CN209949562U

CN209949562U - PCB module and vehicle DC converter

Info

Publication number: CN209949562U
Application number: CN201920217164.8U
Authority: CN
Inventors: 孙艳琪; 孙辉; 柳朝华; 王永山; 高喆; 张博; 孙林; 林准
Original assignee: United Automotive Electronic Systems Co Ltd
Current assignee: United Automotive Electronic Systems Co Ltd
Priority date: 2019-02-20
Filing date: 2019-02-20
Publication date: 2020-01-14
Anticipated expiration: 2029-02-20

Abstract

The utility model provides a PCB module and automobile-used DC converter, the PCB module includes at least one current-carrying reinforcing district, still includes the PCB board and pastes the dress through surface mounting mode a plurality of current-carrying parts on PCB board surface, current-carrying part with the line electricity is walked to the inside in current-carrying reinforcing district. The PCB module may further include a cooling component disposed on the second surface of the PCB board and a thermal via disposed on the PCB board to further facilitate heat dissipation from the PCB board. The vehicle direct current converter comprises the PCB module. The utility model provides a PCB module and automobile-used DC converter, through the local current-carrying capacity of reinforcing PCB board, and improve the heat-sinking capability of PCB board when passing through the heavy current has solved the cost that adopts thick copper PCB board scheme to arouse among the prior art and has risen, the not enough scheduling problem of heat dissipation, in addition, still can reach and simplify production technology, optimizes the effect that current-carrying parts and components and parts were arranged.

Description

PCB module and vehicle DC converter

Technical Field

The utility model relates to a PCB technical field especially relates to a PCB module and automobile-used direct current converter.

Background

A printed Circuit board (pcb) is also called a pcb, and is mainly designed in a layout design to provide electrical connection of electronic components. The PCB board can greatly reduce errors of wiring and assembly, and improve the automation level and the production labor rate. After the electronic equipment adopts the PCB, because of the consistency of the similar PCBs, the error of manual wiring can be avoided, the automatic insertion or mounting, the automatic tin soldering and the automatic detection of electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient. Due to its advantages, PCB boards are now widely used for component integration.

In the field of automotive manufacturing, a large number of PCB boards are also used. Taking a vehicle dc converter as an example, the dc converter is an electromechanical device for converting electric energy in a vehicle, and converts between dc power supplies with different voltages to achieve the effects of improving the efficiency of an engine and saving the fuel consumption of the vehicle. During conversion, a direct current power supply with relatively large voltage is converted into a direct current power supply with relatively small voltage through a Buck conversion circuit (Buck); a relatively low voltage dc power supply is converted into a relatively high voltage dc power supply by a Boost conversion circuit (Boost) function. These circuits are integrated in the PCB of the dc converter, and the PCB needs to convert dc power supplies with different voltages, so that a large current needs to be operated in a local circuit.

The PCB board usually adopts the mode of thick copper PCB board to increase the current carrying capacity. The thick copper PCB (with the inner copper layer being as thick as 3 ounces or 6 ounces) has larger current-carrying capacity than the common PCB (with the inner copper layer being as thick as 1 ounce), but with the increase of current, the current-carrying capacity of the inner copper layer of the PCB is limited, and the current-carrying capacity can be improved only by further increasing the thickness of the inner copper layer. However, in the PCB, the increase of the thickness of the inner copper layer causes a significant increase in cost. And only partial regional inlayer is walked on the PCB board and is had heavy current to pass through, and the increase of whole copper thickness can cause the waste in the cost. In addition, when the PCB board inlayer passes through heavy current, it is serious to generate heat, makes the PCB board have the risk of excess temperature.

Disclosure of Invention

The utility model provides a PCB module can increase the local current-carrying capacity of PCB board to the volume of module is less, and the cost is lower.

In order to achieve the above object, the present invention provides a PCB module, including at least one current-carrying enhancement region, further comprising:

the PCB comprises an internal wiring of the current-carrying enhancement area; and

and the current-carrying components are attached to the surface of the PCB in a surface mounting mode and are electrically connected with the internal wiring of the current-carrying enhancement region.

Optionally, the current-carrying component is a copper bar.

