CN209949566U

CN209949566U - PCB board copper deposition glue removing device

Info

Publication number: CN209949566U
Application number: CN201821995045.7U
Authority: CN
Inventors: 齐鹏
Original assignee: Huizhou Xinhua Mei Machinery Co Ltd
Current assignee: Huizhou Xinhua Mei Machinery Co Ltd
Priority date: 2018-11-29
Filing date: 2018-11-29
Publication date: 2020-01-14
Anticipated expiration: 2028-11-29

Abstract

The utility model provides a PCB copper deposition and glue removal device, which comprises a frame, a hoisting component arranged at the upper end of the frame, a charging component arranged below the hoisting component, and a soaking pool arranged on the frame and with the lower part of the charging component; water circulation mechanisms are symmetrically arranged on two sides of the soaking pool; the water circulation mechanism comprises a water storage tank, a first water pump and a filtering device which are sequentially communicated with the water storage tank and the soaking pool through pipelines, and a second water pump which is arranged at the upper end of the water storage tank and is communicated with the water storage tank and the soaking pool through pipelines; the inner wall of the upper end of the soaking pool is symmetrically provided with water spraying components, and the water spraying components are connected with a water outlet of the second water pump through a pipeline; the water circulation mechanism filters and reflows the solution soaked in the PCB, and sprays the solution from the water spraying assembly to carry out secondary washing, copper deposition and glue removal on the PCB on the charging assembly; the copper deposition and glue removal process of the PCB is more thorough and clean.

Description

PCB board copper deposition glue removing device

Technical Field

The utility model relates to a technical field of PCB production, concretely relates to heavy copper of PCB board removes mucilage binding and puts.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components.

The manufacturing process of the existing PCB comprises the following steps: cutting → inner layer pattern → inner layer etching → pressing → drilling → copper deposition comprises the glue residue removing process → whole plate electroplating → outer layer pattern → pattern electroplating → outer layer etching → solder resist → character → surface treatment → forming → final inspection → packaging, wherein the copper deposition is used for forming a conductive copper layer in the hole, so that the lines between the layers are communicated, and the hole wall needs to be subjected to the glue residue removing process before the copper deposition; however, the reaction in the step of removing the skim latex is often incomplete, which results in incomplete removal of the skim latex.

Therefore, the problem is improved, and the copper deposition and glue removal device for the PCB is provided.

SUMMERY OF THE UTILITY MODEL

In order to overcome prior art's not enough, the utility model provides a PCB board sinks copper and removes mucilage binding and puts, it is provided with water cycle machine and water spray assembly, and this water cycle mechanism filters the backward flow to the solution in the soaking bath that has soaked the PCB board to carry out the secondary from this water spray assembly with solution blowout to the PCB board and wash and sink copper and remove gluey, make remaining copper glue more fully on the PCB board, thoroughly remove.

The technical scheme of the utility model as follows: a PCB copper deposition and glue removal device comprises a rack, a hoisting assembly arranged at the upper end of the rack, a charging assembly arranged below the hoisting assembly, and a soaking pool arranged on the rack and provided with the charging assembly; water circulation mechanisms are symmetrically arranged on two sides of the soaking pool; the water circulation mechanism comprises a water storage tank, a first water pump and a filtering device which are sequentially communicated with the water storage tank and the soaking pool through pipelines, and a second water pump which is arranged at the upper end of the water storage tank and is communicated with the water storage tank and the soaking pool through pipelines; the inner wall of the upper end of the soaking pool is symmetrically provided with water spraying components, and the water spraying components are connected with a water outlet of the second water pump through a pipeline; and the water circulation mechanism filters and reflows the solution soaked in the PCB, and sprays the solution from the water spraying assembly to perform secondary washing on the PCB on the charging assembly.

Preferably, the water spraying assembly comprises a linear module arranged on the soaking pool, a water spraying head arranged on a sliding block of the linear module, and an extension pipe communicated with the water spraying head; and spraying solution to the PCB through the transverse reciprocating motion of the water spraying head of the linear module belt.

Preferably, a water outlet of the second water pump is communicated with a first connector of a Y-shaped quick connector through a water pipe, and a second connector and a third connector of the Y-shaped quick connector are communicated with the upper end of the soaking pool through water pipes; the second interface is communicated with the telescopic pipe, and an electric switch water valve is arranged on the third interface.

Preferably, the water inlet of the second water pump is communicated with one end of a 7-shaped pipeline, and the other end of the 7-shaped pipeline extends into the bottom end of the interior of the water storage tank.

