CN210038684U - Low-power-consumption cloud computer case cooling system - Google Patents
Low-power-consumption cloud computer case cooling system Download PDFInfo
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- CN210038684U CN210038684U CN201920278241.0U CN201920278241U CN210038684U CN 210038684 U CN210038684 U CN 210038684U CN 201920278241 U CN201920278241 U CN 201920278241U CN 210038684 U CN210038684 U CN 210038684U
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- heat
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- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a low-power consumption cloud computer machine case cooling system, which comprises a case, a heat dissipation plate, the heat conduction stick, heat-conducting plate and base, the heat dissipation plate is located the inner chamber of machine case, be equipped with a plurality of vents on it, all install a plurality of draw runners in a plurality of vents, the one end sliding connection of heat conduction stick a plurality of draw runners, the other end is articulated with the heat conduction plate, the heat-conducting plate is linked together through flexible heat conduction pipeline and the inside refrigeration chamber that distributes of base, install the semiconductor refrigeration chip in the refrigeration chamber, semiconductor refrigeration chip, cylinder and temperature sensor all electrically connect the PLC controller, the PLC controller is installed on the base, the base is located the below of machine case, and it has the heat dissipation cavity to distribute with the machine case, the heat dissipation cavity communicates the refrigeration; the utility model provides a quick-witted case cooling system not only has the function that improves quick-witted case radiating efficiency, can also plug up the vent when not using the computer, avoids the dirty entering quick-witted incasement of dust.
Description
Technical Field
The utility model relates to a computer machine case cooling system technical field specifically is a low-power consumption cloud computer machine case cooling system.
Background
The computer is an electronic computing machine for high-speed computation, can perform numerical computation and logic computation, has a memory function, and is modern intelligent electronic equipment capable of automatically and high-speed processing mass data according to program operation. A computer composed of a hardware system and a software system without any software installed is called a bare computer, which has an extremely important influence on human productivity and social activities and is rapidly developed with strong vitality. The application field of the method is expanded from the initial military scientific research application to various social fields, a large-scale computer industry is formed, the technical progress in the global range is driven, and the profound social revolution is initiated.
The chassis of the existing computer has the problems of difficult heat dissipation and poor heat dissipation effect, thereby influencing the use effect and the service life of the computer, and the heat dissipation holes of the existing computer chassis are always in an exposed state, so that dust is easy to enter the mainframe box from the heat dissipation holes, and the use performance of a host computer is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low-power consumption cloud computer machine case cooling system to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a low-power consumption cloud computer machine case cooling system, which comprises a case, the heating panel, the heat conduction stick, heat-conducting plate and base, the heating panel is located the inner chamber of quick-witted case, be equipped with a plurality of vents on it, all install a plurality of draw slivers in a plurality of vents, a plurality of draw slivers of one end sliding connection of heat conduction stick, the other end is articulated with the heat conduction plate, the heat conduction plate is linked together through the refrigeration chamber of flexible heat conduction pipeline with the inside distribution of base, semiconductor refrigeration chip is installed to the refrigeration intracavity, the equal electric connection PLC controller of cylinder and temperature sensor, the PLC controller is installed on the base, the base is located the below of quick-witted case, and the distribution has the heat dissipation cavity between the quick-witted case.
As a preferred technical scheme, the inside of heat-conducting plate, heat conduction stick and flexible heat conduction pipeline is the cavity setting, and the inside cavity of heat-conducting plate passes through the inside cavity of hose intercommunication heat conduction stick, and the inside cavity of heat-conducting plate is through flexible heat conduction pipeline intercommunication refrigeration chamber.
As a preferred technical scheme of the utility model, the output hub connection telescopic shaft of cylinder, telescopic shaft fixed connection right angled triangle wedge, the embedded ball groove in the bevel edge of right angled triangle wedge, the ball that ball groove roll connection connecting rod tip set up.
As an optimal technical scheme of the utility model, the one end and the heat-conducting plate fixed connection of right angled triangle wedge are kept away from to the connecting rod.
As an optimal technical scheme of the utility model, temperature sensor installs at quick-witted incasement, the input of its output electric connection PLC controller, the output electric connection cylinder and the semiconductor refrigeration chip of PLC controller.
