CN210040244U

CN210040244U - Vertical chip ceramic packaging structure of car headlight

Info

Publication number: CN210040244U
Application number: CN201920773405.7U
Authority: CN
Inventors: 陆壮树; 张洪亮
Original assignee: Shenzhen Bright Au Optronics Co
Current assignee: Shenzhen Bright Au Optronics Co
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2020-02-07
Anticipated expiration: 2029-05-27

Abstract

The utility model discloses a perpendicular chip ceramic package structure of car headlight, including ceramic package body, chip and pin, the one end of ceramic package body is provided with the roof, and the below of roof is provided with the bottom plate, the chip sets up between bottom plate and roof, the pin sets up both ends about the chip, the outside surface of roof is provided with protection machanism. The utility model discloses a notch carries on spacingly to the pin that its inboard passes through, and the deformation that produces through the block rubber, laminating degree between pin and the notch improves, guarantee the stability ability between pin and board and the bottom plate with this, the bearing capacity of junction between it has also been improved simultaneously, the setting of block rubber at the inside distribution structure of notch, the effectual setting that reduces block rubber itself is to the influence that the normal heat dissipation of pin caused, with this compactness and harmony to connecting between this ceramic package structure internals improve.

Description

Vertical chip ceramic packaging structure of car headlight

Technical Field

The utility model relates to a chip ceramic packaging technical field specifically is a perpendicular chip ceramic packaging structure of car headlight.

Background

Packaging, namely placing the produced integrated circuit bare chip on a substrate with a bearing effect, leading out pins, and then fixing and packaging the integrated circuit bare chip into a whole; the integrated circuit is protected by a sealing shell, the sealing material is packaged from the initial alloy to the ceramic metal, then the ceramic metal is replaced by the plastic package, the ceramic package and the plastic package are two types of plastic packages along with the rapid development of the new material, the automobile production technology is continuously improved along with the rapid development of the industrial technology, and therefore the ceramic packaging structure for the vertical chip of the automobile headlamp is innovated and designed, and the development of the chip packaging technology is promoted.

The existing ceramic packaging structure for the vertical chip cannot limit and fix the extending pin, so that the stability between the pin and the ceramic packaging structure is affected, and the bearing capacity of the joint between the pin and the ceramic packaging structure is affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a perpendicular chip ceramic package structure of car headlight to solve the ceramic package structure that the current perpendicular chip that proposes in the above-mentioned background art was used, because it can not carry on spacing fixed to the pin that stretches out, thereby cause the influence to the stability ability between pin and the ceramic package structure, thereby cause the problem of influence to the bearing capacity of junction between pin and the ceramic package structure.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a perpendicular chip ceramic package structure of car headlight, includes ceramic package body, chip and pin, the one end of ceramic package body is provided with the roof, and the below of roof is provided with the bottom plate, the chip sets up between bottom plate and roof, and the upper and lower both ends surface of chip all is provided with the backup pad, the pin sets up both ends about the chip, the outside surface of roof is provided with protection machanism, and the inner wall left and right sides of roof all is provided with first stop gear, first stop gear's below is provided with second stop gear, and second stop gear sets up in the top both sides surface of bottom plate.

Preferably, protection machanism's inside is including protection corner, first protruding piece and the protruding piece of second, the protection corner glues and glues in the top both sides outer wall surface of roof, and the outside surface on every side of roof glues and has the protruding piece of second, be provided with first protruding piece between the protection corner.

Preferably, the protection corner equidistance evenly distributes in roof top turning all around, and the outer wall surface of roof constitutes irregular surface through the cooperation of first protruding piece with the second protruding piece.

Preferably, the first limiting mechanism comprises a partition plate, a notch and a rubber block, the notch is formed in one end of the partition plate, and the rubber block is adhered to the surface of the inner wall of the notch.

Preferably, the rubber block equidistance evenly distributes in the inner wall surface of notch, and the inseparable laminating between the outer wall surface of the inner wall surface of rubber block and pin.

