CN210006698U

CN210006698U - Bending device for diode pins

Info

Publication number: CN210006698U
Application number: CN201920792067.1U
Authority: CN
Inventors: 储小兰
Original assignee: Siyang Qunxin Electronics Co Ltd
Current assignee: Siyang Qunxin Electronics Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-01-31
Anticipated expiration: 2029-09-30

Abstract

A bending device for diode pins, which comprises a lower die holder, a lower die plate arranged on the middle of the top surface of the lower die holder, a lower pressing die arranged on the middle of the top surface of the lower die plate, guide post holders connected with the lower die holder arranged on the left and right sides of the lower pressing die plate, guide posts arranged on the top surfaces of the two guide post holders, a mounting plate arranged on the upper part of the two guide posts, a nut arranged on the upper surface of the mounting plate, a upper pressing die arranged below the mounting plate, ear plates arranged on the left and right sides of the upper pressing die, the ear plates sliding up and down along the post body of the guide posts, a return spring arranged on the guide posts and between the ear plates and the guide post holders, a bracket arranged above the mounting plate, a cylinder arranged on the bracket, a -th transverse groove transversely arranged on above the lower pressing die, a plurality of longitudinal grooves arranged above the lower pressing die, a second transverse groove arranged on the lower surface of the upper pressing die, and the lower die having the advantages of .

Description

Bending device for diode pins

Technical Field

The utility model relates to a diode production and processing technology field especially relates to bending device of kinds of diode pins.

Background

The diode is a common electronic component, is widely applied to the field of circuits, among the diodes and the electronic components, devices with two electrodes only allow current to flow in a single direction, and many of the devices use the rectification function, while the varactor is used as an electronic adjustable capacitor, so the diode can be thought of as a check valve of an electronic version.

However, the conventional diode pin bending tool is usually manually bent, the bending angle cannot be 90 degrees, manual operation is time-consuming and labor-consuming, production efficiency is affected, meanwhile, when the diode pin is bent, the diode pin cannot be fixed, the pin moves when the diode pin is bent, and the bending effect is affected, so that kinds of bending tools for the diode pin are provided.

Disclosure of Invention

The utility model aims at providing a bending device of kinds of diode pins for solving above-mentioned problem.

kinds of diode pin's bending device, this bending device include the die holder, be in the top surface of die holder is provided with down-pressure die plate in the middle, the four corners of down-pressure die plate pass through countersunk head bolt with the die holder is connected, the top surface of down-pressure die plate is provided with down-pressure die in the middle, be in down-pressure die plate's the left and right sides respectively be equipped with with the guide pillar seat that the die holder links to each other, be equipped with guide pillars respectively perpendicularly on two guide pillar seat top surfaces, be equipped with horizontally placed mounting panel on the upper portion of two guide pillars;

nuts fixedly connected with the mounting plate are respectively arranged on the upper surface of the mounting plate at the positions of the two guide posts;

upper pressing dies are arranged below the mounting plate, lug plates are arranged on the left side and the right side of each upper pressing die, the lug plates slide up and down along the column body of the guide column, and return springs are arranged on the guide column and between the lug plates and the guide column seats;

an support is arranged in the middle above the mounting plate, the opening of the support faces downwards, an air cylinder is arranged on the support, and an ejector rod of the air cylinder penetrates through the mounting plate and then is fixedly connected with the upper top surface of the upper pressing die to drive the upper pressing die to move downwards;

transverse grooves are formed above the lower pressing die, a plurality of longitudinal grooves are formed above the lower pressing die, and the longitudinal grooves are through grooves and intersect with the transverse grooves;

and a second transverse groove corresponding to the lower pressing die is arranged on the lower surface of the upper pressing die and right above the lower pressing die, and the second transverse groove is matched with the lower pressing die to bend the diode pin.

Preferably, the second transverse groove has a transverse through structure for easy processing.

, in order to achieve better reset effect, the guide post seat is provided with a pit for accommodating the reset spring.

Preferably, the depth dimension of the pit for accommodating the return spring on the guide post seat is within the range of 5-10 mm.

Advantageous effects

The utility model has the advantages that:

this frock of bending of diode pin compares traditional manual work, has that the angle of bending causes advantages such as good, efficient fast.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial enlarged view of the present invention;

in the figure: 1-a lower die holder;

2-a guide post seat;

3-a return spring;

4-guide pillar;

5, mounting a plate;

6-a nut;

7-upper pressing die, 7.1-lug plate, 7.2-second transverse groove;

8, pressing a die;

9-a cylinder;

10-lower die, 10.1- th transverse groove and 10.2-longitudinal groove;

11-pressing down the template.

