CN209963091U - Composite luminous substrate - Google Patents
Composite luminous substrate Download PDFInfo
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- CN209963091U CN209963091U CN201921190517.6U CN201921190517U CN209963091U CN 209963091 U CN209963091 U CN 209963091U CN 201921190517 U CN201921190517 U CN 201921190517U CN 209963091 U CN209963091 U CN 209963091U
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Abstract
The utility model belongs to the technical field of luminescent material, concretely relates to compound luminescent substrate. The utility model provides a composite luminous substrate, which comprises a main body layer, a luminous layer and a surface protective layer which are sequentially stacked; the size of the light-emitting layer is smaller than that of the main body layer and the surface protection layer, and the edge of the light-emitting layer is not in contact with the outside. The utility model discloses set up the size of luminescent layer into the size that is less than main part layer and surface protection layer, utilize the laminar material of different performance to completely cut off luminescent layer and heat, water and oxygen, prevent that luminescent material in the luminescent layer from because of the luminous performance that causes such as weing, oxidation from declining. The embodiment result shows that the composite luminescent substrate provided by the utility model has good stability, and the luminescent performance is still kept at a higher level after the continuous operation for 2000 hours.
Description
Technical Field
The utility model belongs to the technical field of luminescent material, concretely relates to compound luminescent substrate.
Background
Solid state light emission is a very rapidly developed technology in recent years, which is based on semiconductor Light Emitting Diodes (LEDs) and is combined with photoluminescent materials to form various light emitting devices, which can be used for illumination or display. The existing light emitting device is generally obtained by mixing a light emitting material and a curing adhesive (a thermosetting adhesive or a light curing adhesive), then directly coating the obtained mixture on an LED chip, and then curing the mixture to obtain the light emitting device combining an excitation light source LED chip (blue and ultraviolet) and the light emitting material. When the luminescent device works, the surface temperature is high, and luminescent materials dispersed in curing glue, especially quantum dot luminescent materials, are easy to contact with water or oxygen in air after being heated, so that the luminescent performance of the luminescent device is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a compound luminescent substrate, the utility model provides a compound luminescent substrate has stable luminous performance, can extensively be used for the illumination or show.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a composite luminous substrate, which comprises a main body layer, a luminous layer and a surface protective layer which are sequentially laminated; the size of the light-emitting layer is smaller than that of the main body layer and the surface protection layer, and the edge of the light-emitting layer is not in contact with the outside.
Preferably, the distance between the edge of the light-emitting layer and the edge of the main body layer is 0.2-10 mm.
Preferably, an ith isolation layer and/or a diffusion layer is disposed between the host layer and the light emitting layer.
Preferably, when an I-th isolation layer and a diffusion layer are provided between the main body layer and the light-emitting layer, the I-th isolation layer is in contact with the light-emitting layer, and the diffusion layer is in contact with the main body layer.
Preferably, a second isolating layer is arranged between the light-emitting layer and the surface protective layer.
Preferably, the thickness of the main body layer is 0.8-1.5 mm;
the thickness ratio of the luminous layer to the main body layer is (0.02-0.03): 1;
the thickness ratio of the surface protection layer to the main body layer is (0.05-2.0): 1;
preferably, the thickness ratio of the I isolating layer to the main body layer is (0.04-0.08): 1, the thickness ratio of the II th isolation layer to the main body layer is (0.04-0.08): 1.
preferably, the thickness ratio of the diffusion layer to the main body layer is (0.02-0.4): 1.
preferably, the light-emitting layer contains a light-emitting material, and the light-emitting material includes an inorganic light-emitting material or an organic light-emitting material.
Preferably, the forming material of the main body layer comprises polycarbonate, polyethylene terephthalate, polyvinyl chloride, polystyrene or polymethyl methacrylate;
the forming material of the isolation layer comprises curing glue;
the forming material of the surface protection layer comprises epoxy resin or silica gel;
the diffusion layer comprises an optical diffusion plate or a polymer composite plate.
The utility model provides a composite luminous substrate, which comprises a main body layer, a luminous layer and a surface protective layer which are sequentially stacked; the size of the light-emitting layer is smaller than that of the main body layer and the surface protection layer, and the edge of the light-emitting layer is not in contact with the outside. The utility model discloses set up main part layer and surface protection layer respectively on the luminescent layer two sides to the cross sectional dimension of control luminescent layer is less than main part layer cross sectional dimension, so that main part layer and surface protection layer form the isolation protection to the luminescent layer, reduce heat, water and oxygen to the influence of luminescent layer, and then improve the performance of compound luminescent substrate. The embodiment result shows that the composite luminescent substrate provided by the utility model has good stability, and the luminescent performance is still kept at a higher level after the continuous operation for 2000 hours.
