CN209994787U - Electromagnetic shielding cover - Google Patents

Electromagnetic shielding cover Download PDF

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Publication number
CN209994787U
CN209994787U CN201920487613.0U CN201920487613U CN209994787U CN 209994787 U CN209994787 U CN 209994787U CN 201920487613 U CN201920487613 U CN 201920487613U CN 209994787 U CN209994787 U CN 209994787U
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China
Prior art keywords
transparent substrate
shielding
conductive
film layer
coated
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CN201920487613.0U
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Chinese (zh)
Inventor
疏达
李�远
杨野
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Beixing (beijing) Photon Technology Co Ltd
Benewake Beijing Co Ltd
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Beixing (beijing) Photon Technology Co Ltd
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Abstract

The present invention relates to shielding of electromagnetic interference, and more particularly, to an electromagnetic shield. The utility model provides an electromagnetic shield cover, it receives and has seted up the window on the optical surface, is stamped the transparent substrate of coating film on the window, the coating film including filtering rete, electrically conductive shielding rete, filtering rete, electrically conductive shielding rete plate on same transparent substrate or set up alone on two transparent substrates, it is as an organic whole again. This application is through offering the window on the face is received to the shield cover, is stamped the transparent substrate of coating film on the window, and the reverberation gets into photoelectric device through transparent substrate, makes photoelectric device receive the reverberation of sufficient intensity, and the transparent substrate of coating film also has the shielding effect simultaneously, can satisfy the shielding requirement. Compared with the traditional shielding mode, the mode has the advantages that the transparent substrate coated with the film replaces a metal net structure in a light path to form a complete closed cavity, so that the better shielding effect can be achieved, and the attenuation rate of signal light is reduced.

