CN209935363U

CN209935363U - Cleaning device

Info

Publication number: CN209935363U
Application number: CN201920414811.4U
Authority: CN
Inventors: 潘东林; 高英哲; 张文福; 刘家桦; 叶日铨
Original assignee: Huaian Imaging Device Manufacturer Corp
Current assignee: Huaian Imaging Device Manufacturer Corp
Priority date: 2019-03-28
Filing date: 2019-03-28
Publication date: 2020-01-14
Anticipated expiration: 2029-03-28

Abstract

The utility model provides a cleaning device, cleaning device includes: the cleaning device comprises a first cleaning device and a second cleaning device, wherein the first cleaning device comprises a first box body and a driving part connected with the first box body; the first box body comprises a top opening, and the side wall of the first box body is provided with at least one solution spray head and at least one gas spray head; the driving part comprises at least two moving units, and the moving units are used for controlling the displacement of the first box body; the second cleaning equipment comprises a second box body, at least one solution spray head and at least one gas spray head are arranged on the top of the second box body, and the side wall of the second box body is provided with a side wall opening; cleaning a first member to be cleaned entering from the top opening by a first cleaning apparatus, and cleaning a second member to be cleaned entering from the side wall opening by a second cleaning apparatus; the cleaning device can clean different types of parts to be cleaned, reduce pollution to wafers and improve the yield of the wafers.

Description

Cleaning device

Technical Field

The utility model belongs to the semiconductor equipment field relates to a cleaning device.

Background

With the continuous development of semiconductor manufacturing technology, the IC circuit integration level is higher and higher, the critical dimension of the product is gradually reduced, and the requirement for controlling contaminants is stricter and stricter. The wafer must be cleaned before entering each process to remove contaminants such as particles, organics, metals, and native oxides from the wafer surface. Therefore, how to reduce the contamination has become an important part of the development process of semiconductor manufacturing technology.

In the wafer cleaning machine, each robot arm needs to transport the wafer hundreds of times, and during the process of transporting the wafer, relative friction is generated between the wafer and the robot arm, so that pollutants generated by abrasion are remained on the robot arm, or the pollutants exist on the robot arm due to bad environment in the equipment. The partial pollutants may cause the following disadvantages, 1) in the process of transferring the wafer by the mechanical arm, the pollutants are transferred to the next wafer, the pollution range to the wafer is expanded, and the product quality is reduced; 2) the wafer becomes uneven, and uneven stress on the wafer can be caused in the process of transmitting the wafer by the mechanical arm, so that the wafer falls and fragments in the process of transmitting the wafer by the mechanical arm; so that the processed wafer generates secondary pollution and the yield of the wafer is reduced.

Therefore, it is necessary to provide a cleaning device for solving the above problems caused by contaminants on the robot arm.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a cleaning device for solving the above-mentioned problems caused by contaminants on the robot arm in the prior art.

To achieve the above and other related objects, the present invention provides a cleaning device, including:

the cleaning device comprises a first cleaning device and a second cleaning device, wherein the first cleaning device comprises a first box body and a driving part connected with the first box body; the first box body comprises a top opening, and at least one solution spray head and at least one gas spray head are arranged on the side wall of the first box body; the driving part comprises at least two moving units, and the displacement of the first box body is controlled by the moving units; cleaning a first member to be cleaned entering from the top opening by the first cleaning apparatus;

the second cleaning equipment comprises a second box body, at least one solution spray head and at least one gas spray head are arranged on the top of the second box body, and the side wall of the second box body is provided with a side wall opening; cleaning a second member to be cleaned entering from the sidewall opening by the second cleaning device.

Optionally, the solution spray head comprises a nano-atomization spray head.

Optionally, the solution nozzle includes one or a combination of a pure water solution nozzle, an ultrapure water solution nozzle, and a deionized water solution nozzle.

Optionally, the gas shower includes one or a combination of a nitrogen gas shower and an inert gas shower.

Optionally, the solution nozzles and the gas nozzles are respectively distributed at equal intervals.

Optionally, the moving unit comprises one or a combination of a motor, a cylinder and a telescopic rod.

Optionally, the drive member further comprises a rotation unit.

Optionally, the cleaning device further comprises a drainage member connected to the first and second cases.

