CN210042367U - Electromagnetic band gap power supply layer structure applied to high-speed packaging system - Google Patents

Electromagnetic band gap power supply layer structure applied to high-speed packaging system Download PDF

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CN210042367U
CN210042367U CN201920399145.1U CN201920399145U CN210042367U CN 210042367 U CN210042367 U CN 210042367U CN 201920399145 U CN201920399145 U CN 201920399145U CN 210042367 U CN210042367 U CN 210042367U
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李尔平
左盼盼
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Haining Leyi Electronic Technology Co Ltd
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Abstract

The utility model discloses an electromagnetic band gap power supply layer structure for in high-speed packaging system. The power supply layer is etched with an EBG structure, and the EBG structure comprises four EBG basic units which are arranged in a field-shaped manner and are rotationally symmetrical along the circumference; in each basic unit, four corners of the peripheral edge of the square patch are connected with the inner edge of the square frame-shaped patch through respective inner branch structures, the outer edge of the square frame-shaped patch is connected with an outer branch structure, the outer edge of the square frame-shaped patch is connected with a grafting structure, each EBG basic unit is connected with an adjacent EBG basic unit through a connecting branch structure, and the connecting branch structure is mainly formed by connecting 2-shaped metal sheets and 5-shaped metal sheets which are mirror-symmetrical. The utility model discloses can satisfy the degree of depth SSN suppression of broadband in the high frequency range, electromagnetism layer structural design is novel, simple structure, can directly use in the design at power ground level, can additionally not increase the size of printed circuit board.

Description

Electromagnetic band gap power supply layer structure applied to high-speed packaging system
Technical Field
The utility model relates to an Electromagnetic wave propagates and receives technical field, specifically is a novel Electromagnetic Band Gap (EBG) Power layer structural design who is used for Printed Circuit Board (PCB) Power Distribution Network (Power Distribution Network, PDN) to have high frequency broadband to restrain the characteristic.
Background
With the development of integrated circuits, it is very significant for circuit design to design power/ground planes capable of suppressing electromagnetic interference. However, with high-speed digital circuits, high-speed signal processing, and integration of rf circuits and digital circuits, the design of new power/ground planes should have very wide bandwidth and strong attenuation in the forbidden band. The power supply/ground plane loaded with the EBG structure has the advantages of wide forbidden band bandwidth, simple realization process, deep forbidden band depth, low cost and the like, and is used as an effective means for inhibiting the electromagnetic interference between two points on the power supply/ground plane.
Since EBG structures were originally studied optically, and since certain EBG structures can suppress the propagation of light waves of a fixed frequency, researchers wish to design a periodic structure to prevent the propagation of power supply noise (electromagnetic waves) of a certain frequency, and since the optical studies have been extended to the studies on the suppression of power supply noise. The power plane is divided into periodic unit structures by the power layer Electromagnetic Band Gap (EBG) structure, and the power layer EBG structure has the advantages of wide Noise suppression and high suppression depth in terms of suppressing Synchronous Switching Noise (SSN).
The EBG structure can be roughly divided into two types, an embedded EBG structure and a planar EBG structure, and the coplanar EBG structure has many advantages over the Mushroom-type EBG structure, and mainly includes the following points: first, the coplanar EBG is less costly because the mushroom structure has embedded layers making it a three-layer structure for power and ground planes, while the coplanar structure is not needed; secondly, the coplanar EBG has small manufacturing difficulty, patterns only need to be corroded on a power supply plane or a ground plane, and the mushroom-shaped structure needs a hole burying technology, so that the process is difficult to realize; third, mushroom-type EBG suppresses SSN with high lower cutoff frequency and narrow bandwidth, while coplanar-type structure has found wide bandwidth through extensive research and lower cutoff frequency can be as low as several hundred mhz. Therefore, these several advantages make the application range of the coplanar EBG structure wider.
