CN210001813U

CN210001813U - Thermal interface material and device including thermal interface material and heat source

Info

Publication number: CN210001813U
Application number: CN201920232128.9U
Authority: CN
Inventors: 申景博; 赵敬棋; 冯梦凰
Original assignee: Tianjin Laird Technologies Co Ltd
Current assignee: Tianjin Laird Technologies Co Ltd
Priority date: 2019-02-21
Filing date: 2019-02-21
Publication date: 2020-01-31
Anticipated expiration: 2029-02-21

Abstract

The utility model relates to a thermal interface material and equipment including thermal interface material and heat source, the thermal interface material includes upper surface and lower surface, and along the at least surface treatment layer of the at least surfaces of thermal interface material to restrain the thermal interface material along the surface direction of thermal interface material produce at least because of the surface greasy dirt that the organosilicon precipitates and cause, wherein the at least surface treatment layer includes along the lower surface treatment layer of the lower surface of thermal interface material, therefore the greasy dirt of thermal interface material along the lower surface of thermal interface material is restrained to the lower surface treatment layer.

Description

Thermal interface material and device including thermal interface material and heat source

Technical Field

The present invention relates generally to thermal interface materials that are subjected to a surface treatment to reduce oil contamination of the thermal interface material.

Background

This paragraph provides background information related to the present disclosure, but not is admitted to be prior art.

Electrical components (such as semiconductors, integrated circuit packages, transistors, etc.) typically have a preset temperature at which they can optimally operate. Ideally, the preset gauge temperature is close to the temperature of the surrounding air. But the operation of the electrical components generates heat. If heat is not removed, the electrical components may operate at temperatures significantly higher than their normal or desired operating temperatures. Such over-temperature can adversely affect the operating characteristics of the electrical components and the operation of the associated equipment.

To avoid or at least reduce adverse operating characteristics due to heat generation, heat should be removed, for example, by directing heat from the operating electrical components to a heat sink. The heat sink may then be cooled by conventional convection and/or radiation techniques. During the boot, heat may be conducted from the operating electrical component to the heat sink, through direct surface contact between the electrical component and the heat sink and/or through contact of the electrical component and the heat sink surface via an intermediate medium or Thermal Interface Material (TIM). Thermal interface materials may be used to fill gaps between heat transfer surfaces to increase heat transfer efficiency compared to filling gaps with air, which is a relatively poor thermal conductor.

SUMMERY OF THE UTILITY MODEL

This section provides a general summary of the disclosure, but is not a comprehensive disclosure of its full scope or all of its attributes.

According to there is provided thermal interface materials, the thermal interface materials comprising an upper surface and a lower surface, and at least surface treatments along at least surfaces of the thermal interface material to inhibit oil staining of the surface of the thermal interface material by at least silicone precipitates along the surface direction of the thermal interface material, wherein the at least surface treatments comprise a lower surface treatment along the lower surface of the thermal interface material, whereby the lower surface treatment inhibits oil staining of the thermal interface material along the lower surface of the thermal interface material.

The at least surfacing layers have a thickness of less than 0.2 mm.

The thermal interface material further includes an upper surface treatment layer along an upper surface of the thermal interface material, whereby the upper surface treatment layer inhibits oil contamination of the thermal interface material along the upper surface of the thermal interface material.

According to another aspect, there is provided an apparatus comprising a heat source and a thermal interface material positioned relative to the heat source, the lower surface treatment layer being against the heat source, whereby the lower surface treatment layer inhibits oil staining of the thermal interface material to the heat source.

Further areas of applicability will become apparent from the description provided herein. In this summary, the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 illustrates a cross-sectional view of a thermal interface material including a surface treatment layer, wherein the surface treatment layer is shown in phantom.

Corresponding reference characters indicate corresponding parts throughout the several views of the drawings.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings.

Disclosed herein are exemplary embodiments of Thermal Interface Materials (TIMs) (e.g., thermal gap fill materials, etc.) that include a surface treatment (e.g., a surface treated with boron nitride, etc.) to inhibit or reduce (e.g., substantially reduce, substantially eliminate, etc.) oil contamination of the thermal interface material. Also disclosed herein are exemplary embodiments of methods of inhibiting or reducing (e.g., substantially reducing, substantially eliminating, etc.) oil staining of a thermal interface material. Advantageously, the thermal interface material with a surface treatment as disclosed herein may be used in user applications (e.g., optical transceivers, camera lenses, etc.) for which specifications or requirements do not allow for any or substantially zero oil contamination of the thermal interface material.

