cylinder 3, a spring 4, a limiting plate 5, a linkage rod 6, a clamping plate 7, a protrusion 8, a first hot air tube 9, a glue coating tube 10, a chip A11, a chip B12, a DAF film glue 13, a second hot air tube 14, an observation port 15, a roller shaft 16, a hot air blower 17, a baffle 18, supporting legs 19 and a lead frame 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a LED illumination chip stromatolite packaging structure, includes encapsulation platform 1, rectangular pipe 2 is installed at the top of encapsulation platform 1, and is two sets of cylinder body 3 is installed to one side of rectangular pipe 2, install spring 4 in the cylinder body 3, limiting plate 5 is installed to the one end of spring 4, one side fixedly connected with gangbar 6 of limiting plate 5, the one end fixedly connected with splint 7 of gangbar 6, protruding 8 is all installed to splint 7 and rectangular pipe 2's lower extreme one side, and this arch 8 is favorable to restricting the chip in rectangular pipe 2, places the chip and drops at will, and is two sets of respectively swing joint has chip A11 and chip B12 in the rectangular pipe 2, viscidity is connected with DAF film adhesive 13 between chip A11 and the chip B12, chip A11 viscidity is connected on lead frame 20, first hot-blast main 9, second hot-blast main 14 and rubber coating pipe 10 are installed to encapsulation platform 1, the glue tube 10 has resin glue therein for easy application to the lead frame 20.

Specifically, the first hot air duct 9 and the second hot air duct 14 are installed on a hot air blower 17 through a pipeline, and the hot air blower 17 is installed on the package platform 1. The hot air blower 17 blows out hot air, and the hot air dries the resin adhesive and the DAF film adhesive 13 through the first hot air duct 9 and the second hot air duct 14, thereby improving the fixity of the chip a11 and the chip B12.

Specifically, a roller 16 is rotatably mounted on the packaging table 1, and the roller 16 is tangent to the roller 16. The roller 16 facilitates the movement of the lead frame 20 on the encapsulating station 1.

Specifically, two sets of viewing aperture 15 has all been seted up to one side of rectangular pipe 2, install the PVC transparent plate in viewing aperture 15. The observation port 15 is convenient for observing the number of chips in the rectangular tube 2 and is convenient for timely supplement.

Specifically, a baffle 18 is installed on one side of the top of the packaging table 1. The stop 18 is useful for limiting the position of the lead frame 20 on the package table 1.

Specifically, the bottom of the packaging table 1 is provided with four sets of support legs 19, and the support legs 19 are provided with four sets. The four sets of legs 19 contribute to the overall stability.

The working principle is as follows: when the device is used, the chip A11 and the chip B12 are respectively placed in the two groups of rectangular tubes 2, the spring 4 in the cylinder 3 pressurizes the clamping plate 7 to fix the chip in the rectangular tubes 2, resin glue is coated on the lead frame 20 through the glue coating tube 10 during packaging, then the lead frame 20 is moved to the lower portion of the rectangular tubes 2, the chip A11 is extruded, the lowermost chip A11 is adhered to the lead frame 20, the resin glue is dried through the first hot air tube 9, then the DAF film glue 13 is placed on the chip A11, the lead frame 20 is moved to the lower portion of the rectangular tubes 2, the chip B12 is pressurized, the lowermost chip B12 is adhered to the chip A11, and then the DAF film glue 13 is dried through the second hot air tube 14, so that the lamination packaging among the lead frame 20, the chip A11 and the chip B12 is facilitated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED illumination chip stromatolite packaging structure, includes encapsulation platform (1), its characterized in that: rectangular pipe (2) is installed at the top of encapsulation platform (1), and is two sets of cylinder body (3) are installed to one side of rectangular pipe (2), install spring (4) in cylinder body (3), limiting plate (5) are installed to the one end of spring (4), one side fixedly connected with gangbar (6) of limiting plate (5), one end fixedly connected with splint (7) of gangbar (6), arch (8) are all installed to lower extreme one side of splint (7) and rectangular pipe (2), and are two sets of in rectangular pipe (2) respectively swing joint have chip A (11) and chip B (12), viscidity is connected with DAF film adhesive (13) between chip A (11) and chip B (12), chip A (11) viscidity is connected on lead frame (20), first hot-blast main (9)'s (9) are installed in encapsulation platform (1), A second hot air pipe (14) and a glue coating pipe (10).

2. The LED lighting chip stack package structure of claim 1, wherein: the first hot air pipe (9) and the second hot air pipe (14) are arranged on a hot air blower (17) through pipelines, and the hot air blower (17) is arranged on the packaging table (1).

3. The LED lighting chip stack package structure of claim 1, wherein: a roll shaft (16) is rotatably mounted on the packaging table (1), and the roll shaft (16) are tangent.

4. The LED lighting chip stack package structure of claim 1, wherein: two sets of viewing aperture (15) have all been seted up to one side of rectangular pipe (2), install the PVC transparent plate in viewing aperture (15).

5. The LED lighting chip stack package structure of claim 1, wherein: and a baffle (18) is arranged on one side of the top of the packaging table (1).

6. The LED lighting chip stack package structure of claim 1, wherein: the bottom of encapsulation platform (1) is installed landing leg (19), landing leg (19) are provided with four groups.