Optionally, the cleaning device further comprises a controller electrically connected to the first cleaning device and the second cleaning device.

Alternatively, the above cleaning device includes a cleaning device applied to a robot arm in a semiconductor apparatus.

As described above, the cleaning device of the present invention can clean different types of parts to be cleaned by the first cleaning device and the second cleaning device, thereby improving the convenience of operation and expanding the application range; the cleaning time is short, the cleaning efficiency is high, the cleaning effect is good, and no external pollutant is introduced in the cleaning process, so that the pollution to the wafer can be reduced, and the yield of the wafer is improved.

Drawings

Fig. 1a is a schematic top view of a prior art ECO robot.

FIG. 1b is a schematic top view of a Robot arm according to the prior art.

Fig. 2 is a schematic structural diagram of a first cleaning apparatus according to a first embodiment.

Fig. 3 is a schematic structural diagram of a second cleaning apparatus according to the first embodiment.

Fig. 4 is a schematic structural diagram of a cleaning device according to a second embodiment.

Description of the element reference numerals

100. 300 first cleaning device

110. 310 first box

111. 311 side wall of the first housing

112. 312 top opening of first casing

120. 320 drive unit

121. 122, 321, 322 mobile unit

323 rotating unit

130. 230, 330, 430 solution spray head

140. 240, 340, 440 gas shower

150. 250, 350, 450 drainage component

200. 400 second cleaning device

210. 410 second case

211. 411 side wall of the second casing

212. 412 side wall opening of the second box

500 controller

A. B, C path of travel

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 2 to 4. It should be understood that the structure, ratio, size, etc. of the drawings 2 shown in the attached drawings are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any modification of the structure, change of the ratio relation or adjustment of the size should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.

In semiconductor equipment, different types of robots are selected according to specific process requirements to be suitable for production, for example, fig. 1a shows a schematic top view structure diagram of an eco (edge Contact only) robot, which generally performs plane transfer and rotation when grasping a wafer; FIG. 1b illustrates a top view of a Robot Robot, which is typically used to pick up wafers and has a horizontal plane with the wafers, and therefore, to solve the problem of contamination of the Robot, a cleaning device with compatibility is developed to expand the application scope.

Example one

As shown in fig. 2 to 3, the present invention provides a cleaning device, including:

a first cleaning apparatus 100, the first cleaning apparatus 100 including a first housing 110 and a driving part 120 connected to the first housing 110; the first tank 110 includes a top opening 112, and 1 solution nozzle 130 and 1 gas nozzle 140 are disposed on a sidewall 111 of the first tank; the driving part 120 includes 2 moving units, i.e., moving units 121 and 122, and the displacement of the first casing 110 is controlled by the moving units 121 and 122; cleaning a first member to be cleaned entering from the top opening 112 by the first cleaning apparatus 100;

a second cleaning apparatus 200, the second cleaning apparatus 200 comprising a second tank 210, the second tank 210 having 1 solution spray head 230 and 1 gas spray head 240 disposed on a top thereof, a sidewall 211 having a sidewall opening 212; the second member to be cleaned entering from the sidewall opening 212 is cleaned by the second cleaning apparatus 200.

As a further embodiment of this embodiment, the cleaning device includes a cleaning device applied to a robot arm in a semiconductor apparatus, i.e., the first member to be cleaned and the second member to be cleaned include, but are not limited to, a robot arm in a semiconductor apparatus.

Specifically, the first part to be cleaned comprises an ECO mechanical arm, and the second part to be cleaned comprises a Robot mechanical arm; since the ECO Robot generally requires a translational and a rotational motion, the first housing 110 having the top opening 112 may be used to accommodate the ECO Robot, and the driving unit 120 may be used to change the displacement of the first housing 110, thereby cleaning the ECO Robot to remove contaminants on the surface of the ECO Robot. The Robot arm has a generally horizontal surface, and thus, the second housing 210 with the side wall opening 212 facilitates receiving the Robot arm, thereby facilitating cleaning of the Robot arm to remove contaminants from the surface of the Robot arm. The second cleaning device 200 is fixed, and after the Robot arm finishes the operation, the Robot arm extends into the second box 210 from the side wall opening 212 for cleaning through position calibration and setting.