In an exemplary embodiment, the thermal interface material may include a sheet of thermal gap filler material, such as a thermally conductive sheet having a low durometer (e.g., a durometer of less than or equal to about 100 shore a, etc.) in an exemplary embodiment, the thermal interface material may include or more surfaces that are treated with or more surface treatment substances, such as 100% inorganic compounds, powders, etc.

For example, the upper and lower portions (or top and bottom surfaces) of the thermal interface material may be treated with or more inorganic powders, such as powders including or more of boron nitride, talc, silica, and/or alumina, or, for example, all exposed/exterior surfaces of the thermal interface material may be surface treated with or more inorganic powders.

In exemplary embodiments, the surface treatment process may be performed before or after a material curing process for the thermal interface material, depending on the properties and/or characteristics of the particular thermal interface material and the uncured thermal interface material.

For uncured thermal interface materials having relatively high viscosities (e.g., 7,000,000cPs (centipoise) or more, etc.) that are substantially solid prior to curing, exemplary embodiments can include surface treating a preformed sheet of thermal interface material prior to curing the thermal interface material.

For uncured thermal interface materials having a low (e.g., 4,000,000cPs or less, etc.) viscosity, and for relatively soft viscous end products, exemplary embodiments may include direct surface treatment of the thermal interface material.

Referring now to the drawings, FIG. 1 shows a cross-sectional view of a thermal interface material including a surface treatment layer, wherein the surface treatment layer is shown in phantom.

In an exemplary embodiment, a physical method may be used to apply an inorganic powder (e.g., boron nitride, talc, silica, alumina, etc.) along surfaces or surfaces of a thermal interface material (e.g., thermal gap filler, thermal pad, etc.).

The compression process may be performed during a preform process for the TIM, during a molding process for the TIM, and/or on a polished or finished TIM product (e.g., a hot sheet material, etc.). The pre-forming process may be used to form a pad of thermal interface material or a thermal pad, which may then be formed (e.g., compressed, etc.) to a target thickness, thereby providing a target TIM product. The molding process may include compressing the TIM compound to a target thickness to obtain a hot sheet material having the target thickness.

The compression process may occur at an elevated or higher temperature, such as a temperature in a range of about 70 degrees celsius to about 130 degrees celsius. The compression time may be shorter. During the compression process, powders with high specific surface area (e.g., agglomerated or spherical boron nitride, small particle size silica, talc, etc.) may be used. The powder may be compressed to form a surface treatment layer along the thermal interface material. The thickness of the surface treatment layer may be less than 0.2 millimeters (mm).

In accordance with example embodiments, example thermal interface materials that may have a surface treatment to reduce or inhibit oil contamination include thermal gap fillers, thermal putties, thermal pads, and the like in embodiments, the thermal interface materials may include silicone elastomers filled with suitable thermally conductive materials including ceramics, boron nitride, and the like in example embodiments, a TIM may include soft compliant gap fillers having a high thermal conductivity.

Exemplary embodiments may include or more thermal interface materials having high thermal conductivities (e.g., 1W/mK (Watts per meter per Kelvin), 1.1W/mK, 1.2W/mK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7W/mK, 5W/mK, 5.4W/mK, 6W/mK, 8W/mK, etc.), if any, depending on the particular materials used to make the thermal interface materials and the loading percentages of the thermally conductive fillers.

In an exemplary embodiment, the surface treatment may be provided or applied to or more thermal interface materials having the properties shown in tables 1-8. for example, table 1 provides exemplary properties of a soft and compliant elastomeric thermal gap filler having a thermal conductivity of 3W/mK, hardness of 30 (shore 00.) table 2 provides exemplary properties of a ceramic-filled silicone sheet thermal gap filler, having a thermal conductivity of 1.2W/mK, hardness of 51.4(20-30mil) and 25.2 (40+ mil) (shore 00.) table 3 provides exemplary properties of a soft highly compliant ceramic-filled silicone sheet thermal gap filler, having a thermal conductivity of 3W/mK, hardness of 51 (shore 00) at 3 seconds and hardness of 48 (shore 00) at 30 seconds, table 4 provides exemplary properties of a ceramic-filled silicone sheet thermal gap filler having a thermal conductivity of 8W/mK, hardness of 65 (shore 00.) at 3 seconds, table 5 provides exemplary properties of a ceramic-filled silicone sheet thermal gap filler, having a thermal conductivity of greater than 5mm, and reinforcing thermal gap filler having a thermal conductivity of 5mm (0.5 mm) and the like, and the thermal gap filler having a thermal conductivity of 1.5 mm (shore 00 mm, and the like, and the thermal gap filler providing exemplary properties of a thermal gap filler having a thermal gap filler of a thermal gap filler having a thermal conductivity of a thermal gap filler of 3W/mK, a thermal gap filler, a thermal gap filler having a hardness of 5mm, a thermal gap filler having a thermal conductivity of 5mm, a thickness of 1.5 mm, a thickness of 5mm, a thickness of 1.5 mm, a thermal gap