Optionally, the PCB has a first surface and a second surface opposite to the first surface, and the plurality of current-carrying components are attached to the first surface, attached to the second surface, or partially attached to the first surface and partially attached to the second surface.

Optionally, when the plurality of current-carrying components are partially attached to the first surface and partially attached to the second surface, at least one current-carrying component is disposed on each of the first surface and the second surface in at least one current-carrying enhancement region.

Optionally, the PCB module further includes:

and the cooling component is arranged on one side of the second surface of the PCB through a heat-conducting medium, and when the current-carrying components are partially or completely attached to the second surface, the cooling component also covers the current-carrying components attached to the second surface through the heat-conducting medium.

Optionally, the heat conducting medium is heat conducting glue.

Optionally, the cooling part further comprises a cooling main body and a plurality of heat dissipation columns which are connected with the cooling main body and distributed at intervals, the cooling main body is located on one side, close to the PCB, of the cooling part, and the heat dissipation columns are located on one side, far away from the PCB, of the cooling part.

Optionally, the surface of the cooling body facing the PCB board has a plurality of grooves to accommodate current carrying components attached to the second surface.

Optionally, the cooling component further includes a cooling pipe disposed around the heat dissipation pillar, and the cooling pipe is used for circulating a cooling medium.

Optionally, a plurality of thermal vias are disposed in the PCB, and the thermal vias penetrate through the PCB and are distributed around the plurality of current-carrying components.

The utility model discloses still provide an automobile-used direct current converter in addition, including above-mentioned PCB module.

The utility model provides a PCB module includes at least one current-carrying reinforcing district, still includes the PCB board and pastes the dress through surface mounting mode a plurality of current-carrying parts on PCB board surface, current-carrying parts with the line electricity is walked to the inside in current-carrying reinforcing district and is connected. On one hand, under the condition that the PCB has the same current carrying capacity, the PCB module reduces the loss of current carrying components compared with a thick copper PCB scheme, and effectively reduces the cost; on the other hand, an additional connecting structure is not required to be designed on the current-carrying component and the PCB, so that the additional volume generated by welding pins or screwing is eliminated, and the product volume is reduced; on the other hand, the mounting of the current-carrying component and the mounting of the component can be carried out simultaneously, so that the production procedures are reduced, the production process is optimized, and the production efficiency is improved.

In addition, the PCB module provided by the present invention may further include a cooling component and a thermal via hole, wherein the cooling component is disposed on the second surface of the PCB board, and the cooling component may be disposed with a groove covering the current-carrying component attached to the second surface, and the cooling component may further include a cooling pipe disposed around the heat-dissipating column and through which a cooling medium flows; the thermal vias extend through the PCB board and are distributed around the plurality of current carrying components. On one hand, the arrangement of the cooling component and the thermal via hole enhances the heat dissipation capacity of the PCB template to prevent the PCB from overheating, particularly, when the cooling component covers the current-carrying component, the heat dissipation distance of the current-carrying component is further shortened, more effective heat dissipation can be realized, and furthermore, the heat dissipation rate can be further improved through a cooling pipeline which can be selected on the cooling component and is communicated with a cooling medium, so that the PCB module can obtain better heat dissipation effect through the comprehensive effect of the characteristics; on the other hand, the grooves formed in the cooling component can accommodate not only the current-carrying component but also the components, so that the blockage of the cooling component on the current-carrying component and the components in space is eliminated, the arrangement mode of the current-carrying component and the components is more flexible, and the arrangement space is larger.

Drawings

Fig. 1 is a schematic diagram of a PCB module according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view of a current carrying component and a cooling component in a PCB module according to an embodiment of the present invention.

Description of reference numerals:

10-a PCB board; 20-a current-carrying component; 30-a cooling member; 40-heat conducting medium; 101 — a first surface; 102 — a second surface; 103-thermal vias; 301 — cooling the body; 302-heat-dissipating stud; 303-cooling the pipeline; 304-groove.

Detailed Description

The following description of the embodiments of the present invention will be described in more detail with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.

