CN209914338U - Low thermal resistance heat conduction assembly based on heat conduction material - Google Patents
Low thermal resistance heat conduction assembly based on heat conduction material Download PDFInfo
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- CN209914338U CN209914338U CN201821819456.0U CN201821819456U CN209914338U CN 209914338 U CN209914338 U CN 209914338U CN 201821819456 U CN201821819456 U CN 201821819456U CN 209914338 U CN209914338 U CN 209914338U
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Abstract
The utility model relates to a heat conduction assembly especially relates to a low thermal resistance heat conduction assembly based on thermal conductive material, including first heat conduction basic unit, arrange in a plurality of heat conduction monomers in the heat conduction basic unit, the heat conduction monomer includes first heat conductor and second heat conductor at least, first heat conductor, the equal perpendicular to of second heat conductor first heat conduction basic unit and first heat conductor, the mutual interval setting of second heat conductor, the thermal resistivity of first heat conductor, second heat conductor is different. The utility model discloses a heat conduction assembly is through setting up the heat conductor of different thermal resistivity in the direction of perpendicular and heat source interface for the heat transmits with parallelly connected mode between each heat conductor, thereby makes the free overall thermal resistance of heat conduction reduce, increases heat conduction effect and heat conduction assembly's life.
Description
Technical Field
The utility model relates to a heat-conducting component especially relates to a low thermal resistance heat-conducting component based on thermal conductive material.
Background
With the rapid development of modern electronic technology, the integration degree and the assembly density of electronic components are continuously improved, and the working power consumption and the heat productivity of the electronic components are increased sharply while providing strong use functions. High temperatures can have detrimental effects on the stability, reliability and lifetime of electronic components, such as excessive temperatures that can compromise semiconductor junctions, damage the circuit connection interfaces, increase the resistance of the conductors and cause mechanical stress damage. Therefore, ensuring that the heat generated by the heating electronic components can be discharged in time has become an important aspect of microelectronic product system assembly. For portable electronic products (such as notebook computers) with high integration degree and assembly density, heat dissipation even becomes a technical bottleneck problem of the whole product.
The existing electronic product heat dissipation device or heat dissipation liner has small microscopic contact area between the surfaces to be dissipated, which causes heat resistance to be accumulated between the heat dissipation device and the surface of a heat source, thereby affecting the heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned problem that exists among the prior art, the utility model provides a low thermal resistance heat-conducting component based on thermal conductive material, this device can directly set up on heat source body surface, realizes thermal quick transmission.
The to-be-solved technical problem of the utility model is realized through following technical scheme:
the utility model provides a low thermal resistance heat conduction subassembly based on thermal conductive material, includes first heat conduction basic unit, arranges in a plurality of heat conduction monomers on the heat conduction basic unit, the heat conduction monomer includes first heat conductor and second heat conductor at least, first heat conductor, second heat conductor all perpendicular to first heat conduction basic unit and first heat conductor, second heat conductor set up at an interval each other, the thermal resistivity of first heat conductor, second heat conductor is different.
The low-thermal-resistance heat conduction assembly based on the heat conduction material is characterized in that the heat conduction monomers are arranged on the first heat conduction base layer in a clearance mode, and the gaps among the heat conduction monomers are smaller than or equal to the thickness of the heat conduction monomers.
The low-thermal-resistance heat conduction assembly based on the heat conduction material is characterized in that the first heat conductor is made of graphene, and the second heat conductor is made of heat conduction rubber.
The low-thermal-resistance heat conduction assembly based on the heat conduction material is characterized in that a heat conduction insulating film body is further arranged on the peripheral wall of the heat conduction monomer, and the heat conduction insulating film body is made of a heat conduction ceramic material.
The low-thermal-resistance heat conduction assembly based on the heat conduction material comprises one or more of aluminum oxide, boron nitride, aluminum nitride, silicon carbide, calcium carbonate or silicon dioxide.
The low-thermal-resistance heat conduction assembly based on the heat conduction material further comprises a second heat conduction base layer, wherein the second heat conduction base layer is arranged at the free end of the heat conduction monomer, and the second heat conduction base layer is parallel to the first heat conduction base layer.
The low-thermal-resistance heat conduction assembly based on the heat conduction material is characterized in that the first heat conduction base layer and the second heat conduction base layer are adhesive films, and the adhesive films are acrylic adhesive films, silica gel adhesive films or hot melt adhesive films.
The first heat conductor and the second heat conductor can be in the shape of a planar sheet or in the shape of a ring.
The utility model has the advantages that:
the utility model discloses a heat conduction assembly is through setting up the heat conductor of different thermal resistivity in the direction of perpendicular and heat source interface for the heat transmits with parallelly connected mode between each heat conductor, thereby makes the free overall thermal resistance of heat conduction reduce, increases heat conduction effect and heat conduction assembly's life.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of the low thermal resistance heat conduction assembly based on the heat conduction material of the present invention.
Fig. 2 is a first specific structural diagram of the heat-conducting monomer.
Fig. 3 is a second specific structural diagram of the heat-conducting monomer.
Fig. 4 is a schematic view of a third specific structure of the heat conductive monomer.
Fig. 5 is another structural schematic diagram of the low thermal resistance heat conduction assembly based on the heat conduction material of the present invention.
In the figure: 1-heat source interface; 2-a first thermally conductive base layer; 3-a thermally conductive monomer; 4-a first thermally conductive body; 5-a second heat conductor; 6-heat conducting insulating film body; 7-a second thermally conductive base layer.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined purpose, the following detailed description of the embodiments, structural features and effects of the present invention will be made with reference to the accompanying drawings and examples.