Description

Electromagnetic shielding cover
Technical Field
The present invention relates to electromagnetic interference (EMI) shielding, and more particularly to an electromagnetic shield.
Background
Optoelectronic devices are important components of optical radars for receiving optical signals and converting the optical signals into processable electrical signals. These receiver devices typically have sensitive response thresholds and response speeds and are therefore highly susceptible to interference from environmental factors, where ambient light and electromagnetic interference are important factors affecting the performance of the receiver device.
In order to solve the above problems, those skilled in the art generally use a filter and a shield, as shown in fig. 1, the filter 10 is used to reduce the interference caused by the ambient light, the electromagnetic shield is used to reduce the electromagnetic interference, and the shield 9 generally has a metal mesh 8 for passing light, so as to ensure the measurement performance of the radar in the complex environment and ensure the passing of light at the same time. However, the use of both the filter and the shield brings about a complicated assembly process and a large signal light attenuation. In order to reduce the signal light attenuation rate, a reasonable compromise must be made between the shielding effect and the light attenuation, and the mesh number of the grid structure of the shielding case is adjusted, so that the phenomena of common electromagnetic shielding effect and serious light attenuation are likely to occur. Meanwhile, the processing technology of the shielding case can also bring the consistency problem of light attenuation and shielding performance, bring model machine difference and improve the probability of reject ratio.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an electromagnetic shielding cover, and solves the problem that the existing shielding cover cannot meet the light transmittance and the shielding effect of an optical element at the same time.
To achieve the purpose, the application embodiment of the present invention adopts the following technical solutions:
on one hand, the electromagnetic shielding cover is provided with a window on the light receiving surface, the window is covered with a transparent substrate coated with a film, the film comprises a light filtering film layer and a conductive shielding film layer, and the light filtering film layer and the conductive shielding film layer are coated on the same transparent substrate or are independently arranged on two transparent substrates and then are combined into a whole.
In a possible implementation manner, the transparent substrate is a glass substrate or a transparent resin substrate, and a filtering film layer is plated on one side or two sides of the transparent substrate.
In a possible implementation manner, when the single surface of the transparent substrate is plated with the optical filtering film layer, the conductive shielding film layer is compounded on one side of the transparent substrate which is not plated with the optical filtering film layer or is independently arranged on the other transparent substrate.
In a possible implementation manner, when the transparent substrate is plated with the filter film layers on both sides, the conductive shielding film layers are compounded on any side of the transparent substrate or are separately arranged on the other transparent substrate.
In a possible implementation manner, when the light filtering film layer and the conductive shielding film are separately arranged on the two transparent substrates, the two transparent substrates are bonded through the adhesive layer.
In a possible implementation manner, the conductive shielding film layer is a conductive oxide material film layer, and the conductive oxide material is zinc oxide, fluorine-doped tin dioxide, or indium tin oxide.
In one possible implementation manner, the conductive shielding film layer has a visible light transmittance of 80-95%, an infrared light transmittance of 60-80%, and a conductive sheet resistance of 3-10 Ω.
In one possible implementation manner, the conductive shielding film layer has a visible light transmittance of 90-95%, an infrared light transmittance of 70-80%, and a conductive sheet resistance of 3-5 Ω.
In a possible implementation manner, the bandwidth range of the filter film layer is the radar signal light wavelength range, and the thickness of the transparent substrate is 0.3-10 mm.
In a possible implementation mode, the coated transparent substrate and the shielding case window are connected together through screw threads or clamping or bonding.
The window is formed on the light receiving surface of the shielding cover, the transparent substrate coated with the film is covered on the window, reflected light enters the photoelectric device through the transparent substrate, the photoelectric device receives the reflected light with enough intensity, and meanwhile, the transparent substrate coated with the film also has a shielding effect and can meet the shielding requirement. Compared with the traditional shielding mode, the mode has the advantages that the transparent substrate coated with the film replaces a metal net structure in a light path to form a complete closed cavity, so that the better shielding effect can be achieved, and the attenuation rate of signal light is reduced.
Drawings
Fig. 1 is a background art schematic.
FIG. 2 is a schematic view of the present invention with a coated transparent substrate attached to a shield.
FIG. 3 is a schematic diagram of a structure of a transparent substrate coated with a single-sided filter coating.
FIG. 4 is a schematic diagram of a structure of a transparent substrate coated with a filter film on both sides.
FIG. 5 is a schematic view of another structure of a transparent substrate coated with a filter film on both sides.
In the figure:
1. a transparent substrate; 2. a light filtering film layer; 3. a conductive shielding film layer; 4. a window; 5. a photovoltaic device; 6. a conductive adhesive layer; 7. a cementing layer; 8. a metal grid; 9. a shield case; 10. and (3) a filter.
Detailed Description
The technical scheme of the application is further explained by the specific implementation mode in combination with the attached drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or device.
As shown in fig. 2, a window 4 is formed on a light receiving surface of the electromagnetic shielding case, a transparent substrate 1 coated with a film is covered on the window 4, the film includes a light filtering film layer 2 and a conductive shielding film layer 3, the light filtering film layer 2 and the conductive shielding film layer 3 are coated on the same transparent substrate 1 or are separately arranged on two transparent substrates 1, and then are combined into a whole. Wherein the thickness of the inverted shielding film layer is tens to hundreds of nanometers.
The other panels of the shielding case 9 are metal sheets or non-metal sheets compounded with shielding layers.
The window 4 is formed on the light receiving surface of the shielding cover 9, the coated transparent substrate 1 covers the window 4, and laser reflected light can pass through the coated transparent substrate 1, so that the photoelectric device 5 receives reflected light with enough intensity, and meanwhile, the coated transparent substrate 1 also has a shielding effect and can meet the shielding requirement.
Compared with the traditional shielding mode, the transparent substrate 1 with the coating film replaces a metal net structure in a light path to form a complete closed cavity. The shielding effect of the traditional metal grid is 100%, and the light attenuation is 40-50%; the grid number is reduced, the light attenuation is 20-25%, but the shielding effect is reduced to 50-75%; by adopting the scheme, the shielding effect is 100%, the light attenuation is 40-50%, and the attenuation rate of signal light is reduced while the shielding effect is ensured.
The transparent substrate 1 is a glass substrate or a transparent resin substrate, and is coated with the light filtering film layer 2 on one side or two sides.
As shown in fig. 2, when the transparent substrate 1 is coated with the filtering film layer 2 on one side, the conductive shielding film layer 3 is compounded on the side of the transparent substrate 1 not coated with the filtering film layer.
As shown in fig. 3, when the single surface of the transparent substrate 1 is plated with the filtering film layer 2, the conductive shielding film layer 3 can also be separately disposed on another transparent substrate 1, and the two transparent substrates 1 are integrated by the adhesive layer 7.
The other surface of the transparent substrate 1 coated with the light filtering film layer 2 is coated with the conductive shielding film layer 3, and the conductive shielding film layer 3 is coated at high temperature, so that the transparent substrate 1 has requirements on the material of the transparent substrate 1, and the transparent substrate 1 needs to be a glass substrate. When the conductive shielding film layer 3 is separately arranged on the other transparent substrate 1, the materials of the two transparent substrates 1 can be respectively selected from a glass substrate and a transparent resin substrate.
As shown in fig. 4, when the transparent substrate 1 is coated with the filter film layer 2 on both sides, the conductive shielding film layer 3 is compounded on either side of the transparent substrate 1.
As shown in fig. 5, when the transparent substrate 1 is coated with the filter film layer 2 on both sides, the conductive shielding film layer 3 can also be separately disposed on another transparent substrate 1, and the two transparent substrates 1 are integrated together through the adhesive layer 7.
Also, since the conductive shielding layer 3 is coated at a high temperature, when the conductive shielding layer 3 and the filtering film layer 2 are coated on the same transparent substrate 1, the transparent substrate 1 is required to be a glass substrate. When the conductive shielding film layer 3 is separately arranged on the other transparent substrate 1, the materials of the two transparent substrates 1 can be respectively selected from a glass substrate and a transparent resin substrate.
Considering that the thickness of the conductive shielding film 3 is also in the wavelength level and may affect the filtering performance of the transparent substrate 1 with the double-sided coated film, as shown in fig. 5, the conductive shielding film 3 is coated on one side of the transparent substrate 1 alone, and then the filter with the double-sided coated film is glued with the transparent substrate 1 for use, so that the performance is stable and the processing is convenient.
The conductive shielding film 3 is a conductive oxide film layer, and the conductive oxide is zinc oxide, fluorine-doped tin dioxide or indium tin oxide.
The two materials are common shielding materials and have good shielding performance.
The conductive shielding film 3 has a visible light transmittance of 80-95%, an infrared light transmittance of 60-80%, and a conductive sheet resistance of 3-10 Ω.
The visible light transmittance of the conductive shielding film layer 3 is 90-95%, the infrared light transmittance is 70-80%, and the conductive sheet resistance is 3-5 omega.
The conductive sheet resistance is 10 Ω or more, the shielding effect of 100% cannot be ensured, and the light transmittance is reduced. Therefore, 10 Ω or less is selected. In this range of the sheet resistance, the coating of the conductive shielding film layer 3 can ensure that the transmittance parameter meets the application requirement.
The bandwidth range of the filter film layer 2 is the range of the wavelength of the radar signal light, and the thickness of the transparent substrate 1 is 0.3-10 mm.
The thickness of the transparent substrate 1 is too thin and easy to break, too thick and too heavy, and the transparent substrate may fall off by adopting gum pasting and is not shock-resistant, so that the thickness is 0.3-10 mm.
The coated transparent substrate 1 and the shielding case window 4 are connected together by screw connection or clamping connection or adhesion.
When the transparent substrate 1 is bonded with the shielding case window 4 through the conductive bonding layer 7, the conductive bonding layer 7 is made of conductive glue or conductive back glue, when the conductive bonding layer 7 is made of conductive glue, the liquid conductive glue is used, glue dispensing and curing operations are carried out when the composite coated glass 1 is fixed, and conductive contact and fixation of the glass slide and the shielding case are achieved.
When the conductive adhesive layer 7 is a conductive back adhesive, the solid conductive back adhesive can be directly used, the slide is directly pasted and fixed, the conductive contact between the slide and the shielding shell is realized, the assembly efficiency can be improved by using the conductive back adhesive, and the curing time is saved.
The screw or snap connection has a requirement on the strength of the transparent substrate 1, and a transparent resin substrate is generally used.
The technical principles of the present application have been described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the present application and is not to be construed in any way as limiting the scope of the application. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present application without inventive effort, which shall fall within the scope of the present application.