In this embodiment, different types of mechanical arms can be cleaned by the first cleaning device 100 and the second cleaning device 200, so that the operation convenience is improved, and the application range is expanded; the cleaning time is short, the cleaning efficiency is high, the cleaning effect is good, and no external pollutant is introduced in the cleaning process, so that the pollution to the wafer can be reduced, and the yield of the wafer is improved.

As a further embodiment of this embodiment, the solution ejection head 130, 230 comprises a nano-atomizing ejection head.

Specifically, the solution sprayed from the nanometer atomizing nozzle has a larger spraying range and a better atomizing effect through the nanometer atomizing nozzle, so that the cleaning effect of the ECO mechanical arm can be improved. The specific type, shape and number of the nano atomizing nozzles are not limited here.

As a further embodiment of this embodiment, the solution showerhead 130, 230 includes one or a combination of a pure water solution showerhead, an ultrapure water solution showerhead and a deionized water solution showerhead.

Specifically, the specific type of the solution may be selected according to specific requirements, and the solution may include one or a combination of a pure water solution, an ultrapure water solution, and a deionized water solution, so as to avoid contamination to the ECO Robot and the Robot, effectively remove the contaminants, and not introduce new impurities.

As a further embodiment of this embodiment, the

gas showerheads

140, 240 comprise one or a combination of a nitrogen showerhead and an inert gas showerhead.

Specifically, after the ECO Robot and the Robot are cleaned in the first and

second cases

110 and 210, respectively, the ECO Robot and the Robot may be further cleaned and dried by the

gas showers

140 and 240, thereby preventing damage to the wafer and the semiconductor device. The gas may comprise one or a combination of nitrogen and an inert gas, preferably nitrogen, which is inexpensive and relatively common.

As a further embodiment of this embodiment, the solution showerheads 130, 230 and the

gas showerheads

140, 240 are respectively distributed at equal intervals.

Specifically, in this embodiment, only 1 solution nozzle 130 and 1 gas nozzle 140 are disposed on the sidewall of the first box 110, only 1 solution nozzle 230 and 1 gas nozzle 240 are disposed on the top of the second box 210, but not limited thereto, the sidewall of the first box 110 may include a plurality of solution nozzles 130 and a plurality of gas nozzles 140, and the top of the second box 210 may also include a plurality of solution nozzles 230 and a plurality of gas nozzles 240, such as 2, 4, 5, etc., without limitation. Preferably, the solution nozzles 130 and 230 and the

gas nozzles

140 and 240 are respectively distributed at equal intervals to further improve the uniformity of the solution and the gas, thereby further improving the cleaning effect.

As a further embodiment of this embodiment, the moving units 121 and 122 include one or a combination of a motor, an air cylinder, and an expansion rod.

Specifically, the types of the moving units 121 and 122 may be the same or different, and the number of the moving units is not limited to 2, and may be an integer greater than 2, such as 3, 5, 6, and the like. The moving units 121 and 122 include one or a combination of a motor, a cylinder, and a telescopic rod. In this embodiment, the moving units 121 and 122 are both motors, but not limited thereto, wherein the moving unit 121 may move the first box 110 back and forth in a horizontal direction, such as a moving path a, and the moving unit 122 may move the first box 110 up and down in a vertical direction, such as a moving path B, so as to flexibly adjust the position of the first box 110, so that the first box 110 can adapt to the movable ECO robot.

As a further embodiment of this embodiment, the cleaning device further comprises a

drain

150, 250, the drain 150 being connected to the first tank 110, and the drain 250 being connected to the second tank 210.

Specifically, the solution after cleaning in the first box 110 and the second box 210 can be removed in time through the

liquid discharge parts

150 and 250, so as to avoid pollution to the ECO Robot and the Robot. The liquid discharge member may be a pump body or the like, and is not limited herein.

The step of using the cleaning device may comprise: when the semiconductor device is in an empty state or after a batch of products is run, the ECO Robot is cleaned by the first cleaning device 100, and the Robot is cleaned by the second cleaning device 200, including processes of spraying the solution using the solution spray heads 130 and 230 for cleaning and drying using the gas spray heads 140 and 240.

Example two

As shown in fig. 4, the present invention provides a cleaning device having a structure different from that of the first embodiment.

