CN209965958U

CN209965958U - Semiconductor vacuum cup

Info

Publication number: CN209965958U
Application number: CN201821922398.4U
Authority: CN
Inventors: 刘通; 雷景胜; 丁明刚; 岑亮
Original assignee: Wuhan Bioengineering Institute
Current assignee: Wuhan Bioengineering Institute
Priority date: 2018-11-21
Filing date: 2018-11-21
Publication date: 2020-01-21
Anticipated expiration: 2028-11-21

Abstract

A semiconductor vacuum cup comprises a cup body, an inner container and a cup cover, wherein a first heat-conducting silica gel, a semiconductor refrigeration piece, a second heat-conducting silica gel, a radiating fin, a fan, a heat insulation plate and a battery pack are sequentially arranged below the bottom of the inner container; the area enclosed by the bottom of the inner container, the heat insulation plate and the inner wall of the bottom of the cup body forms a first cavity, the battery pack and the gear selection switch are all positioned in the first cavity, and the first heat-conducting silica gel, the semiconductor refrigeration sheet, the second heat-conducting silica gel, the radiating fin and the fan are all positioned outside the first cavity; the heat dissipation holes are formed in the outer wall of the cup body, close to one side of the semiconductor refrigeration sheet, below the bottom of the inner container; the gear selecting switch is respectively and electrically connected with the semiconductor refrigerating sheet, the fan and the battery pack. The battery pack is independently arranged in the first cavity, so that heat generated by the semiconductor refrigerating sheet during working is prevented from being directly conducted to the battery pack, and the service life of the battery pack is prolonged; meanwhile, heat is discharged to the outside through the heat dissipation holes, and the use is convenient and safe.

Description

Semiconductor vacuum cup

Technical Field

The utility model relates to a thermos cup technical field especially relates to a semiconductor thermos cup.

Background

Health life is advocated, and the concept of daily intake of sufficient water is well-felt. The choice of drinking water temperature varies from person to person. Some prefer hot water and others prefer ice water. However, when going out, there is probably no drinking fountain or refrigerator around to provide hot water or ice water. The water heated by the water dispenser and cooled by the refrigerator can not be used up in time, so that water resource waste is caused, and the problems of water quality change, unclean water dispenser or refrigerator, drinking water pollution and the like can be caused by heating water or refrigerating for many times. Moreover, in China, a large number of people who suffer from diabetes and need to inject insulin exist, and the insulin needs to be stored at the temperature of 2-8 ℃ and is inconvenient to carry, so that the life of the people suffering from diabetes is limited.

Semiconductor cooling and heating vacuum cups are put into the market, and are mainly divided into two main categories, namely a first category: the cup body is separated from the cup base, and the size and the weight of the vacuum cup are large due to the structure, so that the vacuum cup is inconvenient to carry and use. The second type: the cup body and the cup base are integrated, and the distance between the power supply, the semiconductor refrigerating piece and the inner wall of the cup body is small. When the semiconductor refrigerating piece works, the generated heat can reach 150 ℃, the heat generated by the vacuum cup structure can not be timely discharged to the outside of the vacuum cup when the vacuum cup is heated or refrigerated, and the heat is directly transmitted to the battery and other parts, so that the service lives of the battery and other parts are influenced. Meanwhile, safety accidents are easily caused by overheating of the battery.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve above-mentioned technical problem to a semiconductor vacuum cup is provided.

The utility model discloses a following technical scheme realizes:

a semiconductor vacuum cup comprises a cup body 1, an inner container 11 and a cup cover 2, wherein a first heat-conducting silica gel, a semiconductor refrigerating sheet 4, a second heat-conducting silica gel, a radiating fin 5, a fan 6, a heat insulating plate and a battery pack 9 are sequentially arranged below the bottom of the inner container 11, and a gear selecting switch 3 is further arranged below the bottom of the inner container 11; a first cavity is formed in an area surrounded by the bottom of the inner container 11, the heat insulation plate and the inner wall of the bottom of the cup body 1, the battery pack 9 and the gear selection switch 3 are located in the first cavity, and the first heat-conducting silica gel, the semiconductor refrigeration sheet 4, the second heat-conducting silica gel, the radiating fin 5 and the fan 6 are located outside the first cavity; the outer wall of the cup body 1, which is close to one side of the semiconductor refrigeration sheet 4, below the bottom of the inner container 11 is provided with heat dissipation holes 13; the gear selection switch 3 is respectively and electrically connected with the semiconductor refrigeration piece 4, the fan 6 and the battery pack 9.

Further, the gear selection switch 3 is provided with three gears, namely a refrigeration gear, a heating gear and a closing gear.