Referring to fig. 1-4, in order to solve the extension of current heat conduction subassembly along with live time, the thermal resistance increases for heat conduction assembly's thermal conductivity is poor, the short technical problem of life, the utility model provides a low thermal resistance heat conduction subassembly based on thermal conductive material, include with the first heat conduction basic unit 2 of heat source interface 1 contact, arrange in a plurality of heat conduction monomers 3 in the heat conduction basic unit, heat conduction monomer 3 includes first heat conductor 4 and second heat conductor 5 at least, first heat conductor 4, second heat conductor 5 all are perpendicular to first heat conduction basic unit 2 and first heat conductor 4, the mutual interval setting of second heat conductor 5, first heat conductor 4, second heat conductor 5's thermal resistivity is different.
Specifically, the heat-conducting monomers 3 are arranged on the first heat-conducting base layer 2 in a clearance manner, and the clearance between the heat-conducting monomers 3 is smaller than or equal to the thickness of the heat-conducting monomers 3, so as to reserve an air exchange port.
In this embodiment, the first heat conductor 4 and the second heat conductor 5 only need to ensure different thermal resistivities, but need to be made of a heat conductive material, preferably, the first heat conductor 4 is made of graphene, and the second heat conductor 5 is made of heat conductive rubber, wherein the graphene has a low thermal resistivity and the heat conductive rubber has a thermal resistivity, and the heat conductive rubber can also play a role in supporting and protecting the graphene layer;
in addition, a heat conduction insulating film body 6 is further arranged on the peripheral wall of the heat conduction monomer 3, and the heat conduction insulating film body 6 is made of a heat conduction ceramic material; the heat-conducting ceramic material comprises one or more of aluminum oxide, boron nitride, aluminum nitride, silicon carbide, calcium carbonate or silicon dioxide.
Referring to fig. 2 to 4, the first thermal conductor 4 and the second thermal conductor 5 may be planar sheets or concentric rings, and when the first thermal conductor 4 and the second thermal conductor 5 are both concentric rings, it is preferable that the outermost layer is a heat-conducting rubber layer.
The heat conduction materials with different thermal resistivities are arranged at intervals, namely, the thermal resistances on the heat source interface 1 are connected in parallel, so that the total thermal resistance of the heat conduction monomer 3 is reduced, the heat conduction effect is enhanced, and the service life is prolonged.
Example 2:
the present embodiment is different from embodiment 1 in that, referring to fig. 5, a second heat conductive base layer 7 is further included, the second heat conductive base layer 7 is disposed at a free end of the heat conductive unit 3, and the second heat conductive base layer 7 is parallel to the first heat conductive base layer 2; the second heat-conducting base layer 7 is an adhesive film, and the adhesive film is an acrylic adhesive film, a silica gel adhesive film or a hot-melt adhesive film.
The purpose of disposing a heat conducting base layer at each end of the heat conducting unit 3 in this embodiment is to enable the heat conducting assembly to be disposed between a heat source and a heat sink.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (7)
1. The low-thermal-resistance heat conduction assembly based on the heat conduction material is characterized by comprising a first heat conduction base layer (2) in contact with a heat source interface (1), and a plurality of heat conduction monomers (3) arranged on the heat conduction base layer, wherein the heat conduction monomers (3) at least comprise a first heat conductor (4) and a second heat conductor (5), the first heat conductor (4) and the second heat conductor (5) are perpendicular to the first heat conduction base layer (2), the first heat conductor (4) and the second heat conductor (5) are arranged at intervals, and the thermal resistivity of the first heat conductor (4) and the thermal resistivity of the second heat conductor (5) are different.
2. The low thermal resistance heat conduction assembly based on the heat conductive material as claimed in claim 1, wherein the heat conductive monomers (3) are arranged on the first heat conductive base layer (2) with gaps therebetween, and the gaps between the heat conductive monomers (3) are less than or equal to the thickness of the heat conductive monomers (3).
3. The heat conducting material-based low thermal resistance heat conducting assembly as claimed in claim 1 or 2, wherein the first heat conductor (4) is made of graphene, and the second heat conductor (5) is made of heat conducting rubber.
4. The low thermal resistance heat conduction assembly based on the heat conduction material as claimed in claim 3, wherein the heat conduction single body (3) is further provided with a heat conduction insulating film body (6) on the peripheral wall, and the heat conduction insulating film body (6) is made of a heat conduction ceramic material.
5. The low thermal resistance heat conduction assembly based on the heat conductive material as claimed in claim 1, further comprising a second heat conductive base layer (7), wherein the second heat conductive base layer (7) is disposed at the free end of the heat conductive unit (3), and the second heat conductive base layer (7) is parallel to the first heat conductive base layer (2).
6. The heat conduction material-based low thermal resistance heat conduction assembly as claimed in claim 1 or 5, wherein the first heat conduction base layer (2) and the second heat conduction base layer (7) are both adhesive films, and the adhesive films are acrylic adhesive films, silica gel adhesive films or hot melt adhesive films.
7. A heat conducting material based low thermal resistance heat conducting assembly as claimed in claim 1 or 2, characterized in that the first heat conductor (4), the second heat conductor (5) can be in the shape of a flat sheet or a ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821819456.0U CN209914338U (en) | 2018-11-06 | 2018-11-06 | Low thermal resistance heat conduction assembly based on heat conduction material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821819456.0U CN209914338U (en) | 2018-11-06 | 2018-11-06 | Low thermal resistance heat conduction assembly based on heat conduction material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914338U true CN209914338U (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821819456.0U Active CN209914338U (en) | 2018-11-06 | 2018-11-06 | Low thermal resistance heat conduction assembly based on heat conduction material |
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| Country | Link |
|---|---|
| CN (1) | CN209914338U (en) |
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2018
- 2018-11-06 CN CN201821819456.0U patent/CN209914338U/en active Active
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