Wherein the cleaning device comprises: a first cleaning apparatus 300, the first cleaning apparatus 300 including a first housing 310 and a driving part 320 connected to the first housing 310; the first tank 310 includes a top opening 312, and 1 solution nozzle 330 and 1 gas nozzle 340 are disposed on a sidewall 311 of the first tank; the driving part 320 includes 2 moving units, i.e., moving units 321 and 322, and the displacement of the first casing 310 is controlled by the moving units 321 and 322; the driving part 320 further includes a rotating unit 323, by which the direction of the first casing 310 can be changed by the rotating unit 323; cleaning a first member to be cleaned entering from the top opening 312 by the first cleaning apparatus 300;

a second cleaning apparatus 400, the second cleaning apparatus 400 comprising a second tank 410, the second tank 410 having 1 solution showerhead 430 and 1 gas showerhead 440 disposed on a top thereof, a sidewall 411 of the second tank having a sidewall opening 412; cleaning a second member to be cleaned entering from the sidewall opening 412 by the second cleaning apparatus 400;

the cleaning apparatus further includes a controller 500, and the controller 500 is electrically connected to the first cleaning device 300 and the second cleaning device 400.

Specifically, the first cleaning apparatus 300 and the second cleaning apparatus 400 are the same as those of the first embodiment except for the rotating unit 323 and the controller 500, and are not described herein again. The number of the rotating units 323 can be a natural number greater than or equal to 1, and the specific number and kind are not limited herein. The direction of the first casing 310, such as the travel path C, can be changed by the rotating unit 323, so that the position of the first casing 310 can be further flexibly controlled, and the convenience of operation can be improved. The controller 500 can automatically control the first cleaning apparatus 300 and the second cleaning apparatus 400, so as to improve the control accuracy of the cleaning device. The controller 500 is connected to the driving part 320, the solution sprayer 330, the gas sprayer 340 and the liquid discharge part 350 of the first cleaning apparatus 300, and is simultaneously connected to the solution sprayer 430, the gas sprayer 440 and the liquid discharge part 450 of the second cleaning apparatus 400, so as to reduce the floor space and save the cost while realizing the automatic control. The controller 500 may also include 2 or more, which is not limited herein.

In summary, the cleaning device of the utility model can clean different types of parts to be cleaned through the first cleaning device and the second cleaning device, thereby improving the convenience of operation and expanding the application range; the cleaning time is short, the cleaning efficiency is high, the cleaning effect is good, and no external pollutant is introduced in the cleaning process, so that the pollution to the wafer can be reduced, and the yield of the wafer is improved. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A cleaning device, characterized in that the cleaning device comprises:

the cleaning device comprises a first cleaning device and a second cleaning device, wherein the first cleaning device comprises a first box body and a driving part connected with the first box body;

the first box body comprises a top opening, and at least one solution spray head and at least one gas spray head are arranged on the side wall of the first box body; the driving part comprises at least two moving units, and the displacement of the first box body is controlled by the moving units; cleaning a first member to be cleaned entering from the top opening by the first cleaning apparatus;

2. The cleaning device of claim 1, wherein: the solution spray head comprises a nano atomization spray head.

3. The cleaning device of claim 1, wherein: the solution nozzle comprises one or a combination of a pure water solution nozzle, an ultrapure water solution nozzle and a deionized water solution nozzle.

4. The cleaning device of claim 1, wherein: the gas nozzle comprises one or a combination of a nitrogen nozzle and an inert gas nozzle.

5. The cleaning device of claim 1, wherein: the solution nozzles and the gas nozzles are respectively distributed at equal intervals.

6. The cleaning device of claim 1, wherein: the moving unit comprises one or a combination of a motor, a cylinder and an expansion rod.

7. The cleaning device of claim 1, wherein: the driving part further includes a rotation unit.

8. The cleaning device of claim 1, wherein: the cleaning device also comprises a liquid discharging part, and the liquid discharging part is connected with the first box body and the second box body.

9. The cleaning device of claim 1, wherein: the cleaning device further comprises a controller, and the controller is electrically connected with the first cleaning device and the second cleaning device.

10. The cleaning device according to any one of claims 1 to 9, wherein: the cleaning device comprises a cleaning device applied to cleaning a mechanical arm in the semiconductor equipment.