Preferably, the inner bottom end of the soaking pool is provided with a conical bottom part, and the conical bottom part is used for gathering the deposited copper; the bottom of conical bottom is provided with a discharge gate, be provided with the pipeline switch that this discharge gate of control opened and close on the discharge gate.

Preferably, the water outlet of the first water pump is communicated with the water storage tank through a pipeline, the water inlet of the first water pump is communicated with the water outlet of the filtering device, and the water inlet of the filtering device is communicated with the lower end of the soaking pool.

Preferably, at least three filter layers are arranged in the filter device, and the filter layers are sequentially obliquely arranged along the water inlet to the water outlet of the filter device.

Preferably, the filter layer is three layers; the first filter layer is formed by laminating three pieces of spraying diamond-shaped stainless steel nets, the second filter layer is formed by laminating a plurality of pieces of nylon nets, and the third filter layer is formed by laminating four pieces of chemical fiber core materials.

Preferably, the hoisting assembly comprises hoisting fixed plates symmetrically arranged at two sides of the soaking pool, a slide rail arranged on the hoisting fixed plates in a vertical horizontal plane, a lifting motor arranged at the top end of the slide rail, and a first support rod arranged in a vertical direction to the slide rail and fixedly connected with a slide block of the slide rail; the lifting motor is connected with a lifting rope pulley assembly, and the lifting motor is in driving connection with the first supporting rod through the lifting rope pulley assembly and drives the first supporting rod to slide on the sliding rail.

Preferably, the material loading assembly comprises a connecting rod connected with the first supporting rod, a second supporting rod connected with the connecting rod, and a material rack connected with the second supporting rod and used for placing the PCB.

The utility model has the advantages that: the utility model discloses a be provided with the hydrologic cycle machine with the water spray assembly, hydrologic cycle mechanism is to having soaked the PCB board solution in the soaks the pond filters the backward flow, and follows the water spray assembly is right with solution blowout PCB board on the charging components carries out the secondary and washes and sink the copper and remove glue, makes remaining copper glue more fully, thoroughly remove on the PCB board. The inside bottom of fermentation vat sets up to conical bottom, and this conical bottom is favorable to heavy copper waste residue to be collected, and follows the discharge gate takes out heavy copper waste residue, retrieves heavy copper waste residue and recycles, and is convenient for the collection and the clearance of heavy copper waste residue.

Description of the drawings:

FIG. 1 is a schematic structural view of the PCB copper deposition and glue removal device of the present invention;

FIG. 2 is an enlarged view of the PCB copper deposition and glue removal device at A in FIG. 1;

FIG. 3 is an enlarged view of the PCB copper deposition and glue removal device at B in FIG. 1;

fig. 4 is the utility model discloses a PCB board copper deposition removes water spray assembly schematic diagram of mucilage binding and puts.

Description of reference numerals:

the device comprises a rack 1, a hoisting component 2, a hoisting fixing plate 21, a slide rail 22, a lifting motor 23, a first supporting rod 24, a hoisting rope pulley component 25, a charging component 3, a connecting rod 31, a second supporting rod 32, a material rack 33, a soaking pool 4, a conical bottom 41, a discharging port 42, a pipeline switch 43, a water circulation mechanism 5, a water storage tank 51, a first water pump 52, a filtering device 53, a second water pump 54, an electric switch water valve 55, a filtering layer 56, a first filtering layer 561, a second filtering layer 562, a third filtering layer 563, a water spraying component 6, a linear module 61, a water spraying head 62 and an extension pipe 63.

Detailed Description

In order to make the utility model discloses a utility model purpose, technical scheme and technological effect are more clear and are understood, and it is right to combine specific embodiment below the utility model discloses do further explanation. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1, the PCB copper deposition and glue removal device comprises a frame 1, a hoisting component 2 arranged at the upper end of the frame 1, a charging component 3 arranged below the hoisting component 2, and a soaking pool 4 arranged on the frame 1 and below the charging component 3. And water circulation mechanisms 5 are symmetrically arranged at two sides of the soaking pool 4. The water circulation mechanism 5 comprises a water storage tank 51, a first water pump 52 and a filtering device 53 which are communicated with the water storage tank 51 and the soaking pool 4 through pipelines in sequence, and a second water pump 54 which is arranged at the upper end of the water storage tank 51 and is communicated with the water storage tank 51 and the soaking pool 4 through pipelines. The inner wall of the upper end of the soaking pool 4 is symmetrically provided with water spraying components 6, and the water spraying components 6 are connected with the water outlet of the second water pump 54 through a pipeline. The water circulation mechanism 5 filters and reflows the solution in the soaking pool 4 soaked with the PCB, and sprays the solution from the water spraying assembly 6 to carry out secondary washing on the PCB on the charging assembly 3 for copper deposition and glue removal, so that the residual copper glue on the PCB is more fully removed.