As described in the background art, when the current carrying capability is increased by using a thick copper PCB in the prior art, the cost is increased, and the thick copper layer is present in the inner layer of the PCB, which causes the PCB to generate heat seriously when passing a large current, so that the PCB has a risk of over-temperature.

In order to solve the technical problem, the utility model provides a PCB module pastes dress current-carrying part in PCB board surface part through surface mounting mode, not only can improve the local current-carrying capacity of PCB board, can also reduce cost, reduces the product volume. Further, in order to improve the heat dissipation capability of the PCB module when passing through a large current, the PCB module of the present invention may further include a cooling member and a thermal via hole.

Fig. 1 is a schematic diagram of a PCB module according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of a current-carrying component and a cooling component in the PCB module according to an embodiment of the present invention. Embodiments of the present invention are described below with reference to fig. 1 and 2.

Referring to fig. 1 and 2, an embodiment of the present invention provides a PCB module, including at least one current-carrying enhancement region, further including: a PCB board 10 and a number of current carrying components 20.

The PCB 10 may be a normal (or standard) PCB, the material of the inner trace may be copper, specifically, the inner copper may include one or more layers of copper foil, the inner copper thickness (i.e., the thickness of the inner trace) may be designed according to performance requirements, for example, 0.5 ounce, 1 ounce, 2 ounce, etc., in this embodiment, the inner copper thickness of the PCB 10 is, for example, about 1 ounce (ounce means the thickness of 1 ounce copper evenly laid on an area of 1 square foot), and the PCB 10 has a first surface 101 and a second surface 102 opposite to the first surface 101. The first surface 101 in this embodiment is, for example, a surface of a single-sided mounted PCB for mounting components, and the current-carrying enhancement region is, for example, a region through which a large current needs to pass, such as a region on the PCB of a 48V dc converter for a vehicle where a conversion circuit operates.

The PCB board 10 includes an inner trace, and the inner trace of the current carrying enhancement region has, for example, a first current carrying end and a second current carrying end at two ends of the inner trace. The first current carrying end and the second current carrying end both extend to the first surface 101 of the PCB board 10 or both extend to the second surface 102 of the PCB board, or both extend to the first surface 101 and the second surface 102 of the PCB board through electrical connections. And the first current-carrying end and the second current-carrying end extend to the first surface 101 of the PCB or/and the first surface 101, and pads are arranged at the positions for mounting the current-carrying component 20.

A plurality of current-carrying components 20 are mounted on the Surface of the PCB board 10 by Surface Mount Technology (SMT) and electrically connected to the inner traces of the current-carrying enhancement region. The surface mount technology is a circuit mounting technology in which a chip component without leads or short leads is mounted on a surface of a PCB or other substrate and then soldered and assembled by a method such as reflow soldering or dip soldering. Compared with the mode of selectively welding or screwing components, the surface mounting technology is not needed to design additional connecting structures on the components and the PCB when the components are assembled, and the automation degree is high, so that the electronic products produced by the surface mounting technology have the characteristics of small volume, high assembly density, high production efficiency and the like. Therefore, the embodiment of the present invention utilizes the surface mounting method to assemble the current carrying component 20, on one hand, the product volume can be reduced; on the other hand, the mounting of the current-carrying component 20 and the mounting of the component can be performed simultaneously, so that the production processes are reduced, the production process is optimized, and the production efficiency is improved.

Specifically, two ends of each current carrying component 20 are connected to pads extending from the first current carrying end and the second current carrying end, respectively, in a surface mount manner. The current-carrying component 20 in this embodiment is preferably a copper bar, and when the copper bar is mounted by using a surface mounting method, the copper bar may be mounted on the surface of the current-carrying enhancement region of the PCB 10 by using, for example, a solder paste.

Specifically, the mounting manners of the current-carrying components 20 on the PCB 10 may be various, for example, all the current-carrying components 20 may be mounted on the first surface 101 of the PCB 10 by a surface mounting manner, or all the current-carrying components 20 may be mounted on the second surface 102 by a surface mounting manner, or a part of the current-carrying components 20 may be mounted on the first surface 101, and the rest of the current-carrying components 20 may be mounted on the second surface 102.

