CN210016689U - Circuit board is with heat radiation structure convenient to fix - Google Patents
Circuit board is with heat radiation structure convenient to fix Download PDFInfo
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- CN210016689U CN210016689U CN201920462540.XU CN201920462540U CN210016689U CN 210016689 U CN210016689 U CN 210016689U CN 201920462540 U CN201920462540 U CN 201920462540U CN 210016689 U CN210016689 U CN 210016689U
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- circuit board
- heat
- bottom plate
- chip
- heat dissipation
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Abstract
The utility model discloses a circuit board is with heat radiation structure convenient to it is fixed, including circuit board and round hole, the inside arrangement of circuit board has the needle file, and the top of needle file is provided with the chip, install the heat dissipation hole on the inside of circuit board, the bottom arrangement of circuit board has the cylinder block, and one side of cylinder block is provided with the telescopic link, the link plate is installed to the bottom of cylinder block, one side of link plate is provided with the bottom plate, and the bottom of bottom plate installs the control box, the inside arrangement of bottom plate has the ventilating fan. The utility model discloses in, settle through the circuit board top has the chip, because the chip on the circuit board need dispel the heat, and the heat conduction material can use and fill the gap between chip and the fin of generating heat, can increase the area of contact between chip and the fin, effectively reduces the thermal contact resistance between them, and settles the heat-conducting layer between chip and fin, uses the heat-conducting layer to transmit the chip thermal current fast on the fin.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board is with heat radiation structure convenient to fix.
Background
The heat dissipation problem of the circuit board heat dissipation substrate directly affects the light output characteristics of an LED and the service life of a device, and is a key problem in high-power LED packaging.
The existing circuit board basically has the heat dissipation function through the heat dissipation holes, does not dissipate heat in a fan mode, and cannot improve the heat dissipation work of the circuit board and fill gaps between a heating chip and a heat dissipation fin when workers operate the circuit board, so that the thermal contact resistance between the chip and the heat dissipation fin is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a circuit board with a heat radiation structure convenient to fix.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a circuit board is with heat radiation structure convenient to it is fixed, includes circuit board and round hole, the inside arrangement of circuit board has the needle file, and the top of needle file is provided with the chip, the internally mounted of circuit board has the heat dissipation hole, the arrangement of the bottom of circuit board has the cylinder block, and one side of cylinder block is provided with the telescopic link, the link plate is installed to the bottom of cylinder block, one side of link plate is provided with the bottom plate, and the bottom of bottom plate installs the control box, the arrangement of the inside of bottom plate has the ventilating fan, the arrangement of the inside of chip has the heat-conducting layer, and the top of heat-conducting layer is provided with the fin, the inside of bottom plate is run through there is the.
As a further description of the above technical solution:
the shape of the radiating fin is matched with that of the heat conducting layer, and the central point of the bottom of the heat conducting layer corresponds to the central point of the chip.
As a further description of the above technical solution:
the cross-sectional area of the circuit board is larger than that of the bottom plate, and the bottom plate is fixedly connected with the hanging plate.
As a further description of the above technical solution:
the telescopic rod is fixedly connected with the hanging plate, and the hanging plate and the cylindrical block body form a detachable structure through bolts.
As a further description of the above technical solution:
the outer side of the bottom plate is fixedly connected with the inner wall of the hanging plate, and the symmetrical center point of the hanging plate is coincided with the symmetrical center point of the round hole.
As a further description of the above technical solution:
the ventilating fan equidistance is provided with three groups, and the ventilating fan constitutes revolution mechanic through pivot and bottom plate.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, settle through the circuit board top has the chip, because the chip on the circuit board need dispel the heat, and the heat conduction material can use and fill the gap between chip and the fin of generating heat, can increase the area of contact between chip and the fin, effectively reduces the thermal contact resistance between them, and settles the heat-conducting layer between chip and fin, uses the heat-conducting layer to transmit the chip thermal current fast on the fin.
2. The utility model discloses in, through the bottom installation control box of circuit board, need carry out radiating in-process when the circuit board, can directly carry out the operation work to the ventilating fan through the control box to the inner wall at the bottom plate is connected to the inboard of control box, and there is the link plate the both sides output of bottom plate, fixes the link plate through the cylinder block, and the telescopic link that makes cylinder block one side drives the bottom plate and reciprocates, effectual solution bottom plate and the radiating distance effect of circuit board.