As an optimized technical scheme of the utility model, the model of semiconductor refrigeration chip is CDL1-12703, and temperature sensor's model is LM 35.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a low-power consumption cloud computer machine case cooling system, through the heating panel that sets up, the heat conduction stick, the heat-conducting plate, the refrigeration chamber, the cylinder, the right angled triangle wedge, the telescopic shaft, connecting rod and temperature sensor, can be when the temperature rises to a definite value in the quick-witted case, temperature sensor sends temperature information to the PLC controller, PLC controller control cylinder and semiconductor refrigeration chip work, the cylinder work can drive the telescopic shaft and rise upwards, cause the right angled triangle wedge can push connecting rod and heat-conducting plate away from quick-witted case, thereby make the heat conduction stick stretched to slide upwards, expose the vent and carry out the heat dissipation work; meanwhile, the semiconductor refrigeration chip can reduce the temperature of air in the refrigeration cavity, the air is transmitted to the heat-conducting plate through the telescopic heat-conducting pipeline and exchanges heat with the heat-conducting plate, and the heat-conducting plate, the heat-conducting rod and the inner cavity of the telescopic heat-conducting pipeline can increase the heat exchange area between the heat-conducting plate and the refrigeration cavity, so that the heat dissipation efficiency of the case is effectively improved;
when not using the computer, the temperature of quick-witted case reduces gradually, and temperature sensor gives the PLC controller with low temperature information transmission this moment, and the work of PLC controller control semiconductor refrigeration chip stop to control cylinder shrink telescopic shaft downwards, cause the right angled triangle wedge can pull connecting rod and heat-conducting plate to quick-witted case, thereby make the heat conduction stick to slide downwards and plug up the vent, play the dirty effect of dust prevention.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a connection diagram of the heat dissipation plate and the heat conduction rod of the present invention.
In the figure: 1. a chassis; 2. a heat dissipation plate; 3. a heat conducting rod; 4. a heat conducting plate; 5. a base; 6. a vent; 7. a slide bar; 8. a telescopic heat conducting pipeline; 9. a refrigeration cavity; 10. a semiconductor refrigeration chip; 11. a cylinder; 12. a temperature sensor; 13. a PLC controller; 14. a heat dissipation cavity; 15. a heat dissipation through hole plate; 16. A through hole; 17. a telescopic shaft; 18. a right-angled triangular wedge block; 19. a connecting rod; 20. and a ball.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: a low-power-consumption cloud computer case cooling system comprises a case 1, a cooling plate 2, a heat conducting rod 3, a heat conducting plate 4 and a base 5, wherein the cooling plate 2 is positioned in an inner cavity of the case 1, a plurality of ventilation openings 6 are formed in the cooling plate, a plurality of sliding strips 7 are arranged in the ventilation openings 6, and the heat conducting rod 3 is limited in sliding position on the premise that the ventilation openings 6 are not blocked; a plurality of draw runner 7 of one end sliding connection of heat conduction stick 3, the other end is articulated with heat-conducting plate 4, heat-conducting plate 4 is linked together through the refrigeration chamber 9 of flexible heat conduction pipeline 8 and the inside distribution of base 5, install semiconductor refrigeration chip 10 in refrigeration chamber 9, semiconductor refrigeration chip 10, the equal electric connection PLC controller 13 of cylinder 11 and temperature sensor 12, PLC controller 13 is installed on base 5, base 5 is located the below of quick-witted case 1, and distribute between the quick-witted case 1 and have heat dissipation cavity 14, heat dissipation cavity 14 communicates refrigeration chamber 9 through the through-hole 16 that distributes on the heat dissipation through-hole board 15.