Drawings
Fig. 1 is a schematic structural diagram of a composite light emitting substrate provided by a composite light emitting substrate structure 1 and a composite light emitting substrate provided in example 1 of the present invention;
fig. 2 is a schematic structural diagram of a composite light-emitting substrate provided in the composite light-emitting substrate structure 2 and embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of a composite light emitting substrate provided in the composite light emitting substrate structure 3 and embodiment 3 of the present invention;
fig. 4 is a schematic structural diagram of a composite light emitting substrate provided in the composite light emitting substrate structure 4 and embodiment 4 of the present invention;
fig. 5 is a schematic structural diagram of a composite light emitting substrate provided by the composite light emitting substrate structure 5 of the present invention;
fig. 6 is a schematic structural diagram of a composite light emitting substrate provided by the composite light emitting substrate structure 6 of the present invention;
fig. 7 is a schematic structural diagram of a composite light emitting substrate provided by the composite light emitting substrate structure 7 of the present invention;
fig. 8 is a schematic structural diagram of a composite light emitting substrate structure 8 and the composite light emitting substrate provided in example 5 of the present invention;
fig. 9 is a schematic structural diagram of a composite light-emitting substrate provided in embodiment 6 of the present invention;
fig. 10 is a schematic structural diagram of a composite light-emitting substrate provided in embodiment 7 of the present invention;
fig. 11 is a schematic structural diagram of a composite light-emitting substrate provided in embodiment 8 of the present invention;
fig. 12 is a schematic structural diagram of a composite light-emitting substrate provided in embodiment 9 of the present invention;
FIG. 13 is a graph showing the test results of the composite luminescent substrate of example 1 of the present invention;
FIG. 14 is a graph showing the test results of the composite luminescent substrate of example 2 of the present invention;
FIG. 15 is a graph showing the test results of the composite luminescent substrate of example 3 of the present invention;
FIG. 16 is a graph showing the test results of the composite luminescent substrate of example 4 of the present invention;
FIG. 17 is a graph showing the test results of the composite luminescent substrate of example 5 of the present invention;
FIG. 18 is a graph showing the test results of the composite luminescent substrate of example 6 of the present invention;
FIG. 19 is a graph showing the test results of the composite luminescent substrate of example 7 of the present invention;
FIG. 20 is a graph showing the test results of the composite luminescent substrate of example 8 of the present invention;
FIG. 21 is a graph showing the test results of the composite luminescent substrate of example 9 of the present invention;
in the above drawings, 1 is a host layer, 2 is a diffusion layer, 3 is an I-th barrier layer, 4 is a light-emitting layer, 4a is a red light-emitting layer, 4b is a green light-emitting layer, 5 is an II-th barrier layer, and 6 is a surface protective layer. The present invention is illustrated in the following schematic drawings, which only show the relative position relationship between the layers constituting the composite luminescent substrate, and the size and shape on the drawings do not represent the size and shape of the real sample.
Detailed Description
In the following detailed description of the present invention, reagents or materials used are commercially available products well known to those skilled in the art, unless otherwise specified.
The utility model provides a composite luminous substrate, as shown in figure 1, comprising a main body layer 1, a luminous layer 4 and a surface protection layer 6 (structure 1) which are sequentially laminated; the size of the light emitting layer 4 is smaller than that of the main body layer 1 and the surface protection layer 6, and the edge of the light emitting layer 4 is not in contact with the outside.
The composite light-emitting substrate comprises a main body layer 1, the preferred macromolecular material that is the forming material of main body layer 1, the macromolecular material is preferred to include Polycarbonate (PC), polyethylene terephthalate (PET), polyvinyl chloride (PVC), Polystyrene (PS) or polymethyl methacrylate (PMMA). In the present invention, the main layer is preferably a polymer plate material of the above-mentioned components. The utility model discloses it is right the size and the shape on main part layer do not have special requirement, according to actual need set for can. In the embodiment of the present invention, the thickness of the main body layer is preferably 0.8-1.5 mm, and more preferably 1.0-1.2 mm.
The composite luminous substrate comprises a luminous layer 4, wherein the luminous layer 4 is arranged on the surface of the main body layer 1 in a stacking manner. In the present invention, the size of the light emitting layer 4 is smaller than the size of the main body layer 1 and the surface protection layer 6, and is not in contact with the outside. The invention preferably coats the edge of the luminescent layer 4 by solid glue so that the luminescent layer 4 is not in contact with the outside. In the utility model discloses in, with the size and the shape of main part layer 1 are the benchmark, the preferred shape with main part layer 1 of shape of luminescent layer 4 is unanimous, and the size is less than main part layer 1's size, and the distance between the corresponding side reason of the edge of luminescent layer 4 and main part layer 1 is preferred 0.2 ~ 10mm, more preferably 0.5 ~ 9mm, and is preferred 1 ~ 8mm again. Use the thickness of main part layer 1 is the benchmark, the thickness ratio of luminescent layer 4 and main part layer 1 is preferred (0.02 ~ 0.03): 1, more preferably (0.023-0.027): 1.
the present invention is directed to a light-emitting layer, wherein the light-emitting layer preferably includes a curable adhesive and a light-emitting material, and the light-emitting material preferably accounts for 5 to 25% of the total mass of the light-emitting layer, more preferably 6 to 22%, and still more preferably 10 to 20%. The utility model discloses utilize the solidification to glue dispersion luminescent material to make luminescent material adhere in the surface on main part layer forms the luminescent layer.
