CN210040457U - VDA size soft package module sampling device - Google Patents
VDA size soft package module sampling device Download PDFInfo
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- CN210040457U CN210040457U CN201921140774.9U CN201921140774U CN210040457U CN 210040457 U CN210040457 U CN 210040457U CN 201921140774 U CN201921140774 U CN 201921140774U CN 210040457 U CN210040457 U CN 210040457U
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- circuit board
- copper foil
- foil circuit
- extension bar
- sampling device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses a VDA size soft package module sampling device, including etching copper foil circuit board, the upper surface of etching copper foil circuit board is equipped with electric core temperature sampling portion, one side integrated into one piece of etching copper foil circuit board has the second extension bar, one side integrated into one piece of second extension bar has the golden finger, one side of etching copper foil circuit board is close to one side integrated into one piece of second extension bar has the first extension bar, one end of first extension bar is kept away from one side integrated into one piece of etching copper foil circuit board has first pad; the etched copper foil circuit board in the utility model replaces the traditional cable, the sampling link of module manufacturing, the automatic laser welding is adopted comprehensively, and the production efficiency is greatly improved; the utility model provides a golden finger structure replaces traditional connector to connect, saves links such as cable terminal, line terminal connector, cable crimping, pencil assembly, and the cost advantage is obvious, and required space is littleer, and the structure is compacter.
Description
Technical Field
The utility model relates to a soft packet of module sampling technical field specifically is a soft packet of module sampling device of VDA size.
Background
NTC is thermistor, it means that the resistance reduces with the temperature rise, thermistor phenomenon and material with negative temperature coefficient, Busbar means the Busbar, it is a relay station used for collecting all data and transmitting it out, PCB board is printed circuit board, with the rapid popularization of new energy automobile, the power battery grouping technique receives great attention, after the electric core is grouped, it needs to monitor the electric core voltage, electric core temperature, Busbar temperature and other information in the whole life cycle, provide basic signal for PACK and whole automobile, in order to implement corresponding strategy, guarantee the electric core health work, improve the service life, prevent the safety risk, in order to meet these demands, the module sampling device comes into existence, the conventional sampling device at present is mainly formed by combining a plurality of cables, terminals, connectors, wear-resistant tapes, encapsulated thermistor, etc., it needs a large space, the module is difficult to arrange inside, and is with high costs, and production organizational efficiency is low, can't realize automation hardly, for this reason, provides a soft packet of module sampling device of VDA size.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a soft packet of module sampling device of VDA size to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a VDA size soft package module sampling device comprises an etched copper foil circuit board, wherein the upper surface of the etched copper foil circuit board is provided with a cell temperature sampling part, a second extension bar is integrally formed on one side of the etched copper foil circuit board, a golden finger is integrally formed on one side of the second extension bar, a first extension bar is integrally formed at one side of the etched copper foil circuit board close to one side of the second extension bar, one end of the first lengthening bar is far away from one side of the etched copper foil circuit board and is integrally formed with a first bonding pad, a thermistor is integrally formed on one side of the etched copper foil circuit board away from the second extension bar, the bottom integrated into one piece of thermistor has third pad and second pad, the preceding surface mounting of second pad has busbar temperature sampling portion, be equipped with the etching fuse in the etching copper foil circuit board.
As further preferable in the present technical solution: and a protective film is integrally formed on the upper surface of the etched copper foil circuit board.
As further preferable in the present technical solution: and a first arc-shaped part is arranged at the joint of the etched copper foil circuit board and the thermistor.
As further preferable in the present technical solution: and a second arc-shaped part is arranged at the joint of the etched copper foil circuit board and the second lengthening rod.
As further preferable in the present technical solution: the number of the first extension bars is two, and the two first extension bars are symmetrically arranged on two sides of the etched copper foil circuit board.
As further preferable in the present technical solution: the second pad is welded with a bus bar.
As further preferable in the present technical solution: and the bottom of the golden finger is provided with a printed circuit board.
As further preferable in the present technical solution: the printed circuit board is provided with a printed circuit board end plug-in, and the gold finger is plugged with the printed circuit board end plug-in.
Compared with the prior art, the utility model discloses a beneficial effect is as follows:
firstly, the etched copper foil circuit board in the utility model replaces the traditional cable, the sampling link of module manufacturing adopts automatic laser welding comprehensively, and the production efficiency is greatly improved;
secondly, the golden finger structure in the utility model replaces the traditional connector connection, so that the links of cable terminals, wire end connectors, cable crimping, wire harness assembly and the like are omitted, the cost advantage is obvious, the required space is smaller, and the structure is more compact;
thirdly, the etched copper foil circuit board in the utility model can form a fuse through etching, thereby playing a role in low-voltage short circuit protection, preventing the thermal runaway of the battery cell caused by the low-voltage short circuit, and the traditional harness sampling device can not realize the fuse function;
fourthly, the temperature sampling point and the voltage sampling point of the module busbar in the utility model can be combined, and the number of the welding pads and the number of the cables are reduced compared with that of the wire harness sampling device;
fifthly, the etched copper foil circuit board in the utility model is a thin material, the thickness is only about 0.3mm (except for the thermistor), which is far smaller than the space required by the traditional cable, and the valuable space is saved for the module;
sixth, the utility model provides an etching copper foil circuit board light in weight, it is very convenient to assemble, utilizes the double faced adhesive tape can fix, saves special buckle of traditional cable and wire casing structure.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a diagram illustrating a connection mode between the temperature sampling unit and the bus bar according to the present invention;
FIG. 3 is a diagram showing the connection between the gold finger and the printed circuit board end plug-in of the present invention;
FIG. 4 is a schematic diagram of the structure of the etched fuse of the present invention.