Various planar EBG structures for suppressing SSN are available, but deep SSN suppression in a wide band in a high frequency range cannot be satisfied. Therefore, a new EBG structure for a broadband power layer covering a wide frequency range is proposed by the inventor to suppress SSN and satisfy the requirement of power integrity.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that exists among the background art, the utility model aims at providing a plane electromagnetism band gap power supply layer structure of degree of depth suppression broadband noise on the novel printed circuit board power distribution network in order to overcome that current power supply layer EBG structure restraines the bandwidth limited and restrain the degree of depth not enough for on the printed circuit board power distribution network, have the high frequency broadband and restrain the characteristic.
The utility model provides a technical scheme is:
the utility model discloses a power plane, medium base plate layer and ground plane, the power plane sculpture have the EBG structure, the power plane that the sculpture has the EBG structure has been arranged on the front on medium base plate layer, the ground plane has been arranged to the back, the EBG structure mainly comprises outside and inside rectangle metal paster that all has the minor matters.
The EBG structure comprises four EBG basic units with the same structure, wherein the EBG basic units are formed by arranging in a field-shaped manner along the circumference in a rotational symmetry manner, and each EBG basic unit comprises a square patch, a square frame-shaped patch, two outer branch structures, four inner branch structures and a connecting branch structure; the square patch is positioned in the center of the square frame-shaped patch, four corners of the periphery of the square patch are connected with the inner edge of the square frame-shaped patch through respective inner branch structures, the four inner branch structures are rotationally and symmetrically arranged around the center of the square patch, the outer edges of two adjacent sides of the square frame-shaped patch are connected with outer branch structures, the outer edge of one side of the square frame-shaped patch is connected with a connecting branch structure, each EBG basic unit is connected with an adjacent EBG basic unit through the connecting branch structure, and the four connecting branch structures are rotationally and symmetrically arranged around the center of the EBG basic unit.
The inner branch structure and the outer branch structure are both L-shaped metal sheets, the short edge of each L-shaped metal sheet of the inner branch structure is connected to the edge where a corner of the square patch is located, and the long edge of each L-shaped metal sheet of the inner branch structure is parallel to the edge of the square patch and is connected to the inner edge of the square frame-shaped patch; the short edge of the L-shaped metal sheet of the outer branch structure is connected to the outer edge of the corner of the square frame-shaped patch, and the long edge of the L-shaped metal sheet of the outer branch structure is parallel to the edge of the square patch.
The connecting branch structure is mainly formed by connecting metal sheets in a shape like a 2 and a 5 which are mirror-symmetrical, so as to increase the equivalent inductance value of the loop; the outer edge of the square frame-shaped patch connected with the connecting branch structure is used as a reference edge, the bottom end part of the 2-shaped metal sheet and the bottom end part of the 5-shaped metal sheet are connected through strip-shaped metal sheets parallel to the two end parts, the top end part of the 2-shaped metal sheet is connected to the tail end of one side of the reference edge of the square frame-shaped patch through the strip-shaped metal sheet perpendicular to the end parts and is flush with the tail end of the other side of the reference edge, the top end part of the 5-shaped metal sheet extends to be flush with the adjacent edge towards the tail end of the other side of the reference edge, and then a 90-degree corner extends to be connected to the tail end of the edge of the square frame-shaped.
The widths of the 2-shaped metal sheet and the 5-shaped metal sheet are the same.
The power layer and the grounding layer are both copper-clad metal layers with the thickness of 1 ounce.
A 1 ounce (oz) refers to a uniform copper foil weight of 28.35 grams over a 1 square foot area, with the average thickness of the copper foil being expressed in terms of weight per unit area, as is well known in the art.
The power supply layer is integrally manufactured.
Each EBG basic unit is internally provided with a pattern with an inner branch structure embedded all around, and each EBG basic unit only has an inner branch structure towards the inner side of the structure and an outer branch structure towards the outer side of the structure. Moreover, the EBG basic cells at the lower right corner and the lower left corner in fig. 2 are obtained by sequentially rotating the EBG basic cells at the upper left corner by 90 degrees in the clockwise direction, respectively.