In the present invention, the curing glue preferably comprises a thermal curing glue or a photo-curing glue, wherein the thermal curing glue preferably comprises an AB-type thermal curing glue; the photo-curable glue preferably comprises a UV glue.
In the present invention, the light emitting material preferably includes an inorganic light emitting material or an organic light emitting material.
In the present invention, the inorganic luminescent material preferably includes a quantum dot luminescent material, a rare earth luminescent material, and a perovskite luminescent material.
The quantum dot luminescent material preferably comprises a quantum dot microcrystal or a quantum dot modified microcrystal, and the quantum dot microcrystal preferably comprises a cadmium selenide (CdSe) quantum dot microcrystal, a cadmium telluride (CdTe) quantum dot microcrystal or a manganese-doped zinc selenide (ZnSe: Mn) quantum dot microcrystal. The utility model discloses in, the preferred 50 ~ 400nm of particle size of quantum dot micrite, more preferred 70 ~ 350 nm. In the utility model, the quantum dot modified microcrystal preferably comprises cadmium selenide quantum dot modified microcrystal, cadmium telluride quantum dot modified microcrystal and manganese doped zinc selenide quantum dot modified microcrystal; the particle size of the quantum dot modified microcrystal is preferably 250-700 nm, and more preferably 300-600 nm.
The utility model discloses in, tombarthite luminescent material is preferred to include tombarthite doping oxide luminescent material, tombarthite doping phosphate luminescent material, tombarthite doping aluminate luminescent material, tombarthite doping silicate luminescent material, tombarthite doping sulphide luminescent material or tombarthite doping nitride luminescent material, tombarthite luminescent material's particle diameter is preferred 200 ~ 500nm, and more preferred is 300 ~ 400 nm.
In the present invention, the rare earth-doped oxide light emitting material preferably includes: y is2O3:Eu3+、Gd2O3：Eu3+Or Bi2O3:3B2O3:Tb3+；
The rare earth doped phosphate luminescent material preferably includes: LaPO4:Ce3+,Tb3+、SrP2O7:Eu2+Or Sr10(PO4)8Cl2:Eu2+；
The rare earth doped aluminate luminescent material preferably includes: SrAl2O4:Eu2+、Sr4Al14O25:Eu2+,Dy3+Or CaAl2O4:Eu2+,Nd3+；
The rare earth doped silicate luminescent material preferably comprises: sr2MgSi2O7:Eu2+,Dy3+、Ca2MgSi2O7:Eu2+,Dy3+、Sr3MgSi2O8:Eu2+,Dy3+Or Ca3MgSi2O8:Eu2+,Dy3+；
The rare earth doped sulfide luminescent material preferably includes: CaS Ce3+、CaS:Pr3+、CaS:Nd3+、CaS:Sm3+、CaS:Tb3+Or CaS Dy3+；
The rare earth-doped nitride light emitting material preferably includes: BaYSi4N7:Ce3+、BaYSi4N7:Eu2+、Y2Si3O3N4:Ce3+Or Ca-alpha-SiAlON: Eu2+。
In the present invention, the perovskite luminescent material preferably comprises a lead cesium halide, a lead methylammonium halide or a lead-free perovskite; in the present invention, all perovskite luminescent materials are used in a microcrystalline amount or modified microcrystalline manner; the particle size of the perovskite luminescent material is preferably 200-750 nm, and more preferably 300-500 nm.
In the present invention, the lead cesium halide perovskite luminescent material preferably includes: a lead cesium chloride crystallite, a lead cesium chloride-modified crystallite, a lead cesium bromide-modified crystallite, a lead cesium iodide crystallite, or a lead cesium iodide-modified crystallite;
the lead methyl ammonium halide perovskite luminescent material preferably comprises: lead methylammonium chloride microcrystals, lead methylammonium chloride modified microcrystals, lead methylammonium bromide modified microcrystals, lead methylammonium iodide microcrystals or lead methylammonium bromide modified microcrystals;
the lead-free perovskite luminescent material preferably includes: tin cesium iodide microcrystals, tin cesium iodide modified microcrystals, bismuth methylammonium bromide microcrystals, or bismuth methylammonium bromide modified microcrystals.
In the present invention, the organic light emitting material preferably includes a polymer light emitting material or an organic small molecule light emitting material.
Further, the polymer light emitting material preferably includes: poly (p-phenylene vinylene) and derivative thereof, polythiophene and derivative thereof, and poly (p-phenylene vinylene)Oxadiazole and its derivatives or polyfluorene and its derivatives; the particle size of the polymer luminescent material is preferably 50-500 nm, and more preferably 100-400 nm;
the organic small molecule light-emitting material preferably includes: DCM and its derivatives, coumarin and its derivatives, or, DPA (diphenylanthracene) and its derivatives; the particle size of the organic small-molecule luminescent material is preferably 200-500 nm, more preferably 240-480 nm, and further preferably 300-400 nm.
The light-emitting material of the present invention preferably includes ultraviolet (190 to 390nm), visible light (390 to 800nm), or infrared (800 to 3000 nm).