Further, the bottom of the inner container 11, the first heat-conducting silica gel, the semiconductor refrigeration piece 4, the second heat-conducting silica gel and the radiating fin 5 are connected in sequence.

Further, cup 1 bottom sets up the USB interface 8 that charges, USB charges interface 8 and is connected with group battery 9 electricity, USB charges interface 8 and can be connected with external power source.

Further, the USB interface 8 that charges sets up the USB interface protection shield 12 that charges, USB interface protection shield 12 and the USB interface 8 swing joint that charges.

Further, the model of the semiconductor chilling plate 4 is SP 1848-27145.

Further, the battery pack 9 is L-shaped.

Further, the heat dissipation hole 13 includes an upper layer and a lower layer.

Further, a waterproof breathable film is attached to the surface of the heat dissipation hole 13.

Further, the heat insulation board comprises a first heat insulation board 7 and a second heat insulation board 10, wherein the first heat insulation board 7 is connected with the second heat insulation board 10.

Compared with the prior art, the utility model discloses main beneficial effect as follows: (1) the heat insulation plate is arranged below the bottom of the inner container, a first cavity is formed in an area surrounded by the bottom of the inner container, the heat insulation plate and the inner wall of the bottom of the cup body, the battery pack and the gear selection switch are located in the first cavity, and the first heat conduction silica gel, the semiconductor refrigeration sheet, the second heat conduction silica gel, the radiating fin and the fan are located outside the first cavity. Set up the group battery in first cavity alone through the heat insulating board, avoid the direct conduction of heat that the semiconductor refrigeration piece during operation produced to the group battery, prevent that the group battery from influencing group battery working property because of overheated, extension group battery life, convenient to use safety. (2) The fan is arranged below the bottom of the inner container, the heat dissipation holes are formed in the outer wall of the cup body, close to one side of the semiconductor refrigeration sheet, below the bottom of the inner container, and the waterproof breathable film is attached to the surfaces of the heat dissipation holes. The heat that semiconductor refrigeration piece during operation produced accelerates the heat dissipation through the fan, and the heat passes through the louvre simultaneously and discharges to the thermos cup outside for the heat scatters and disappears in the thermos cup bottom, avoids the heat to concentrate on unable in time discharging in the thermos cup bottom, makes semiconductor refrigeration piece, gear selection switch, fan and battery homoenergetic normal work. The waterproof ventilated membrane on the surface of the radiating hole can enable the heat inside the vacuum cup to be convected with the outside, and meanwhile, the water can be prevented from entering the vacuum cup. (3) When the battery pack is in no-power state, the USB charging interface is connected with an external power supply, the battery pack is charged through the USB charging interface, the vacuum cup can normally refrigerate or heat, and the use is convenient. (4) The semiconductor refrigeration piece, first heat conduction silica gel, second heat conduction silica gel, fin, fan, heat insulating board, select shelves switch and group battery that set up in the thermos cup bottom are rationally distributed, and the cup outer wall sets up the louvre, makes the heat that the thermos cup during operation produced can in time discharge fast to external environment for the radiating rate in the thermos cup bottom. Simultaneously, set up the group battery in first cavity alone, avoid the direct conduction of heat that the semiconductor refrigeration piece during operation produced to group battery, prevent that the group battery from influencing group battery working property because of overheated, extension group battery life, convenient to use safety, convenient to carry, simple structure, low in manufacturing cost is honest and clean, has market perspective.

Drawings

FIG. 1 is a schematic view of the structure of the present invention

FIG. 2 is the schematic diagram of the USB charging interface protection board 12 and the heat dissipation holes 13 of the present invention

1-cup body; 2-a cup cover; 3-a gear selection switch; 4-semiconductor refrigerating sheet; 5-a heat sink; 6-a fan; 7-a first insulation board; 8-USB charging interface; 9-a battery pack; 10-a second insulation board; 11-an inner container; 12-USB charging interface protection board; 13-heat dissipation holes;

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1 and 2, a semiconductor vacuum cup comprises a cup body 1, an inner container 11 and a cup cover 2, wherein a first heat-conducting silica gel, a semiconductor refrigerating sheet 4, a second heat-conducting silica gel, a radiating fin 5, a fan 6, a heat-insulating plate and a battery pack 9 are sequentially arranged below the bottom of the inner container 11, and a gear selection switch 3 is further arranged below the bottom of the inner container 11; a first cavity is formed in an area surrounded by the bottom of the inner container 11, the heat insulation plate and the inner wall of the bottom of the cup body 1, the battery pack 9 and the gear selection switch 3 are located in the first cavity, and the first heat-conducting silica gel, the semiconductor refrigeration sheet 4, the second heat-conducting silica gel, the radiating fin 5 and the fan 6 are located outside the first cavity; the outer wall of the cup body 1, which is close to one side of the semiconductor refrigeration sheet 4, below the bottom of the inner container 11 is provided with heat dissipation holes 13; the gear selection switch 3 is respectively and electrically connected with the semiconductor refrigeration piece 4, the fan 6 and the battery pack 9.