The utility model discloses a high frequency broadband electromagnetism band gap power supply layer structure is become by outside and inside rectangle paster that all has the minor matters. Each EBG basic unit on the power layer of the electromagnetic band gap is of a type that branches are embedded into the interior of the EBG basic unit, and branches formed by connecting two mirror-symmetrical 2-shaped metal sheets with right-angled corners and a 5-shaped metal sheet with right-angled corners and corners are interconnected between every two adjacent EBG basic units so as to increase the equivalent inductance value of the loop. The utility model discloses under the high frequency, use-30 dB to restrain the degree of depth as the standard, can obtain the stop band bandwidth of broad.
When the excitation end loads an excitation signal, current flows from one basic unit to the other basic unit, and the metal connecting branch structure connecting the basic units is a main path for connection between the basic units. The connecting branch structure has a longer effective length, and an equivalent LC circuit of the connecting branch structure has a larger effective inductance value. According to the determination formula of the relative bandwidth and the center frequency of the stop band gap:
Figure BDA0002008820120000031
WB=△ω/ω0=(1/η)(L/C)1/2
wherein, ω is0Represents the center frequency of the band gap of the stop band, L represents the equivalent inductance of the metal branch, C represents the equivalent capacitance of the metal branch, WBIndicating the relative bandwidth of the stop band gap, △ ω indicating the frequency band range satisfying the stop band rejection conditions, η indicating the free-space wave impedance.
It follows that a relatively large effective inductance value allows the LC circuit to have a low lower cutoff frequency and a wide stopband rejection width at resonance.
The high-frequency broadband electromagnetic band gap structure is composed of rectangular patches with branches outside and inside.
Compared with the prior art, the beneficial effects of the utility model are that:
1. as shown in fig. 2, in the present invention, the intermediate structure of each EBG basic unit adopts a pattern of an inner branch structure embedded all around, and the pattern of the outer branch structure and the connecting branch structure are used in combination to interconnect, so that the equivalent inductance of the loop is significantly increased.
2. The origin of coordinates is set at the lower left corner of the whole structure, the input port adopts 50 ohm standard coaxial excitation, the input port 1 is set at the position of (12.5mm,12.5mm,0mm), the output port 2 is set at the position of (12.5mm, 37.5mm,0mm), and the output port 3 is set at the position of (37.5mm,37.5mm,0 mm).
The utility model discloses an use novel plane EBG basic unit structural design, can satisfy the degree of depth SSN suppression of broadband in the high frequency range, make insertion loss S21 curve keep not higher than-30 dB ' S limit value in 17GHz-32.5GHz high frequency band up to 15.5GHz always, simultaneously, insertion loss S31 between port 1 and port 3 also keeps not higher than-30 dB ' S limit value in 17GHz-40GHz ' S high frequency band.
However, in the current latest literature, the maximum frequency of the EBG Structure at high frequencies with insertion loss below the-30 dB limit can only be kept around 20GHz (e.g., L.F.Shi, Z.M.Sun, G.X.Liu and S.Chen, "Hybrid-Embedded EBG Structure for ultra wide band Suppression of SSN," in IEEE Transactions on electromagnetic Compatibility, vol.60, No.3, pp.747-753, June 2018.).
Therefore, the utility model discloses effectively restrain the propagation of noise on this power plane to improve and improve the performance of power distribution network.
3. The utility model discloses this kind of EBG structural design is novel, simple structure, can directly use in the design at power horizon. The utility model discloses the pattern of the power distribution network etching that has only changed printed circuit board can additionally not increase the printed circuit board size.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic side view of a two-layer pcb power distribution network according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of the front structure of the power layer of the printed circuit board according to the present invention.
Fig. 3 is a schematic diagram of the front structure of the upper left corner unit on the power layer of the printed circuit board of the present invention.
Fig. 4 is a schematic diagram showing the dimensions of the middle structure, the outer branch structure and the inner branch structure of the upper left corner unit on the power layer of the printed circuit board of the present invention.
Fig. 5 is a schematic size diagram of the connection branch structure of the upper left corner unit on the power layer of the printed circuit board according to the present invention.
Fig. 6 is a schematic diagram of the front structure of the upper right corner unit on the power layer of the printed circuit board of the present invention.