Composite luminescent substrate includes surface protection layer 6, surface protection layer 6's forming material is preferred to include epoxy or silica gel, and further preferred is the transparent panel of epoxy material or silica gel resin material. The utility model has no special requirements for the concrete types of the epoxy resin or the silica gel, and can adopt the methods well known by the technical personnel in the field. In the present invention, the thickness ratio of the surface protection layer 6 to the main body layer 1 is preferably (0.05-2.0): 1, more preferably (0.3 to 1.2): 1. the utility model discloses in, when the surface protection layer formed for a plurality of panel stacks, the thickness of surface protection layer indicates the thickness sum of all panels. In the present invention, the size and shape of the surface protective layer 6 are preferably identical to those of the main body layer 1.
The utility model discloses it is preferable still to have the I isolating layer 3 and/or the diffusion layer 2 between the main body layer 1 and the luminescent layer 4 of the compound luminescent substrate; when the ith separation layer 3 and the diffusion layer 2 are disposed between the main body layer 1 and the light emitting layer 4, the ith separation layer 3 is preferably in contact with the light emitting layer 4, and the diffusion layer 2 is preferably in contact with the main body layer 1. Specifically, the method comprises the following steps:
when only the diffusion layer is provided, the structural composition of the composite light emitting substrate is preferably: a main body layer 1, a diffusion layer 2, a light-emitting layer 4, and a surface protective layer 6 (structure 2, corresponding to fig. 2);
when only the ith isolation layer is provided, the composite light emitting substrate has a structure consisting of: a main body layer 1, an I-th isolation layer 3, a light-emitting layer 4 and a surface protection layer 6 (structure 3, corresponding to fig. 3);
when the diffusion layer and the I-th isolation layer are simultaneously arranged, the composite light-emitting substrate structurally comprises the following components: a host layer 1, a diffusion layer 2, an ith separator 3, a light-emitting layer 4, and a surface protective layer 6 (structure 4, corresponding to fig. 4).
The utility model discloses it is preferred to set up the diffusion barrier between bulk layer and luminescent layer, and the transmission direction of dispersible and change light source to satisfy actual demand.
The utility model discloses preferably set up I isolation layer 3 between main body layer 1 and luminescent layer 4, can further protect the luminescent material in the luminescent layer, make it avoid the influence of temperature, water and oxygen to obtain stable performance's luminescent device.
In the present invention, the thickness ratio of the diffusion layer to the main body layer is preferably (0.02-0.4): 1, more preferably (0.05 to 0.25): 1; the utility model discloses it is right the size and the shape of diffusion layer do not have special requirement, can be unanimous with the size of main part layer or luminescent layer, also can be less than the cross sectional dimension of main part layer.
In the present invention, the diffusion layer preferably includes an optical diffusion plate or a polymer composite plate. The utility model discloses in, polymer composite panel is preferred include macromolecular material and disperse in solid powder in the macromolecular material, solid powder is 1 ~ 25% of polymer composite panel total mass, more preferably is 2 ~ 10%. The solid powder material comprises: silicon dioxide, titanium dioxide, aluminum oxide, or microcrystalline powder; the microcrystalline powder is preferably blank quantum dot microcrystals or blank quantum dot modified microcrystals, and the preparation method of the microcrystalline powder is the same as that of the quantum dot microcrystals and the quantum dot modified microcrystals, but the microcrystalline powder does not contain quantum dots.
In the utility model discloses in, the solid powder preferredly still can add zinc selenide quantum dot micrite or zinc selenide quantum dot modified micrite according to specific need.
In the present invention, the particle size of the solid powder is preferably 100 to 700nm, and more preferably 250 to 600 nm. The utility model discloses preferred interpolation through solid powder to improve polymer composite board to the diffusion performance of incident light.
In the present invention, the polymer material in the polymer composite board is preferably consistent with the above technical solution, the selection range of the polymer material used in the main body layer is consistent, and the selection range is not repeated here. In the present invention, the diffusion layer is preferably solid on the surface of the main body layer by means of adhesion, and is explained in particular in the preparation method.
In the present invention, the thickness ratio of the first isolation layer to the main body layer is preferably (0.04-0.08): 1, more preferably (0.05 to 0.07): 1. in the present invention, the size of the I-th isolation layer is the same as the size of the main body layer or the light emitting layer. The utility model discloses in, the preferred including solidification of forming material of I isolation layer is glued, it is preferably glued including photocuring or thermal curing to solidify to glue, photocuring glue is preferably glued with thermal curing's constitution and is optimized and above-mentioned technical scheme solidify the selection range of gluing the constitution in the luminescent layer unanimously, and here is no longer repeated. In the present invention, an additive is preferably further dispersed in the material forming the isolation layer, and the additive is preferably a zinc selenide quantum dot microcrystal or a zinc selenide quantum dot modified microcrystal.
The utility model discloses in, the addition of additive is preferably 0.5 ~ 8.0%, more preferably 1.0 ~ 2.5% of isolation layer formation material quality in the I isolation layer. The utility model discloses it is preferred through the additive that disperses above-mentioned content in solidifying gluey, can improve the luminous stability of luminescent layer.
