CN210016697U - Flexible circuit board and electronic device - Google Patents
Flexible circuit board and electronic device Download PDFInfo
- Publication number
- CN210016697U CN210016697U CN201822279160.0U CN201822279160U CN210016697U CN 210016697 U CN210016697 U CN 210016697U CN 201822279160 U CN201822279160 U CN 201822279160U CN 210016697 U CN210016697 U CN 210016697U
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- China
- Prior art keywords
- circuit board
- flexible circuit
- pad portion
- holes
- substrate
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- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a flexible circuit board and electron device, electron device passes through flexible circuit board switches on with outside circuit board, flexible circuit board includes the base plate, locates the first pad portion of base plate one end, locates the second pad portion of the base plate other end and set up in the connection of base plate first pad portion with the signal line of second pad portion, first pad portion is equipped with two and mutual interval setting, each a plurality of through-holes that run through its setting are seted up to first pad portion, and are a plurality of the through-hole is the array and arranges. Compared with the prior art, the utility model provides a flexible circuit board's performance is better.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a circuit board field especially relates to a flexible circuit board and electron device.
[ background of the invention ]
The Flexible Printed Circuit Board (also called "Flexible Printed Circuit Board") uses a Printed Circuit made of Flexible insulating base material, and has many advantages that the rigid Printed Circuit Board does not have. Compared with a general circuit board, the flexible circuit board has high reliability, has the characteristics of high wiring density, light weight and thin thickness, and is widely applied to connection of electronic devices.
In the related art, a flexible circuit board applied to a speaker includes a substrate, first and second pad portions at both ends of the substrate, and a signal line connecting the first and second pad portions, the first pad part is used for welding with an external printed circuit board, the second pad part is used for welding with a loudspeaker, the first pad portion and the second pad portion are usually disposed in two, respectively, and the two first pad portions are spaced and insulated from each other, when the first pad part is welded with an external printed circuit board, because the whole surface of the first pad part is plated with copper, solder paste easily overflows during soldering, so that a short circuit is caused between the two first pad portions, and since the first pad portions are of a solid structure, the requirement on the thickness range and uniformity of the tin brush is extremely high, the difficulty in the process of manufacturing is increased, and the yield of the finished flexible circuit board is influenced.
Therefore, there is a need to provide an improved flexible circuit board and electronic device to solve the above problems.
[ Utility model ] content
To the technical problem of the flexible circuit board among the correlation technique short circuit takes place easily when with external printed circuit board welding, the utility model provides a better flexible circuit board of performance and electron device.
The utility model provides a flexible circuit board, its includes the base plate, locate the first pad portion of base plate one end, locate the second pad portion of the base plate other end and set up in the signal line of base plate connecting first pad portion with the second pad portion, first pad portion is equipped with two and sets up at interval each other, and each first pad portion is seted up a plurality of through-holes that run through its setting, and is a plurality of the through-hole is array arrangement.
Preferably, the through hole is a circular hole.
Preferably, a plurality of the through holes are uniformly spaced.
Preferably, the aperture of the through hole is 0.15 mm.
Preferably, the distance between the centers of two adjacent through holes is 0.23 mm.
Preferably, the through hole is formed by etching.
Preferably, the first pad portion includes a copper metal layer, the copper metal layer is stacked at an end of the signal line away from the second pad portion, and the through hole penetrates through the copper metal layer and the signal line and extends to at least a portion of the substrate.
Preferably, the second pad portions include two and are spaced apart from each other.
An electronic device, the electronic device is conducted with an external circuit board, the electronic device comprises the flexible circuit board, the first pad part conducts the second pad part with the external circuit board, and the first pad part is fixedly connected with the external circuit board through SMT (surface mount technology) solder paste.
Compared with the prior art, the through hole is formed in the first welding disc part of the flexible circuit board, so that when the flexible circuit board is welded with an external circuit board, solder paste can flow into the through hole, the solder paste is prevented from splashing and overflowing the first welding disc part, and the problem of short circuit between the two first welding disc parts is avoided; meanwhile, the through holes are formed in the first welding disc part, so that the requirements of the first welding disc part on the thickness range and uniformity of tin brushing are reduced, the difficulty of process manufacturing is reduced, and the performance of the flexible circuit board is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic structural diagram of the flexible circuit board of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1. The utility model provides a flexible circuit board 100 is applied to electron device (for example speaker), and it includes base plate 10, locates the first pad portion 20 of base plate 10 one end, locate the second pad portion 30 of the base plate 10 other end and set up in the connection of base plate 10 first pad portion 20 with the signal line 40 of second pad portion 30. The first pad part 20 is used for soldering with an external circuit board, and the second pad part 30 is used for soldering with an internal circuit of an electronic device.
The substrate 10 is a bent circuit board. The first pad portions 20 and the second pad portions 30 are respectively provided in two numbers, the two first pad portions 20 are spaced apart from each other, and the two second pad portions 30 are spaced apart from each other.
Each of the first pad portions 20 is provided with a through hole 21 penetrating through the first pad portion 20, the through holes 21 are round holes and are provided with a plurality of through holes 21, and the plurality of through holes 21 are arranged in an array. In this embodiment, the plurality of through holes 21 are arranged in an array to form a honeycomb structure, and the plurality of through holes 21 are uniformly spaced. Specifically, the through holes 21 are formed through an etching process, the aperture of each through hole 21 is 0.15mm, and the distance between the centers of two adjacent through holes 21 is 0.23 mm.