Exemplary properties, thermal conductivity of 3W/mK, hardness of 14 (Shore 00). The properties provided in tables 1-8 are for illustrative purposes only, as other exemplary embodiments may include surface treatments of different thermal interface materials configured to have different properties.

Table 1

Table 2

Table 3

Table 4

Table 5

Table 6

Table 7

Table 8

In addition, well-known processes, well-known device structures, and well-known techniques have not been described in detail in the several exemplary embodiments, but rather, advantages and modifications that may be realized with the or more embodiments of the present application are provided for purposes of illustration only and are not limiting of the scope of the present application, as the exemplary embodiments disclosed herein may provide all or none of the above-described advantages and modifications and yet fall within the scope of the present application.

The particular values and ranges of values for a given parameter disclosed herein do not preclude the use of or more other values and ranges of values that may be useful in embodiments disclosed herein and it is contemplated that any two particular values of a particular parameter described herein may define the endpoints of the ranges of values for the given parameter (e.g., the disclosure of the number and second number for a given parameter may be read as any number between the number and the second number for the given parameter is also applicable to the given parameter). for example, if parameter X is illustrated herein as having a value A and is also illustrated as having a value Z, it is contemplated that parameter X may have a range of values from about A to about Z. similarly, it is contemplated that the disclosure of two or more ranges of values for a parameter (whether these ranges are nested, overlapping or different) includes all possible combinations of the endpoints, it may be required that the combination of the disclosed ranges of values used for the disclosed ranges of values is 1 to 2, 3 to 10, 3 to 2, or 3 to 8, and the like.

As used herein, the singular forms "" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the terms "comprising", "including" and "having" are intended to be inclusive and thus specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not exclude the presence or addition of or more other features, integers, steps, operations, elements, components, and/or combinations thereof.

In contrast, when an element or layer is referred to as being "on," engaged to, "" connected to "or" coupled to "another element or layer, the element or layer may be directly on," "engaged to," connected to or coupled to the other element or layer, or intervening elements or layers may be present.

The term "about" when used in reference to a numerical value means: allowing the calculation or measurement to be somewhat less accurate in value (approaching an exact value; approximating or reasonably close to a value; at a point of difference). For some reason, if the imprecision otherwise provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may result from ordinary methods of measuring or using such parameters. For example, the terms "approximately", "about", and "substantially" may be used herein to refer to within manufacturing tolerances.

Although the terms , second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms.

Spatially relative terms such as "inner," "outer," "under," "below," "lower," "above," "upper," and the like may be used herein for convenience in describing the relationship of elements or features shown in the figures to another element or feature.

The foregoing description of the embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the application. Individual elements, intended or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but, where appropriate, are interchangeable and can be used in a selected embodiment, even if not explicitly shown or described. The same embodiment can be modified in many ways. Such variations are not to be regarded as a departure from the application, and all such modifications are intended to be included within the scope of the application.

Claims

thermal interface material, characterized in that the thermal interface material comprises an upper surface and a lower surface, and at least surface treatment layers along at least surfaces of the thermal interface material to inhibit the generation of at least surface oil stains of the thermal interface material due to silicone precipitation along the surface direction of the thermal interface material, wherein the at least surface treatment layers comprise a lower surface treatment layer along the lower surface of the thermal interface material, whereby the lower surface treatment layer inhibits the oil stains of the thermal interface material along the lower surface of the thermal interface material.
2. A thermal interface material as defined in claim 1, wherein said at least surface treatments have a thickness of less than 0.2 mm.
3. A thermal interface material as defined in claim 1, wherein:

the at least surface treatments further include an upper surface treatment along an upper surface of the thermal interface material, whereby the upper surface treatment inhibits oil fouling of the thermal interface material along the upper surface of the thermal interface material.
4, an apparatus comprising a heat source and the thermal interface material of any of claims 1-3, positioned relative to the heat source, wherein the lower surface treatment layer abuts the heat source, whereby the lower surface treatment layer inhibits oil staining of the thermal interface material to the heat source.