Fig. 7 is a schematic diagram of the front structure of the lower right corner unit on the power layer of the printed circuit board of the present invention.
Fig. 8 is a schematic diagram of the front structure of the lower left corner unit on the power layer of the printed circuit board of the present invention.
Fig. 9 is an insertion loss S21 bandgap characteristic curve of the EBG structure according to the present invention.
Fig. 10 is an insertion loss S31 bandgap characteristic curve of the EBG structure according to the present invention.
Wherein, 1, a power layer, 2, a medium substrate layer and 3, a grounding layer; 4. square patch, 5 square frame patch, 6 left side inner branch structure, 7 upper inner branch structure, 8 right side inner branch structure, 9 lower inner branch structure, 10 left side outer branch structure, 11 upper outer branch structure, 12 connecting branch structure.
Detailed Description
The present invention will be described in further detail with reference to the following examples and accompanying drawings.
As shown in fig. 1, the utility model discloses the implementation includes power layer 1, medium base plate layer 2 and ground plane 3, and power layer 1 sculpture has the EBG structure, and the power layer 1 that the sculpture has the EBG structure is arranged on the front on medium base plate layer 2, and the ground plane 3 is arranged to the back.
As shown in fig. 2, each EBG structure has the same basic composition, and the EBG structure includes four EBG basic cells having the same structure and arranged in a zigzag shape in a rotational symmetry manner along the circumference.
As shown in fig. 3, each EBG basic unit includes a square patch 4, a square frame-shaped patch 5, two outer branch structures 10, 11, four inner branch structures 6 to 9, and a connecting branch structure 12; the square frame-shaped patch 5 is a square ring structure, the square patch 4 is positioned in the center in the square frame-shaped patch 5, four corners of the periphery of the square patch 4 are connected with the inner edge of the square frame-shaped patch 5 through respective inner branch structures 6-9, the four inner branch structures 6-9 are rotationally and symmetrically arranged around the center of the square patch 4, the outer edges of two adjacent edges of the square frame-shaped patch 5 are connected with the outer branch structures 10 and 11, the two outer branch structures 10 and 11 are rotationally and symmetrically arranged around the center of the square patch 4 at two sides of the square frame-shaped patch 5 perpendicular to 90 degrees, the outer edge of one edge of the square frame-shaped patch 5 is connected with a connecting branch structure 12, each EBG basic unit is connected with an adjacent EBG basic unit by the connecting branch structure 12, so that the equal connecting branch structure 12 is connected between the two adjacent EBG basic units, and the four connecting branch structures 12 are rotationally and symmetrically arranged around the center of, .
As shown in fig. 4, the inner branch structures 6-9 and the outer branch structures 10 and 11 are both L-shaped metal sheets, the short sides of the L-shaped metal sheets of the inner branch structures 6-9 are connected to the edges of the corners of the square patch 4, and the long sides of the L-shaped metal sheets of the inner branch structures 6-9 are parallel to the edges of the square patch 4 and connected to the inner edges of the square frame-shaped patches 5 near the corners; the short sides of the outer branch structures 10 and 11L-shaped metal sheets are connected to the outer edge of the corner of the square frame-shaped patch 5, the long sides of the outer branch structures 10 and 11L-shaped metal sheets are parallel to the side of the square patch 4, and the tail ends of the outer branch structures are not connected with other parts.