In the present invention, a second isolation layer 5 is preferably disposed between the light-emitting layer 4 and the surface protection layer 6; when the II th isolation layer 5 is provided, the composite light emitting substrate has a structure,
a main body layer 1, a light-emitting layer 4, a II th isolation layer 5 and a surface protection layer 6 (structure 5, corresponding to FIG. 5);
a main body layer 1, a diffusion layer 2, a light emitting layer 4, a second isolation layer 5 and a surface protection layer 6 (structure 6, corresponding to fig. 6);
a main body layer 1, an I-th isolation layer 3, a light-emitting layer 4, a II-th isolation layer 5 and a surface protection layer 6 (structure 7, corresponding to FIG. 7);
a host layer 1, a diffusion layer 2, an I-th barrier layer 3, a light-emitting layer 4, an II-th barrier layer 5, and a surface protective layer 6 (structure 8, corresponding to fig. 8).
In the present invention, the selection range of the composition, size and thickness of the II isolation layer 5 and the I isolation layer 3 is the same, and is not repeated here. The utility model discloses it sets up II isolation layer 5 preferably between luminescent layer 4 and surface protection layer 6, can provide more protection for the luminescent material in the luminescent layer, improves the luminous stability of luminescent layer.
The utility model discloses in, among the compound luminescent substrate who has structure 8, except that the size and the shape of main part layer and surface protection layer are unanimous, the size and the shape of other each structural layer are adjustable, and each layer size change schematic diagram is shown in fig. 9 ~ 12.
The utility model also provides an above-mentioned technical scheme the preparation method of compound luminescent substrate, including following step:
taking the main body layer or the surface protection layer as a substrate;
and sequentially arranging the structural layers on the main body layer or the surface protection layer to obtain the composite light-emitting substrate.
The utility model discloses use main part layer or surface protection layer as the basement, provide the basis for forming the structural layer of compound luminous substrate. The utility model discloses use the main part layer as the basement, the mode that sets up each structural layer is preferred to include:
performing surface treatment on one surface of the main body layer, and then dispersing a forming material of the light-emitting layer on the treated surface of the main body layer to form the light-emitting layer; and infiltrating the surface of the light-emitting layer, then adhering a surface protection layer forming material to the surface of the light-emitting layer, and curing to obtain the composite light-emitting substrate (structure 1, corresponding to figure 1).
In the present invention, the surface treatment preferably comprises planing, corona or wetting, in a manner well known to those skilled in the art; the wetting agent preferably comprises a coupling agent or an organic solvent, the coupling agent being known to the person skilled in the art, such as in particular: a silane coupling agent KH550, a silane coupling agent KH570 or a titanate coupling agent TTS; the organic solvent preferably includes acetone, toluene, xylene, chloroform, carbon tetrachloride, hexane, ethyl acetate or methyl t-butyl ether; the xylene preferably comprises ortho-xylene, meta-xylene or para-xylene. The utility model discloses preferably carry out surface treatment to the main part layer, can improve the adhesion of main part layer, promote the formation of follow-up structural layer.
In the present invention, the dispersion of the light-emitting layer-forming material preferably includes:
the first method is as follows: and dispersing the luminescent material in the curing adhesive, coating the obtained composite adhesive on the processing surface of the main body layer, and curing. The utility model discloses to the coating mode that compound was glued, the dispersion mode of luminescent material in solidifying gluey do not have special requirement, adopt the familiar mode of technical staff in the field can. In the embodiment of the present invention, the dispersing means includes stirring, kneading, and filtering.
In the utility model, the curing mode is determined by the type of the curing glue; specifically, when the curing adhesive is a thermosetting adhesive, the curing temperature and the curing time are determined according to the components of the curing agent so as to enable the curing adhesive to be solidified; when the curing adhesive is a light curing adhesive, the wavelength of light used for curing is preferably 365nm, and the power density is preferably 150W/cm2The time is preferably 10 to 30 seconds.
The second method comprises the following steps: and coating the curing glue on the processing surface of the main body layer, and then spraying the luminescent material on the curing glue for curing. The utility model discloses it is right the coating mode of solidification glue, luminescent material's spraying mode do not have special requirement, adopt the familiar mode of technical staff in the field can.
After the luminescent layer is formed, the utility model discloses with the surface of surface protection layer's formation material adhesion at the luminescent layer, obtain compound luminescent substrate after the solidification. The utility model discloses in, gluing agent is preferred to be glued including curing for the adhesion, the selection range of the component that the curing was glued, the preferred and used curing of luminescent layer of curing mode are glued and the curing mode is unanimous, and here is no longer repeated.
When a diffusion layer and/or an isolation layer is further disposed between the host layer and the light-emitting layer of the composite light-emitting substrate, it is preferable that:
covering a forming material of a diffusion layer on the processing surface of the main body layer to form the diffusion layer, and obtaining the composite light-emitting substrate with the structure of the main body layer, the diffusion layer, the light-emitting layer and the surface protection layer;
alternatively, the first and second electrodes may be,
and coating the forming material of the I-th isolation layer on the treated surface of the main body layer, and curing to form the I-th isolation layer to obtain the composite light-emitting substrate with the main body layer, the isolation layer, the light-emitting layer and the surface protection layer. In the present invention, the curing method is preferably the same as the curing method of the luminescent layer in the above technical solution, and is not repeated here;
alternatively, the first and second electrodes may be,
covering the processing surface of the main body layer with a forming material of a diffusion layer, then coating the forming material of an I-th isolation layer on the surface of the diffusion layer, and curing to form the diffusion layer and the I-th isolation layer to obtain the composite light-emitting substrate with the main body layer, the diffusion layer, the isolation layer, the light-emitting layer and the surface protection layer.