Preferably, the second limiting mechanism and the first limiting mechanism are symmetrical about a horizontal central line of the chip, and the upper end surface and the lower end surface of the chip are tightly attached to the inner wall surface of the supporting plate.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model can separate the top plate, the bottom plate and other objects through the mutual matching between the protection corner and the convex block, and simultaneously, the ceramic packaging body is subjected to shock absorption protection through the deformation generated between the protection corner and the convex block, so that the bearing capacity of the ceramic packaging body is improved, and the influence of external factors on the stability of the ceramic packaging body is reduced;

2. the utility model discloses a notch is spacing to the pin that its inside passes through, and the deformation that produces through the block rubber, improves the laminating degree between pin and the notch to this stability can be guaranteed between pin and board and the bottom plate, has also improved the bearing capacity of junction between them simultaneously, the setting of block rubber in the internal distribution structure of notch, the effectual setting that reduces block rubber itself causes the influence of pin normal heat dissipation, compactness and harmony to connecting between this ceramic packaging structure inner part improve with this;

3. the utility model discloses a stop gear that both ends surface connection about the pin carries on spacing fixed simultaneously to the upper and lower both ends of pin to this stability can guarantee the chip, thereby has reduced the influence that external factor caused its stability can.

Drawings

FIG. 1 is a schematic view of the front view of the internal structure of the present invention;

FIG. 2 is a schematic top view of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

In the figure: 1. a ceramic package body; 2. a top plate; 3. a base plate; 4. a protection mechanism; 401. protecting corners; 402. a first raised block; 403. a second raised block; 5. a chip; 6. a support plate; 7. a pin; 8. a first limit mechanism; 801. a partition plate; 802. a recess; 803. a rubber block; 9. and a second limiting mechanism.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a vertical chip ceramic packaging structure of a car headlight comprises a ceramic packaging body 1, a chip 5 and pins 7, wherein one end of the ceramic packaging body 1 is provided with a top plate 2, a bottom plate 3 is arranged below the top plate 2, the chip 5 is arranged between the bottom plate 3 and the top plate 2, the upper end surface and the lower end surface of the chip 5 are respectively provided with a supporting plate 6, the pins 7 are arranged at the left end and the right end of the chip 5, the outer side surface of the top plate 2 is provided with a protection mechanism 4, the left side and the right side of the inner wall of the top plate 2 are respectively provided with a first limiting mechanism 8, the protection mechanism 4 internally comprises a protection corner 401, a first raised block 402 and a second raised block 403, the protection corner 401 is adhered to the outer wall surfaces at the two sides of the top end of the top plate 2, the second raised block 403 is adhered to the outer side peripheral surface of the top plate 2, the first raised block 402 is arranged between the protection corners 401, the outer wall surface of the top plate 2 forms an irregular surface through the matching of the first protruding blocks 402 and the second protruding blocks 403, the top plate 2, the bottom plate 3 and other objects can be separated through the mutual matching of the protection corners 401 and the protruding blocks, and meanwhile, the ceramic packaging body 1 is subjected to shock absorption protection through the deformation generated between the protection corners 401 and the protruding blocks, so that the bearing capacity of the ceramic packaging body 1 is improved, and the influence of external factors on the stability performance of the ceramic packaging body is reduced;

the second limiting mechanism 9 is arranged below the first limiting mechanism 8, the second limiting mechanism 9 is arranged on the surfaces of the two sides of the top end of the bottom plate 3, the first limiting mechanism 8 comprises a partition plate 801, a notch 802 and a rubber block 803, the notch 802 is arranged inside one end of the partition plate 801, the rubber block 803 is adhered to the surface of the inner wall of the notch 802, the rubber block 803 is uniformly distributed on the surface of the inner wall of the notch 802 in an equal distance, the surface of the inner wall of the rubber block 803 is tightly adhered to the surface of the outer wall of the pin 7, the pin 7 passing through the inner side of the notch 802 is limited through the notch 802, the adhering degree between the pin 7 and the notch 802 is improved through the deformation generated by the rubber block 803, so that the stability between the pin 7 and the top plate 2 and the bottom plate 3 is ensured, the bearing capacity of the joint between the pin 7 and the top plate 2 is improved, and the bearing capacity of the joint between the pin, the effectual influence that has reduced setting up of block rubber 803 itself and normally dispel the heat and cause pin 7, improve compactness and harmony that connects between this ceramic package structure internals with this, the horizontal central line symmetry about chip 5 between second stop gear 9 and the first stop gear 8, and inseparable laminating between the upper and lower both ends surface of chip 5 and the inner wall surface of backup pad 6, stop gear through both ends surface connection about pin 7, carry out spacing fixed simultaneously to the upper and lower both ends of pin 7, guarantee with this stability can to chip 5, thereby the influence that external factor caused its stability can be reduced.