As shown in fig. 5, the connecting branch structure 12 is mainly formed by connecting metal sheets in a shape like "2" and "5" with mirror symmetry corners and corners both being right angles, so as to increase the equivalent inductance value of the loop; the widths of the 2-shaped metal sheet and the 5-shaped metal sheet are the same, the internal intervals are the same, and the structures are completely and symmetrically arranged. The 2-shaped metal sheet and the 5-shaped metal sheet are both S-shaped formed by alternately connecting the short side of a right-angle turn and the extended long side, the short side and the long side are mutually vertical, and the long side is parallel to the outer edge of the square frame-shaped patch 5 close to the connecting branch structure 12; the outer edge of the square frame-shaped patch 5 to which the connecting branch structure 12 is connected is taken as a reference edge, the right end part of the bottom of the 2-shaped metal sheet and the left end part of the bottom of the 5-shaped metal sheet are connected by a strip-shaped metal sheet parallel to the two end parts, the right end part of the bottom of the 2-shaped metal sheet and the left end part of the bottom of the 5-shaped metal sheet are positioned on the same straight line, the straight line is parallel to the reference edge, the left end part of the top of the 2-shaped metal sheet is connected to the tail end of one side of the reference edge of the square frame-shaped patch 5 through a strip-shaped metal sheet perpendicular to the end parts and is flush with the adjacent edge of the reference edge, the right end part of the top of the 5-shaped metal sheet extends to the tail end of the other side of the reference edge to be flush with the adjacent edge of the reference edge, and then the 90-degree corner extends to the tail end of the edge of the square frame-shaped patch 5 of the adjacent EBG basic unit in the direction far away.
The power plane 1 and ground plane 3 are typically single-sided copper-clad metal layers of 1 ounce thickness.
In specific implementation, the power layer 1 is integrally formed, that is, the square patch 4, the square frame-shaped patch 5, the two outer branch structures 10 and 11, the four inner branch structures 6 to 9 and the connecting branch structure 12 can be formed on the same metal sheet by etching.
The thickness of the dielectric substrate layer 2 varies depending on the material and typically varies from 0.4mm to 3 mm.
The utility model has outstanding generality, and adopts a common epoxy board FR-4 dielectric material with epsilon equal to 4.4 as a substrate; the proposed electromagnetic band gap model designs a high-frequency broadband electromagnetic band gap power supply layer structure based on a 2 x 2 array. As can be seen from fig. 1, the dielectric substrate is square (50mm x 50mm), and the high-resistance surface electromagnetic bandgap power supply layer structure is attached to the surface of the dielectric substrate. The ground plane is a continuous and complete metal plate.
The origin of coordinates is set in the lower left corner of the whole structure, the input port is excited coaxially with a 50 ohm standard, the input port 1 is set at the position of (12.5mm,12.5mm,0mm), the output port 2 is set at the position of (12.5mm, 37.5mm,0mm), and the output port 3 is set at the position of (37.5mm,37.5mm,0 mm).
Example 1
A2 x 2 array EBG structure with the size of 50mm x 0.47mm is designed to be used as an electromagnetic band gap power supply plane, and the ground plane is a continuous and complete metal surface. A dielectric material of a common epoxy board FR-4 is adopted between the power supply plane and the ground plane, the loss tangent of the material is 0.02, and the dielectric constant is 4.4. The metal face was a copper foil with a thickness of 0.035mm and a conductivity of 5.8E + 0.07S/m. The origin of coordinates is set in the lower left corner of the whole structure, the input port is excited coaxially with a 50 ohm standard, the input port 1 is set at the position of (12.5mm,12.5mm,0mm), the output port 2 is set at the position of (12.5mm, 37.5mm,0mm), and the output port 3 is set at the position of (37.5mm,37.5mm,0 mm).
The power plane in this example is square in shape, the material of which is copper (copper), and the dimensions of which are 50mm x 1oz (0.035 mm). It consists of four electromagnetic bandgap cells. Four electromagnetic bandgap cells are shown in fig. 3, 6, 7 and 8, respectively.
The ground plane 3 in this embodiment has a square shape and is made of copper (copper) with dimensions 50mm x 1oz (0.035 mm).
The dielectric substrate 2 in this embodiment is square, and is made of epoxy board (FR-4) with a dielectric constant of 4.4, and the dielectric substrate has a size of 50mm × 50mm × 0.4 mm.
Taking the upper left electromagnetic bandgap cell as an example, the specific dimensions are shown in fig. 4 and 5. Wherein, a is 9.7mm, b is 23.9mm, c is 0.6mm, s is 0.2mm, ss is 0.2 mm. Thus, the total size of each electromagnetic bandgap cell is 24.3mm by 24.3 mm. The basic composition of each EBG basic unit is the same, and the EBG basic unit comprises a middle structure, 2 outer branch structures, 4 inner branch structures and 1 connecting branch structure. The middle structure, the outer branch structure, the inner branch structure and the connecting branch structure of the EBG basic unit at the upper left corner as shown in fig. 3 are taken as an example to be explained in detail.