Specifically, the gear selection switch 3 is electrically connected with the semiconductor refrigeration sheet 4, the fan 6 and the battery pack 9 through wires.

When the liquid in the inner container 11 needs to be refrigerated, the refrigerating gear of the gear selection switch 3 is selected, the gear selection switch 3 is connected with the battery pack 9, the gear selection switch 3 is respectively and electrically connected with the semiconductor refrigerating sheet 4, the fan 6 and the battery pack 9, and the semiconductor refrigerating sheet 4 and the fan 6 are electrified and work. The end face of the top of the semiconductor refrigerating sheet 4 refrigerates, and the end face of the bottom of the semiconductor refrigerating sheet 4 heats. The terminal surface at 11 bottoms of inner bag, first heat conduction silica gel and 4 tops of semiconductor refrigeration piece connects gradually, and cold volume transmits to 11 bottoms of inner bag evenly through first heat conduction silica gel to carry out refrigeration treatment to the liquid in the inner bag 11, make the liquid cooling in the inner bag 11.

The bottom of the semiconductor refrigerating piece 4, the second heat-conducting silica gel and the radiating fin 5 are sequentially connected, the fan 6 is arranged below the radiating fin 5, and heat generated by heating the end face of the bottom of the semiconductor refrigerating piece 4 is absorbed by the second heat-conducting silica gel and the radiating fin 5. The fan 6 is arranged below the radiating fin 5, the fan 6 is electrified to rotate, so that the heat absorbed by the second heat-conducting silica gel and the radiating fin 5 is discharged to the outside through the radiating hole 13 on the outer wall of the cup body 1, and the temperature in the bottom of the cup body 1 is reduced.

When liquid in the inner container 11 needs to be heated, a heating gear of the gear selection switch 3 is selected, the gear selection switch 3 is connected with the battery pack 9, the gear selection switch 3 is respectively electrically connected with the semiconductor refrigerating sheet 4 and the battery pack 9, the gear selection switch 3 is disconnected with the fan 6, the fan 6 is not connected with the battery pack 9 and does not work, and the semiconductor refrigerating sheet 4 is electrified and works. The end face of the top of the semiconductor refrigerating sheet 4 heats, and the end face of the bottom of the semiconductor refrigerating sheet 4 refrigerates. The end faces of the bottom of the inner container 11, the first heat-conducting silica gel and the top of the semiconductor refrigerating sheet 4 are sequentially connected, and heat is uniformly transmitted to the bottom of the inner container 11 through the first heat-conducting silica gel, so that liquid in the inner container 11 is heated, and the temperature of the liquid in the inner container 11 is increased.

When the liquid in the inner container 11 does not need to be cooled or heated, the closing gear of the gear selection switch 3 is selected, at the moment, the gear selection switch 3 is not communicated with the battery pack 9, and the semiconductor refrigerating sheet 4 and the fan 6 are not electrified and do not work.

Specifically, the region enclosed by the bottom of the inner container 11, the thermal insulation plate and the inner wall of the bottom of the cup body 1 forms a first cavity, the battery pack 9 is located in the first cavity, and the first heat-conducting silica gel, the semiconductor refrigeration sheet 4, the second heat-conducting silica gel, the radiating fin 5 and the fan 6 are located outside the first cavity. Set up group battery 9 in first cavity alone through the heat insulating board, avoid the direct conduction of heat that the semiconductor refrigeration piece 4 during operation produced to group battery 9, prevent that group battery 9 from influencing group battery 9 life because of receiving high temperature to strike, causing the incident.

Specifically, when the battery pack 9 is not powered, the USB charging interface 8 is connected to the external power supply, and the battery pack 9 is charged through the USB charging interface 8.

Specifically, the USB charging interface protection plate 12 can slide on the surface of the USB charging interface 8. When not using the USB interface 8 that charges, slip USB interface protection shield 12 that charges makes USB interface protection shield 12 cover the USB interface 8 that charges, waterproof dustproof.

Further, the model of the semiconductor chilling plate 4 is SP 1848-27145.

Further, the battery pack 9 is L-shaped.

Specifically, the battery pack 9 is L-shaped, and the number of batteries can be increased to increase the battery capacity.

Further, as shown in fig. 2, the heat dissipation hole 13 includes an upper layer and a lower layer.