Heat-conducting plate 4, the inside of heat conduction stick 3 and flexible heat conduction pipeline 8 is the cavity setting, the inside cavity of heat conduction stick 4 passes through the inside cavity of hose intercommunication heat conduction stick 3, and the inside cavity of heat conduction stick 4 communicates refrigeration chamber 9 through flexible heat conduction pipeline 8, make heat-conducting plate 4, heat conduction stick 3 and flexible heat conduction pipeline 8 can carry out the heat exchange with refrigeration chamber 9, heat-conducting plate 4, the inside cavity of heat conduction stick 3 and flexible heat conduction pipeline 8 can increase its and the area of 9 heat exchanges in refrigeration chamber, be favorable to improving its radiating efficiency, and can also install a small-size air exhauster in the heat-conducting plate 4, take out heat conduction stick 4 with the cold air in the refrigeration chamber 9, in the cavity in heat conduction stick 3 and the flexible heat conduction pipeline 8, reduce the heat of the hot air in the cavity, reach radiating purpose.
The output shaft of cylinder 11 is connected telescopic shaft 17, telescopic shaft 17 fixed connection right angle triangle wedge 18, the embedded ball groove in the bevel limit of right angle triangle wedge 18, ball 20 that the ball groove roll connection connecting rod 19 tip set up, and ball groove and ball 20 not only can reduce gliding frictional force between right angle triangle wedge 18 and the connecting rod 19, can also be as an organic whole with right angle triangle wedge 18 and connecting rod 19 joint.
One end of the connecting rod 19, which is far away from the right-angled triangular wedge-shaped block 18, is fixedly connected with the heat conducting plate 4, and can drive the heat conducting plate 4 and the connecting rod 19 to move synchronously.
The model of the semiconductor refrigeration chip 10 is CDL1-12703, and the model of the temperature sensor 12 is LM 35.
The working principle is as follows:
when the temperature control device works, a user starts a computer, the case 1 works, the temperature in the case gradually rises along with the working time, when the temperature rises to a certain value, the temperature sensor 12 can send the temperature information to the PLC 13, the PLC 13 controls the cylinder 11 and the semiconductor refrigeration chip 10 to start to work according to the received temperature information, and the cylinder 11 can drive the telescopic shaft 17 to rise upwards when working, so that the right-angled triangular wedge-shaped block 18 pushes the connecting rod 19 and the heat conducting plate 4 to synchronously move towards the direction far away from the case 1; meanwhile, the semiconductor refrigeration chip 10 can reduce the air temperature in the refrigeration cavity 9, because one end of the telescopic heat conduction pipeline 8 is positioned in the refrigeration cavity 9 and can exchange heat with the refrigeration cavity 9, and because the telescopic heat conduction pipeline 8 is fixedly connected with the heat conduction plate 4, the heat conduction plate 4 is connected with the heat conduction rod 3, and the heat conduction rod 3 is connected with the heat dissipation plate 2, the heat conduction plate 4, the heat conduction rod 3 and the telescopic heat conduction pipeline 8 can exchange heat with the refrigeration cavity 9, the heat conduction plate 4, the heat conduction rod 3 and the inner cavity of the telescopic heat conduction pipeline 8 can increase the heat exchange area with the refrigeration cavity 9, which is beneficial to improving the heat dissipation efficiency, and a small exhaust fan can be arranged in the heat conduction plate 4 to draw the cold air in the refrigeration cavity 9 into the cavities in the heat conduction plate 4, the heat conduction rod 3 and the telescopic heat conduction pipeline 8 to reduce, the purpose of heat dissipation is achieved;
when not using the computer, the temperature of machine case 1 reduces gradually, and temperature sensor 12 sends low temperature information for PLC controller 13 this moment, and PLC controller 13 control semiconductor refrigeration chip 10 stop work to control cylinder 11 shrink telescopic shaft 17 downwards, cause right angled triangle wedge 18 can pull connecting rod 19 and heat-conducting plate 4 to machine case 1, thereby make heat-conducting plate 4 move down and block up vent 6, play the dirty effect of dust prevention.