The middle structure comprises a square patch 4 and a square frame-shaped patch 5. The square patch 4 is inside the square frame patch 5, which are centered. As shown in fig. 4, the square patch 4 has a side length of a, and the square frame-shaped patch 5 has a side length of b. The distance between the outer edge of the square patch 4 and the adjacent inner wall of the square frame-shaped patch 5 is (c + ss + dd), i.e. 1 mm.
The shapes of the inner branch structures 6, 7, 8 and 9 are the same, each inner branch structure is L-shaped and consists of a second strip-shaped patch and a second square patch, and the side length of the second square patch is the same as the width of the second strip-shaped patch and is ss; since the width of the gap between the outer side of the square patch 4 and the inner wall of the adjacent square frame-shaped patch 5 is (c + ss + dd), the length of the second strip-shaped patch is equal to (a + c + ss + dd); in the inner branch structure 7, the second strip-shaped patch is horizontally arranged, the second square patch is positioned at the lower part of the right end of the second strip-shaped patch, and the right end of the second square patch, the right end of the second strip-shaped patch and the right end of the square patch are parallel and level; the lower part of the second square patch is connected with the upper part of the square patch; the left end of the second strip-shaped patch is connected with the left inner wall of the square frame-shaped patch, namely, the inner branch structure 7 communicates the left inner wall of the square frame-shaped patch with the top of the square patch. The other three inner branch structures 6, 9 and 8 are formed by respectively rotating the corresponding inner branch structure 7 by 90 degrees anticlockwise in sequence and correspondingly communicating the square patch with the inner wall of the square frame-shaped patch.
The second square patches were 0.2mm by 0.2mm in size and the second strip patches were 10.7mm by 0.2mm in size.
The outer branch structure is shown as branch 10 and branch 11 in fig. 3. Each outer branch structure is in an L shape; the patch is composed of a third strip patch and a third square patch, and the side length of the third square patch is the same as the width of the third strip patch; the length of the third strip-shaped patch is equal to the length of the external side of the square frame-shaped patch; in the outer branch structure 11, a third strip patch is horizontally arranged, a third square patch is positioned at the lower part of the right end of the third strip patch, and the right end of the third square patch, the right end of the third strip patch and the right end outside the square frame patch are parallel and level; the lower part of the third square patch is connected with the outer upper side of the square frame patch; the other outrigger structure 10 is rotated 90 degrees counterclockwise with respect to the outrigger structure 11, wherein the third square patch is connected to the left end portion of the outside of the square frame-shaped patch.
The size of the third square patch was 0.2mm, and the size of the third strip patch was 23.9mm 0.2 mm.
The continuous grafting structure is shown as a branch 12 in fig. 3, and can be regarded as a connection body of a 2-shaped metal sheet with right angles of corners and a 5-shaped metal sheet with right angles of corners and corners; the bottom right side of "2" communicates with the bottom left side of "5".
As shown in fig. 5, the distance between the right side of the middle of "2" and the left side of the middle of "5" is g; the width of the horizontal patches in the '2' is the same and is s, the spacing between the horizontal patches is the same and is d, and the '5' is the same; the top of the '2' is connected with the left lower end of the square frame patch 5 through a fourth strip patch with the length of d and the width of s and is level; the uppermost horizontal patch of "5" extends horizontally to be flush with the right outside of the square frame-shaped patch 5, and then is vertically connected to the top right side of the left-lower EBG basic unit by a fifth stripe-shaped patch having a length of 3 x (s + d) and a width of s. In terms of size, the whole structure of the right-angled 2-shaped metal sheet is 11.65mm long and 1mm wide, one end of the structure is connected with the middle structure through a square patch with the length of 0.2mm x 0.2mm, and the other end of the structure is connected with the right-angled 5-shaped metal sheet through a rectangular patch with the length of 0.2mm and the width of 0.1 mm. The right-angled 5-shaped sheet metal structure is mirror-symmetrical to the right-angled 2-shaped sheet metal structure, and thus the length and width of the right-angled 5-shaped sheet metal structure are 11.65mm and 1mm, respectively. The right-angled 5-shaped metal sheet structure is also interconnected with the right-angled 2-shaped metal sheet structure through a rectangular patch with the length of 0.2mm and the width of 0.1mm, and the other end of the right-angled 2-shaped metal sheet structure is connected with the adjacent EBG basic unit structure through an L-shaped branch section with the length of 1.2mm and the width of 0.4mm, which is rotated by 90 degrees clockwise.