3. The utility model discloses in, there is the bottom plate below through the circuit board, when the heat extraction hole on the circuit board carries out the heat extraction through the ventilating fan, and there are three group's ventilating fans inside of bottom plate, then wherein two sets of ventilating fans are connected with the pivot from top to bottom, and the pivot runs through in the inside of bottom plate, drive the ventilating fan on the bottom plate both sides through the pivot, better messenger's ventilating fan pivoted angle carries out the work of dispelling the heat to the heat extraction hole on the circuit board, the central point of bottom plate is provided with a set of ventilating fan simultaneously, its ventilating fan can directly carry out the heat extraction with the heat extraction hole, make the radiating efficiency of circuit board improve.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
fig. 2 is a schematic top view of the bottom plate of the present invention;
fig. 3 is a schematic top view of the bottom of the circuit board according to the present invention;
illustration of the drawings:
1. a circuit board; 2. a cylindrical block body; 3. a telescopic rod; 4. a heat sink; 5. a heat conductive layer; 6. an operation box; 7. a base plate; 8. hanging the plate; 9. a circular hole; 10. a rotating shaft; 11. a ventilating fan; 12. heat removal holes; 13. a needle seat; 14. and (3) a chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, a heat radiation structure convenient for fixing for a circuit board comprises a circuit board 1 and a circular hole 9, a needle seat 13 is arranged inside the circuit board 1, a chip 14 is arranged at the top end of the needle seat 13, a heat exhaust hole 12 is arranged inside the circuit board 1, a cylindrical block 2 is arranged at the bottom of the circuit board 1, an expansion link 3 is arranged on one side of the cylindrical block 2, a hanging plate 8 is arranged at the bottom end of the cylindrical block 2, a bottom plate 7 is arranged on one side of the hanging plate 8, an operation box 6 is arranged at the bottom of the bottom plate 7, a ventilating fan 11 is arranged inside the bottom plate 7, a heat conduction layer 5 is arranged inside the chip 14, a heat radiation fin 4 is arranged at the top of the heat conduction layer 5, a rotating shaft 10 penetrates through the bottom plate 7, the.
Furthermore, the heat sink 4 is matched with the heat conducting layer 5 in shape, the central point of the bottom of the heat conducting layer 5 corresponds to the central point of the chip 14, and the heat conducting material can be used for filling a gap between the heat generating chip 14 and the heat sink 4, so that the contact area between the chip 14 and the heat sink 4 can be increased, and the thermal contact resistance between the chip 14 and the heat sink 4 can be effectively reduced.
Further, the cross sectional area of circuit board 1 is greater than the cross sectional area of bottom plate 7, and be fixed connection between bottom plate 7 and the link plate 8, in-process when circuit board 1 needs to carry out the heat dissipation, operation box 6 is connected at the inner wall of bottom plate 7, and there is link plate 8 bottom plate 7's both sides output, fix link plate 8 through cylinder block 2, make the telescopic link 3 that is two segmentation threaded connection of cylinder block 2 one side adjust the work of stretching out and drawing back, then can drive bottom plate 7 and reciprocate.
Further, be fixed connection between telescopic link 3 and the link plate 8, and constitute detachable construction through the bolt between link plate 8 and the cylinder block 2, when needs dismantle the work to bottom plate 7, then through dismantling the bolt for break away from between link plate 8 and the cylinder block 2, then accomplish the dismantlement work to bottom plate 7.
Further, be fixed connection between the outside of bottom plate 7 and the inner wall of link plate 8, and the central point of symmetry of link plate 8 coincides mutually with the central point of symmetry of round hole 9, is provided with link plate 8 through the both sides output of bottom plate 7, and passes round hole 9 on link plate 8 through the cylinder block 2 that is the symmetry setting and carry out the fixed work of locate mode, avoids the radiator unit of bottom plate 7 bottom to reduce the heat dispersion of circuit board 1.
Further, 11 equidistances of ventilating fan are provided with three groups, and ventilating fan 11 constitutes revolution mechanic through pivot 10 and bottom plate 7, through starting ventilating fan 11 for the wind body carries out heat extraction work to circuit board 1 department along heat extraction hole 12 activity, and through the rotation effect between ventilating fan 11 and the pivot 10, then can realize the multi-angle to the heat dissipation work of chip 14, promotes this heat radiation structure's flexibility.