Detailed Description

The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of , but not all embodiments.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships that are based on the positions or relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate and imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example 1

Please refer to fig. 1 and 2, a diode pin bending apparatus of kinds includes a lower die holder 1, a lower die plate 11 is arranged in the middle of the top surface of the lower die holder 1, four corners of the lower die plate 11 are connected with the lower die holder 1 through countersunk bolts, a lower die 10 is arranged in the middle of the top surface of the lower die plate 11, guide post holders 2 connected with the lower die holder 1 are respectively arranged on the left and right sides of the lower die plate 11, guide posts 4 are respectively vertically arranged on the top surfaces of the two guide post holders 2, and a mounting plate 5 horizontally arranged at is arranged on the upper portions of the two guide posts 4.

The upper surface of the mounting plate 5 is provided with nuts 6 fixed to the mounting plate 5 at the positions of the two guide posts 4.

upper pressing dies 7 are arranged below the mounting plate 5, lug plates 7.1 are arranged on the left side and the right side of each upper pressing die 7, the lug plates 7.1 slide up and down along the column shaft of the guide column 4, and return springs 3 are arranged on the guide column 4 and between the lug plates 7.1 and the guide column seat 2.

support 8 is arranged in the middle above the mounting plate 5, the opening of the support 8 faces downwards, a cylinder 9 is arranged on the upper pressing die 8, and an ejector rod of the cylinder 9 penetrates through the mounting plate 5 and then is fixedly connected with the upper top surface of the upper pressing die 7 to drive the upper pressing die 7 to move downwards.

transverse transverse grooves 10.1 are formed above the lower die 10, transverse grooves 10.1 are used for placing pn joint parts of the diode, a plurality of longitudinal grooves 10.2 are formed above the lower die 10, the longitudinal grooves 10.2 are through grooves and are intersected with the transverse grooves 10.1, and the longitudinal grooves 10.2 are used for placing pins at two ends of the diode.

And a second transverse groove 7.2 corresponding to the lower pressing die 10 is arranged on the lower surface of the upper pressing die 7 and is positioned right above the lower pressing die 10, and the second transverse groove 7.2 is matched with the lower pressing die 10 to bend the diode pin.

In order to facilitate the processing and not influence the use, the second transverse groove 7.2 is set to be a transverse through structure, and in order to prevent the reset spring 3 from swinging randomly to influence the reset effect, a pit with the depth size of 5-10mm for accommodating the reset spring 3 is arranged on the guide pillar seat 2.

It will thus be seen that the present invention is illustrative and not restrictive, and the scope of the invention is defined by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment contains independent technical solutions, and such description of the description is only for clarity, and those skilled in the art should take the description as as a whole, and the technical solutions in the respective embodiments may be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

The bending device for the diode pins is characterized by comprising a lower die holder (1), wherein a lower pressing die plate (11) is arranged in the middle of the top surface of the lower die holder (1), four corners of the lower pressing die plate (11) are connected with the lower die holder (1) through countersunk bolts, a lower pressing die (10) is arranged in the middle of the top surface of the lower pressing die plate (11), guide pillar seats (2) connected with the lower die holder (1) are respectively arranged on the left side and the right side of the lower pressing die plate (11), guide pillars (4) are respectively and vertically arranged on the top surfaces of the two guide pillar seats (2), and mounting plates (5) horizontally arranged at are arranged on the upper parts of the two guide pillars (4);

the upper surface of the mounting plate (5) is respectively provided with nuts (6) fixedly connected with the mounting plate (5) at the positions of the two guide columns (4);

upper pressing dies (7) are arranged below the mounting plate (5), lug plates (7.1) are arranged on the left side and the right side of each upper pressing die (7), the lug plates (7.1) slide up and down along the column body of the guide column (4), and return springs (3) are arranged on the guide column (4) and between the lug plates (7.1) and the guide column seats (2);

an support (8) is arranged in the middle above the mounting plate (5), the opening of the support (8) faces downwards, an air cylinder (9) is arranged on the support (8), and an ejector rod of the air cylinder (9) penetrates through the mounting plate (5) and then is fixedly connected with the upper top surface of the upper pressing die (7) to drive the upper pressing die (7) to move downwards;

a transverse groove (10.1) arranged along the transverse direction is formed above the lower die (10), a plurality of longitudinal grooves (10.2) arranged along the longitudinal direction are formed above the lower die (10), and the longitudinal grooves (10.2) are through grooves and are intersected with the transverse groove (10.1);

and a second transverse groove (7.2) corresponding to the lower pressing die (10) is arranged on the lower surface of the upper pressing die (7) and right above the lower pressing die (10), and the second transverse groove (7.2) is matched with the lower pressing die (10) to bend the diode pin.
2. The kinds of diode pin bending device according to claim 1, wherein the second transverse slot (7.2) is a transverse through structure.
3. The kinds of diode pin bending device according to claim 1, wherein the guide pillar base (2) is provided with a concave pit for accommodating the return spring (3).
4. The kinds of diode pin bending device according to claim 3, wherein the depth dimension of the concave pit on the guide pillar base (2) for accommodating the return spring (3) is in the range of 5-10 mm.