In the figure: 1. etching the copper foil circuit board; 2. a protective film; 3. a cell temperature sampling unit; 4. a first extension bar; 5. a first pad; 6. a second extension bar; 7. a golden finger; 8. a thermistor; 9. a second pad; 10. a second pad; 11. a bus bar; 12. a printed circuit board; 13. printed circuit board end plugs; 14. etching the fuse; 15. a first arcuate portion; 16. a second arcuate portion; 17. a bus temperature sampling part.
Detailed Description
The following description is provided for illustrative embodiments of the present invention, and the advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure of the present invention. The present invention can also be implemented in other different ways, i.e. different modifications and changes can be made without departing from the scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a VDA size soft packet of module sampling device, includes etching copper foil circuit board 1, the upper surface of etching copper foil circuit board 1 is equipped with electric core temperature sampling portion 3, one side integrated into one piece of etching copper foil circuit board 1 has second extension bar 6, one side integrated into one piece of second extension bar 6 has golden finger 7, one side of etching copper foil circuit board 1 is close to one side integrated into one piece of second extension bar 6 has first extension bar 4, one side integrated into one piece of etching copper foil circuit board 1 is kept away from to the one end of first extension bar 4 has first pad 5, one side of etching copper foil circuit board 1 is kept away from one side integrated into one piece of second extension bar 6 has thermistor 8, thermistor 8's bottom integrated into one piece has third pad 10 and second pad 9, the preceding surface mounting of second pad 9 has busbar temperature sampling portion 17, an etching fuse 14 is arranged in the etching copper foil circuit board 1.
In this embodiment, specifically: a protective film 2 is integrally formed on the upper surface of the etched copper foil circuit board 1; by providing the protective film 2 on the upper surface of the etched copper foil circuit board 1, the protective capability of the etched copper foil circuit board 1 can be increased, and the possibility of damage to the etched copper foil circuit board 1 can be reduced.
In this embodiment, specifically: a first arc-shaped part 15 is arranged at the joint of the etched copper foil circuit board 1 and the thermistor 8; by providing the first arc-shaped portion 15, the etched copper foil circuit board 1 is smoother in appearance.
In this embodiment, specifically: a second arc-shaped part 16 is arranged at the joint of the etched copper foil circuit board 1 and the second extension bar 6; by providing the second arc-shaped portion 16, the etched copper foil circuit board 1 is again made smoother in appearance.
In this embodiment, specifically: the number of the first extension bars 4 is two, and the two first extension bars 4 are symmetrically arranged on two sides of the etched copper foil circuit board 1; two first extension bars 4 are arranged, so that two first bonding pads 5 can be connected to two sides of the etched copper foil circuit board 1.
In this embodiment, specifically: a bus bar 11 is welded on the second pad 9; through second pad 9 and the welding of busbar 11, can make the heat transfer of busbar 11 to second pad 9, the heat of second pad 9 is passed through the heat-conducting glue and is transmitted thermistor 8, and thermistor 8's resistance corresponds with the temperature in pairs, and the Pin both ends resistance that golden finger 7 corresponds is different to realize temperature detection.
In this embodiment, specifically: the bottom of the golden finger 7 is provided with a printed circuit board 12; by providing the printed circuit board 12 at the bottom of the gold finger 7, the temperature of the printed circuit board 12 can be detected.
In this embodiment, specifically: a printed circuit board end plug-in 13 is arranged on the printed circuit board 12, and the gold finger 7 is plugged with the printed circuit board end plug-in 13; the golden finger 7 is connected with the printed circuit board end plug-in 13 in an inserting mode, so that voltage and temperature signals are communicated with pins corresponding to the golden finger 7, and acquisition of module voltage and temperature signals is achieved.
In this embodiment: the etched copper foil circuit board 1 replaces a common cable, so that the wire opening and the crimping of a terminal are reduced, and the production efficiency is high.
In this embodiment: the thermistor 8 is directly integrated with the etched copper foil circuit board 1 in a Surface Mount Technology (SMT), and is fixedly sealed by heat-conducting glue, wherein the thickness of the thermistor is not more than 2mm and is far lower than that of the wire harness type sensor by 6 mm.
In this embodiment: the first bonding pad 5, the second bonding pad 9 and the third bonding pad 10 are integrally formed with the copper foil circuit in an etching mode, and no bonding or welding is conducted.
In this embodiment: the gold finger 7 is directly formed by etching copper foil without secondary welding.