Claims (10)

1. The electromagnetic shielding cover is characterized in that a window is arranged on the light receiving surface of the electromagnetic shielding cover, a transparent substrate coated with a film is covered on the window, the film comprises a light filtering film layer and a conductive shielding film layer, and the light filtering film layer and the conductive shielding film layer are coated on the same transparent substrate or are independently arranged on two transparent substrates and then are combined into a whole.
2. An electromagnetic shield according to claim 1, wherein said transparent substrate is a glass substrate or a transparent resin substrate, and is coated with a filter film layer on one side or both sides thereof.
3. The electromagnetic shield according to claim 2, wherein when the transparent substrate is coated with the filter layer on one side, the conductive shielding film layer is combined with the transparent substrate on the side not coated with the filter layer or is separately disposed on another transparent substrate.
4. The electromagnetic shield according to claim 2, wherein when the transparent substrate is coated with the filter film on both sides, the conductive shielding film is laminated on either side of the transparent substrate or is separately disposed on another transparent substrate.
5. The electromagnetic shielding case according to claim 2 or 3, wherein the two transparent substrates are adhered by an adhesive layer when the optical filtering film layer and the conductive shielding film are separately disposed on the two transparent substrates.
6. An electromagnetic shield according to any one of claims 1 to 4, wherein the conductive shielding film is a conductive oxide film, and the conductive oxide is zinc oxide, fluorine-doped tin dioxide or indium tin oxide.
7. The electromagnetic shielding case of claim 6, wherein the conductive shielding film layer has a visible light transmittance of 80-95%, an infrared light transmittance of 60-80%, and a conductive sheet resistance of 3-10 Ω.
8. The electromagnetic shielding can of claim 7, wherein the conductive shielding film layer has a visible light transmittance of 90-95%, an infrared light transmittance of 70-80%, and a conductive sheet resistance of 3-5 Ω.
9. An electromagnetic shield according to claim 8, wherein said filter layer has a bandwidth in the wavelength range of radar signal light and said transparent substrate has a thickness of 0.3-10 mm.
10. The electromagnetic shield according to claim 9, wherein the coated transparent substrate is screwed or snapped or bonded to the shield window.
CN201920487613.0U 2019-04-11 2019-04-11 Electromagnetic shielding cover Active CN209994787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920487613.0U CN209994787U (en) 2019-04-11 2019-04-11 Electromagnetic shielding cover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920487613.0U CN209994787U (en) 2019-04-11 2019-04-11 Electromagnetic shielding cover

Publications (1)

Publication Number Publication Date
CN209994787U true CN209994787U (en) 2020-01-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890192A (en) * 2019-04-11 2019-06-14 北醒(北京)光子科技有限公司 A kind of electro-magnetic shielding cover

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890192A (en) * 2019-04-11 2019-06-14 北醒(北京)光子科技有限公司 A kind of electro-magnetic shielding cover

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