Each EBG basic unit only has an inner branch structure towards the inner side of the structure and an outer branch structure towards the outer side of the structure. Taking the top left EBG basic unit as shown in fig. 3 as an example, there are only the connecting branch structure 12 located below the middle structure, the outer branch 10 on the left side, and the outer branch 11 on the top. Therefore, the inner branch structure branches 6, 7, 8 and 9, the outer branch structure branches 10 and 11, the connecting branch structure 12 and the intermediate structures 4 and 5 together form an EBG basic unit at the upper left corner.
The EBG basic cells at the upper left corner are sequentially rotated by 90 degrees clockwise, and the EBG basic cells at the upper right corner, the lower right corner and the lower left corner as shown in fig. 6, fig. 7 and fig. 8 are obtained. All the patterns, i.e., fig. 3, 6, 7, and 8, together finally constitute the EBG structure of the present invention shown in fig. 2.
In the embodiment, the power layer 1 and the ground layer 3 in fig. 1 are single-sided copper clad laminates, and the EBG structure shown in fig. 2 can be prepared on the power layer 1 copper clad laminate by a printed circuit board process and a chemical corrosion method or an etching method. The material of the copper-clad plate can be reasonably selected according to the application environment. To protect the metal surface, gold plating protection may be applied to the metal pattern. According to the requirements of application environment, the prepared electromagnetic band gap structure can be further subjected to environmental adaptive protection, for example, in order to prevent water and deal with unfavorable environments such as acid-base salt fog, chemical vapor deposition is carried out on the electromagnetic band gap structure, and a dielectric protection film layer grows.
The insertion loss S21 and S31 bandgap characteristic curves of the EBG structure of the present invention are shown in fig. 9 and 10, respectively. The insertion loss S21 means the magnitude of the signal measured at port 2 when the excitation signal is input from port 1. If insertion loss S21 is less than-30 dB 'S interior limit value, then the signal is less through the EBG structure that the utility model provides a signal that passes through to port 2 department, explains the utility model provides an EBG structure has fine suppression noise signal propagation' S function. The insertion loss S31 means the signal size measured from port 3 when the excitation signal is input from port 1. If the insertion loss S31 is lower than the internal limit value of-30 dB, the signal transmitted to the port 3 through the EBG structure provided by the present invention is smaller, which also indicates that the EBG structure provided by the present invention has a good function of suppressing the propagation of noise signals.
As shown in FIG. 9 and FIG. 10, it can be seen that the utility model discloses can make the insertion loss S21 curve between port 1 and port 2 keep not higher than-30 dB ' S limit value in the high frequency channel of 17GHz-32.5GHz up to 15.5GHz all the time, simultaneously, insertion loss S31 between port 1 and port 3 also keeps not higher than-30 dB ' S limit value in the high frequency channel of 17GHz-40GHz, illustrate the utility model discloses can effectively restrain the propagation of noise on this power plane, realize the deep noise suppression of broadband in the high frequency range to improve and improve power distribution network ' S performance.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and all changes, modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be embraced therein.

Claims (7)

1. An electromagnetic band gap power supply layer structure applied to a high-speed packaging system comprises a power supply layer (1), a medium substrate layer (2) and a ground layer (3), and is characterized in that: the power layer (1) is etched with an EBG structure, the power layer (1) etched with the EBG structure is arranged on the front surface of the medium substrate layer (2), the ground layer (3) is arranged on the back surface of the medium substrate layer, and the EBG structure mainly comprises rectangular metal patches with branches outside and inside.