In this embodiment: the golden finger 7 can be directly connected with the printed circuit board terminal plug-in 13 in an inserting mode, and a wiring harness terminal plug-in are omitted.
In this embodiment: the utility model discloses an appearance blanking integrated into one piece, the precision is far above the pencil.
In this embodiment: the utility model discloses pass through laser welding with electric core utmost point ear or busbar 11, save the ultrasonic bonding and the rubber coating of pencil and seal admittedly.
In this embodiment: the thickness of the utility model is only 0.2-0.3mm (except the thermistor 8), and the required space is far less than 5-8mm of wire harness.
In this embodiment: the utility model discloses can directly bond fixedly with the double faced adhesive tape, save pencil buckle and special pencil draw-in groove structure, it is efficient, simple structure.
Working principle or structural principle: the second bonding pad 9 is connected with the bus bar 11 through laser welding, the positive and negative electrodes of the battery core are connected with the bus bar 11, so that the positive and negative electrodes of the battery core are connected with PIN PINs at the ends of the golden fingers 7, the voltage of the battery core is obtained at the two ends of the corresponding Pin PINs, when the temperature of the bus bar 11 is sampled, the heat of the bus bar 11 is transferred to the second bonding pad 9, the heat of the second bonding pad 9 is transferred to the thermistor 8 through heat-conducting glue, the resistance value of the thermistor 8 corresponds to the temperature, the resistance values at the two ends of the Pin corresponding to the golden fingers 7 are different, so that the temperature detection is realized, when the temperature of the battery core is sampled, the surface temperature of the battery core is detected, the thermistor 8 is pasted on the battery core, or the thermistor 8 is in contact with the battery core through structural limitation, the heat of the battery core is transferred to the thermistor 8, the resistance value, when the copper foil circuit is etched, the local thinning and narrowing design is carried out, the function similar to a fuse is formed, if a local short circuit is formed due to short circuit of other devices or invasion of external conductive substances, the etching fuse 14 can be effectively fused to form low-voltage protection, the gold finger 7 is connected with the printed circuit board end plug-in 13 in an inserting mode, voltage and temperature signals are communicated with pins corresponding to the gold finger 7, and acquisition of module voltage and temperature signals is achieved.
The above is only the embodiment of the present invention, not so above only is the embodiment of the present invention, not so limiting the patent scope of the present invention, all of which utilize the equivalent structure made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, all of which are included in the patent protection scope of the present invention.
Claims (8)
1. The utility model provides a soft packet of module sampling device of VDA size, includes etching copper foil circuit board (1), its characterized in that: the upper surface of the etching copper foil circuit board (1) is provided with a cell temperature sampling part (3), one side of the etching copper foil circuit board (1) is integrally formed with a second extension bar (6), one side of the second extension bar (6) is integrally formed with a gold finger (7), one side of the etching copper foil circuit board (1) is close to one side of the second extension bar (6) and is integrally formed with a first extension bar (4), one side of the first extension bar (4) far away from the etching copper foil circuit board (1) is integrally formed with a first pad (5), one side of the etching copper foil circuit board (1) far away from one side of the second extension bar (6) is integrally formed with a thermistor (8), the bottom of the thermistor (8) is integrally formed with a third pad (10) and a second pad (9), and a busbar temperature sampling part (17) is installed on the front surface of the second pad (9), an etching fuse (14) is arranged in the etching copper foil circuit board (1).
2. The VDA size soft-packing module sampling device of claim 1, wherein: and a protective film (2) is integrally formed on the upper surface of the etched copper foil circuit board (1).
3. The VDA size soft-packing module sampling device of claim 1, wherein: and a first arc-shaped part (15) is arranged at the joint of the etched copper foil circuit board (1) and the thermistor (8).
4. The VDA size soft-packing module sampling device of claim 1, wherein: and a second arc-shaped part (16) is arranged at the joint of the etched copper foil circuit board (1) and the second extension bar (6).
5. The VDA size soft-packing module sampling device of claim 1, wherein: the number of the first extension bars (4) is two, and the two first extension bars (4) are symmetrically arranged on two sides of the etched copper foil circuit board (1).
6. The VDA size soft-packing module sampling device of claim 1, wherein: the second pad (9) is welded with a bus bar (11).
7. The VDA size soft-packing module sampling device of claim 1, wherein: the bottom of the golden finger (7) is provided with a printed circuit board (12).
8. The VDA size soft-packing module sampling device of claim 7, wherein: the printed circuit board (12) is provided with a printed circuit board end plug-in (13), and the golden finger (7) is connected with the printed circuit board end plug-in (13) in an inserting mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921140774.9U CN210040457U (en) | 2019-07-19 | 2019-07-19 | VDA size soft package module sampling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921140774.9U CN210040457U (en) | 2019-07-19 | 2019-07-19 | VDA size soft package module sampling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210040457U true CN210040457U (en) | 2020-02-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921140774.9U Active CN210040457U (en) | 2019-07-19 | 2019-07-19 | VDA size soft package module sampling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210040457U (en) |
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2019
- 2019-07-19 CN CN201921140774.9U patent/CN210040457U/en active Active
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