When a second isolation layer is further disposed between the light-emitting layer and the surface protection layer of the composite light-emitting substrate, it is preferable that the composite light-emitting substrate further includes: and coating a forming material of a II th isolation layer on the surface of the solidified luminous layer, solidifying to form the II th isolation layer, and correspondingly obtaining the composite luminous substrate shown in the structure charts 5-8.
The utility model discloses when using surface protection layer as the basis, the mode of setting on each structural layer is the same with above-mentioned technical scheme the mode of setting is no longer repeated one by one.
The utility model also provides the composite luminous substrate or the technical proposal, and the application of the composite luminous substrate prepared by the preparation method in preparing the illuminating device or the display. The utility model has no special requirements for the specific application mode of the composite luminous substrate, and the mode which is well known by the technical personnel in the field can be adopted.
For further explanation of the present invention, the composite light emitting substrate provided by the present invention will be described in detail with reference to the drawings and examples, but they should not be construed as limiting the scope of the present invention.
Example 1
Uniformly coating a layer of mixed solvent formed by mixing ethyl acetate and acetone according to the volume ratio of 1:1 on a PMMA plate with the thickness of 1mm by using a roller brush for later use;
taking 20g of quantum dot modified microcrystal (red luminescent material with the wavelength of 620-630 nm, CdSe material), 20g of quantum dot modified microcrystal (green luminescent material with the wavelength of 520-530 nm, CdSe) and 240g of ultraviolet curing glue (UV glue), mixing, stirring, uniformly mixing all components, kneading, refining, pressing, and filtering to obtain a luminescent layer forming material;
uniformly coating the luminescent layer material on the treated surface of the treated main body layer, wherein the coating range is retracted from the edge of the main body layer3.0mm, with a thickness of 25 μm, and then cured. The curing conditions were: 365nm wavelength and 150W/cm optical power density2Ultraviolet light irradiation of (1) for 15 s;
and coating a curing agent on the cured luminescent layer, then covering the surface of the luminescent layer with a silica gel plate, wherein the size of the silica gel plate is consistent with that of the main body layer, the thickness of the silica gel plate is 1.5mm, and curing to obtain the composite luminescent substrate with the structure shown in figure 1.
Example 2
A composite luminescent substrate was prepared as in example 1, except that before the luminescent layer forming material was coated, a light diffusion plate was covered on the PMMA plate, and the size of the diffusion plate was identical to that of the bulk layer; then coating a light-emitting layer forming material on the main body layer to obtain a structure: a composite light emitting substrate of a main body layer-a diffusion layer-a light emitting layer-a surface protective layer (fig. 2); the thickness and composition parameters of each layer are shown in table 1.
Example 3
A composite luminescent substrate was prepared in the manner of example 1, except that:
mixing 100g of quantum dot microcrystal (zinc selenide) and 720g of curing glue, and stirring, kneading, refining and filtering to obtain an isolation layer forming material;
coating the isolation layer forming material on the PMMA plate, wherein the coating range is consistent with the size of the main body layer, and the obtained structure is as follows: the composite light-emitting substrate (figure 3) of the main body layer, the I isolating layer, the light-emitting layer and the surface protection layer has the thickness and composition parameters shown in the table 1.
Example 4
The main body layer, the diffusion layer, the I-th isolation layer, the light-emitting layer and the surface protection layer are sequentially arranged in the manner of the embodiment 1-3, and the obtained structure is as follows: the composite light-emitting base (figure 4) of the main body layer, the diffusion layer, the I isolating layer, the light-emitting layer and the surface protection layer is shown in the table 1.
Example 5
Uniformly coating a layer of mixed solvent formed by mixing ethyl acetate and acetone according to the volume ratio of 1:1 on a PMMA plate (same as the embodiment 1) by using a roller brush, and then bonding a diffusion plate with the same size; the shape and the size of the diffusion plate are the same as those of the PMMA plate;
taking 100g of zinc selenide quantum dot modified microcrystal and 720g of ultraviolet curing glue, and sequentially stirring, dispersing, kneading, refining, pressing and filtering to obtain zinc selenide quantum dot modified microcrystal glue (namely a forming material of an isolation layer); coating zinc selenide quantum dot modified microcrystalline glue on a diffusion plate, wherein the coating range is the same as the size of the diffusion plate, the thickness is 50 mu m, and then curing to form an I-th isolation layer. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Ultraviolet light irradiation of (1) for 15 s;
taking 20g of red luminescent water-phase quantum dot modified microcrystal with the wavelength of 620-630 nm, 20g of green luminescent water-phase quantum dot modified microcrystal with the wavelength of 520-530 nm and 240g of ultraviolet curing glue, and sequentially stirring, dispersing, kneading, pressure refining and filtering to obtain mixed quantum dot modified microcrystal glue (forming material of a luminescent layer); and uniformly coating the obtained mixed quantum dot modified microcrystalline glue on the cured zinc selenide quantum dot modified microcrystalline glue layer, wherein the coating range is equivalent to 3.0mm retraction from the edge of the cured ultraviolet curing glue, the thickness of the ultraviolet curing glue layer is 25 mu m, and then curing to form a light emitting layer. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Is irradiated for 15 s.