Referring to fig. 2, when a larger current needs to be passed through or a winding needs to be performed in a certain current-carrying enhancement region, the current-carrying components 20 may be symmetrically disposed on both sides of the PCB board 10, that is, at least one current-carrying component 20 is disposed on each of the first surface 101 and the second surface 102 in the current-carrying enhancement region. For example, when the current-carrying capacity required by a current-carrying enhancement region is not achieved by arranging one current-carrying component 20, if the current-carrying components 20 are continuously mounted on the same side, a lot of space is wasted, the volume of the PCB 10 is increased, and the arrangement of adjacent components is affected, and at this time, if the current-carrying components 20 are symmetrically mounted on the other side of the PCB 10, the current-carrying capacity of the current-carrying enhancement region can be further improved without affecting the arrangement of the components. Furthermore, the current-carrying components 20 respectively located on the first surface 101 and the second surface 102 may also be integrated into a whole according to design requirements, such as a coil of an inductor.

In addition, since the current-carrying component 20 is added to the PCB 10, the heat dissipation effect of the current-carrying component 20 is better than that of a thick copper layer inside a thick copper PCB compared to a thick copper PCB. In order to further optimize the heat dissipation effect of the PCB board 10, so as to optimize the performance of the PCB board 10 when passing a large current, the embodiment of the present invention provides a PCB module that can further include a cooling component 30.

Specifically, the cooling member 30 may be disposed on the first surface 101 or the second surface 102 of the PCB 10 through a heat conducting medium 40 (e.g., a heat conducting glue), and the embodiment is exemplified to be disposed on one side of the second surface 102.

In this embodiment, the cooling member 30 is used to dissipate heat of the current-carrying member 20, so as to prevent the PCB 10 from overheating when a large current passes through the current-carrying enhancement region, and of course, the cooling member 30 may also help the components and inner copper of the PCB 10 to dissipate heat. The cooling member 30 may include a cooling body 301 and a plurality of heat dissipation pillars 302 connected to the cooling body 301, wherein the cooling body 301 is located on a side of the cooling member 30 close to the PCB 10, and the heat dissipation pillars 302 are located on a side of the cooling member 30 away from the PCB 10. Referring to fig. 2, the heat-dissipating stud 302 can increase the heat-dissipating surface and enhance the heat-dissipating effect. The heat dissipation columns 302 can dissipate heat through the circulation of air among the heat dissipation columns; a plurality of heat dissipation pipes 303 can be further arranged around the heat dissipation columns 302, even if the heat dissipation pipes 303 pass through gaps between adjacent heat dissipation columns 302, a flowing cooling medium flows through the inside of the heat dissipation pipes 303, the cooling medium can absorb the heat of the heat dissipation columns 302 to help heat dissipation, and when the heat dissipation pipes 303 are arranged around the heat dissipation columns 302, the cooling rate is higher than that of the case of heat dissipation by air. The cooling medium is preferably cooling water. In particular, the heat dissipation pipes 303 may be disposed in different regions, for example, the heat dissipation pipes 303 through which a cooling medium is introduced are disposed in a region with a high current-carrying capacity requirement to dissipate heat, and the heat dissipation pipes 303 are disposed in a region with a low current-carrying capacity requirement to dissipate heat through air. Through reasonable division and combination, the cooling part 30 can achieve the best heat dissipation effect at lower cost.

The arrangement of the current-carrying member 20 and the cooling member 30 of the present embodiment on the PCB board 10 may include the following cases.

When the plurality of current-carrying members 20 are all attached to the first surface 101, the cooling member 30 covers the entire second surface 102 with the heat transfer medium 40. At this time, the heat of the current-carrying member 20 attached to the first surface 101 is transferred to the heat transfer medium 40 through the PCB board 10, and then transferred to the cooling member 30 through the heat transfer medium 40.