The working principle is as follows: firstly, a needle seat 13 is arranged in the circuit board 1, the output end of the needle seat 13 is connected with a chip 14, when the chip 14 needs to radiate heat, a heat conduction material can be used for filling a gap between the heating chip 14 and the radiating fin 4, the contact area between the chip 14 and the radiating fin 4 can be increased, the contact thermal resistance between the chip 14 and the radiating fin 4 can be effectively reduced, meanwhile, an operation box 6 is arranged at the bottom of the bottom plate 7, a driving component in the operation box 6 can be directly started, so that the ventilating fan 11 is in a normal working state, and the heat radiation work of the chip 14 from multiple angles can be realized through the rotating action between the ventilating fan 11 and the rotating shaft 10, before the heat radiation work is carried out, the bottom plate 7 needs to be arranged at the bottom of the circuit board 1, the cylindrical blocks 2 which are symmetrically arranged can pass through the round holes 9 on the hanging plate 8 to carry out positioning type fixing work, and, the distance between the bottom plate 7 and the circuit board 1 can be adjusted, so that the auxiliary circuit board 1 with the better heat dissipation structure can complete heat dissipation work.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A heat dissipation structure convenient for fixing of a circuit board comprises the circuit board (1) and a circular hole (9), and is characterized in that a needle seat (13) is arranged inside the circuit board (1), a chip (14) is arranged at the top end of the needle seat (13), a heat dissipation hole (12) is arranged inside the circuit board (1), a cylindrical block body (2) is arranged at the bottom of the circuit board (1), an expansion link (3) is arranged on one side of the cylindrical block body (2), a hanging plate (8) is arranged at the bottom end of the cylindrical block body (2), a bottom plate (7) is arranged on one side of the hanging plate (8), an operation box (6) is arranged at the bottom of the bottom plate (7), a ventilating fan (11) is arranged inside the bottom plate (7), a heat conduction layer (5) is arranged inside the chip (14), and heat dissipation fins (4) are arranged at the, the inside of bottom plate (7) is run through and is had pivot (10), and pivot (10) are connected with ventilating fan (11), round hole (9) are settled in the inside of link plate (8).
2. The fixed heat dissipation structure for circuit board according to claim 1, wherein the heat sink (4) and the heat conductive layer (5) are shaped to match each other, and a center point of the bottom of the heat conductive layer (5) corresponds to a center point of the chip (14).
3. The heat dissipation structure for the circuit board convenient to fix as claimed in claim 1, wherein the cross-sectional area of the circuit board (1) is larger than that of the bottom plate (7), and the bottom plate (7) and the hanging plate (8) are fixedly connected.
4. The heat dissipation structure convenient for fixing of the circuit board according to claim 1, wherein the telescopic rod (3) and the hanging plate (8) are fixedly connected, and the hanging plate (8) and the cylindrical block body (2) form a detachable structure through a bolt.
5. The heat dissipation structure for circuit boards convenient to fix according to claim 1, wherein the outer side of the bottom plate (7) is fixedly connected with the inner wall of the hanging plate (8), and the symmetric center point of the hanging plate (8) coincides with the symmetric center point of the circular hole (9).
6. The heat dissipation structure for circuit board convenient to fix as claimed in claim 1, wherein the ventilation fans (11) are arranged in three groups at equal intervals, and the ventilation fans (11) and the bottom plate (7) form a rotating structure through the rotating shaft (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920462540.XU CN210016689U (en) | 2019-04-08 | 2019-04-08 | Circuit board is with heat radiation structure convenient to fix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920462540.XU CN210016689U (en) | 2019-04-08 | 2019-04-08 | Circuit board is with heat radiation structure convenient to fix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210016689U true CN210016689U (en) | 2020-02-04 |
Family
ID=69314608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920462540.XU Active CN210016689U (en) | 2019-04-08 | 2019-04-08 | Circuit board is with heat radiation structure convenient to fix |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210016689U (en) |
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2019
- 2019-04-08 CN CN201920462540.XU patent/CN210016689U/en active Active
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