And uniformly coating a layer of zinc selenide quantum dot modified microcrystalline glue on the light emitting layer, wherein the coating range is the same as the size of the PMMA plate, the thickness is 75 mu m, and then curing to form a II-th isolation layer. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Is irradiated for 15 s.
And (3) adhering a silica gel plate with the thickness of 1.5mm on the II isolating layer, wherein the size of the silica gel plate is the same as that of the PMMA plate, the diffusion plate and the like, and obtaining the composite light-emitting substrate with the structure shown in the figure 8.
Example 6
A composite light-emitting substrate was prepared as in example 5, except that the light-emitting layer was disposed in a different manner, specifically:
taking 20g of red luminescent water-phase quantum dot modified microcrystal (cadmium telluride quantum dot modified microcrystal) with the wavelength of 620-630 nm and 120g of ultraviolet curing glue, and sequentially stirring, dispersing, kneading, refining, pressing and filtering to obtain the red luminescent quantum dot modified microcrystal glue;
taking 20g of green luminescent water-phase quantum dot modified microcrystal (cadmium telluride quantum dot modified microcrystal) with the wavelength of 520-530 nm and 120g of ultraviolet curing glue, and sequentially stirring, dispersing, kneading, refining, pressing and filtering to obtain the green luminescent quantum dot modified microcrystal glue;
uniformly coating the obtained red light-emitting quantum dot modified microcrystalline glue on the cured ultraviolet curing glue, wherein the coating range is equivalent to 3.0mm of retraction from the edge of the cured ultraviolet curing glue, the thickness of the cured ultraviolet curing glue is 10 mu m, and then curing the red light-emitting quantum dot modified microcrystalline glue to form a red light-emitting layer 4a in the picture 9;
uniformly coating the obtained green light-emitting quantum dot modified microcrystalline glue on the cured red light-emitting quantum dot dispersed modified microcrystalline ultraviolet curing glue layer, wherein the coating range is the same as that of the red light-emitting quantum dot dispersed modified microcrystalline ultraviolet curing glue layer, the thickness of the glue layer is 15 mu m, and then curing to form a red light-emitting layer 4b in the picture 9; the structure of the resulting composite light-emitting substrate is shown in detail in fig. 9.
Example 7
The method takes the surface protection layer as a substrate to prepare the composite luminescent substrate, and comprises the following specific steps: a layer of ultraviolet curing glue is uniformly coated on a rubber plate (the size is the same as that of the example 1), the coating range is the same as that of the silica gel plate, the thickness is 75 mu m, and then the ultraviolet curing glue is cured to form a II th isolation layer 5. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Is irradiated for 15 s.
Taking 20g of red luminescent water-phase quantum dot modified microcrystal with the wavelength of 620-630 nm, 20g of green luminescent water-phase quantum dot modified microcrystal with the wavelength of 520-530 nm and 240g of ultraviolet curing glue, and sequentially stirring, dispersing, kneading, pressure refining and filtering to obtain mixed quantum dot modified microcrystal glue; and uniformly coating the obtained mixed quantum dot modified microcrystalline glue on the cured ultraviolet curing glue, wherein the coating range is equivalent to 3.0mm of retraction from the edge of the cured ultraviolet curing glue, the thickness of the ultraviolet curing glue is 25 mu m, and then curing to form the light-emitting layer 4. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Is irradiated for 15 s.
And uniformly coating a layer of ultraviolet curing glue on the cured ultraviolet curing glue layer containing the quantum dot modified microcrystal, wherein the coating range is the same as the glue size of the silica gel plate, is slightly larger than the ultraviolet curing glue layer dispersed with the quantum dot modified microcrystal, and has the thickness of 50 mu m, and then curing to form the I-th isolation layer 3. The curing conditions were: the wavelength is 365nm, and the optical power density is 150W/cm2Is irradiated for 15 s.
And bonding a diffusion plate on the cured ultraviolet curing glue layer to form a diffusion layer 2, wherein the size of the diffusion plate is the same as that of the silica gel plate and the like and is slightly larger than that of the modified microcrystal ultraviolet curing glue layer with the dispersed quantum dots.
Uniformly coating a layer of mixed solvent formed by mixing ethyl acetate, methanol and acetone according to the volume ratio of 1:1:2 on a diffusion plate by using a roller brush, and then bonding a layer of PMMA plate to form a main body layer 1, wherein the thickness of the PMMA plate is 1mm, the size of the PMMA plate is the same as that of a silica gel layer, and the PMMA plate is slightly larger than the quantum dot dispersed modified microcrystal ultraviolet curing glue layer, so that the composite luminescent substrate with the structure shown in the figure 10 is obtained.