When the current-carrying components 20 are partially or completely attached to the second surface 102, the cooling component 30 also covers the current-carrying components 20 attached to the second surface 102 through the heat-conducting medium 40. Preferably, the cooling body 301 may further have a plurality of grooves 304 on a surface facing the PCB main board 10 to accommodate the current-carrying component 20 attached to the second surface 102. A single recess 304 may accommodate one or more current carrying components 20 depending on the location and density of distribution of the current carrying components 20. For example, in regions where the current carrying enhancement regions are densely distributed, the recesses 304 may be sized and positioned to accommodate all of the current carrying members 20 of the region; whereas for regions where the current carrying enhancement region exists relatively isolated, the recesses 304 may be sized and positioned to contain only a single current carrying member 20 to simplify the number and manner of formation of recesses 304. Further, the groove 304 may be formed by machining on the cooling part 30, for example, and may also be formed during the injection molding of the cooling part 30. Particularly, because various components are usually attached to the PCB, the arrangement of the cooling component usually causes a hindrance to the arrangement of the components, so that the components and the cooling component can only be separately arranged on both sides of the PCB, and the cooling component 30 provided by the embodiment of the present invention is provided with a plurality of grooves 304, the grooves 304 are not only limited to accommodating the current carrying component 20, but also can accommodate part of the components of the PCB 10, so that the cooling component 30 no longer restricts the positions where the current carrying component 20 and the components are attached, and thus the arrangement of the current carrying component 20 and the components on both sides of the PCB 10 is more flexible, and the arrangement space is larger; in addition, the heat dissipation distance of the current-carrying component 20 and the component arranged in the groove 304 can be shorter, and the heat dissipation effect is better.

The heat conductive medium 40 may be a heat conductive adhesive, because the heat conductive medium 40 preferably has good heat conductivity, adhesiveness and insulation properties, so as to achieve the functions of good heat conduction, good adhesion with the cooling member 30 and the current carrying member 20, and no influence on the electrical connection on the PCB board 10. Referring to fig. 2, in the area where the current-carrying part 20 is not in contact with the cooling part 30, the heat-conducting medium 40 directly covers the surface of the PCB 10, and bonds the cooling part 30 and the PCB 10 together. In the contact region between the current-carrying component 20 (and the component) and the cooling component 30, the heat-conducting medium 40 covers one side of the current-carrying component 20 (and the component) away from the PCB board 10 and fills the whole groove 301, so as to bond the cooling component 30 and the current-carrying component 20 (and the component).

Furthermore, the embodiment of the present invention provides a PCB module can further include a plurality of thermal vias 103, the thermal vias 103 run through the PCB board 10, which can help the dissipation and transfer of heat. Preferably around the current-carrying part 20 on a different side from the cooling part 30, further for assisting heat dissipation from said current-carrying part 20. The thermal vias 103 may help dissipate heat from the inner copper of the PCB 10 and components on the PCB 10, in addition to the current carrying component 20 on a different side from the cooling component 30.

Referring to fig. 2, the heat dissipation direction is the direction of the arrow. By way of example, when the current-carrying component 20 is attached to the second surface 102, heat on the PCB 10, especially the enhanced current-carrying region, is transferred to the cooling body 301 through the heat-conducting medium 40, and then transferred from the cooling body 301 to the heat-dissipating stud 302 for dissipation or absorption; when the current-carrying component 20 is attached to the first surface 101, heat is transferred from the current-carrying component 20 to the thermal via 103, then from the thermal via 103 to the thermal conductive medium 40, then from the thermal conductive medium 40 to the cooling body 301, and then from the cooling body 301 to the heat dissipation pillar 302 for dissipation or absorption. The components are arranged in the same manner as the current carrying member 20 in terms of heat dissipation. It can be seen that when the current-carrying component 20 is attached to the second surface 102, the heat dissipation path is shorter and the heat dissipation effect is better.

The embodiment of the utility model provides a PCB module adopts the surface mounting mode to be in the current-carrying reinforcing area of PCB board pastes dress current-carrying part to set up cooling part and set up hot via hole in order further to promote on the PCB board at the second surface of PCB board the PCB board heat dissipation can realize following beneficial effect:

the current-carrying component in the embodiment is attached to one end or two ends of the current-carrying enhancement region of the PCB in a surface mounting mode, on one hand, under the condition that the PCB has the same current-carrying capacity, the PCB module reduces the loss of the current-carrying component compared with a thick copper PCB scheme, and effectively reduces the cost; on the other hand, an additional connecting structure is not required to be designed on the current-carrying component and the PCB, so that the additional volume generated by welding pins or screwing is eliminated, and the product volume is reduced; on the other hand, the mounting of the current-carrying component and the mounting of the component can be carried out simultaneously, so that the production procedures are reduced, the production process is optimized, and the production efficiency is improved.