Referring to fig. 1, the hoisting assembly 2 includes hoisting fixing plates 21 symmetrically disposed at two sides of the steeping cistern 4, a slide rail 22 disposed on the hoisting fixing plates 21 in a vertical horizontal plane, a lifting motor 23 disposed at the top end of the slide rail 22, and a first support rod 24 disposed perpendicular to the slide rail 22 and fixedly connected to a slide block of the slide rail 22. The lifting motor 23 is connected with a lifting rope pulley assembly 25 (in the prior art, such as a structure in a hoist), and the lifting motor 23 is connected with the first support rod 24 through the driving of the lifting rope pulley assembly 25, and drives the first support rod 24 to slide on the slide rail 22, so as to drive the lifting movement of the charging assembly 3. The hoisting component 2 is a hoisting framework with two symmetrical sides, so that the process of hoisting and pulling the charging component 3 is carried out more stably.

Referring to fig. 1, the charging assembly 3 includes a connecting rod 31 connected to the first support rod 24, a second support rod 32 connected to the connecting rod 31, and a rack 33 connected to the second support rod 32 for placing PCB boards. The material rack 33 can extend into the soaking pool 4 under the driving of the lifting motor 23, and the copper deposition and glue removal process is carried out on the PCB in the material rack 33.

Referring to fig. 1 and 3, the inner bottom end of the soaking tank 4 is provided with a conical bottom 41, and the conical bottom 41 is used for the accumulation of the precipitated copper. And the conical bottom 41 is beneficial to collecting the copper precipitation slag on the conical bottom 41 when the copper precipitation slag falls down. The bottom end of the conical bottom 41 is provided with a discharge hole 42, and the discharge hole 42 is provided with a pipeline switch 43 for controlling the opening and closing of the discharge hole 42. When a certain amount of copper is collected on the conical bottom 41, the discharge hole 42 can be opened, the collected copper deposition waste residue is taken out, the copper deposition waste residue is recycled, and the collection and the cleaning of the copper deposition waste residue are convenient.

Referring to fig. 1, a water outlet of the first water pump 52 is communicated with the water storage tank 51 through a pipeline, a water inlet of the first water pump 52 is communicated with a water outlet of the filtering device 53, and a water inlet of the filtering device 53 is communicated with the lower end of the soaking pool 4. At least three filter layers 56 are arranged in the filter device 53, and the filter layers 56 are sequentially arranged along the water inlet to the water outlet of the filter device 53 in an inclined manner. The filter layer 56 is three layers; the first filter layer 561 is formed by laminating three pieces of diamond-shaped sprayed stainless steel, the second filter layer 562 is formed by laminating a plurality of pieces of nylon, and the third filter layer 563 is formed by laminating four pieces of chemical fiber core material. The filtering device 53 filters the incompletely reacted solution in the soaking pool 4 and then reflows the solution into the water storage tank 51, so that the solution can be recycled for many times, and the solution utilization rate is improved.

Referring to fig. 1 and 2, the inlet of the second water pump 54 communicates with one end of a "7" shaped pipe, and the other end of the "7" shaped pipe extends into the inner bottom end of the water storage tank 51. The water outlet of the second water pump 54 is communicated with a first interface of a Y-shaped quick coupling through a water pipe, and a second interface and a third interface of the Y-shaped quick coupling are communicated with the upper end of the soaking pool 4 through water pipes. An electric switch water valve 55 is arranged on the third interface, and the electric switch water valve 55 is controlled to be opened and closed through the electric switch water valve 55. The refreshing solution can be rapidly added into the soaking pool 4 through the third interface of the Y-shaped quick coupling.

Referring to fig. 2-3, the water spraying assembly 6 includes a linear module 61 installed on the inner wall of the soaking pool 4, a water spraying head 62 disposed on a sliding block of the linear module 61, and a telescopic pipe 63 communicating with the water spraying head 62; one end of the extension tube 63 is communicated with the sprinkler head 62, and the other end of the extension tube 63 is communicated with a second interface of the Y-shaped quick coupling. Through straight line module 61 drives the horizontal reciprocating motion of sprinkler head 62 spouts the solution to the PCB board, right the PCB board in the work or material rest 33 carries out the secondary hydrojet and sinks the copper and removes gluey, makes remaining copper glue on the PCB board more fully remove, and the copper that sinks removes gluey process more thoroughly, goes on cleanly.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of the ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, its framework form can be nimble changeable, can derive series of products. But merely as a matter of simple deductions or substitutions, should be considered as belonging to the scope of patent protection of the present invention as determined by the claims submitted.