Specifically, the heat dissipation holes 13 include an upper layer and a lower layer, which can increase the number of the heat dissipation holes 13 and increase the heat dissipation rate.

Specifically, waterproof ventilated membrane can accelerate the heat and the outside air convection that produce in the 1 bottom of cup for rate of heat dissipation, also can prevent 1 bottom of cup inside intaking.

Specifically, the first heat insulation plate 7 and the second heat insulation plate 10 are both made of insulating high temperature resistant materials.

Preferably, the temperature resistant range of the insulating high-temperature resistant material is more than 200 ℃.

The gear selection switch 3 is provided with three gears, namely a refrigeration gear, a heating gear and a closing gear; when the liquid in the inner container 11 needs to be refrigerated, the refrigerating gear of the gear selection switch 3 is selected, the gear selection switch 3 is connected with the battery pack 9, the gear selection switch 3 is respectively and electrically connected with the semiconductor refrigerating sheet 4, the fan 6 and the battery pack 9, and the semiconductor refrigerating sheet 4 and the fan 6 are electrified and work. The end face of the top of the semiconductor refrigerating sheet 4 refrigerates, and the end face of the bottom of the semiconductor refrigerating sheet 4 heats; when liquid in the inner container 11 needs to be heated, a heating gear of the gear selection switch 3 is selected, the gear selection switch 3 is connected with the battery pack 9, the gear selection switch 3 is respectively electrically connected with the semiconductor refrigerating sheet 4 and the battery pack 9, the gear selection switch 3 is disconnected with the fan 6, the fan 6 is not connected with the battery pack 9 and does not work, and the semiconductor refrigerating sheet 4 is electrified and works. The end face of the top of the semiconductor refrigerating sheet 4 heats, and the end face of the bottom of the semiconductor refrigerating sheet 4 refrigerates; when liquid refrigeration or heating in the inner bag 11 need not be when, select the gear of closing of selecting shelves switch 3, select shelves switch 3 and group battery 9 not to switch on this moment, semiconductor refrigeration piece 4 and fan 6 are all not switched on, and are out of work, are prior art, not the utility model discloses an improve and protection scope. In specific implementation, the method can be realized by adopting the prior art. The utility model protects a structure of semiconductor thermos cup.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications and equivalent changes made according to the technical spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor thermos cup, includes cup (1), inner bag (11) and bowl cover (2), its characterized in that: a first heat-conducting silica gel, a semiconductor refrigerating sheet (4), a second heat-conducting silica gel, radiating fins (5), a fan (6), a heat insulation plate and a battery pack (9) are sequentially arranged below the bottom of the inner container (11), and a gear selecting switch (3) is further arranged below the bottom of the inner container (11); the electric cup is characterized in that an area surrounded by the bottom of the inner container (11), the heat insulation plate and the inner wall of the bottom of the cup body (1) forms a first cavity, the battery pack (9) and the gear selection switch (3) are located in the first cavity, and the first heat-conducting silica gel, the semiconductor refrigeration sheet (4), the second heat-conducting silica gel, the radiating fins (5) and the fan (6) are located outside the first cavity; radiating holes (13) are formed in the outer wall of the cup body (1) on one side, close to the semiconductor refrigerating sheet (4), below the bottom of the inner container (11); the gear selection switch (3) is electrically connected with the semiconductor refrigeration sheet (4), the fan (6) and the battery pack (9) respectively.

2. The semiconductor thermos cup of claim 1, wherein: the gear selection switch (3) is provided with three gears, namely a refrigeration gear, a heating gear and a closing gear.

3. The semiconductor thermos cup of claim 1, wherein: the bottom of the inner container (11), the first heat-conducting silica gel, the semiconductor refrigerating sheet (4), the second heat-conducting silica gel and the radiating sheet (5) are sequentially connected.

4. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: cup (1) bottom sets up USB interface (8) that charges, USB charges interface (8) and is connected with group battery (9) electricity, USB charges interface (8) and can be connected with external power source.

5. The semiconductor thermos cup of claim 4, wherein: the USB charging interface (8) is provided with a USB charging interface protection plate (12), and the USB charging interface protection plate (12) is movably connected with the USB charging interface (8).

6. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: the model of the semiconductor refrigerating sheet (4) is SP 1848-27145.

7. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: the battery pack (9) is L-shaped.

8. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: the heat dissipation hole (13) comprises an upper layer and a lower layer.

9. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: and a waterproof breathable film is stuck to the surface of the heat dissipation hole (13).

10. A semiconductor thermal insulation cup according to claim 1, 2 or 3, characterized in that: the heat insulation plate comprises a first heat insulation plate (7) and a second heat insulation plate (10), wherein the first heat insulation plate (7) is connected with the second heat insulation plate (10).