2. The electromagnetic bandgap power layer structure applied in high speed packaging system as claimed in claim 1, wherein: the EBG structure comprises four EBG basic units with the same structure, wherein the EBG basic units are arranged in a field-shaped manner and are in rotational symmetry along the circumference, and each EBG basic unit comprises a square patch (4), a square frame-shaped patch (5), two outer branch structures (10 and 11), four inner branch structures (6-9) and a connecting branch structure (12); the square patch (4) is located in the center of the square frame-shaped patch (5), four corners of the periphery of the square patch (4) are connected with the inner edge of the square frame-shaped patch (5) through respective inner branch structures (6-9), the four inner branch structures (6-9) are rotationally and symmetrically arranged around the center of the square patch (4), the outer edges of two adjacent edges of the square frame-shaped patch (5) are connected with outer branch structures (10 and 11), the outer edge of one edge of the square frame-shaped patch (5) is connected with a connecting branch structure (12), each EBG basic unit is connected with the adjacent EBG basic unit through the connecting branch structure (12), and the four connecting branch structures (12) are rotationally and symmetrically arranged around the center of the EBG basic unit.
3. The electromagnetic bandgap power layer structure applied in high speed packaging system as claimed in claim 2, wherein: the inner branch structure (6-9) and the outer branch structure (10, 11) are both L-shaped metal sheets, the short side of the L-shaped metal sheet of the inner branch structure (6-9) is connected to the edge of the corner of the square patch (4), and the long side of the L-shaped metal sheet of the inner branch structure (6-9) is parallel to the side of the square patch (4) and is connected to the inner edge of the square frame-shaped patch (5); the short sides of the L-shaped metal sheets of the outer branch structures (10 and 11) are connected to the outer edges of the corners of the square frame-shaped patches (5), and the long sides of the L-shaped metal sheets of the outer branch structures (10 and 11) are parallel to the sides of the square patches (4).
4. The electromagnetic bandgap power layer structure applied in high speed packaging system as claimed in claim 2, wherein: the connecting branch structure (12) is mainly formed by connecting metal sheets in a shape like a Chinese character '2' and a Chinese character '5' which are mirror-symmetrical, so that the equivalent inductance value of the loop is increased; the outer edge of a square frame-shaped patch (5) connected with a connecting branch structure (12) is used as a reference edge, the bottom end part of a 2-shaped metal sheet and the bottom end part of a 5-shaped metal sheet are connected through strip-shaped metal sheets parallel to the two end parts, the top end part of the 2-shaped metal sheet is connected to one side end of the reference edge of the square frame-shaped patch (5) through the strip-shaped metal sheets perpendicular to the end parts and is flush with the end part, the top end part of the 5-shaped metal sheet extends to the other side end of the reference edge to be flush with the adjacent edge, and then a 90-degree corner extends to the direction far away from the reference edge of the square frame-shaped patch (5) and is connected to the end part of the edge of the square frame-shaped patch.
5. The electromagnetic bandgap power layer structure as claimed in claim 4, wherein: the widths of the 2-shaped metal sheet and the 5-shaped metal sheet are the same.
6. The electromagnetic bandgap power layer structure as claimed in claim 4, wherein: the power supply layer (1) and the grounding layer (3) are both copper-clad metal layers with the thickness of 1 ounce.
7. The electromagnetic bandgap power layer structure as claimed in claim 4, wherein: the power supply layer (1) is integrally manufactured.
CN201920399145.1U 2019-03-27 2019-03-27 Electromagnetic band gap power supply layer structure applied to high-speed packaging system Active CN210042367U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087384A (en) * 2019-03-27 2019-08-02 海宁利伊电子科技有限公司 Applied to the electro-magnetic bandgap bus plane structure in high speed package system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087384A (en) * 2019-03-27 2019-08-02 海宁利伊电子科技有限公司 Applied to the electro-magnetic bandgap bus plane structure in high speed package system
CN110087384B (en) * 2019-03-27 2024-04-05 海宁利伊电子科技有限公司 Electromagnetic band gap power supply layer structure applied to high-speed packaging system

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