In addition, the PCB module of this embodiment may further include a cooling component and a thermal via hole, on one hand, the arrangement of the cooling component and the thermal via hole enhances the heat dissipation capability of the PCB template to prevent the PCB from overheating, and particularly, when the cooling component covers the current-carrying component, the heat dissipation distance of the current-carrying component is further shortened to achieve more effective heat dissipation, and further, the heat dissipation rate is further increased by a cooling pipe through which a cooling medium flows, which may be selectively installed on the cooling component, and the above-mentioned features are combined to enable the PCB module to obtain better heat dissipation effect; on the other hand, the grooves formed in the cooling component can accommodate not only the current-carrying component but also the components, so that the blockage of the cooling component on the current-carrying component and the components in space is eliminated, the arrangement mode of the current-carrying component and the components is more flexible, and the arrangement space is larger.

The embodiment of the utility model provides a still provide an automobile-used direct current converter, automobile-used direct current converter includes above-mentioned PCB module.

The vehicle direct current converter is an important component in an electric vehicle power system and is an energy conversion bridge when direct current power supplies with different voltages transmit energy mutually. The DC converter functionally includes at least two parts, a connector module and a PCB module. Taking the 48V dc converter for the vehicle as an example, the connector module of the 48V dc converter for the vehicle comprises 3 independent parts of a 48V connector, a 12V connector and a signal connector, which are respectively connected with a 48V circuit, a 12V circuit and a control circuit on a PCB board of the PCB module. Because the direct current conversion is to be performed, the PCB module of the automotive direct current converter generally has at least one current-carrying enhancement region, for example, a current-carrying enhancement region is formed in a conversion circuit region between a 48V circuit and a 12V circuit. On the basis, in order to improve the heat dissipation capacity of the PCB module when the DC converter operates the high-voltage power supply circuit, the PCB module can also comprise a cooling component and a thermal via hole so as to prevent the PCB module from overheating.

The above description is only for the preferred embodiment of the present invention, and not intended to limit the scope of the present invention. Those skilled in the art can make various changes, substitutions and alterations to the technical solutions and technical contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention all fall within the protection scope of the present invention, unless departing from the contents of the technical solution of the present invention.

Claims

1. A PCB module comprising at least one current carrying enhancement region, comprising:

2. The PCB module of claim 1, wherein the current carrying component is a copper bar.

3. The PCB module of claim 1, wherein the PCB board has a first surface and a second surface opposite the first surface, and wherein the plurality of current carrying components are each attached to the first surface, each attached to the second surface, or partially attached to the first surface and partially attached to the second surface.

4. The PCB module of claim 3, wherein the first surface and the second surface are each provided with one of the current-carrying components at least in one of the current-carrying enhancement regions when the plurality of current-carrying components are partially attached to the first surface and partially attached to the second surface.

5. The PCB module of claim 3, further comprising:

6. The PCB module of claim 5, wherein the heat conducting medium is a heat conducting glue.

7. The PCB module of claim 5, wherein the cooling member further comprises a cooling body and a plurality of spaced apart heat-dissipating studs attached to the cooling body, the cooling body being located on a side of the cooling member proximate to the PCB board and the heat-dissipating studs being located on a side of the cooling member distal from the PCB board.

8. The PCB module of claim 7, wherein a surface of the cooling body facing the PCB board has a plurality of grooves to receive current carrying components attached to the second surface.

9. The PCB module of claim 7, wherein the cooling member further comprises a cooling duct disposed around the heat-dissipating stud, the cooling duct for circulating a cooling medium.

10. A PCB module according to any of claims 1 to 9, wherein a plurality of thermal vias are provided in the PCB, the thermal vias extending through the PCB and being distributed around the plurality of current carrying components.

11. A dc converter for a vehicle, comprising a PCB module according to any one of claims 1 to 10.