Claims

1. A PCB copper deposition and glue removal device comprises a rack (1), a hoisting assembly (2) arranged at the upper end of the rack (1), a charging assembly (3) arranged below the hoisting assembly (2), and a soaking pool (4) arranged on the rack (1) and provided with the charging assembly (3); the device is characterized in that water circulation mechanisms (5) are symmetrically arranged on two sides of the soaking pool (4); the water circulation mechanism (5) comprises a water storage tank (51), a first water pump (52) and a filtering device (53) which are communicated with the water storage tank (51) and the soaking pool (4) through pipelines in sequence, and a second water pump (54) which is arranged at the upper end of the water storage tank (51) and is communicated with the water storage tank (51) and the soaking pool (4) through pipelines; the inner wall of the upper end of the soaking pool (4) is symmetrically provided with water spraying components (6), and the water spraying components (6) are connected with a water outlet of the second water pump (54) through a pipeline; and the water circulation mechanism (5) filters and refluxes the solution soaked in the PCB, and sprays the solution from the water spraying assembly (6) to wash the PCB on the material loading assembly (3) for the second time.

2. The PCB copper deposition and glue removal device of claim 1, wherein the water spray assembly (6) comprises a linear module (61) installed on the soaking pool (4), a water spray head (62) arranged on a sliding block of the linear module (61), and a telescopic pipe (63) communicated with the water spray head (62); the straight line module (61) drives the water spray head (62) to transversely reciprocate to spray solution on the PCB.

3. The PCB copper deposition and glue removal device of claim 2, wherein a water outlet of the second water pump (54) is communicated with a first interface of a Y-shaped quick coupling through a water pipe, and a second interface and a third interface of the Y-shaped quick coupling are communicated with the upper end of the soaking pool (4) through water pipes; the second interface is communicated with the telescopic pipe (63), and an electric switch water valve (55) is arranged on the third interface.

4. The PCB copper deposition and glue removal device of claim 3, wherein the water inlet of the second water pump (54) is communicated with one end of a 7-shaped pipe, and the other end of the 7-shaped pipe extends into the inner bottom end of the water storage tank (51).

5. The PCB copper deposition and glue removal device of claim 1, wherein the inner bottom end of the soaking pool (4) is provided with a conical bottom (41), and the conical bottom (41) is used for the aggregation of the deposited copper; the bottom of the conical bottom (41) is provided with a discharge hole (42), and a pipeline switch (43) for controlling the opening and closing of the discharge hole (42) is arranged on the discharge hole (42).

6. The PCB copper deposition and glue removal device of claim 1, wherein a water outlet of the first water pump (52) is communicated with the water storage tank (51) through a pipeline, a water inlet of the first water pump (52) is communicated with a water outlet of the filtering device (53), and a water inlet of the filtering device (53) is communicated with the lower end of the soaking pool (4).

7. The PCB copper deposition and glue removal device of claim 6, wherein at least three filter layers (56) are arranged in the filter device (53), and the filter layers (56) are sequentially arranged along the water inlet to the water outlet of the filter device (53) in an inclined manner.

8. The PCB copper deposition and glue removal device of claim 7, wherein the filter layer (56) is three layers; the first filter layer (561) is formed by laminating three pieces of diamond-shaped sprayed stainless steel meshes, the second filter layer (562) is formed by laminating a plurality of pieces of nylon meshes, and the third filter layer (563) is formed by laminating four pieces of chemical fiber core materials.

9. The PCB copper deposition and glue removal device of claim 1, wherein the hoisting assembly (2) comprises hoisting fixing plates (21) symmetrically arranged at two sides of the soaking pool (4), a slide rail (22) vertically and horizontally arranged on the hoisting fixing plates (21), a lifting motor (23) arranged at the top end of the slide rail (22), and a first support rod (24) arranged vertically to the slide rail (22) and fixedly connected with a slide block of the slide rail (22); the lifting motor (23) is connected with a lifting rope pulley assembly (25), and the lifting motor (23) is in driving connection with the first supporting rod (24) through the lifting rope pulley assembly (25) and drives the first supporting rod (24) to slide on the sliding rail (22).

10. The PCB copper deposition and glue removal device of claim 9, wherein the loading assembly (3) comprises a connecting rod (31) connected with the first supporting rod (24), a second supporting rod (32) connected with the connecting rod (31), and a rack (33) connected with the second supporting rod (32) and used for placing the PCB.