Example 8
A composite light emitting substrate was prepared as shown in example 5 except that the size of the ith separation layer was different and the size of the ith separation layer was identical to that of the light emitting layer, and the structure of the resulting composite light emitting substrate was as shown in fig. 11.
Example 9
A composite light emitting substrate was prepared in the same manner as in example 7 except that the size of the diffusion layer 2 provided between the host layer 1 and the light emitting layer 4 was different, the diffusion layer size in this example was identical to the light emitting layer size, and the structure of the resulting composite light emitting substrate was as shown in fig. 12.
It should be noted that, in the above embodiment, when the size of the intermediate structure layer is changed, the edge of the smaller-sized structure layer needs to be coated with the solid glue, so that the circumferential thickness of the whole composite light emitting substrate is uniform.
TABLE 1 compositions and thicknesses of layers of the composite light-emitting substrates obtained in examples 1 to 9
Continuing with Table 1:
characterization and results of Performance
The composite luminescent substrate obtained in examples 1 to 9 and an LED chip set used as a light source were mounted together, and the composite luminescent substrate was lit under normal operating conditions of a display device (e.g., a television), and the luminescent properties of the composite luminescent substrate were measured at different times, with the results shown in fig. 13 to 21.
As can be seen from fig. 13 to 21, the light emitting performance of the composite light emitting substrate provided by the present invention remains almost unchanged after 2000 hours of continuous operation, which illustrates that the light emitting performance of the composite light emitting substrate provided by the present invention is stable.
According to the embodiment, the composite luminescent substrate provided by the utility model has stable luminescent performance, simple preparation method and low cost, and is suitable for industrial production.
Although the above embodiments have been described in detail, it is only a part of the embodiments of the present invention, rather than all embodiments, and other embodiments can be obtained without inventive step according to the present embodiments.
Claims (10)
1. A composite light-emitting substrate is characterized by comprising a main body layer, a light-emitting layer and a surface protection layer which are sequentially laminated; the size of the light-emitting layer is smaller than that of the main body layer and the surface protection layer, and the edge of the light-emitting layer is not in contact with the outside.
2. The composite light emitting substrate of claim 1, wherein the edge of the light emitting layer is spaced from the edge of the host layer by 0.2 to 10 mm.
3. The composite light emitting substrate of claim 1, wherein an ith barrier layer and/or a diffusion layer is disposed between the host layer and the light emitting layer.
4. The composite light emitting substrate of claim 3, wherein when an ith barrier layer and a diffusion layer are disposed between the host layer and the light emitting layer, the ith barrier layer is in contact with the light emitting layer and the diffusion layer is in contact with the host layer.
5. The composite light emitting substrate of claim 1, 3 or 4, wherein a second barrier layer is disposed between the light emitting layer and the surface protective layer.
6. The composite light emitting substrate of claim 5, wherein the bulk layer has a thickness of 0.8 to 1.5 mm;
the thickness ratio of the luminous layer to the main body layer is (0.02-0.03): 1;
the thickness ratio of the surface protection layer to the main body layer is (0.05-2.0): 1.
7. the composite light emitting substrate of claim 6, wherein the thickness ratio of the ith barrier layer to the host layer is (0.04-0.08): 1, the thickness ratio of the II th isolation layer to the main body layer is (0.04-0.08): 1.
8. the composite light emitting substrate according to claim 6 or 7, wherein the thickness ratio of the diffusion layer to the bulk layer is (0.02 to 0.4): 1.
9. the composite light-emitting substrate according to claim 6 or 7, wherein the light-emitting layer contains a light-emitting material, and the light-emitting material comprises an inorganic light-emitting material or an organic light-emitting material.
10. The composite light emitting substrate according to claim 6 or 7, wherein the material forming the body layer comprises polycarbonate, polyethylene terephthalate, polyvinyl chloride, polystyrene, or polymethyl methacrylate;
the forming material of the isolation layer comprises curing glue;
the forming material of the surface protection layer comprises epoxy resin or silica gel;
the diffusion layer comprises an optical diffusion plate or a polymer composite plate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110311055A (en) * | 2019-07-26 | 2019-10-08 | 马鞍山微晶光电材料有限公司 | A kind of recombination luminescence substrate and its preparation method and application |
| CN111370557A (en) * | 2020-03-18 | 2020-07-03 | 马鞍山微晶光电材料有限公司 | Method for preparing optical substrate by multilayer coextrusion and optical substrate |
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2019
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110311055A (en) * | 2019-07-26 | 2019-10-08 | 马鞍山微晶光电材料有限公司 | A kind of recombination luminescence substrate and its preparation method and application |
| CN111370557A (en) * | 2020-03-18 | 2020-07-03 | 马鞍山微晶光电材料有限公司 | Method for preparing optical substrate by multilayer coextrusion and optical substrate |
| CN111370557B (en) * | 2020-03-18 | 2021-02-23 | 马鞍山微晶光电材料有限公司 | Method for preparing optical substrate by multilayer coextrusion and optical substrate |
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