It is worth noting that: the whole device is controlled by the master control button, and the equipment matched with the control button is common equipment, so that the device belongs to the existing well-known technology, and the electrical connection relation and the specific circuit structure of the device are not repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A low-power-consumption cloud computer case heat dissipation system is characterized by comprising a case (1), a heat dissipation plate (2), a heat conduction rod (3), a heat conduction plate (4) and a base (5), wherein the heat dissipation plate (2) is positioned in an inner cavity of the case (1) and is provided with a plurality of ventilation openings (6), a plurality of sliding strips (7) are arranged in the plurality of ventilation openings (6), one end of the heat conduction rod (3) is connected with the plurality of sliding strips (7) in a sliding manner, the other end of the heat conduction rod is hinged with the heat conduction plate (4), the heat conduction plate (4) is communicated with a refrigeration cavity (9) distributed in the base (5) through a telescopic heat conduction pipeline (8), a semiconductor refrigeration chip (10) is arranged in the refrigeration cavity (9), the semiconductor refrigeration chip (10), an air cylinder (11) and a temperature sensor (12) are electrically connected with a PLC controller (13), and the, the base (5) is positioned below the case (1), a heat dissipation cavity (14) is distributed between the base and the case (1), and the heat dissipation cavity (14) is communicated with the refrigeration cavity (9) through holes (16) distributed on a heat dissipation through hole plate (15).
2. The heat dissipation system for the chassis of the low-power-consumption cloud computer, as recited in claim 1, wherein the heat conducting plate (4), the heat conducting rod (3) and the telescopic heat conducting pipe (8) are all arranged in a cavity, the internal cavity of the heat conducting plate (4) is communicated with the internal cavity of the heat conducting rod (3) through a hose, and the internal cavity of the heat conducting plate (4) is communicated with the refrigeration cavity (9) through the telescopic heat conducting pipe (8).
3. The low-power-consumption cloud computer case cooling system is characterized in that an output end shaft of the air cylinder (11) is connected with a telescopic shaft (17), the telescopic shaft (17) is fixedly connected with a right-angle triangular wedge block (18), a ball groove is embedded in an oblique corner edge of the right-angle triangular wedge block (18), and the ball groove is in rolling connection with a ball (20) arranged at the end of a connecting rod (19).
4. The heat dissipation system for the chassis of the low-power-consumption cloud computer as claimed in claim 3, wherein one end of the connecting rod (19) far away from the right-angled triangular wedge-shaped block (18) is fixedly connected with the heat conduction plate (4).
5. The low-power-consumption cloud computer case cooling system according to claim 1, wherein the temperature sensor (12) is installed in the case (1), an output end of the temperature sensor is electrically connected with an input end of the PLC (13), and an output end of the PLC (13) is electrically connected with the cylinder (11) and the semiconductor refrigeration chip (10).
6. The low-power-consumption cloud computer cabinet heat dissipation system of claim 1, wherein the semiconductor refrigeration chip (10) is of a type CDL1-12703, and the temperature sensor (12) is of a type LM 35.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920278241.0U CN210038684U (en) | 2019-03-05 | 2019-03-05 | Low-power-consumption cloud computer case cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920278241.0U CN210038684U (en) | 2019-03-05 | 2019-03-05 | Low-power-consumption cloud computer case cooling system |
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| Publication Number | Publication Date |
|---|---|
| CN210038684U true CN210038684U (en) | 2020-02-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920278241.0U Expired - Fee Related CN210038684U (en) | 2019-03-05 | 2019-03-05 | Low-power-consumption cloud computer case cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111338447A (en) * | 2020-03-12 | 2020-06-26 | 浙江广厦建设职业技术学院 | Host placing device capable of radiating heat of host computer |
| CN114924625A (en) * | 2022-05-25 | 2022-08-19 | 深圳市万桥技术有限公司 | Server device for data transmission of contact center |
-
2019
- 2019-03-05 CN CN201920278241.0U patent/CN210038684U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111338447A (en) * | 2020-03-12 | 2020-06-26 | 浙江广厦建设职业技术学院 | Host placing device capable of radiating heat of host computer |
| CN114924625A (en) * | 2022-05-25 | 2022-08-19 | 深圳市万桥技术有限公司 | Server device for data transmission of contact center |
| CN114924625B (en) * | 2022-05-25 | 2022-12-13 | 深圳市万桥技术有限公司 | Server device for data transmission of contact center |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200207 Termination date: 20210305 |
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| CF01 | Termination of patent right due to non-payment of annual fee |