The working principle is as follows: for the vertical chip ceramic packaging structure of the car headlight, the top plate 2 and the bottom plate 3 are made of ceramic materials, the installed chip 5 is subjected to heat dissipation protection through the ceramic materials with strong heat dissipation performance and sealing performance, the top plate 2, the bottom plate 3 and other objects can be separated through the mutual matching between the protection corner 401 and the protruding block, and meanwhile, the ceramic packaging body 1 is subjected to shock absorption protection through the deformation generated between the protection corner 401 and the protruding block, so that the bearing capacity of the ceramic packaging body 1 is improved, and the influence of external factors on the stability performance of the ceramic packaging body is reduced;

carry on spacingly through notch 802 to the pin 7 that its inboard passes through during the use, and the deformation that produces through block rubber 803, laminating degree between pin 7 and notch 802 improves, guarantee the stability ability between pin 7 and roof 2 and bottom plate 3 with this, the bearing capacity of junction between them has also been improved simultaneously, block rubber 803 is in the setting of the internal distribution structure of notch 802, the effectual influence that causes the normal heat dissipation of setting up of block rubber 803 itself to pin 7 that has reduced, with this compactness and the harmony of connecting between this ceramic package structure inner part improve, the use of this car headlight's perpendicular chip ceramic package structure has just been accomplished like this.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a perpendicular chip ceramic package structure of car headlight, includes ceramic package body (1), chip (5) and pin (7), its characterized in that: the ceramic package body comprises a ceramic package body (1), wherein a top plate (2) is arranged at one end of the ceramic package body (1), a bottom plate (3) is arranged below the top plate (2), a chip (5) is arranged between the bottom plate (3) and the top plate (2), supporting plates (6) are arranged on the surfaces of the upper end and the lower end of the chip (5), pins (7) are arranged at the left end and the right end of the chip (5), a protection mechanism (4) is arranged on the surface of the outer side of the top plate (2), first limiting mechanisms (8) are arranged on the left side and the right side of the inner wall of the top plate (2), second limiting mechanisms (9) are arranged below the first limiting mechanisms (8), and the second limiting mechanisms (9) are arranged on the surfaces of the two sides of the.

2. The vertical chip ceramic package structure of the headlamp of claim 1, wherein: the inside of protection machanism (4) is including protection corner (401), first protruding piece (402) and second protruding piece (403), protection corner (401) glue and glue in the top both sides outer wall surface of roof (2), and the outside of roof (2) is around the surface glue and is glued second protruding piece (403), be provided with first protruding piece (402) between protection corner (401).

3. The vertical chip ceramic package structure of the headlamp of claim 2, wherein: protection corner (401) equidistance even distribution is in roof (2) top corner all around, and the outer wall surface of roof (2) constitutes irregular surface through the cooperation of first protruding piece (402) and second protruding piece (403).

4. The vertical chip ceramic package structure of the headlamp of claim 1, wherein: the first limiting mechanism (8) comprises a separation plate (801), a notch (802) and a rubber block (803), the notch (802) is arranged in one end of the separation plate (801), and the rubber block (803) is adhered to the surface of the inner wall of the notch (802).

5. The vertical chip ceramic package structure of the headlamp of claim 4, wherein: the rubber blocks (803) are uniformly distributed on the inner wall surface of the notch (802) at equal intervals, and the inner wall surface of the rubber blocks (803) is tightly attached to the outer wall surface of the pin (7).

6. The vertical chip ceramic package structure of the headlamp of claim 1, wherein: the second limiting mechanism (9) and the first limiting mechanism (8) are symmetrical about the horizontal central line of the chip (5), and the upper end surface and the lower end surface of the chip (5) are tightly attached to the inner wall surface of the supporting plate (6).