It can be understood that, by forming the through hole 21 on the first pad portion 20, the solder paste can flow into the through hole 21 during the high-temperature hot-press soldering process of the first pad portion 20 and the external circuit board, so as to avoid the solder paste from splashing and overflowing the first pad portion 20, thereby avoiding the short circuit problem between the two first pad portions 20. And through setting up the through-hole 21, also make the first pad portion 20 be partial hollow structure, to brushing tin thickness scope and homogeneity requirement reduction to the degree of difficulty in the technology manufacturing process has been reduced, let the finished product yield further improve.
In this embodiment, the through holes 21 are circular holes, and the through holes 21 are uniformly spaced. Of course, in other embodiments, the through holes 21 may have any shape, for example, the through holes 21 may have a rectangular shape, a fan shape, etc., and the through holes 21 may be randomly distributed. Only need promptly first pad portion 20 offer be used for preventing that the tin cream from splashing and overflowing to can reduce the through-hole 21 of the degree of difficulty in the technology manufacturing process can, the shape structure of through-hole 21, the mode of arranging the utility model discloses do not do any and prescribe a limit to.
The first pad portion 20 further includes a metal plating layer 22, the metal plating layer 22 is stacked on an end of the signal line 40 away from the second pad portion 30, and the via 21 penetrates the metal plating layer 22 and the signal line 40 and extends to at least a portion of the substrate 10. The first pad part 20 is surface-treated by, for example, tin plating, gold plating, or the like. In the present embodiment, the metal plating layer 22 is a metal copper layer, i.e., the first pad portion 20 is surface-treated by copper plating.
The first pad part 20 is provided with an insulating material, such as a polyimide layer. The insulating material further prevents the short circuit problem of the flexible circuit board 100 and a metal component directly contacted with the flexible circuit board 100, has a reinforcing function, and improves the product performance, thereby prolonging the service life of the flexible circuit board 100. The through-hole 21 is arranged through the metallization 22, i.e. only the insulating material in the through-hole 21 is free of copper.
The signal line 40 is used to connect the first pad portion 20 and the second pad portion 30, so that the first pad portion 20 and the second pad portion 30 are electrically connected. The signal line 40 is a metal line disposed on the substrate 10, and the signal line 40 may be a metal material such as copper, aluminum, and the like. The shape of the signal lines 40 can be changed according to the change of the orientation of the substrate 10, that is, the arrangement position of the signal lines 40 can be determined according to actual requirements.
Meanwhile, the utility model also provides an electronic device (not shown), the electronic device switches on with external circuit board, the electronic device includes flexible circuit board 100, first pad portion 20 will second pad portion 30 with external circuit board switches on. Specifically, the first pad portion 20 and the external circuit board are fixedly connected by SMT solder paste.
Compared with the prior art, the through hole is formed in the first welding disc part of the flexible circuit board, so that when the flexible circuit board is welded with an external circuit board, solder paste can flow into the through hole, the solder paste is prevented from splashing and overflowing the first welding disc part, and the problem of short circuit between the two first welding disc parts is avoided; meanwhile, the through holes are formed in the first welding disc part, so that the requirements of the first welding disc part on the thickness range and uniformity of tin brushing are reduced, the difficulty of process manufacturing is reduced, and the performance of the flexible circuit board is improved.
The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.
Claims (9)
1. The flexible circuit board comprises a substrate, a first bonding pad part arranged at one end of the substrate, a second bonding pad part arranged at the other end of the substrate and a signal line arranged on the substrate and connecting the first bonding pad part and the second bonding pad part, wherein the first bonding pad part is provided with two through holes which penetrate through the first bonding pad part and are arranged at intervals.
2. The flexible circuit board of claim 1, wherein the through-hole is a circular hole.
3. The flexible circuit board of claim 2, wherein a plurality of the through holes are uniformly spaced apart.
4. The flexible circuit board of claim 3, wherein the via hole diameter is 0.15 mm.
5. The flexible circuit board of claim 3, wherein the distance between the centers of two adjacent through holes is 0.23 mm.
6. The flexible circuit board of claim 1, wherein the via is formed by etching.
7. The flexible circuit board of claim 1, wherein the first pad portion comprises a copper metal layer, the copper metal layer is stacked on an end of the signal line away from the second pad portion, and the via hole penetrates the copper metal layer and the signal line and extends to at least a portion of the substrate.
8. The flexible circuit board according to claim 1, wherein the second pad portion includes two and is spaced apart from each other.
9. An electronic device, which is conducted with an external circuit board, wherein the electronic device comprises the flexible circuit board according to any one of claims 1 to 8, the first pad portion conducts the second pad portion with the external circuit board, and the first pad portion is fixedly connected with the external circuit board by SMT solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822279160.0U CN210016697U (en) | 2018-12-30 | 2018-12-30 | Flexible circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822279160.0U CN210016697U (en) | 2018-12-30 | 2018-12-30 | Flexible circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210016697U true CN210016697U (en) | 2020-02-04 |
Family
ID=69312142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822279160.0U Expired - Fee Related CN210016697U (en) | 2018-12-30 | 2018-12-30 | Flexible circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210016697U (en) |
-
2018
- 2018-12-30 CN CN201822279160.0U patent/CN210016697U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200204 Termination date: 20211230 |